Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

The formation and the growth of Cu-Sn intermetallic compound （IMC） layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce （only 0.1%,mass fraction） into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.     

Effect of anions on stress corrosion cracking behaviors of ultra-high strength steel 23Co14Ni12Cr3Mo

The effects of chloride, sulfate and carbonate anions on stress corrosion behaviors of ultra-high strength steel 23Co14Ni12Cr3Mo were studied by stress corrosion cracking （SCC） test method using double cantilever beam （DCB） specimens. The SCC morphology was observed by using scanning electron microscopy （SEM） and the composition of corrosion products was analyzed by using energy dispersive spectrometer （EDS）. The results show that the crack propagates to bifurcation in NaCl and Na2SO4 solution, while the crack in Na2CO3 solution propagates along the load direction. The SCC rate in NaCl solution is the highest, while lower in Na2SO4 solution and little in Na2CO3 solution. From the SEM morphologies, quasi-cleavage fracture was observed in NaCl and Na2SO4 solutions, but intergranular features in Na2CO3 solution. The mechanism of anion effect on SCC of steel 23Co14Ni12Cr3Mo was studied by using full immersion test and electrochemical measurements.