化学气相沉积法制备Ta2O5薄膜的研究进展

Ta2O5是重要的介电材料和光波导材料.从前驱体的选择方面综述了化学气相沉积法制备Ta2O5薄膜的研究进展,说明了五卤化钽和Ta金属有机化合物对CVD过程的影响,对这两类前驱体的优缺点进行了比较和评述,讨论了Ta2O5的生成机理,并对其发展方向作了简要的展望.     

Influence of the self-buffer layer on ZnO film grown by atmospheric metal organic chemical vapor deposition

ZnO films with and without a self-buffer layer were grown on c-plane sapphire substrates by atmospheric metal organic chemical vapor deposition. The influence of the buffer layer thickness, annealing temperature and annealing time on ZnO films has been investigated. The full width at half maximum of the ω-rocking curve of the optimized self-buffer layer sample is only 395 arc sec. Its surface is composed of regular columnar hexagons. After the buffer layer was introduced, the A₁ longitudinal mode peak at 576 cm^− 1, related to the defects, disappears in Raman spectra. For the photoluminescence, besides the strong donor binding exciton peak at 3.3564 eV, an ionized donor binding exciton and a free exciton peak is respectively observed at 3.3673 and 3.3756 eV at the high-energy side in the spectrum of the sample with the buffer layer.     

Preparation of β-Fesi2 thin film by metal organic chemical vapor deposition using iron-carbonyl and mono-silane

β-FeSi₂ films were deposited at 750 °C by a supplying Fe(CO)₅ and SiH₄ simultaneously during metal organic chemical vapor deposition (CVD). Films could be deposited using this precursors system, even though film deposition was not ascertained by the single supply of Fe(CO)₅. Fe(CO)₅ was probably decomposed in gas phases before it reached to substrate surface. It was suggested that a kind of intermediate reactant which was more stable than Fe(CO)₅ created by the simultaneous supply of Fe(CO)₅ and SiH₄ makes Fe-Si films. Epitaxial β-FeSi₂ films were obtained on Si(111) substrates, and neither carbide nor oxide phases were detected on XRD patterns.     

Effect of deposition temperature on dielectric properties of PECVD Ta2O5 thin film

Tantalum oxide film formation by plasma-enhanced chemical vapour deposition (PECVD) using TaCl₅ as a source material was examined. The effects of deposition temperature on the formation, structure and electric properties of the Ta₂O₅ film were investigated for Al/Ta₂O₅/ p-Si (MTS) capacitors. The deposition rate and refractive index increased with increasing deposition temperature. It was found that the structure of Ta₂O₅ deposited by PECVD was amorphous as-deposited. However, crystalline -Ta₂O₅ of hexagonal structure was formed by a 700 °C, 1 h heat treatment in argon. Capacitance and relative dielectric constant of the PECVD Ta₂O₅ were found to be 2.54 fF m^–2 and 23.5, respectively. The PECVD films obtained in this study have higher dielectric constants and remarkably better general film characteristics than those obtained by other deposition methods.     

Effect of deposition temperature on dielectric properties of PECVD Ta2O5 thin film

Tantalum oxide film formation by plasma-enhanced chemical vapour deposition (PECVD) using TaCl₅ as a source material was examined. The effects of deposition temperature on the formation, structure and electric properties of the Ta₂O₅ film were investigated for Al/Ta₂O₅/ p-Si (MTS) capacitors. The deposition rate and refractive index increased with increasing deposition temperature. It was found that the structure of Ta₂O₅ deposited by PECVD was amorphous as-deposited. However, crystalline -Ta₂O₅ of hexagonal structure was formed by a 700 °C, 1 h heat treatment in argon. Capacitance and relative dielectric constant of the PECVD Ta₂O₅ were found to be 2.54 fF m^–2 and 23.5, respectively. The PECVD films obtained in this study have higher dielectric constants and remarkably better general film characteristics than those obtained by other deposition methods.     

Effects of growth variables on the properties of single crystalline ZnO thin film grown by inductively coupled plasma metal organic chemical vapor deposition

Single crystalline undoped and Ga-doped n-type zinc oxide (ZnO) films were grown on sapphire (Al₂O₃) substrates by inductively coupled plasma (ICP) metal organic chemical vapor deposition. Effects of growth variables on the structural, optical, and electrical properties of ZnO films have been studied in detail. Single crystal films with flat and smooth surfaces were reproducibly obtained, with application of sample bias and O₂ ICP. The best film properties were obtained at the growth condition of 650 °C, 400 W ICP power, − 94 V bias voltage, O/Zn (VI/II) ratio of 75. Single crystalline Ga doped n-ZnO films were also obtained, with free carrier concentration of about 1.5 × 10¹⁹/cm³ at 1 at.% Ga concentration.     

金属Cu诱导层对热丝法制备多晶硅薄膜微结构的影响

采用热丝化学气相沉积法(HWCVD),在金属铜诱导层上成功制备出横向晶粒尺寸在1μm左右、垂直晶粒尺寸达20μm的柱状多晶硅薄膜,其晶化率在95%以上.使用XRD、Raman光谱、扫描电子显微镜(SEM)等分析测试手段研究了灯丝温度在1500～1800℃之间变化时,金属铜诱导层对多晶硅薄膜的微观形貌、结晶性及晶体学生长方向的影响规律.结果表明:金属铜诱导层的引入,在一定温度范围内改善了晶粒尺寸,改变了多晶硅薄膜的择优取向,降低了薄膜的晶化温度,提高了晶化率.     

离子束溅射沉积Ta2O5光学薄膜的实验研究

根据择优溅射的理论,在不同的通氧方式下,详细分析了离子辅助对离子束溅射沉积Ta2O5薄膜光学特性的影响。结果表明,在薄膜生长的过程中,由于氩离子的轰击作用,薄膜中的氧原子被优先溅射出来,造成了薄膜化学剂量比失调、吸收增加。但是,通过优化辅助离子源中氧气的比例,可获得合理化学剂量比、低损耗的Ta2O5薄膜。     

Fabrication and characterization of ZnO nanoneedle array using metal organic chemical vapor deposition

High density and vertically well-aligned ZnO nanoneedle arrays were fabricated on the ZnO thin film deposited on silicon substrates. The ZnO buffer layer and nanoneedles were synthesized by metal organic chemical vapor deposition using diethylzinc and oxygen gas. The ZnO buffer film was grown at 250 degrees C and the growth temperature of nanoneedles was in the range of 480-500 degrees C. As-grown ZnO nanoneedles showed single crystalline structure of ZnO (002). The crystalline properties of three samples (A: as-deposited ZnO buffer layer, B: annealed buffer film, C: ZnO nanoneedles) were compared using XRD and Raman spectroscopy. The synthesized ZnO nanoneedles (sample C) showed highest crystalline quality among three samples. The field emission properties of ZnO nanoneedles were investigated, which showed low turn on field of 4.8 Vmicrom(-1) and high field enhancement factor of 3.2 x 103.     

Growth of InAs quantum dots on GaAs nanowires by metal organic chemical vapor deposition

InAs quantum dots (QDs) are grown epitaxially on Au-catalyst-grown GaAs nanowires (NWs) by metal organic chemical vapor deposition (MOCVD). These QDs are about 10-30 nm in diameter and several nanometers high, formed on the {112} side facets of the GaAs NWs. The QDs are very dense at the base of the NW and gradually sparser toward the top until disappearing at a distance of about 2 μm from the base. It can be concluded that these QDs are formed by adatom diffusion from the substrate as well as the sidewalls of the NWs. The critical diameter of the GaAs NW that is enough to form InAs QDs is between 120 and 160 nm according to incomplete statistics. We also find that these QDs exhibit zinc blende (ZB) structure that is consistent with that of the GaAs NW and their edges are faceted along particular surfaces. This hybrid structure may pave the way for the development of future nanowire-based optoelectronic devices.     

Phase composition of mixed ZnS-EuS thin films grown by metal organic chemical vapor deposition

The phase composition of the mixed ZnS-EuS films deposited from volatile dithiocarbamates has been studied using differential dissolution technique (chemical method of the phase analysis) and electron microscopy. Phase composition was found to depend on the Eu content in the films, that in turn depends on a flow density ratio of the Eu and Zn volatile precursors. A single-phase solid solution, Zn_0.998Eu_≤0.002S, was observed only for films with Eu content≤1 mol%, other films were found to be two-phase. For films with the Eu content between 2 and 16% and above 80%, impurity phases, EuS and ZnS, respectively, were detected by differential dissolution technique. They evolved as low-sized sulfide precipitates encapsulated in an organic coat. No impurity phases in the films of the same Eu content were noticed by X-ray technique and Raman spectroscopy. For the films with the Eu content between 16 and 80%, sulfide phases, ZnS and EuS, were found to be free from any organic coat, and structural methods as with differential dissolution technique were also capable of observing the phases. Conditions are given to prepare Eu doped ZnS films of good quality by MOCVD technique.     

Preparation of TiO2 thick film by laser chemical vapor deposition method

A TiO₂ film was prepared on Pt/Ti/SiO₂/Si substrate by a laser chemical vapor deposition method. The rutile TiO₂ film with pyramidal grains and columnar cross-section was obtained at a high deposition rate (R _dep = 11.4 μm h^?1). At 300 K and 1 MHz, the dielectric constant (ε _r) and loss (tanδ) of the TiO₂ film were about 73.0 and 0.0069, respectively. The electrical properties of TiO₂ film were investigated by ac impedance spectroscopy over ranges of temperature (300–873 K) and frequency (10²–10⁷ Hz). The Cole–Cole plots between real and imaginary parts of the impedance (Z′ and Z′′) in the above frequency and temperature range suggested the presence of two relaxation regimes that were attributed to grain and grain boundary responses. The ionic conduction in the rutile TiO₂ film was dominated by the oxygen vacancies.     

Effect of laser power on microstructure and dielectric properties of BaTi5O11 films prepared by laser chemical vapor deposition method

BaTi₅O₁₁ films were prepared on Pt/Ti/SiO₂/Si substrates by a laser chemical vapor deposition method. The effect of laser power (P _L) on microstructure and dielectric properties of the BaTi₅O₁₁ films was investigated. With increasing P _L from 62 to 108?W, the deposition temperature (T _dep) monotonously increased from 872 to 951?K. At T _dep?=?920?K (P _L?=?90?W), the BaTi₅O₁₁ film had $ (\overline{3} 01) $ preferred orientation. At T _dep?≥?938?K (P _L?≥?98?W), the preferred orientation changed to $ (\overline{3} 22)/(\overline{2} 23) $ . The deposition rate (R _dep) was 154.8–177.6?μm?h^?1. With increasing T _dep, the surface morphologies changed from rectangular to pyramidal, and the dielectric constant (ε _r) increased from 18.3 to 21.4 at 1?MHz and 300?K.     

化学气相沉积制备V2O5-WO3/TiO2催化剂及表征

以蜂窝堇青石为基体,采用化学气相沉积技术结合浸渍工艺制备出V2O5-WO3/TiO2脱硝催化剂,通过SEM、BET、XRD和EDS完成载体以及催化剂微观结构和成分表征,并利用活性评价装置测试了催化剂NO脱出率。试验结果表明,化学气相沉积技术制备的载体表面为锐钛矿型TiO2,其颗粒聚集成团块状,BET为62.73m2/g,平均孔径为9.8nm。制备的V2O5-WO3/TiO2催化剂孔结构规律与TiO2载体相似,V2O5在TiO2载体上无定形态单层分散,微量V2O5在微区长大成针状,宽度100nm;在350℃、4000h-1、n(NH3)/n(NO)=1时,催化剂NO脱出率ηNO达到96.7%。     

有机气相沉积中薄膜生长的模拟研究

通过对有机气相沉积中气体的传输过程进行模拟,略述了OVPD传输的基本机制。利用蒙特卡洛法对有机蒸气通过掩膜孔的动力学沉积过程进行仿真,仿真结果表明薄膜的形状受沉积参数的影响,例如,分子平均自由程(沉积压强)、掩膜板的尺寸以及掩膜板至基板的距离。分析表明,通过缩小掩膜板至基板的距离,同时减小沉积压强可以提高所成薄膜图案的分辨率,减小掩膜板的厚度可以提高材料的使用效率。     

Features of the transport of sputtered atoms during Ta2O5 film deposition onto substrates of complicated configuration

The possibility of obtaining Ta₂O₅ films with homogeneous properties on the surface of substrates possessing complicated shapes was studied. In the deposition systems employing point molecular sources of a vapor flow, the problem is solved by using various planetar manipulators ensuring complicated rotations of the substrates in a vacuum chamber; in the case of magnetron sputtering, a more technological method can be realized based on the controlled transport of sputtered particles in the target-substrate drift space. The transport of sputtered particles is described using various models and static modeling techniques, which can be also of interest for solving numerous applied problems in the physics of gas discharge. The results were used to optimize the technology of Ta₂O₅ film deposition onto large-size substrates of complicated configurations.     

The effect of He or Ar/O2 plasma treatment on Si surface prior to chemical vapor deposition of SiO2

The effect of O₂ plasma pretreatment on the SiO₂/Si interface property was studied using direct plasma varying the plasma power, He or Ar/O₂ ratio and the pretreatment time. The decrease of the pretreatment plasma power decreased the plasma damage and improved the interface property. The addition of He in O₂ glow discharge improved the electrical and the interface properties and there was an optimum He/O₂ ratio. The improvement of the interface property by Ar/O₂-plasma pretreatment was better than that by He/O₂, which is believed to be due to the lower oxidation rate of the Si surface. C–V analysis showed that the P_b center defect density was influenced by plasma pretreatment process parameters. To investigate the oxidation states near to and at the SiO₂/Si interface, X-ray photoelectron spectroscopy depth analysis was used and the gas phase in the glow discharge was investigated using optical emission spectroscopy analysis at various experimental conditions.