A high-performance 40-85 GHz MMIC SPDT switch using FET-integrated transmission line structure

A compact ultra-broadband distributed SPDT switch has been developed using GaAs PHEMTs. An FET-integrated transmission line structure, where the source pad of the shunt FET has been integrated into the signal line while the drain has been grounded to a via-hole with minimum parasitic inductance, has been proposed to extend the operating bandwidth of the distributed switches. SPDT and SPST switches using this structure have been fabricated using a commercial GaAs PHEMT foundry. The SPDT switch showed low insertion loss (<2 dB) and good isolation (>30 dB) over an octave bandwidth from 40 to 85 GHz. At 77 GHz, the SPDT switch showed extremely low insertion loss of 1.4 dB and high isolation of 38 dB. The chip size was as small as 1.45/spl times/1.0 mm/sup 2/. To the best of our knowledge, this is among the best performance ever reported for an octave-band SPDT switch at this frequency range. SPST switch also showed the excellent performance with the insertion loss of 0.4 dB and isolation of 34 dB at 60 GHz.     

Fin-line PIN-diode attenuators and switches for 94 GHz range

The letter reports new results of fin-line PIN-diode attenuators and switches for the 94 GHz range. Design and performance of SPST and SPDT switches?single-pole single-throw and single-pole double-throw, respectively?will be presented. The attenuation of the SPST switch, for example, can be adjusted between 2 and 35 dB over the entire waveguide band from 75 to 110 GHz.     

A 90-dB Microstrip Switch on a Plastic Substrate (Correspondence)

A single-pole double-throw (SPDT) microstrip switch has been designed on a plastic (polyolefin) substrate to switch two 10-W CW carriers into a common load over the frequency range 1.7 to 2.3 GHz. No tuning adjustments are used over this 30-percent bandwidth to obtain a 90-dB minimum isolation, a 23-dB minimum return loss, and a 1-dB maximum insertion loss. Units now in production typically have a 0.6-dB insertion loss, a 26-dB return loss, and isolation levels of 105/spl plus mn/5 dB.     

Single-pole double-throw CMOS switches for 900-MHz and 2.4-GHz applications on p/sup -/silicon substrates

A 900-MHz single-pole double-throw (SPDT) switch with an insertion loss of 0.5 dB and a 2.4-GHz SPDT switch with an insertion loss of 0.8 dB were implemented using 3.3-V 0.35-/spl mu/m NMOS transistors in a 0.18-/spl mu/m bulk CMOS process utilizing 20-/spl Omega//spl middot/cm p/sup -/ substrates. Impedance transformation was used to reduce the source and load impedances seen by the switch to increase the power handling capability. SPDT switches with 30-/spl Omega/ impedance transformation networks exhibit 0.97-dB insertion loss and 24.3-dBm output P/sub 1dB/ when tuned for 900-MHz operation, and 1.10-dB insertion loss and 20.6-dBm output P/sub 1dB/ when tuned for 2.4-GHz operation. The 2.4-GHz switch is the first bulk CMOS switch which can be used for 802.11b wireless local area network applications.     

5.8-GHz CMOS T/R switches with high and low substrate resistances in a 0.18-/spl mu/m CMOS process

Two single-pole, double-throw transmit/receive switches were designed and fabricated with different substrate resistances using a 0.18-/spl mu/m p/sup $/substrate CMOS process. The switch with low substrate resistances exhibits 0.8-dB insertion loss and 17-dBm P/sub 1dB/ at 5.825 GHz, whereas the switch with high substrate resistances has 1-dB insertion loss and 18-dBm P/sub 1dB/. These results suggest that the optimal insertion loss can be achieved with low substrate resistances and 5.8-GHz T/R switches with excellent insertion loss and reasonable power handling capability can be implemented in a 0.18-/spl mu/m CMOS process.     

X-波段MEMS单刀双掷开关的研究

利用X-波段MEMS单刀单掷膜开关和成熟的微带线技术设计了一种X-波段MEMS单刀双掷膜开关,其模拟结果为;阈值电压为19V左右,工作频率为8～12GHz,在中心频率（10GHz）处,导通开关的插入损耗为-0．2dB,截止开关的隔离度为-21dB,开关的回波损耗为-43dB。     

Analysis and Design of Bandpass Single-Pole–Double-Throw FET Filter-Integrated Switches

This paper proposes a method to integrate a single-pole - double-throw (SPDT) switch and a quarter-wavelength bandpass filter. A 1-GHz SPDT hybrid switch and a 60-GHz pseudomorphic HEMT monolithic-microwave integrated-circuit SPDT switch with 30% fractional bandwidth are demonstrated. The 1-GHz SPDT switch achieves 1.5-dB insertion loss and 20-dB isolation at center frequency. For the 60-GHz SPDT switch, the measured insertion loss is lower than 2.5 dB and the isolation is higher than 27 dB. The low insertion loss and high isolation show that no performance is degraded when integrating the filter function. The analysis of the power performance is also described. Using the device dc-IV curves, the power compression point can be predicted.     

DC－40GHzMMIC开关

ＤＣ－４０ＧＨｚＭＭＩＣ开关叶禹康，俞土法，伍祥冰（南京电子器件研究所，２１００１６）提要＊用微波单片集成电路（ＭＭＩＣ）技术设计制作了高隔离度、超快速ＤＣ－４０ＧＨｚＭＭＩＣ开关（ＳＰＳＴ）。开关采用串联、并联单元ＭＥＳＦＥＴ兼用的电路结构。芯片尺...     

DC－40GHzMMIC开关

ＤＣ－４０ＧＨｚＭＭＩＣ开关叶禹康，俞土法，伍祥冰（南京电子器件研究所，２１００１６）提要＊用微波单片集成电路（ＭＭＩＣ）技术设计制作了高隔离度、超快速ＤＣ－４０ＧＨｚＭＭＩＣ开关（ＳＰＳＴ）。开关采用串联、并联单元ＭＥＳＦＥＴ兼用的电路结构。芯片尺...     

A novel loss compensation technique analysis and design for 60 GHz CMOS SPDT switch

A novel loss compensation technique for a series-shunt single-pole double-throw (SPDT) switch is presented operating in the 60 GHz. The feed-forward compensation network which is composed of an NMOS, a couple capacitance and a shunt inductance can reduce the impact of the feed forward capacitance to reduce the insertion loss and improve the isolation of the SPDT switch. The measured insertion loss and isolation characteristics of the switch somewhat deviating from the 60 GHz are analyzed revealing that the inaccuracy of the MOS model can greatly degrade the performance of the switch. The switch is implemented in TSMC 90-nm CMOS process and exhibits an isolation of above 27 dB at transmitter mode, and the insertion loss of 1.8-3 dB at 30-65 GHz by layout simulation. The measured insertion loss is 2.45 dB at 52 GHz and keeps<4 dB at 30-64 GHz. The measured isolation is better than 25 dB at 30-64 GHz and the measured return loss is better than 10 dB at 30-65 GHz. A measured input 1 dB gain compression point of the switch is 13 dBm at 52 GHz and 15 dBm at 60 GHz. The simulated switching speed with rise time and fall time are 720 and 520 ps, respectively. The active chip size of the proposed switch is 0.5×0.95 mm².     

Low-power InP-HEMT switch ICs integrating miniaturized 2/spl times/2 switches for 10-Gb/s systems

This paper presents a wideband cold-FET switch with virtually zero power dissipation. The use of InP HEMTs with a low R/sub on//spl middot/C/sub off/ product enables us to configure a DC-to-over-10-GHz single-pole double-throw (SPDT) switch without using a shunt FET. The series-FET configuration offers a logic-level-independent interface and makes possible positive control voltage operation in spite of using depletion-mode FETs. A miniaturized 2/spl times/2 switch using two SPDT switches yields an insertion loss of less than 1.16 dB and isolation of more than 21.2 dB below 10 GHz, which allows us to increase the scale of the switch in a single chip easily. The add-drop operation combining two 2/spl times/2 switches in a single chip and a 4/spl times/4 switch IC integrating four 2/spl times/2 switches are presented. The packaged ICs achieve error-free operation up to 12.5 Gb/s with either positive or negative logic-level input. Extremely fast switching of /spl sim/140 ps is also successfully demonstrated.     

GaAs PIN二极管大功率毫米波单刀双掷开关单片

采用76.2mm(3英寸)GaAs PIN二极管工艺设计和制作了大功率毫米波单刀双掷开关单片。采用并联结构的单刀双掷开关以获得较高的功率特性。在片测试表明,在30～36GHz工作频段,开关导通支路插损1.0dB,驻波优于1.5,开关关断端口隔离度大于34dB。开关在导通态下输入功率0.5dB压缩点P-0.5 dB大于5W。     

一种高线性度非对称单刀双掷开关的设计

介绍了一种用于射频收发系统的16 GHz、低损耗、高隔离度、高线性度的非对称型单刀双掷开关。针对串联和并联晶体管尺寸对插入损耗及隔离度的影响、对称型和非对称型两种结构各自的特点,以及选择非对称结构的原因进行了分析。采用90 nm CMOS工艺实现,设计中采用深N阱MOS管,并在必要的节点加入交流悬浮偏置,提高开关整体性能。测试表明,Rx模式下,插损为0.77 dB,隔离度为22.9 dB,输入1 dB压缩点为9 dBm;Tx模式下,插损为2.14 dB,隔离度为20.2 dB,输入1 dB压缩点大于15 dBm。     

An Internally-Matched High-Isolation CMOS SPDT Switch Using Leakage Cancellation Technique

An internally-matched single-pole double-throw (SPDT) switch with high isolation is presented. The high isolation is resulted from the leakage cancellation by employing a compensation circuit, which also achieves impedance match for all ports. The SPDT chip, implemented in a 0.18-mum CMOS process, achieves a measured isolation of 72 dB, an insertion loss of 1.1 dB, return losses better than 10 dB at all ports and PidB of 19.3 dBm at 1.9 GHz.     

单刀双掷RF MEMS开关的研究与设计

介绍了一种基于横向金属接触的DC-5GHz单刀双掷RF MEMS开关的研究与设计．横向金属接触开关包括了一套有限的共面波导（FGCPW）传输线和左右摆动的悬臂梁．为了降低开启电压,设计了一种曲折型的折叠梁结构,通过理论分析与仿真实验验证了该结构的可行性,并利用MetalMUMPs工艺加以实现．测试结果显示,该开关在5GHz处的插入损耗为0．8dB,回波损耗大于20dB,隔离度为40dB．测得最低开启电压为33V．     

Signal generation, control, and frequency conversion AlGaN/GaN HEMT MMICs

We review the design and experimental results of three new AlGaN/GaN high electron-mobility transistor monolithic microwave integrated circuits: a voltage-controlled oscillator (VCO), a single-pole-double-throw switch (SPDT), and a resistive field-effect transistor mixer. The VCO exhibits frequency range between 8.5-9.5 GHz with maximum output power of 35 dBm (at V/sub ds/=30 V) across a 50-/spl Omega/ load. The L/S band SPDT switch at 0.9, 1.8, and 2.1 GHz was measured to have 0.87-, 0.96-, 1-dB insertion loss and 46-, 42-, and 41-dB isolation, respectively. The switch also shows linear performance for the power levels up to 1 W in the insertion mode. A singly ended X-band resistive mixer has exhibited very low intermodulation, less than -60 dBc for the second and third harmonics of the IF at the RF power level of 10 dBm, and high power handling, P/sub 1 dB/ is estimated to be at least 1 W, with the conversion loss of 17 dB.     

Resonated GaAs FET devices for microwave switching

Several designs of monolithic switches for X-band applications have been fabricated and tested. These switches, which consist of two parallel-resonated GaAs FET's in a series SPDT configuration, have very low dc power dissipation, low insertion loss, and are bidirectional. An insertion loss of 0.7 dB with 28-dB isolation at 10.2 GHz has been measured for these devices. A simple equivalent circuit model is presented which explains reasonably well the basic features of resonated GaAs FET switches. The tradeoffs between performance and bandwidth, and the important design criteria, particularly with respect to the layout of monolithic inductors, are investigated.     

Monolithic 2-18 GHz low loss, on-chip biased PIN diode switches

Two state-of-the-art monolithic GaAs PIN diode switches have been designed, fabricated and tested. These single-pole double-throw (SPDT) switches exhibit insertion losses of 1.15±0.15 dB over a 2-18 GHz band, which is an unprecedented performance in loss and flatness for monolithic wideband switches incorporating on-chip bias networks. Isolation and return loss are greater than 43 dB and 12 dB, respectively, and the input port power handling is 23 dBm at 1-dB insertion loss compression. These performance characteristics were measured at a nominal bias setting of -8 V, which corresponds to 3.7 mA of series diode bias current and a total dc power consumption of 55 mW. The input power at the third-order interception is 40 dBm. The switches can handle up to 31 dBm (1.25 W) at a higher bias of -18 V and 9.3 mA     

Microwave switching with parallel-resonated GaAs FETS

The use of GaAs FETs as microwave switches is discussed, and the feasibility of such devices for applications requiring ultra low dc power consumption, low insertion loss, and bidirectionality is demonstrated. A discrete SPST switch consisting of two parallel-resonated single-gate GaAs FETs exhibited 0.5 db insertion loss with 25 db isolation at 8.5 GHz. The first monolithic SPDT switch incorporating parallel-resonated GaAs FETs is also reported.     

单片集成GaAs MESFET微波开关——Ⅱ、宽带单刀单掷和单刀双掷开关电路

本文介绍了单片集成GaAs MESFET微波开关的设计方法和制作工艺.利用空气桥和通孔接地等工艺技术,研制成的调配型宽带单刀单掷开关在0.01～7GHz内,插损为2～3.5dB,隔离度不小于32dB;分布型宽带单刀双掷开关在4.5～7GHz内,插损为1～2dB,隔离度不小于21dB,5GHz下的最大功率容量为3瓦.实验也证实电路的开通时间小于0.6ns.