光固化树脂结合剂SiC晶须砂轮初探

SiC晶须因其具有高强度、高弹性模量、高耐磨性及好的相容性等优良的机械与物理化学特性,广泛地用作金属、陶瓷、聚合物及复合材料的增强增韧材料。然而把SiC晶须作为磨粒来制作砂轮,国内外对此研究较少。本文采用了紫外光固化快速成型技术制作超薄型晶须砂轮,研究了紫外光辐照度的变化对晶须砂轮强度产生的影响,以及静电场的作用对晶须定向排列的影响。此外,本文还进行了光固化树脂结合剂晶须砂轮的切割试验。拉伸试验表明,随着紫外光辐照亮的增强,试件的拉伸强度和抗弯曲强度得到了不同程度的提高;初步的切割试验表明,SiC晶须砂轮可以实现对玻璃和硅片等不同材料的切割。     

砂带修锐树脂结合剂CBN砂轮的研究

砂带修锐树脂结合剂ＣＢＮ砂轮的研究南京航空航天大学李迎，徐鸿钧，张幼帧一、砂带修锐原理超硬磨料磨具的修整分整形和修锐两个过程．而修锐是目前超硬磨具修整工作中的难点。电解在线修锐成功地解决了金属结合剂超硬磨料磨具修锐问题（１），使树脂结合剂ＣＢＮ砂轮的...     

利用光固化树脂作为结合剂的超薄型切割砂轮的研制

利用光固化树脂作为结合剂研制成功厚度为０．１５ｍｍ的超薄型金刚石切割砂轮,并完成了对单昌硅片的切割试验。研究结果表明,经ＳｉＯ２微粒增强后的光固化树脂可以替代热固化树脂用作超薄型切割砂轮的结合剂,微粒添加量的大小是影响超薄型切割砂轮的机械性能和切割精度的一个重要因素。     

光固化树脂结合剂锯片结合机理及其应用研究

探讨了光固化树脂磨具不同于普通树脂磨具的结合机理，并在该理论的基础上寻找出改善磨具结合性能的措施。首次在光固化树脂结合剂锯片中引进几种金属镀覆的金刚石磨料，通过对不同半导体材料进行切割试验，证实了在光固化树脂结合剂锯片中采用金属镀覆金刚石磨料后，针对单晶硅、铌酸锂、陶瓷等半导体材料，几种不同锯片的磨损率分别降低了259／5～200％、12．5％～62．5％和10．5%～52．6％，加工效率和使用寿命有了显著的提高。     

树脂结合剂CBN砂轮低温磨削技术

讨论了Al2O3砂轮磨削耐热合金时磨削比低、表面质量差的原因。分析了影响树脂结合剂CBN砂轮磨削性能的关键因素。提出用断续式砂轮合并采用镀膜CBN磨料和耐热增强树脂粉进行磨削的耐热合金低温磨削技术，该技术可充分发挥树脂结合剂和CBN的性能，从而获得满意的综合磨制效果．     

树脂结合剂金刚石砂轮在磨削高级陶瓷中的行为

报导了磨削陶瓷材料时金刚石砂轮平面切向磨削过程的研究结果,着重讨论了金刚石砂轮的磨损机理和陶瓷材料的磨削过程。     

光固化树脂结合剂磨具的研究与进展

采用光固化树脂作为结合剂制作有机磨具是近年来先进制造领域里的一个新型制造工艺.首先介绍了光固化快速成型技术,随后讨论了光固化树脂结合剂磨具的研究现状.分别从国外和国内两个方面,针对光固化树脂磨具的不同类型的研究和光固化树脂磨具的性能研究进行了详细介绍.     

钎焊单层金刚石砂轮的实验研究

单层高温钎焊超硬磨料砂轮具有传统砂轮和电镀砂轮无法比拟的优异磨削性能。利用高频感应钎焊的方法,以Ag-Cu合金和Cr粉为钎料,在一定的钎焊工艺条件下进行了实验研究,实现了金刚石与钢基体间的牢固化学冶金结合。扫描电镜分析发现在Ag-Cu-Cr与金刚石的界面之间形成CrC,与钢基体结合界面之间形成(FexCry)C,这是实现合金层与金刚石及钢基体之间都有较高结合强度的主要因素,并在相同的磨削参数条件下与电镀砂轮进行了对比实验,取得了较好的结果。     

层状复合板层间剪切强度的研究现状

阐述了层状复合板层间剪切强度的概念和实验方法，介绍了现有的界面结合机理和类型，综述了影响复合板层间剪切强度的因素，主要有表面处理、液态相合金化、复合温度和复合工艺等，并提出了研究层状复合板应重视的问题。     

光固化快速成形中树脂涂层技术研究

分析光固化快速成形对树脂涂层技术的要求及对成形工艺,制件精度,成形效率的影响。并根据液态树脂的物性,分析现有激光快速成形机中各种树脂再涂层方法的特点,提出一种瀑布式树脂再涂层方法。     

树脂结合剂金刚石砂轮磨削铁氧体陶瓷磨削力的实验研究

通过一系列的实验，研究了树脂结合剂金刚石砂轮磨削铁氧体陶瓷材料时磨削力的变化规律及其特点。通过磨削对比实验方法分析磨削铁氧体陶瓷时，磨削用量对磨削力大小的影响。通过砂轮速度，磨削深度，横向进给速度和纵向进给速度等因素影响磨削力大小变化的数据及磨削力信号特征处理的分析和比较，分析了对铁氧体材料磨削时产生的磨削力影响的一些规律，表明铁氧体陶瓷磨削时磨削力变化的特有规律．     

Wear of grinding wheels

Wear phenomena accompanying cylindrical grinding were investigated directly from the wear particles removed from the wheel. The self-dressing mechanism was identified from the wear particle size distribution.     

The optimisation of the grinding of silicon carbide with diamond wheels using genetic algorithms

Modelling and optimisation are necessary for the control of any process to achieve improved product quality, high productivity and low cost. The grinding of silicon carbide is difficult because of its low fracture toughness, making it very sensitive to cracking. The efficient grinding of high performance ceramics involves the selection of operating parameters to maximise the MRR while maintaining the required surface finish and limiting surface damage. In the present work, experimental studies have been carried out to obtain optimum conditions for silicon carbide grinding. The effect of wheel grit size and grinding parameters such as wheel depth of cut and work feed rate on the surface roughness and damage are investigated. The significance of these parameters, on the surface roughness and the number of flaws, has been established using the analysis of variance. Mathematical models have also been developed for estimating the surface roughness and the number of flaws on the basis of experimental results. The optimisation of silicon carbide grinding has been carried out using genetic algorithms to obtain a maximum MRR with reference to surface finish and damage.Nomenclature C constant in mathematical model - C₁ constant in surface roughness model - C₂ constant in the number of flaws model - d depth of cut, m - dof degrees of freedom - f table feed rate, mm/min - M grit size (mesh) - MRR material removal rate, mm³/mm width-min - N_c number of flaws measured - R_a surface roughness measured, m - Y machining response - depth of cut exponent in mathematical model - ₁ depth of cut exponent in surface roughness model - ₂ depth of cut exponent in number of flaws model - feed rate exponent in mathematical model - ₁ feed rate exponent in surface roughness model - ₂ feed rate exponent in number of flaws model - grit size exponent in mathematical model - ₁ grit size exponent in surface roughness model - ₂ grit size exponent in number of flaws model     

The optimal diamond wheels for grinding diamond tools

Grinding is the most suitable process for manufacturing good quality diamond tools. In this paper, diamond wheels have been studied. From the grinding of polycrystalline diamond (PCD) insets, the effects of certain factors such as the bonding material, the grit size and structure of a diamond wheel have been investigated. It is concluded that vitrified bond diamond wheels are the most suitable for grinding PCDs and the recommended grit size is mesh number 1000, which can get a good surface quality within an appropriate time. The wheel structure is another important factor. Rougher wheels (mesh #800, #1000) with the softer grade scale P yield a higher material removal rate (MRR) than scale Q. However, a finer wheel (mesh #1200) needs a tougher structure to promote its grinding ability and to have a higher MRR.