Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> Superlattices Grown by Nanoalloying

In this work, Bi₂Te₃-Sb₂Te₃ superlattices were prepared by the nanoalloying approach. Very thin layers of Bi, Sb, and Te were deposited on cold substrates, rebuilding the crystal structure of V₂VI₃ compounds. Nanoalloyed super- lattices consisting of alternating Bi₂Te₃ and Sb₂Te₃ layers were grown with a thickness of 9 nm for the individual layers. The as-grown layers were annealed under different conditions to optimize the thermoelectric parameters. The obtained layers were investigated in their as-grown and annealed states using x-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive x-ray (EDX) spectroscopy, transmission electron microscopy (TEM), and electrical measurements. A lower limit of the elemental layer thickness was found to have c-orientation. Pure nanoalloyed Sb₂Te₃ layers were p-type as expected; however, it was impossible to synthesize p-type Bi₂Te₃ layers. Hence the Bi₂Te₃-Sb₂Te₃ superlattices consisting of alternating n- and p-type layers showed poor thermoelectric properties.     

Improvement of Thermoelectric Power Factor of Hydrothermally Prepared Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Compared with its Solvothermally Prepared Counterpart

We report on the successful hydrothermal synthesis of Bi_0.5Sb_1.5Te₃, using water as the solvent. The products of the hydrothermally prepared Bi_0.5 Sb_1.5Te₃ were hexagonal platelets with edges of 200–1500 nm and thicknesses of 30–50 nm. Both the Seebeck coefficient and electrical conductivity of the hydrothermally prepared Bi_0.5Sb_1.5Te₃ were larger than those of the solvothermally prepared counterpart. Hall measurements of Bi_0.5Sb_1.5Te₃ at room temperature indicated that the charge carrier was p-type, with a carrier concentration of 9.47 × 10¹⁸ cm⁻³ and 1.42 × 10¹⁹ cm⁻³ for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively. The thermoelectric power factor at 290 K was 10.4 μW/cm K² and 2.9 μW/cm K² for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively.     

Solid-State Synthesis of Te-Doped Mg<Subscript>2</Subscript>Si

Te-doped Mg₂Si (Mg₂Si:Te _m , m = 0, 0.01, 0.02, 0.03, 0.05) alloys were synthesized by a solid-state reaction and mechanical alloying. The electronic transport properties (Hall coefficient, carrier concentration, and mobility) and thermoelectric properties (Seebeck coefficient, electrical conductivity, thermal conductivity, and figure of merit) were examined. Mg₂Si was synthesized successfully by a solid-state reaction at 673 K for 6 h, and Te-doped Mg₂Si powders were obtained by mechanical alloying for 24 h. The alloys were fully consolidated by hot-pressing at 1073 K for 1 h. All the Mg₂Si:Te _m samples showed n-type conduction, indicating that the electrical conduction is due mainly to electrons. The electrical conductivity increased and the absolute value of the Seebeck coefficient decreased with increasing Te content, because Te doping increased the electron concentration considerably from 10¹⁶ cm⁻³ to 10¹⁸ cm⁻³. The thermal conductivity did not change significantly on Te doping, due to the much larger contribution of lattice thermal conductivity over the electronic thermal conductivity. Thermal conduction in Te-doped Mg₂Si was due primarily to lattice vibrations (phonons). The thermoelectric figure of merit of intrinsic Mg₂Si was improved by Te doping.     

Doping of the Bi<Subscript>1.9</Subscript>Sb<Subscript>0.1</Subscript>Te<Subscript>3</Subscript> solid solution with Sn impurity

In (Bi_1.9Sb_0.1)_{1 − x} Sn _x Te₃ solid solution with different contents of Sn, the electrical conductivity (σ₁₁) and the Hall (R ₁₂₃ and R ₃₂₁), Seebeck (S ₁₁ and S ₃₃), and Nernst-Ettingshausen (Q ₁₂₃ and Q ₃₂₁) coefficients have been measured. It is shown that doping with tin strongly modifies temperature dependences of the kinetic coefficients. The effect of tin on electrical homogeneity of the samples has been studied: with increasing number of Sn atoms embedded, crystals become more homogeneous. These features indicate the presence of the quasi-local states of Sn in the valence band of Bi_1.9Sb_0.1Te₃. Within a one-band model, we estimated the effective mass of the density of hole states (m _d ), the energy gap extrapolated to 0 K (E _g0 = 0.20–0.25 eV), the energy of impurity states (E _Sn ≈ 40–45 meV), and the scattering parameter (r ≈ 0.1–0.4). Numerical values of the scattering parameter indicate a mixed mechanism of scattering in the samples under investigation with dominant scattering at acoustic phonons. With increasing content of tin in the samples, the contribution of impurity scattering increases.     

Thermoelectric Properties of the Pseudobinary Alloy (Ag<Subscript>0.365</Subscript>Sb<Subscript>0.558</Subscript>Te)<Subscript>0.975</Subscript>(GeTe)<Subscript>0.025</Subscript> Prepared by Spark Plasma Sintering

Ag-Sb-Te-Ge-based alloys have received great attention in recent years. In the present work we prepared the pseudobinary alloy (Ag_0.365Sb_0.558Te)_0.975 (GeTe)_0.025 using spark plasma sintering and evaluated its thermoelectric (TE) properties over the temperature range from 318 K to 551 K. Rietveld analysis revealed that about 1.3 at.% Ge atoms occupy the Sb sites and that the alloy exhibits the same crystal structure as AgSbTe₂. By using back-scattered electron imaging, we observed two instead of one phase in the sample. The small white AgSbTe₂ chunks embedded in the matrix can substantially scatter phonons. Compared with the transport properties of Ag_0.365Sb_0.558Te, we obtained a slightly increased Seebeck coefficient and reduced thermal conductivity without sacrificing electrical conductivity. The highest TE figure of merit, ZT, was 0.69 at 551 K, whereas that of the ternary alloy Ag_0.365Sb_0.558Te was 0.61 at the corresponding temperature, suggesting that (Ag_0.365Sb_0.558Te)_0.975(GeTe)_0.025 has the potential to improve TE performance with optimization of its chemical composition.     

Thermal Conductivity of Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Affected by Grain Size and Pores

A fine measurement system for measuring thermal conductivity was constructed. An accuracy of 1% was determined for the reference quartz with a value of 1.411 W/m K. Bi_0.5Sb_1.5Te₃ samples were prepared by mechanical alloying followed by hot-pressing. Grain sizes were varied in the range from 1 μm to 10 μm by controlling the sintering temperature in the temperature range from 623 K to 773 K. The thermal conductivity was 0.89 W/m K for the sample sintered at 623 K, while a grain size of 1.75 μm was measured by optical microscopy and scanning electron microscopy. The thermal conductivity increased on the sample sintered at 673 K because of grain growth and decreased on those sintered at the temperatures from 673 K to 773 K because the increase of pore size caused to decrease thermal conductivity. The increase of thermal conductivity for the samples sintered at temperatures above 773 K was affected by the increase of carrier concentration.     

Electrodeposition of <Emphasis Type="Italic">p</Emphasis>-Type Sb<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te<Subscript><Emphasis Type="Italic">y</Emphasis></Subscript> Thermoelectric Films

Thermoelectric Sb _x Te _y films were potentiostatically electrodeposited in aqueous nitric acid electrolyte solutions containing different concentrations of TeO₂. Stoichiometric Sb _x Te _y films were obtained by applying a voltage of −0.15 V versus saturated calomel electrode (SCE) using a solution consisting of 2.4 mM TeO₂, 0.8 mM Sb₂O₃, 33 mM tartaric acid, and 1 M HNO₃. The nearly stoichiometric Sb₂Te₃ films had a rhombohedral structure, R[`3]m R\bar{3}m , with a preferred orientation along the (015) direction. The films had hole concentration of 5.8 × 10¹⁸/cm³ and exhibited mobility of 54.8 cm²/Vs. A more negative potential resulted in higher Sb content in the deposited Sb _x Te _y films. Furthermore, it was observed that the hole concentration and mobility decreased with increasingly negative deposition potential, and eventually showed insulating properties, possibly due to increased defect formation. The absolute value of the Seebeck coefficient of the as-deposited Sb₂Te₃ thin film at room temperature was 118 μV/K.     

Effect of pH on Structural and Electrical Properties of Electrodeposited Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> Thin Films

Bi₂Te₃ thin films were electrodeposited at various pH values of a bismuth nitrate and tellurium oxide plating solution. Enhancement in pH results in a decrease in grain size. Transmission electron microscopy reveals the transformation of the film morphology from dispersed nanoparticles to connected chain-like nanostructures of Bi₂Te₃ as pH is increased. Electrical characterization for samples deposited in the temperature range of 300 K to 425 K shows a fourfold increase in Seebeck coefficient, S, between its maximum and minimum value as the solution pH changes from 1 to 3.5. Such enhancement of S is attributed to the increased connectivity of the nanostructures at higher pH.     

Influence of Element Substitution on Corrosion Behavior of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Compounds

Atmospheric water may condense on the surface of Bi₂Te₃-based compounds constituting the Peltier module, depending on the operating environment used. In the stage of disposal, Bi₂Te₃-based compounds may come into contact with water in waste disposal sites. There are very few publications about the influence of condensed water on Peltier modules. Bi₂Te₃-Sb₂Te₃ or Bi₂Te₃-Bi₂Se₃ pseudo binary system compounds are used as p-type material or n-type material, respectively. The lattice distortion will be induced in the crystal of Bi₂Te₃-based compounds by element substitution due to the reduction in their thermal conductivity. However, the influence of element substitution on the corrosion behavior of Bi₂Te₃-based compounds remains unclear. In this study, the influence of element substitution on the corrosion behavior of Bi₂Te₃-based compounds with practical compositions has been investigated. Bi_0.5Sb_1.5Te₃ or Bi₂Te_2.85Se_0.15 was prepared by the vertical Bridgman method. The electrochemical properties at room temperature were evaluated by cyclic voltammetry in a standard three-electrode cell. The working electrolyte was a naturally aerated 0.6 or 3.0 mass% NaCl solution. From the tendency for corrosion potential for all the samples, the corrosion sensitivity of ternary compounds was slightly higher than that of binary compounds. From the trend of current density, it was found that Bi_0.5Sb_1.5Te₃ had a corrosion resistance intermediate between Bi₂Te₃ and Sb₂Te₃. On the other hand, corrosion resistance was affected despite a small amount of Se substitution, and the corrosion resistance of Bi₂Te_2.85Se_0.15 was close to or lower than that of Bi₂Se₃. From the observation results of the corrosion products, the trends of morphology and composition of corrosion products for Bi_0.5Sb_1.5Te₃ or Bi₂Te_2.85Se_0.15 were consistent with those of Sb₂Te₃ or Bi₂Se₃, respectively. From the results of x-ray photoelectron spectroscopy for the electrolyte after testing, the possibility that a corrosion product diffuses to the environment including the salt was suggested in Bi_0.5Sb_1.5Te₃. However, the amount of dissolved corrosion product was very low, and the chemical stability of the corrosion product was not changed or improved by element substitution.     

Thermoelectric Properties of Sb-Doped Mg<Subscript>2</Subscript>Si<Subscript>0.3</Subscript>Sn<Subscript>0.7</Subscript>

Mg₂(Si_0.3Sn_0.7)_1−y Sb _y (0 ≤ y ≤ 0.04) solid solutions were prepared by a two-step solid-state reaction method combined with the spark plasma sintering technique. Investigations indicate that the Sb doping amount has a significant impact on the thermoelectric properties of Mg₂(Si_0.3Sn_0.7)_1−y Sb _y compounds. As the Sb fraction y increases, the electron concentration and electrical conductivity of Mg₂(Si_0.3Sn_0.7)_1−y Sb _y first increase and then decrease, and both reach their highest value at y = 0.025. The sample with y = 0.025, possessing the highest electrical conductivity and one of the higher Seebeck coefficient values among all the samples, has the highest power factor, being 3.45 mW m⁻¹ K⁻² to 3.69 mW m⁻¹ K⁻² in the temperature range of 300 K to 660 K. Meanwhile, Sb doping can significantly reduce the lattice thermal conductivity (κ _ph) of Mg₂(Si_0.3Sn_0.7)_1−y Sb _y due to increased point defect scattering, and κ _ph for Sb-doped samples is 10% to 20% lower than that of the nondoped sample for 300 K < T < 400 K. Mg₂(Si_0.3Sn_0.7)_0.975Sb_0.025 possesses the highest power factor and one of the lower κ _ph values among all the samples, and reaches the highest ZT value: 1.0 at 640 K.     

Effects of SiC Nanodispersion on the Thermoelectric Properties of <Emphasis Type="Italic">p</Emphasis>-Type and <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Based Alloys

Polycrystalline p-type Bi_0.5Sb_1.5Te₃ and n-type Bi₂Te_2.7Se_0.3 thermoelectric (TE) alloys containing a small amount (vol.% ≤5) of SiC nanoparticles were fabricated by mechanical alloying and spark plasma sintering. It was revealed that the effects of SiC addition on TE properties can be different between p-type and n-type Bi₂Te₃-based alloys. SiC addition slightly increased the power factor of the p-type materials by decreasing both the electrical resistivity (ρ) and Seebeck coefficient (α), but decreased the power factor of n-type materials by increasing both ρ and α. Regardless of the conductivity type, the thermal conductivity was reduced by dispersing SiC nanoparticles in the Bi₂Te₃-based alloy matrix. As a result, a small amount (0.1 vol.%) of SiC addition increased the maximum dimensionless figure of merit (ZT _max) of the p-type Bi_0.5Sb_1.5Te₃ alloys from 0.88 for the SiC-free sample to 0.97 at 323 K, though no improvement in TE performance was obtained in the case of n-type Bi₂Te_2.7Se_0.3 alloys. Importantly, the SiC-dispersed alloys showed better mechanical properties, which can improve material machinability and device reliability.     

Point Defect Engineering of High‐Performance Bismuth‐Telluride‐Based Thermoelectric Materials

Developing high‐performance thermoelectric materials is one of the crucial aspects for direct thermal‐to‐electric energy conversion. Herein, atomic scale point defect engineering is introduced as a new strategy to simultaneously optimize the electrical properties and lattice thermal conductivity of thermoelectric materials, and (Bi,Sb)₂(Te,Se)₃ thermoelectric solid solutions are selected as a paradigm to demonstrate the applicability of this new approach. Intrinsic point defects play an important role in enhancing the thermoelectric properties. Antisite defects and donor‐like effects are engineered in this system by tuning the formation energy of point defects and hot deformation. As a result, a record value of the figure of merit ZT of ≈1.2 at 445 K is obtained for n‐type polycrystalline Bi₂Te_2.3Se_0.7 alloys, and a high ZT value of ≈1.3 at 380 K is achieved for p‐type polycrystalline Bi_0.3Sb_1.7Te₃ alloys, both values being higher than those of commercial zone‐melted ingots. These results demonstrate the promise of point defect engineering as a new strategy to optimize thermoelectric properties.     

Features of reflection spectra of single crystals of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript>-Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> solid solutions in the region of plasma effects

Reflectance spectra of single crystals of Bi₂Te₃-Sb₂Te₃ solid solutions containing 0, 10, 25, 40, 50, 60, 65, 70, 80, 90, 99.5, and 100 mol % of Sb₂Te₃ have been studied in the range of 400–4000 cm⁻¹ at the temperature T = 291 K and with orientation of the vector of the electric-field strength E perpendicular to the trigonal axis of the crystal C ₃ (E ⊥ C ₃). The shape of the spectra is characteristic of plasma reflection; the spectra include the features in the range 1250–3000 cm⁻¹ corresponding to the optical band gap E _{g opt}. The features become more pronounced as the content of Bi₂Te₃ is increased to 80 mol % in the composition of the Bi₂Te₃-Sb₂Te₃ solid solution. A further increase in the content of Sb₂Te₃ is accompanied by discontinuities in the functional dependences of the parameters characterizing the plasma oscillations of free charge carriers on the solid-solution composition and also by a sharp increase in E _{g opt}.     

Thermal Stability of Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> in Contact with Ti and TiN

The thermal stability of a Ge₂Sb₂Te₅ chalcogenide layer in contact with titanium and titanium nitride metallic thin films has been investigated mainly using x-ray diffraction and elastic nuclear backscattering techniques. Without breaking vacuum, Ti and TiN have been deposited on Ge₂Sb₂Te₅ material using magnetron sputtering. Thermal treatments have been performed in a 10⁻⁷ mbar vacuum furnace. On annealing up to 450°C, the TiN metallic film does not interact with the chalcogenide film, but at the same time adhesion problems and instabilities in contact resistance arise. To improve the adhesion and eventually stabilize the contact resistance, an interfacial Ti layer has been considered. At 300°C, a TiTe₂ compound is formed by interacting with Te segregated from the Ge₂Sb₂Te₅ layer. At higher temperatures, the Ti layer decomposes the chalcogenide film, forming several compounds tentatively identified as GeTe, Ge₃Ti₅, Ge₅Ti₆, TiTe_2,, and Sb₂Te₃. It has been found that the properties of the Ge₂Sb₂Te₅ film can be retained by controlling the decomposition rate of the chalcogenide layer, which is achieved by providing a limited supply of Ti and/or by depositing a Te-rich Ge₂Sb₂Te₅ film.     

Electrodeposition and Thermoelectric Characteristics of Bi<Subscript>2</Subscript>Te<Subscript>3</Subscript> and Sb<Subscript>2</Subscript>Te<Subscript>3</Subscript> Films for Thermopile Sensor Applications

A thermopile sensor was processed on a glass substrate by electrodeposition of n-type bismuth telluride (Bi-Te) and p-type antimony telluride (Sb-Te) films. The n-type Bi-Te film electrodeposited at −50 mV in a 50 mM electrolyte with a Bi/(Bi + Te) mole ratio of 0.5 exhibited a Seebeck coefficient of −51.6 μV/K and a power factor of 7.1 × 10⁻⁴ W/K² · m. The p-type Sb-Te film electroplated at 20 mV in a 70 mM solution with an Sb/(Sb + Te) mole ratio of 0.9 exhibited a Seebeck coefficient of 52.1 μV/K and a power factor of 1.7 × 10⁻⁴ W/K² · m. A thermopile sensor composed of 196 pairs of the p-type Sb-Te and the n-type Bi-Te thin-film legs exhibited sensitivity of 7.3 mV/K.     

Physical Properties of Sn<Subscript>96.5</Subscript>Ag<Subscript>3.5</Subscript>-Based Solders with Additions of Bi,Ge, and In

The melting temperature, electrical resistivity, surface tension, and density of the (Sn_0.965Ag_0.035)_95.17Bi_4.83, (Sn_0.965Ag_0.035)_95.17Bi_4.73Ge_0.1, and (Sn_0.965Ag_0.035)₉₄-Bi₂In₄ alloys have been studied in comparison with the Sn₆₀Pb₄₀ and Sn_96.5Ag_3.5 binary alloys (all wt.%). The electrical conductivity of the solid alloys based on Sn_96.5Ag_3.5 is comparable to that of the Sn₆₀Pb₄₀ alloy. The wetting behavior on Cu and Ni surfaces has been investigated in a wide temperature interval. It is established that the addition of Bi to Sn_96.5Ag_3.5 decreases the surface tension and improves the wetting properties of the alloy. The addition of a small quantity of Ge to the Sn-Ag-Bi alloy did not improve the wetting behavior on either Cu or Ni surfaces. The wetting ability of the (Sn_0.965Ag_0.035)₉₄Bi₂In₄ alloy was slightly worse as compared with (Sn_0.965Ag_0.035)_95.17Bi_4.83.     

Effects of Cooling Rate on Thermoelectric Properties of <Emphasis Type="Italic">n</Emphasis>-Type Bi<Subscript>2</Subscript>(Se<Subscript>0.4</Subscript>Te<Subscript>0.6</Subscript>)<Subscript>3</Subscript> Compounds

A series of Bi₂(Se_0.4Te_0.6)₃ compounds were synthesized by a rapid route of melt spinning (MS) combined with a subsequent spark plasma sintering (SPS) process. Measurements of the Seebeck coefficient, electrical conductivity, and thermal conductivity were performed over the temperature range from 300 K to 520 K. The measurement results showed that the cooling rate of melt spinning had a significant impact on the transport properties of electrons and phonons, effectively enhancing the thermoelectric properties of the compounds. The maximum ZT value reached 0.93 at 460 K for the sample prepared with the highest cooling rate, and infrared spectrum measurement results showed that the compound with lower tellurium content, Bi₂(Se_0.4Te_0.6)₃, possesses a larger optical forbidden gap (E _g) compared with the traditional n-type zone-melted material with formula Bi₂(Se_0.07Te_0.93)₃. Our work provides a new approach to develop low-tellurium-bearing Bi₂Te₃-based compounds with good thermoelectric performance.     

Thermoelectric Characterization of (Ga,In)<Subscript>2</Subscript>Te<Subscript>3</Subscript> with Self-Assembled Two-Dimensional Vacancy Planes

The key properties for the design of high-efficiency thermoelectric materials are a low thermal conductivity and a large Seebeck coefficient with moderate electrical conductivity. Recent developments in nanotechnology and nanoscience are leading to breakthroughs in the field of thermoelectrics. The goal is to create a situation where phonon pathways are disrupted due to nanostructures in “bulk” materials. Here we introduce promising materials: (Ga,In)₂Te₃ with unexpectedly low thermal conductivity, in which certain kinds of superlattice structures naturally form. Two-dimensional vacancy planes with approximately 3.5-nm intervals exist in Ga₂Te₃, scattering phonons efficiently and leading to a very low thermal conductivity.     

Synthesis and Characterization of <Emphasis Type="Italic">p</Emphasis>-Type Pb<Subscript>0.5</Subscript>Sn<Subscript>0.5</Subscript>Te Thermoelectric Power Generation Elements by Mechanical Alloying

A mechanical alloying (MA) process to transform elemental powders into solid Pb_0.5Sn_0.5Te with thermoelectric functionality comparable to melt-alloyed material is described. The room-temperature doping level and mobility as well as temperature-dependent electrical conductivity, Seebeck coefficient, and thermal conductivity are reported. Estimated values of lattice thermal conductivity (0.7 W m⁻¹ K⁻¹) are lower than some reports of functional melt-alloyed PbSnTe-based material, providing evidence that MA can engender the combination of properties resulting in highly functional thermoelectric material. Though doping level and Sn composition have not been optimized, this material exhibits a ZT value >0.5 at 550 K.     

Interaction of electrical active intrinsic defects in Sn-doping Bi2Te3

Impure Sn produces the resonant states on the background of the allowed spectrum of states of the valence band in Bi₂Te₃. A high density of the resonant states stabilizes the Fermi level _F. Stabilization of _F leads to an enhancement of the volume homogeneity of the distribution of electrically active components.We report the results of an experimental study on the influence of doping Sn atoms on hole concentrations of Bi₂Te₃ and replace the part of Te atoms on Se atoms and the part of Bi atoms on Sb atoms. The estimation of the influence of resonant states on the process of crystal defects formation has been attempted theoretically.