刚挠结合板用改性粘结材料研究

介绍了自主研发改性粘结片AT-25在刚挠结合板中之应用,与BH-25、AD-25HH进行比较后,结果表明：自主研发改性粘结片AT-25应用于刚挠结合板具有较好效果。     

刚挠结合板阻抗设计研究

随着数据传输速率越来越快,刚挠结合板的阻抗要求也越来越高,而刚挠结合板和普通刚性板的阻抗有很大区别,这对刚挠结合板的阻抗设计和控制带来很大的挑战,其阻抗设计值与理论值差别较大,往往实际测值超出理论值范围,达不到客户要求。针对如何满足客户刚挠结合板成品阻抗要求从工程设计方面进行探讨,希望能对PCB制造业同行有所帮助。     

挠性板部分埋入制作刚挠结合板

介绍了一种刚挠结合板制作新技术,只在需要弯折的部位埋入挠性板,通过挠性板使各刚性板之间实现互连。详细分析了设计与材料对刚挠结合板的影响,研究了预压合保护膜、挠性板埋入层压等关键工艺,给出了工艺难点的具体解决办法。结果表明,该技术提高了挠性板材的使用率,简化了挠性板及刚挠结合板加工工艺,使刚挠结合板成品率提高至少8%。     

刚挠结合印制板挠性区外观不良改善研究

目前多层刚挠结合板,软板之间通常都采用不流胶PP压合,其PP在压合前需对挠性区的PP进行铣槽开窗,从而避免PP黏结片与挠性部位粘连;但不流胶PP铣槽加工极易产生PP粉,叠层时难以清洁,成品揭盖后发现挠性区覆盖膜上残留较多PP胶团,导致产品外观不良,无法满足客户产品外观质量的要求。本文提出的改进方案是利用耐高温胶带,在压合前对挠性区域覆盖膜进行保护,外层揭盖时同步去除,从而有效改善PP粉残留问题,极大提升刚挠结合板的外观良率。     

刚挠结合板孔内金属化工艺探讨

文章对刚挠结合板孔内金属化制作工艺进行探讨,分别对钻孔、去钻污及化学沉镀铜工艺进行陈述,利用实验分析钻孔作业参数对刚挠结合板孔内金属化的重要性,在现有制程条件下以实现刚挠结合板孔内金属化的质量要求。     

刚挠结合板钻孔披锋改善研究

含多张软板的刚挠结合板,为了保证压合填胶效果以及满足产品对于厚度的要求,外层芯板有时会采用较薄的材料。而压合过程中使用高附型材料会导致压合后板面不平整,孔环位置会因内层软板掏铜而向内凹陷,钻孔后披锋严重。文章针对刚挠结合板钻孔披锋严重的问题进行探究,提出一种改善披锋的加工方法。     

PCB刚挠结合板加工工艺技术

文章从一个全面的角度阐述了刚挠结合板的制作流程,分析并解决了软硬结合板制作中的技术难点,可以有效的指导该类型产品批量生产,具有较强的市场推广性。     

刚挠结合板激光加工工艺研究

刚挠结合板是近几年PCB行业重点发展的新产品,广泛应用于航空航天、医疗、高端电子产品。作为目前PCB行业中利润最高的产品,全球众多的在PCB行业有重大影响力的PCB制造商都在积极地研发和制造相关产品。然而,由于其与普通的硬板绝然不同的结构,在制造工艺上也存在着不同的地方,特别是有些传统的制作工艺难以解决的问题,也阻碍了它的进一步发展。激光作为一种新型的加工工具,特别是进入21世纪以来,在各行各业都得到了广泛的应用。近来,在PCB设备厂商的积极研发及推动下,激光在PCB行业的应用也越来越广泛。在刚挠结合板的制作中,开盖和外形成型一直是制造过程中的难点,而激光基于自身的特点,在这些制程中相比传统机械加工方式有许多优点,如高效率、高精度、高良品率、挠性便捷的加工方式等。另外,在R-Flex板的制作中,激光还可加工P/P料的异型槽孔。本文将对激光在R-Flex板的制作中的这些应用最前沿的研究成果进行总结和阐述,相信在这些技术的推动下,刚挠结合板一定能够得到更快速的发展和更广泛的应用。     

外层挠性结构的刚挠结合板线路制作探讨

文章着重讲述在刚挠结合板制作过程中,外层为挠板结构设计的刚挠结合板线路及通孔铜厚的实现方法,以及制作过程中制作难点和易产生缺陷的解决途径。     

刚挠板软板区域揭盖方法研究

随着电子产品不断向多功能化、小型轻量化、高性能化的方向发展,刚挠板因具有立体组装的便利性特点而得到较迅猛的发展,刚挠板品质薄弱处集中在刚挠结合区,特别是常规的揭盖工艺：“机械揭盖+激光成型（挠性区域）”,机械揭盖通常控深后还需配合手动采用刀笔挑拨揭盖,不仅存在刀笔误伤挠性区域线路的风险,电测试也不容易测出,在客户端安装回流后出现开路,而且采用激光严重影响激光产能,成本高,又存在碳黑风险。相比传统的揭盖工艺,采用新型的揭盖方法,是一种高品质,高效率,低成本的具备竞争力的刚挠板揭盖工艺。     

OLED柔性衬底封装材料研究进展

有机电致发光器件在柔性衬底上的制备是下一代显示技术发展的重要方向。根据柔性显示对封装材料的要求,综述了柔性衬底材料的种类及研究应用现状,重点介绍了聚合物柔性衬底材料的研究进展。     

Research on Crucial Manufacturing Process of Rigid-Flex PCB

The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Board （PCB） is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process, is discussed in detail. Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches to 89.4%.     

Highly Conductive,Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

Flexible interconnects are one of the key elements in realizing next‐generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip‐chip and surface‐mount interconnections are less commonly used and reported. A polyurethane (PU)‐based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10^?5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU‐ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die‐attach material for flip‐chip, as vertical interconnect access (VIA)‐filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio‐frequency devices.     

Water‐Based Isotropically Conductive Adhesives: Towards Green and Low‐Cost Flexible Electronics

This paper reports the first high‐performance water‐based isotropically conductive adhesives (WBICAs) – a promising material for both electrical interconnects and printed circuits for ultralow‐cost flexible/foldable printed electronics. Through combining surface iodination and in situ reduction treatment, the electrically conductivity of the WBICAs are dramatically improved (8 × 10^‐5 Ω cm with 80 wt% of silver); moreover, their reliability (stable for at least 1440 h during 85 °C/85% RH aging) meets the essential requirements for microelectronic applications. Prototyped applications in carrying light emitting diode (LED) arrays and radio frequency identification (RFID) antennas on flexible substrates were demonstrated, which showed satisfactory performances. Moreover, their water‐based character may render them more environmentally benign (no volatile organic chemicals involved in the printing and machine maintenance processes), more convenient in processing (reducing the processing steps), and energy economic (thermally sintering the silver fillers and curing the resin is not necessary unlike conventional ICAs). Therefore, they are especially advantageous for mass‐fabricating flexible electronic devices when coupled with paper and other low‐cost substrate materials such as PET, PI, wood, rubber, and textiles.     

Advanced Flexible Materials from Nanocellulose

With the increase of environmental pollution and depletion of fossil fuel resources, the utilization of renewable biomass resources for developing functional materials or fine chemicals is of great value and has attracted considerable attention. Nanocellulose, as a well-known renewable nanomaterial, is regarded as a promising nano building block for advanced functional materials owing to its unique structure and properties, as well as natural abundance. Typically, its high mechanical strength, structural flexibility, reinforcing capabilities, and tunable self-assembly behavior makes it highly attractive to fabricate flexible materials for various applications. Herein, the recent progress in the design, properties, and applications of advanced flexible materials from nanocellulose is comprehensively summarized. The preparation and properties of nanocellulose are first briefly introduced and discuss its merits in fabricating flexible materials. Then, various advanced flexible materials from nanocellulose are introduced, and the critical role of nanocellulose in constructing flexible materials is highlighted based on its intrinsic properties. After that, their applications in energy storage, electronics, sensor, biomedical, thermally insulating, photonic devices, etc., are presented. At last, the outlook of the current challenges and future perspectives for developing nanocellulose-derived flexible materials are discussed.     

应用于刚挠印制板无铅工艺兼容的不流动性半固化片

当今电子产品的功能不断增加，随之而来的是对电子产品设计多样化的要求。正是由于这种需求，刚挠结合板以其巨大的技术进步和不断增加的需求而获得关注。这其中的不流动性半固化片是将刚性板与挠性板结合在一起的关键材料，它的主要功能是在刚性材料和挠性材料之间形成可靠性的粘接层，所以对该材料界面性质和功能进行研究。对于不流动性半固化片的应用来说是至关重要的。现在，一种新的基于酚醛固化树脂体系的不流动性半固化片已经被开发出来，这种新型材料显示了优异的耐热性和可靠性。经过热性能分析和热冲击测试，这种新型材料的性能比传统的DICY固化环氧树脂体系材料更加优越。     

Advanced Thermoelectric Materials for Flexible Cooling Application

Flexible cooling devices, which aim to fulfill the essential requirement of complex working environments and enable local heat dissipation, have become the cutting-edge area of refrigeration technology. Thermoelectric (TE) material represents a promising candidate for various flexible cooling applications, including wearable personal thermoregulation devices. With the increasing interest in the Peltier effect of conductive polymers and inorganic films on flexible substrates, flexible cooling devices have undergone rapid development. Herein, the fundamental mechanisms, basic parameters, and temperature measurement techniques for evaluating the cooling performance are summarized. Moreover, recent progress on TE materials, such as flexible inorganic and organic materials for Peltier cooling studies, is reviewed. More importantly, insights are provided into the key strategies for high-performance Peltier devices. The final part details the existing challenges and perspectives on flexible TE cooling to inspire additional research interests toward the advancement of refrigeration technology.     

先进的刚-挠性PCB新材料和积层结构

介绍了具有可弯曲的和可用于HDI板积层的新材料而生产的阶跃式刚-挠性PCB.这种新材料既可用于HDI的积层上,又可以应用刚性HDI的设计规则进行设计和采用刚性PCB生产技术与工艺进行生产.     

激光微孔加工技术在刚挠性基材中的研究

刚挠结合印制板向高密度互联方向发展,要求线路更细,导通孔直径更小。适合刚挠结合印制板的微导通孔加工工艺在刚挠结合印制板制造工艺中起着关键作用,微孔加工工艺中普遍采用激光技术。文章分析了激光微孔加工中的各影响因素,用正交试验法作对比试验,优化各因素参数,讨论了各因素与基板材料的关系,并拟合出方程定量描述此种关系。根据优化方程选取激光微孔参数,在挠性与刚性基板材料上取得理想效果。     

有机显示器和电子器件的柔性基板和封装

尽管柔性显示技术面临性能的挑战,第一款商业化的产品仍计划在2006-2007年度投入市场。