A 3-V, 0.35-/spl mu/m CMOS Bluetooth receiver IC

A fully integrated CMOS low-IF Bluetooth receiver is presented. The receiver consists of a radio frequency (RF) front end, a phase-locked loop (PLL), an active complex filter, a Gaussian frequency shift keying (GFSK) demodulator, and a frequency offset cancellation circuit. The highlights of the receiver include a low-power active complex filter with a nonconventional tuning scheme and a high-performance mixed-mode GFSK demodulator. The chip was fabricated on a 6.25-mm/sup 2/ die using TSMC 0.35-/spl mu/m standard CMOS process. -82 dBm sensitivity at 1e-3 bit error rate, -10 dBm IIP3, and 15 dB noise figure were achieved in the measurements. The receiver active current is about 65 mA from a 3-V power supply.     

A low-power CMOS Bluetooth RF transceiver with a digital offset canceling DLL-based GFSK demodulator

This paper presents a fully integrated 0.18-/spl mu/m CMOS Bluetooth transceiver. The chip consumes 33 mA in receive mode and 25 mA in transmit mode from a 3-V system supply. The receiver uses a low-IF (3-MHz) architecture, and the transmitter uses a direct modulation with ROM-based Gaussian low-pass filter and I/Q direct digital frequency synthesizer for high level of integration and low power consumption. A new frequency shift keying demodulator based on a delay-locked loop with a digital frequency offset canceller is proposed. The demodulator operates without harmonic distortion, handles up to /spl plusmn/160-kHz frequency offset, and consumes only 2 mA from a 1.8-V supply. The receiver dynamic range is from -78 dBm to -16 dBm at 0.1% bit-error rate, and the transmitter delivers a maximum of 0 dBm with 20-dB digital power control capability.     

A 900 MHz Zero‐IF RF Transceiver for IEEE 802.15.4g SUN OFDM Systems

This paper presents a 900 MHz zero‐IF RF transceiver for IEEE 802.15.4g Smart Utility Networks OFDM systems. The proposed RF transceiver comprises an RF front end, a Tx baseband analog circuit, an Rx baseband analog circuit, and a ΔΣ fractional‐N frequency synthesizer. In the RF front end, re‐use of a matching network reduces the chip size of the RF transceiver. Since a T/Rx switch is implemented only at the input of the low‐noise amplifier, the driver amplifier can deliver its output power to an antenna without any signal loss; thus, leading to a low dc power consumption. The proposed current‐driven passive mixer in Rx and voltage‐mode passive mixer in Tx can mitigate the IQ crosstalk problem, while maintaining 50% duty‐cycle in local oscillator clocks. The overall Rx‐baseband circuits can provide a voltage gain of 70 dB with a 1 dB gain control step. The proposed RF transceiver is implemented in a 0.18 μm CMOS technology and consumes 37 mA in Tx mode and 38 mA in Rx mode from a 1.8 V supply voltage. The fabricated chip shows a Tx average power of ?2 dBm, a sensitivity level of ?103 dBm at 100 Kbps with , an Rx input P_1dB of ?11 dBm, and an Rx input IP3 of ?2.3 dBm.     

A dual-mode 802.11b/bluetooth radio in 0.35-/spl mu/m CMOS

A fully integrated dual-mode CMOS transceiver tuned to 2.4 GHz consumes 65 mA in receive mode and 78 mA in transmit mode from a 3-V supply. The radio includes all the receive and transmit building blocks, such as frequency synthesizer, voltage-controlled oscillator (VCO), and power amplifier, and is intended for use in 802.11b and Bluetooth applications. The Bluetooth receiver uses a low-IF architecture for higher level of integration and lower power consumption, while the 802.11b receiver is direct conversion. The receiver achieves a typical sensitivity of -88 dBm at 11 Mb/s for 802.11b, and -83 dBm for Bluetooth mode. The receiver minimum IIP3 is -8 dBm. Both transmitters use a direct-conversion architecture, and deliver a nominal output power of 0 dBm, with a power range of 20 dB in 2-dB steps.     

A GFSK demodulator for low-IF Bluetooth receiver

An efficient mixed-mode Gaussian frequency-shift keying (GFSK) demodulator with a frequency offset cancellation circuit is presented. The structure is suitable for a low-IF Bluetooth receiver and can also be applied to other receivers involving continuous phase shift keying (CPSK) signals. The demodulator implementation is robust to tolerate process variations without requiring calibration. It can also track and cancel the time-varying local oscillator frequency offset between transmitter and receiver during the entire reception period. The chip was fabricated in CMOS 0.35-/spl mu/m digital process; it consumes 3 mA from a 3-V power supply and occupies 0.7 mm/sup 2/ of silicon area. A 16.2-dB input signal-to-noise ratio is obtained to achieve 0.1% bit-error rate as specified in Bluetooth specs. The co-channel interference rejection ratio is about 11 dB. Theoretical and experimental results are in good agreement.     

A 2.4-GHz CMOS transceiver for Bluetooth

A fully integrated CMOS transceiver tuned to 2.4 GHz consumes 46 mA in receive mode and 47 mA in transmit mode from a 2.7-V supply. It includes all the receive and transmit building blocks, such as frequency synthesizer, voltage-controlled oscillator (VCO), power amplifier, and demodulator. The receiver uses a low-IF architecture for higher level of integration and lower power consumption. It achieves a sensitivity of -82 dBm at 0.1% BER, and a third-order input intercept point (IIP3) of -7 dBm. The direct-conversion transmitter delivers a GFSK modulated spectrum at a nominal output power of 4 dBm. The on-chip voltage controlled oscillator has a close-in phase-noise of -120 dBc/Hz at 3-MHz offset     

A 1 V Wireless Transceiver for an Ultra-Low-Power SoC for Biotelemetry Applications

This paper presents a 1 V RF transceiver for biotelemetry and wireless body sensor network (WBSN) applications, realized as part of an ultra low power system-on-chip (SoC), the Sensiumtrade. The transceiver utilizes FSK/GFSK modulation at a data rate of 50 kbit/s to provide wireless connectivity between target sensor nodes and a central base-station node in a single-hop star network topology operating in the 862-870 MHz European short-range-device (SRD) and the 902-928 MHz North American Industrial, Scientific & Medical (ISM) frequency bands. Controlled by a proprietary media access controller (MAC) which is hardware implemented on chip, the transceiver operates half-duplex, achieving -102 dBm receiver input sensitivity (for 1E-3 raw bit error rate) and up to -7 dBm transmitter output power through a single antenna port. It consumes 2.1 mA during receive and up to 2.6 mA during transmit from a 0.9 to 1.5 V supply. It is fabricated in a 0.13 mum CMOS technology and occupies 7 mm² in a SoC die size of 4 times 4 mm².     

A 0.18-$muhbox{m}$ CMOS GFSK Analog Front End Using a Bessel-Based Quadrature Discriminator With On-Chip Automatic Tuning

A fully integrated 2-MHz Gaussian frequency-shift keying (GFSK) analog front end for low-IF receivers is presented. The analog GFSK demodulation uses a Bessel-based quadrature discriminator and a differentiator-based data decision circuit, eliminating the need for analog–digital converters while enabling high sensitivity and large frequency offset tolerance. The analog front end consists of a fifth-order Butterworth low-pass prefilter, a seven-stage limiter, a quadrature discriminator with a fourth-order Bessel phase-shift network, a fourth-order Butterworth low-pass postfilter, and a differentiator-based data decision circuit. The prefilter, Bessel phase shifter, postfilter, and differentiator are built using identical $Gm{-}C$ cells and tuned across process variations with a single master–slave phase-locked loop. The GFSK analog front end is implemented in a 1.8-V 0.18-${rm mu}hbox{m}$ CMOS process, recovering 1-Mb/s input data from a 2-MHz GFSK signal with maximum frequency deviation of $pm$160-kHz, frequency offset tolerance from $-$ 38% to $+$ 47%, and input sensitivity of $-$53 dBm and consuming 7 mA of current.      

Low-power transceiver analog front-end circuits for bidirectional high data rate wireless telemetry in medical endoscopy applications

State-of-the-art endoscopy systems require electronics allowing for real-time, bidirectional data transfer. Proposed are 2.4-GHz low-power transceiver analog front-end circuits for bidirectional high data rate wireless telemetry in medical endoscopy applications. The prototype integrates a low-IF receiver analog front-end [low noise amplifier (LNA), double balanced down-converter, bandpass-filtered automatic gain controlled (AGC) loop and amplitude-shift keying (ASK) demodulator], and a direct up-conversion transmitter analog front-end [20-MHz IF phase-locked loop (PLL) with well-defined amplitude control circuit, ASK modulator, up-converter, and power amplifier] on a single chip together with an internal radio frequency oscillator and local oscillating (LO) buffers. Design tradeoffs have been made over the boundaries of the different building blocks to optimize the overall system performance. All building blocks feature circuit topologies that enable comfortable operation at low power consumption. The circuits have been implemented in a 0.25-microm CMOS process. The measured sensitivity of the receiver analog front-end is -70 dBm with a data rate of 256 kbps, and the measured output power of the transmitter analog front-end could achieve -23 dBm with a data rate of 1 Mbps. The integrated circuit consumes a current of 6 mA in receiver mode and 5.6 mA in transmitter mode with a power supply of 2.5 V. This paper shows the feasibility of achieving the analog performance required by the wireless endoscopy capsule system in 0.25 microm CMOS.     

A low power 3-5 GHz CMOS UWB receiver front-end

A novel low power RF receiver front-end for 3-5 GHz UWB is presented. Designed in the 0.13μm CMOS process, the direct conversion receiver features a wideband balun-coupled noise cancelling transconductance input stage, followed by quadrature passive mixers and transimpedance loading amplifiers. Measurement results show that the receiver achieves an input return loss below-8.5 dB across the 3.1-4.7 GHz frequency range, max-imum voltage conversion gain of 27 dB, minimum noise figure of 4 dB, IIP3 of-11.5 dBm, and IIP2 of 33 dBm. Working under 1.2 V supply voltage, the receiver consumes total current of 18 mA including 10 mA by on-chip quadrature LO signal generation and buffer circuits. The chip area with pads is 1.1 × 1.5 mm2.     

A 5-GHz direct-conversion CMOS transceiver utilizing automatic frequency control for the IEEE 802.11a wireless LAN standard

A fully integrated CMOS direct-conversion 5-GHz transceiver with automatic frequency control is implemented in a 0.18-/spl mu/m digital CMOS process and housed in an LPCC-48 package. This chip, along with a companion baseband chip, provides a complete 802.11a solution The transceiver consumes 150 mW in receive mode and 380 mW in transmit mode while transmitting +15-dBm output power. The receiver achieves a sensitivity of better than -93.7dBm and -73.9dBm for 6 Mb/s and 54 Mb/s, respectively (even using hard-decision decoding). The transceiver achieves a 4-dB receive noise figure and a +23-dBm transmitter saturated output power. The transmitter also achieves a transmit error vector magnitude of -33 dB. The IC occupies a total die area of 11.7 mm/sup 2/ and is packaged in a 48-pin LPCC package. The chip passes better than /spl plusmn/2.5-kV ESD performance. Various integrated self-contained or system-level calibration capabilities allow for high performance and high yield.     

A Fully Integrated 2.4-GHz IEEE 802.15.4-Compliant Transceiver for ZigBee™ Applications

A single-chip 2.4-GHz CMOS radio transceiver with integrated baseband processing according to the IEEE 802.15.4 standard is presented. The transceiver consumes 14.7 mA in receive mode and 15.7 mA in transmit mode. The receiver uses a low-IF topology for high sensitivity and low power consumption, and achieves -101 dBm sensitivity for 1% packet error rate. The transmitter topology is based on a PLL direct-modulation scheme. Optimizations of architecture and circuit design level in order to reduce the transceiver power consumption are described. Special attention is paid to the RF front-end design which consumes 2.4mA in receive mode and features bidirectional RF pins. The 5.77 mm² chip is implemented in a standard 0.18-mum CMOS technology. The transmitter delivers +3 dBm into the 100-Omega differential antenna port     

A switch‐controlled multimode narrowband receiver RF front‐end

This work illustrates a flexible and convenient method to build a multimode narrowband receiver RF front‐end by means of controlled switches, switched capacitors, and switched inductors. The front‐end comprises a dual‐gain‐mode narrowband low‐noise amplifier (LNA) and a dual‐linearity‐mode mixer. A four‐mode receiver RF front‐end constructed with the dual‐gain‐mode LNA and the dual‐linearity‐mode mixer operating in frequency band range from 1800 to 2050 MHz was demonstrated with an IBM 90‐nm CMOS process. The front‐end achieves a 1/1.6 dB noise figure, 30/20 dB power gain, and 16/?10 dBm third‐order input intercept point while draws a 5.9/3.6 mA current from a 1.8‐V supply voltage at the low noise mode and high linearity mode, respectively. The proposed technique can be employed to build an intelligent mobile system.     

Low‐Power Direct Conversion Transceiver for 915 MHz Band IEEE 802.15.4b Standard Based on 0.18 μm CMOS Technology

This paper presents the experimental results of a low‐power low‐cost RF transceiver for the 915 MHz band IEEE 802.15.4b standard. Low power and low cost are achieved by optimizing the transceiver architecture and circuit design techniques. The proposed transceiver shares the analog baseband section for both receive and transmit modes to reduce the silicon area. The RF transceiver consumes 11.2 mA in receive mode and 22.5 mA in transmit mode under a supply voltage of 1.8 V, in which 5 mA of quadrature voltage controlled oscillator is included. The proposed transceiver is implemented in a 0.18 μm CMOS process and occupies 10 mm² of silicon area.     

应用于GSM/EDGE零中频接收机的CMOS射频前端

介绍了一个零中频接收机CMOS射频前端,适用于双带(900MHz/1800 MHz)GSM/EDGE;E系统.射频前端由两个独立的低噪声放大器和正交混频器组成,并且为了降低闪烁噪声采用了电流模式无源混频器.该电路采用0.13 μm CMOS工艺流片,芯片面积为0.9 mm×1.0 mm.芯片测试结果表明:射频前端在90...     

3‐Level Envelope Delta‐Sigma Modulation RF Signal Generator for High‐Efficiency Transmitters

This paper presents a 0.13 μm CMOS 3‐level envelope delta‐sigma modulation (EDSM) RF signal generator, which synthesizes a 2.6 GHz‐centered fully symmetrical 3‐level EDSM signal for high‐efficiency power amplifier architectures. It consists of an I‐Q phase modulator, a Class B wideband buffer, an up‐conversion mixer, a D2S, and a Class AB wideband drive amplifier. To preserve fast phase transition in the 3‐state envelope level, the wideband buffer has an RLC load and the driver amplifier uses a second‐order BPF as its load to provide enough bandwidth. To achieve an accurate 3‐state envelope level in the up‐mixer output, the LO bias level is optimized. The I‐Q phase modulator adopts a modified quadrature passive mixer topology and mitigates the I‐Q crosstalk problem using a 50% duty cycle in LO clocks. The fabricated chip provides an average output power of –1.5 dBm and an error vector magnitude (EVM) of 3.89% for 3GPP LTE 64 QAM input signals with a channel bandwidth of 10/20 MHz, as well as consuming 60 mW for both channels from a 1.2 V/2.5 V supply voltage.     

A monolithic 3.1-4.8 GHz MB-OFDM UWB transceiver in 0.18-μm CMOS

A monolithic RF transceiver for an MB-OFDM UWB system in 3.1-4.8 GHz is presented.The transceiver adopts direct-conversion architecture and integrates all building blocks including a gain controllable wideband LNA,a I/Q merged quadrature mixer,a fifth-order Gm-C bi-quad Chebyshev LPF/VGA,a fast-settling frequency synthesizer with a poly-phase filter,a linear broadband up-conversion quadrature modulator,an active D2S converter and a variablegain power amplifier.The ESD protected transceiver is fabricated in Jazz Semiconductor's 0.18-μm RF CMOS with an area of 6.1 mm2 and draws a total current of 221 mA from 1.8-V supply.The receiver achieves a maximum voltage gain of 68 dB with a control range of 42 dB in 6 dB/Step,noise figures of 5.5-8.8 dB for three sub-bands,and an inband/out-band IIP3 better than-4 dBm/+9 dBm.The transmitter achieves an output power ranging from-10.7 to-3dBm with gain control,an output P1dB better than-7.7 dBm,a sideband rejection about 32.4 dBc,and LO suppression of 31.1 dBc.The hopping time among sub-bands is less than 2.05 ns.     

A fully integrated 0.18-/spl mu/m CMOS direct conversion receiver front-end with on-chip LO for UMTS

This paper presents a 0.18-/spl mu/m CMOS direct-conversion IC realized for the Universal Mobile Telecommunication System (UMTS). The chip comprises a variable gain low-noise amplifier, quadrature mixers, variable gain amplifiers, and local oscillator generation circuits. The solution is based on very high dynamic range front-end blocks, a low-power superharmonic injection-locking technique for quadrature generation and continuous-time dc offset removal. Measured performances are an overall gain variable between 21 and 47 dB, 5.6 dB noise figure, -2 dBm out-of-band IIP3, -10 dBm in-band IIP3, 44.8-dBm minimum IIP2, and -155-dBc/Hz phase noise at 135 MHz from carrier frequency, while drawing 21 mA from a 1.8-V supply.     

A Single-Chip CMOS Transceiver for UHF Mobile RFID Reader

This paper describes a single-antenna low-power single-chip radio frequency identification (RFID) reader for mobile phone applications. The reader integrates an RF transceiver, data converters, a digital baseband modem, an MPU, memory, and host interfaces. The direct conversion RF receiver architecture with the highly linear RF front-end circuit and DC offset cancellation circuit is used to give good immunity to the large transmitter leakage. It is suitable for a mobile phone reader with single-antenna architecture and low-power reader solution. The transmitter is implemented in the direct I/Q up-conversion architecture. The frequency synthesizer based on a fractional-N phase-locked-loop topology offering 900 MHz quadrature LO signals is also integrated with the RF transceiver. The reader is fabricated in a 0.18 mum CMOS technology, and its die size is 4.5 mm times 5.3 mm including electrostatic discharge I/O pads. The reader consumes a total current of 89 mA apart from the external power amplifier with 1.8 V supply voltage. It achieves an 8 dBm P1dB, an 18.5 dBm IIP3, and a maximum transmitter output power of 4 dBm.     

A highly integrated dual-band multimode wireless LAN transceiver

A fully integrated radio transceiver chip for the 2.4- and 5-GHz WLAN standards 802.11a/b/g is presented in a 0.25-/spl mu/m 40-GHz BiCMOS technology. The chip integrates the low-noise amplifiers, mixers, channel filters, programmable gain control, synthesizers with voltage-controlled oscillators and reference oscillator, transmitters, antialiasing filters, and voltage regulators. The key performances of the presented transceiver are a receive sensitivity of -85 dBm and -74 dBm for 11-Mb/s complementary code keying (CCK) and 54 Mb/s orthogonal frequency division multiplexing (OFDM) modes, respectively, and an error vector magnitude of -35 dB measured at the transmitter with an output power of -4 dBm at 54-Mb/s 802.11a mode. The transceiver exceeds all IEEE requirements for the 802.11a/b/g CCK and OFDM standards and supports a frequency range of 4.9 to 6 GHz for the future extensions of the 802.11a standard in different countries.