Flexible AMOLEDs with low‐temperature‐processed TFT backplane technologies

Developments of backplane technologies, which are one of the challenging topics, toward the realization of flexible active matrix organic light‐emitting diodes (AMOLEDs) are discussed in this paper. Plastic substrates including polyimide are considered as a good candidate for substrates of flexible AMOLEDs. The fabrication process flows based on plastic substrates are explained. Limited by the temperature that plastic substrates can sustain, TFT technologies with maximum processing temperature below 400 °C must be developed. Considering the stringent requirements of AMOLEDs, both oxide thin‐film transistors (TFTs) and ultra‐low‐temperature poly‐silicon TFTs (U‐LTPS TFTs) are investigated. First, oxide TFTs with representative indium gallium zinc oxide channel layer are fabricated on polyimide substrates. The threshold voltage shifts under bias stress and under bending test are small. Thus, a 4.0‐in. flexible AMOLED is demonstrated with indium gallium zinc oxide TFTs, showing good panel performance and flexibility. Further, the oxide TFTs based on indium tin zinc oxide channel layer with high mobility and good stability are discussed. The mobility can be higher than 20 cm²/Vs, and threshold voltage shifts under both voltage stress and current stress are almost negligible, proving the potential of oxide TFT technology. On the other hand, the U‐LTPS TFTs are also developed. It is confirmed that dehydrogenation and dopant activation can be effectively performed at a temperature within 400 °C. The performance of U‐LTPS TFTs on polyimide is compatible to those of TFTs on glass. Also, the performance of devices on polyimide can be kept intact after devices de‐bonded from glass carrier. Finally, a 4.3‐in. flexible AMOLED is also demonstrated with U‐LTPS TFTs.     

Full‐color active‐matrix OLED based on a‐Si TFT technology

Abstract— We have successfully demonstrated a 4‐in. full‐color active‐matrix OLED display based on amorphous‐Si (a‐Si) TFT technology. With improvements in the TFT manufacturing process and structure, a‐Si TFTs provide abundant capability to drive OLEDs. This demonstration clearly shows the possibility of using a‐Si TFTs as driving backplanes in the manufacture of full‐color AMOLEDs.     

Threshold‐voltage‐compensation methods for AMOLED pixel and analog buffer circuits

Abstract— New pixel‐circuit designs for active‐matrix organic light‐emitting diodes (AMOLEDs) and a new analog buffer circuit for the integrated data‐driver circuit of active‐matrix liquid‐crystal displays (AMLCDs) and AMOLEDs, based on low‐temperature polycrystalline‐silicon thin‐film transistors (LTPS‐TFTs), were proposed and verified by SPICE simulation and measured results. Threshold‐voltage‐compensation pixel circuits consisting of LTPS‐TFTs, an additional control signal line, and a storage capacitor were used to enhance display‐image uniformity. A diode‐connected concept is used to calibrate the threshold‐voltage variation of the driving TFT in an AMOLED pixel circuit. An active load is added and a calibration operation is applied to study the influences on the analog buffer circuit. The proposed circuits are shown to be capable of minimizing the variation from the device characteristics through the simulation and measured results.     

Novel a‐Si:H TFT pixel circuit for electrically stable top‐anode light‐emitting AMOLEDs

Abstract— A novel pixel circuit for electrically stable AMOLEDs with an a‐Si:H TFT backplane and top‐anode organic light‐emitting diode is reported. The proposed pixel circuit is composed of five a‐Si:H TFTs, and it does not require any complicated drive ICs. The OLED current compensation for drive TFT threshold voltage variation has been verified using SPICE simulations.     

Current and future technology of low‐temperature poly‐Si TFT‐LCDs

Abstract— The state of the art of large‐area low‐temperature TFT‐LCDs will be reported in this paper. High‐performance poly‐Si TFTs are expected to realize various applications such as system display where various signal‐processing functions are added to the display. In the past few years, low‐temperature poly‐Si thin‐film‐transistor (LTPS TFT) technology has made great progress, especially in the areas of excimer laser annealing (ELA) of high‐quality poly‐Si film, ion doping for large‐area doping, and high‐quality gate SiO₂ film formation by using the low‐temperature PE‐CVD method. Also, technology trends and possible applications, such as a system displays, will be discussed.     

PECVD‐based nanocrystalline‐silicon TFT backplanes for large‐sized AMOLED displays

Abstract— A 14.1‐in. AMOLED display using nanocrystalline silicon (nc‐Si) TFTs has been developed. Nanocrystalline silicon was deposited using conventional 13.56‐MHz plasma‐enhanced chemical vapor deposition (PECVD). Detailed thin‐film characterization of nc‐Si films was followed by development of nc‐Si TFTs, which demonstrate a field‐effect mobility of about 0.6–1.0 cm²/V‐sec. The nc‐Si TFTs show no significant shift in threshold voltage when over 700 hours of constant current stress is applied, indicating a stable TFT backplane. The nc‐Si TFTs were successfully integrated into a 14.1‐in. AMOLED display. The display shows no significant current decrease in the driving TFT of the 2T‐1cap circuit because the TFTs are highly stable. In addition to the improved lifetime of AMOLED displays, the development of nc‐Si TFTs using a conventional 13.56‐MHz PECVD system offers considerable cost advantages over other laser and non‐laser polysilicon‐TFT technologies for large‐sized AMOLEDs.     

Digital‐to‐analog converter with gamma correction on glass substrate for TFT‐panel applications

Abstract— Low‐temperature polysilicon (LTPS) technology has a tendency towards integrating all circuits on glass substrate. However, the poly‐Si TFTs suffered poor uniformity with large variations in the device characteristics due to a narrow laser process window for producing large‐grained poly‐Si TFTs. The device variation is a serious problem for circuit realization on the LCD panel, so how to design reliable on‐panel circuits is a challenge for system‐on‐panel (SOP) applications. In this work, a 6‐bit R‐string digital‐to‐analog converter (DAC) with gamma correction on glass substrate for TFT‐panel applications is proposed. The proposed circuit, which is composed of a folded R‐string circuit, a segmented digital decoder, and reordering of the decoding circuit, has been designed and fabricated in a 3‐μm LTPS technology. The area of the new proposed DAC circuit is effectively reduced to about one‐sixth compared to that of the conventional circuit for the same LTPS process.     

Hysteresis analysis in excimer‐laser‐annealed low‐temperature polycrystalline‐silicon thin‐film transistors

To analyze the hysteresis phenomenon in p‐channel low‐temperature polycrystalline‐silicon thin‐film transistors (LTPS TFTs), the direct correlation between the hysteresis and the interface (N_it) and the grain‐boundary trap density (N_trap) has been investigated. To fabricate LTPS TFTs with different electrical properties and trap types, the thickness of a‐Si was varied from 30 to 80 nm and crystallized by the excimer‐laser‐anneal (ELA) method. The interface trap density is extracted from the subthreshold slope (SS) and low‐high‐frequency C‐V analysis, while the grain‐boundary trap density is extracted by the Levinson and Proano method. The LTPS TFTs with smaller hysteresis exhibited a lower trap density. From the correlation between extracted parameters, the hysteresis seems to be more dependent on N_it and decreases when the film thickness increases to 80 nm while the N_trap is almost the same in all devices.     

Current programming pixel circuit and data‐driver design for active‐matrix organic light‐emitting diodes

Abstract— We propose a new pixel design for active‐matrix organic light‐emitting diodes (AMOLEDs) employing five polycrystalline thin‐film transistors (poly‐Si TFTs) and one capacitor, which decreases the data current considerably in order to reduce the charging time compared with that of conventional current‐mirror structures. Also, the new pixel design compensates the threshold‐voltage degradation of OLEDs caused by continuous operation and the non‐uniformity of poly‐Si TFTs due to excimer‐laser annealing. The proposed pixel circuit was verified by SPICE simulation, based on measured TFT and OLED characteristics. We also propose current‐data‐driver circuitry that reduces the number of shift‐register signals for addressing the current data driver by one‐half.     

Alternative approach to large‐sized AMOLED HDTV

Abstract— In this work, alternative approaches to existing technologies for the fabrication of large‐sized AMOLEDs, such as non‐laser crystallization methods for poly‐Si TFT fabrication and color patterning using laser‐induced thermal imaging (LITI), is proposed. In particular, it was found that the super grain crystallization (SGS) method resulted in high‐performance TFTs in terms of mobility and off‐current. The feasibility of these techniques for large‐sized AMOLEDs is demonstrated by 17‐in. UXGA AMOLED displays which show good brightness uniformity.     

A new threshold‐voltage compensation technique of poly‐Si TFTs for AMOLED display pixel circuits

Abstract— A new threshold‐voltage compensation technique for polycrystal line‐silicon thin‐film transistors (poly‐Si TFTs) used in active‐matrix organic light‐emitting‐diode (AMOLED) display pixel circuits is presented. The new technique was applied to a conventional 2‐transistor—1‐capacitor (2T1C) pixel circuit, and a new voltage‐programmed pixel circuit (VPPC) is proposed. Theoretically, the proposed pixel is the fastest pixel with threshold‐voltage compensation reported in the literature because of the new compression technique implemented with a static circuit block, which does not affect the response time of the conventional 2T1C pixel circuit. Furthermore, the new pixel exhibits all the other advantages of the 2T1C pixel, such as the simplicity of the peripheral drivers and improves other characteristics, such as its behavior in the temperature variations. The verification of the proposed pixel is made through simulations with HSpice. In order to obtain realistic simulations, device parameters were extracted from fabricated low‐temperature poly‐Si (LTPS) TFTs.     

Development of rapid thermal processor for large‐glass LTPS production

Abstract— A field‐enhanced rapid‐thermal‐processor (FE‐RTP) system that enables LTPS LCD and AMOLED manufacturers to produce poly‐Si films at low cost, high throughput, and high yield has been developed. The FE‐RTP allows for diverse process options including crystallization, thermal oxidation of gate oxides, and fast pre‐compactions. The process and equipment compatibility with a‐Si TFT manufacturing lines provides a viable solution to produce poly‐Si TFTs using a‐Si TFT lines.     

Effects of post‐annealing on a‐Si:H TFT characteristics fabricated on stainless‐steel substrate

Abstract— A 14.1‐in.‐diagonal backplane employing hydrogenated amorphous‐silicon thin‐film transistors (a‐Si:H TFTs) was fabricated on a flexible stainless‐steel substrate. The TFTs exhibited a field‐effect mobility of 0.54 cm²/V‐sec, a threshold voltage of 1.0 V, and an off‐current of 10^?13 A. Most of the electrical characteristics were comparable to those of the TFTs fabricated on glass substrates. To increase the stability of a‐Si:H TFTs fabricated on stainless‐steel substrate, the specimens were thermally annealed at 230°C. The field‐effect mobility was reduced to 71% of the initial value because of the strain of the released hydrogen atoms and residual compressive stress in a‐Si:H TFT under thermal annealing at 230°C.     

Fabrication of low‐temperature‐polysilicon thin‐film transistors on flexible substrates using excimer‐laser crystallization

Abstract— Low‐temperature‐polysilicon thin‐film transistors (LTPS TFTs) were fabricated on polymer substrates using sputtered amorphous‐Si (a‐Si) films and excimer‐laser crystallization. The in‐film argon concentration of a‐Si films was minimized as low as 1.6% by using an argon/helium gas mixture as the sputtering gas. By employing XeCl excimer‐laser crystallization, poly‐Si films were successfully fabricated on polymer substrates with an average grain size of 400 nm. With a four‐mask process, a poly‐Si TFT was fabricated with a fully self‐aligned top‐gate structure, and the pMOS TFT device showed a field‐effect mobility of 63.6 cm²/V‐sec, ON/OFF ratio of 10⁵, and threshold voltage of ?1.5 V.     

Voltage‐programming method with transimpedance‐feedback technique for threshold voltage and mobility compensations in large‐area high‐resolution AMOLED displays

Abstract— A voltage‐programming method with transimpedance‐feedback control technique is proposed for compensating threshold voltage and mobility variations of driving thin‐film transistors (TFTs) in large‐area high‐resolution polycrystalline‐silicon (poly‐Si) active‐matrix organic light‐emitting‐diode (AMOLED) displays. Those electrical characteristic variations of TFTs throughout a large‐area high‐resolution panel result in picture‐quality non‐uniformity of AMOLED displays. The simulation and experimental results of the proposed method show that the maximum emission‐current error for 30‐in. full‐high‐definition television (HDTV) applications is less than 1.9% when the mobility variation and the threshold‐voltage variation are ±12.5% and ±0.3 V, respectively. The proposed method is the best programming method for large‐area high‐resolution AMOLEDs among the published methods.     

Optimization of low‐temperature poly‐Si TFT‐LCDs and a large‐scale production line for large glass substrates

Abstract— An update of the progress of inherently low‐temperature poly‐Si (LTPS) technologies, such as ELA, ion doping, and activation in conjunction with chemical vapor deposition (CVD) and photolithography will be given. We will also discuss whether LTPS LCDs will be applied to a large‐scale production line using a large motherglass substrate. It was found that a more‐powerful excimer laser as well as photolithography with higher‐resolution and a more‐precise overlaid arrangement would enable a large‐scale production line handling motherglass of 4th generation size to be constructed in the very near future with reasonable investment and productivity costs.     

Active‐matrix organic light‐emitting diode using inverse‐staggered poly‐Si TFTs with a center‐offset gated structure

Abstract— A low‐cost active‐matrix backplane using non‐laser polycrystalline silicon (poly‐Si) having inverse‐staggered TFTs with amorphous‐silicon (a‐Si) n⁺ contacts has been developed. The thin‐film transistors (TFTs) have a center‐offset gated structure to reduce the leakage current without scarifying the ON‐currents. The leakage current of the center‐offset TFTs at Vg = ?10 V is two orders of magnitude lower than those of the non‐offset TFTs. The center‐offset length of the TFTs was 3 μm for both the switching and driving TFTs. A 2.2‐in. QQVGA (1 60 × 1 20) active‐matrix organic light‐emitting‐diode (AMOLED) display was demonstrated using conventional 2T + 1C pixel circuits.     

In‐pixel temperature sensor for high‐luminance active matrix micro‐light‐emitting diode display using low‐temperature polycrystalline silicon and oxide thin‐film‐transistors

We propose an in‐pixel temperature sensor using low‐temperature polycrystalline silicon and oxide (LTPO) thin‐film transistor (TFTs) for high‐luminance active matrix (AM) micro‐light‐emitting diode (LED) displays. By taking advantage of the different off‐current characteristics of p‐type LTPS TFTs and n‐type a‐IGZO TFTs under temperature change, we designed and fabricated a temperature sensor consists of only LTPO TFTs without additional sensing component or material. The fabricated sensor exhibits excellent temperature sensitivity of up to 71.8 mV/°C. In addition, a 64 × 64 temperature sensor array with 3T sensing pixel and integrated gate driver has also been fabricated, which demonstrates potential approach for maxing out the performance of high‐luminance AM micro‐LED display with real‐time in‐pixel temperature monitoring.     

High‐performance thin‐film transistor using silicide‐mediated crystallization

Abstract— We studied the silicide‐mediated crystallization of a‐Si for low‐temperature polycrystalline‐silicon (LTPS) on glass. By controling the heating method and Ni density on the a‐Si, the grain size could be increased to 40 μm. Radial grain growth from a NiSi₂ crystalline nucleus gives rise to a large‐grain poly‐Si without amorphous phase inside. A field‐effect mobility of over 200 cm²/V‐sec was achieved by using LTPS.     

Letter: Mechanisms for on/off currents in dual‐gate a‐Si:H thin‐film transistors using indium‐tin‐oxide top‐gate electrodes

Abstract— Two types of dual‐gate a‐Si:H TFTs were made with transparent indium‐tin‐oxide (ITO) top‐gate electrodes of different lengths to investigate the static characteristics of these devices. By changing the length of the ITO top gate, we found that the variations in the on‐currents of these dual‐gate TFTs with dual‐gate driving are due to the high resistance of the parasitic intrinsic a‐Si:H regions between the back electron channel and the source/drain contact. In the off‐state of the dual‐gate‐driven TFTs, the Poole‐Frenkel effect is also enhanced due to back‐channel hole accumulation in the vicinity of the source/drain contact. Furthermore, we observed for the first time that under illumination the dual‐gate‐driven a‐Si:H TFTs exhibit extremely low photo‐leakage currents, much lower than that of single‐gate‐driven TFTs in a certain range (reverse subthreshold region) of negative gate voltages. The high on/off current ratio under backside illumination makes dual‐gate TFTs suitable devices for use as switching elements in liquid‐crystal displays (LCDs) or for other applications.