Ion implantation doping and electrical conductivity enhancement of C60 films

Pristine C₆₀ films sublimed onto sheet mica were implanted with 20 keV K⁺ ions and I⁺ ions at doses of 1.0 × 10¹⁶/cm², 3.0 × 10¹⁶/cm² and 5.0 × 10¹⁶/cm², and with 20 keV Ar⁺ ions at a dose of 5.0 × 10¹⁶/cm². The distributions of dopants were studied using Rutherford backscattering spectrometry (RBS). The temperature dependence of sheet resistivity of the films was investigated applying a four-probe system. It was proposed that the conductivity enhancement of K⁺ implanted C₆₀ films was due to the implanted ions in the films, while for I⁺ implanted C₆₀ films, both implanted I⁺ ions and irradiation effects of the ions contributed to the enhancement of conductivity.     

Effect of forming gas anneals on the photoluminescence from nanocrystalline silicon formed by Si implantation into SiO2 matrix

The blue region of the room temperature photoluminescence spectrum from Si nanocrystallites formed in SiO₂ by Si⁺ ion implantation has been observed for the first time after annealing in a forming gas (10% H₂ + 90% N₂) ambient. Thermally grown SiO₂ on Si substrates were implanted with a dose of 2 × 10¹⁷ Si⁺ cm⁻² at energies of 200 keV and 400 keV. For reference purposes, quartz silica was implanted also with the same dose of 200 keV Si⁺ ions. The implanted samples were annealed in nitrogen and forming gas at 900°C for 3 to 180 min. Both the SiO₂ and quartz samples exhibited luminescence at about 380 nm which was weak, but detectable, before annealing. During extended anneals in forming gas, the intensity increased by a factor of about 2 above that recorded after a nitrogen anneal but the peak position was unchanged. The intensity was greater in samples annealed in forming gas which is due to the additional hydrogen. It would seem that this blue luminescence originates from new luminescent centres in the matrix caused by the Si⁺ ion implantation.     

Low temperature epitaxial regrowth of mercury implanted sapphire

Hg ions were implanted into sapphire at room temperature and 80 keV energy to a fluence of 1 × 10¹⁵ Hg⁺ / cm². This fluence was enough to produce an amorphous surface layer. The annealing behaviour was studied combining RBS/channeling and hyperfine interaction techniques. Surprisingly, the RBS/channeling results show there is an epitaxial regrowth of the damaged layer after annealing at 800°C for 20 min. Although some of the implanted Hg segregates to the surface during the epitaxial regrowth, a significant fraction is incorporated into regular sites along the c-axis. The hyperfine interactions results, obtained after implantation of a dose of 5 × 10¹² Hg⁺ / cm², show that a small fraction of Hg is probably bound to oxygen. This result is in agreement with the RBS/channeling measurements which also show that the system formed after annealing is stable even at high temperatures.     

Effects of Ag and Au ion implantation of lithium niobate

The optical effects of implantation of lithium niobate crystals with 100 keV Ag⁺ and 8 MeV Au³⁺ ions with fluences of 1 × 10¹⁷ ions/cm² have been investigated. Metal nanoparticle formation has been studied as a function of annealing temperature, and the resulting optical extinction curves have been simulated by the Mie theory in the small particle limit. Transmission electron microscopy (TEM) has provided direct evidence for the MNP sizes allowing comparison with the calculated results. A TEM study of an X-cut sample implanted with Ag⁺ ions show that the implanted region is partially amorphised. The differences in the temperature of Au colloid development in X- and Y-cut faces of the lithium niobate crystal are attributed to restoration of crystallinity as a result of annealing.     

A study of the blue photoluminescence emission from thermally-grown, Si-implanted SiO2 films after short-time annealing

Thermal SiO₂ films have been implanted with Si⁺ ions using double-energy implants (200 + 100 keV) at a substrate temperature of about −20°C to total doses in the range 1.6 × 10¹⁶−1.6 × 10¹⁷ cm⁻² followed by short-time thermal processing, in order to form a Si nanostructure capable of yielding blue photoluminescence (PL). The intensity and the peak position of the PL band have been investigated as a function of ion dose, manner of heat treatment, anneal time and anneal temperature. For the formation of blue PL emitting centres, optimum processing conditions in terms of excess Si concentration and overall thermal budget are mandatory. The nature of the observed blue emission is discussed.     

Suppression of charge carrier collection in diode with retrograde well and epitaxial layers for soft-error immunity

One of the solutions to the reduction of soft errors is suppression of carrier collection generated by an energetic particle emitted from typical contaminants of packaging or wiring materials. Suppression of carrier collection by a retrograde well or an epitaxial layer has been investigated by nuclear microprobes to clarify the validity of various well structures against soft errors in dynamic random access memories (DRAMs). The carrier collection efficiency of a retrograde well, a retrograde well with a buried layer on a Si wafer, and on an epitaxial wafer has been investigated for DRAM application using the ion-beam-induced-current (IBIC) measurement. The collection of carriers induced by proton microprobe irradiation could be reduced by the retrograde well formed at different boron doses. n⁺p diodes with retrograde well structures were fabricated by B⁺ implantation at 0.4–1.3 μm and to doses of 3.5 × 10¹⁶–3.4 × 10¹⁷ ions/cm³. It should be noted that an increase in the B⁺ implantation dose effetively reduces carrier collection efficiency, though a buried layer implanted with a higher dose degrades the characteristics of devices by the increase in leakage current. The carrier collection efficiency of the n⁺p diode with the higher dose retrograde well can be reduced by more than half compared to the diode with a retrograde well in an epitaxial layer.     

Characterization of extended defects in SiGe alloys formed by high dose Ge implantation into Si

The synthesis of SiGe/Si heterostructures by Ge⁺ ion implantation is reported. 400 keV Ge⁺ ions were implanted at doses ranging from 3 × 10¹⁶ to 10 × 10¹⁶ ions/cm² into (001) Si wafers, followed by Si⁺ amorphisation and low temperature Solid Phase Epitaxial Regrowth (SPER). TEM investigations show that strained alloys can be fabricated if the elastic strain energy (E_el) of the SiGe layer does not exceed a critical value (E′_el) of about 300 mJ/m², which is independent of the implantation energy. Our analysis also suggests that “hairpin” dislocations are formed as strain relieving defects in relaxed structures. A “strain relaxation” model is proposed to explain their formation.     

Photoluminescence of Au formed in 12CaO · 7Al2O3 single crystal by Au-implantation

Au⁺ ion implantation with fluences from 1 × 10¹⁴ to 3 × 10¹⁶ cm⁻² into 12CaO · 7Al₂O₃ (C12A7) single crystals was carried out at a sample temperature of 600 °C. The implanted sample with the fluence of 1 × 10¹⁵ cm⁻² exhibited photoluminescence (PL) bands peaking at 3.1 and 2.3 eV at 150 K when excited by He–Cd laser (325 nm). This was the first observation of PL from C12A7. These two PL bands are possibly due to intra-ionic transitions of an Au⁻ ion having the electronic configuration of 6s², judged from their similarities to those reported on Au⁻ ions in alkali halides. However, when the concentration of the implanted Au ions exceeded the theoretical maximum value of anions encaged in C12A7 (2.3 × 10²¹ cm⁻³), surface plasmon absorption appeared in the optical absorption spectrum, suggesting Au colloids were formed at such high fluences. These observations indicate that negative gold ions are formed in the cages of C12A7 by the Au⁺ implantation if an appropriate fluence is chosen.     

Ion beam induced nucleation in amorphous GaAs layers during MeV implantation

To investigate the nonlinear dose dependence of the thickness of the recrystallized layer during ion beam induced epitaxial recrystallization at amorphous/crystalline interfaces GaAs samples were irradiated with 1.0 MeV Ar⁺, 1.6 MeV Ar⁺ or 2.5 MeV Kr⁺ ions using a dose rate of 1.4 × 10¹² cm⁻² s⁻¹ at temperatures between 50°C and 180°C. It has been found that the thickness of the recrystallized layer reaches a maximum value at T_max = 90°C and 135°C for the Ar⁺ and Kr⁺ implantations, respectively. This means that the crystallization rate deviates from an Arrhenius dependence due to ion beam induced nucleation and growth within the remaining amorphous layer. The size of the crystallites depends on the implantation dose. This nucleation and growth of the crystallites disturbes and at least blocks the interface movement because the remaining surface layer becomes polycrystalline. Choosing temperatures sufficiently below T_max the thickness of the recrystallized layer increases linearly with the implantation dose indicating that the irradiation temperature is too low for ion induced nucleation.     

Effect of electric charge accumulation on low energy ion implantation in insulators

Charge accumulation at the surface of insulators during low energy ion implantation is related to two processes: ion impinging on the sample and secondary electron emission. Samples composed of a piece of Si (having the size of the ion beam) fixed on the centre of polyethylene (PE) coupons have been implanted with 2.2 keV H₂ ions to a fluence of 2 × 10¹⁶ H/cm². ERD (Elastic Recoil Detection) depth profiles of the implanted ions are shallower with an increase of the PE coupon size. The relative critical Si/PE size to repel all the incident ions is around 1.1 × 1.1 cm²/2.5 × 2.5 cm². The potential of the secondary electron suppressor has been varied from −500 V to +500 V. It changes the secondary electron distribution around the implanted area and, consequently, affects the accumulation of charges at the sample surface. When the potential is 0 V, a uniform ion implantation with little effect of charge accumulation for all sizes of PE coupons is obtained. A two-dimension model has been performed and gives a good explanation for the mechanism of the electric charge neutralisation.     

High temperature carbon implantation in SIMOX

The aim of this experiment was to explore the possibility to convert the Si-overlayer of a SIMOX wafer into 3C-SiC by carbon implantation. In a first attempt carbon was implanted at a temperature 1030°C and energy 100 keV to a dose of 2.5 × 10¹⁷ C⁺ cm⁻². The SIMOX was covered by a thick thermal oxide. Cross-section TEM observations on the implanted specimen reveal that carbon is concentrated mainly at the Si/SiO₂ interfaces at the front and back face of the Si-overlayer forming continuous but highly defected 3C-SiC layers which are in epitaxial relation with the Si matrix. The implanted carbon has the tendency to migrate from the SiO₂ and Si to the SiO₂/Si interfaces to form SiC there.     

Ion-Beam Surface Modification of Strut Dowel Used in ITER PF Support

In this paper, surface modification of the strut dowel used in ITER PF support is reported. Different ions (nitrogen/titanium) with different doses are implanted into the surface of strut dowel. The result of Auger Electron Spectroscopy (AES) indicates that nitrogen can be implanted more deeply than titanium under the implantation condition of 60 kV accelerating voltage and a dose of 8x10¹⁷/cm² nitrogen. Surface Micro Hardness (SMH) and wear resistance are improved remarkably. Further SEM observation shows that there are no obvious scratches and damages after wear test.     

High ion-beam induced electron yields from polycrystalline diamond

Extraordinarily high ion-beam induced electron yields are seen from polycrystalline diamond surfaces for high energy H⁺, He⁺ and Ar⁺ ions. This is attributed to the negative electron affinity of the diamond surface. However, the yield decays rapidly with dose, limiting the potential applications. The mechanism for decay is suggested to be electron-stimulated desorption of surface hydrogen, which removes the negative electron affinity responsible for high yields.     

Optical behaviour of Er doped rutile by ion implantation

Rutile single crystals were implanted at room temperature with fluences of 5 × 10¹⁵ Er⁺/cm² ions with 150 keV energy. Rutherford backscattering/channeling along the 0 0 1 axis reveals complete amorphization of the implanted region. Photoluminescence reveals the presence of an optical centre close to the intra-ionic emission of Er³⁺ in the as-implanted samples. After annealing at 800 °C in air no changes were observed in the aligned RBS spectrum. On the contrary, annealing in reducing atmosphere (vacuum) induces the epitaxy of the damage layer. These results are unexpected, since for implantations of other ions under the same conditions, epitaxial recrystallization of the damage region occurs at this temperature. On the other hand, photoluminescence studies show the presence of new Er-related optical centres with high thermal stability in the samples annealed under oxidizing conditions. Annealing at 1000 °C in vacuum leads to the complete recrystallization of the damaged region. At this temperature a large fraction of Er segregates to the surface.     

Damage distributions in LiNbO3 crystal induced by MeV F tilted implantations

X-cut LiNbO₃ crystals have been implanted by 0.8, 1.0 and 1.2 MeV F⁺ tilted at angles of 15°, 45° and 60° with doses of 5 × 10¹⁴, 7 × 10¹⁴ and 5 × 10¹⁴ ions/cm², respectively. The Rutherford backscattering (RBS)/channeling technique was used to investigate the induced damage distributions. The damage profiles were deconvoluted from the measured spectra after considering the energy spread due to the different stopping power of channeled and nonchanneled ions. Good agreements were obtained between the measured damage profiles and the calculated defect profiles by TRIM'90 (transport of ions in matter, version 1990), except that the measured damage concentration was enhanced in the near-surface region. Information on the lateral and longitudinal damage spread in LiNbO₃ crystals was obtained from the damage profiles induced by tilted ion implantations and compared with TRIM'90 calculation.     

Heavy-ion-induced luminescence of amorphous SiO2 during nanoparticle formation

Silica glass was implanted with negative 60 keV Cu ions at an ion flux from 5 to 75 μA/cm² up to a fluence of 1 × 10¹⁷ ions/cm² at initial sample temperatures of 300, 573 and 773 K. Spectra of ion-induced photon emission (IIPE) were collected in situ in the range from 250 to 850 nm. Optical absorption spectra of implanted specimens were ex situ measured in the range from 190 to 2500 nm.

IIPE spectra showed a broad band centered around 560 nm (2.2 eV) that was assigned to Cu⁺ solutes. The band appeared at the onset of irradiation, increased in intensity up to a fluence of about 5 × 10¹⁵ ions/cm² and then gradually decreased indicating three stage of the ion beam synthesis of nanoclusters: accumulation of implants, nucleation and growth nanoclusters. The IIPE intensity normalized on the ion flux is independent on the ion flux below 20 μA/cm²at higher fluences. The intensity of the band increased with increasing samples temperature, when optical absorption spectra reveal the increase of Cu nanoparticles size.     

Defect evolution in MeV ion-implanted silicon

Lightly doped silicon samples of both n- and p-type have been implanted with low doses of H, B and Si ions using energies between 1 and 6 MeV. The resulting electrically active point defects were characterized by deep level transient spectroscopy (DLTS) and several of these defects involve oxygen and/or carbon, two major impurities in as-grown crystalline silicon. Both interstitial- and vacancy-type defects are observed; in particular, interstitial carbon is found to migrate at room temperature with a diffusion constant of 1 × 10⁻¹⁵ cm² s⁻¹ and is effectively trapped by interstitial oxygen atoms. The concentration of implantation-induced defects increases linearly with dose but the defect production decreases at high enough dose rates. This dose rate effect depends on the ion mass and is qualitatively predicted by computer simulations of the defect reaction kinetics.     

Irradiation induced growth of CoSi2 precipitates in Si at 650°C: An in situ study

Crystalline Si samples were implanted at 350°C with 50 keV Co⁺ ions to a fluence of 10¹⁵ Co cm⁻². Small CoSi₂ precipitates were formed. We studied the precipitate growth, via in situ transmission electron microscopy, under irradiation with 100 keV Si ions at 650°C. We deduce the precipitate growth processes involved. Irradiation-induced (or enhanced) Ostwald ripening is the main growth mechanism. We also find an instability of the B-type precipitates, which leads to their transformation into A-type precipitates above a critical size. These preliminary results show that direct comparisons with kinetic Monte Carlo modelling of the precipitate growth is at hand.     

丝状真菌F54的分离鉴定及其对铯的吸附特性

从新疆放射性污染土壤样本中,采用微生物分离方法,结合压力试验及吸附实验,获得一株对放射性核素污染具有修复能力的土著丝状真菌F54。通过形态学、分子生物学鉴定及Biolog碳源利用实验,F54为镰刀霉菌属真菌,与Fusarium oxysporum strain ATCC MYA-3931同源性最高。最适宜生长条件是:马铃薯葡萄糖培养基,30℃,pH=7.0。菌株F54吸附Cs+的最佳条件是:pH=7.0,30℃,伴随生长进行吸附约3~4d,吸附率最高能达到约84%,常见金属阳离子K~+、Na~+、Ca~(2+)、Mg~(2+)、Al~(3+)、Fe~(3+)对其吸附均有一定的抑制作用。菌株F54能够耐受10kGy的钴源照射,对重金属离子Ni~(2+)、Cr~(3+)、Zn~(2+)、Co~(2+)、Pb~(2+)、Hg~(2+)均有较高耐受性,对放射性137 Cs的吸附率为62%。菌株F54在有较高的重金属离子混合污染的放射性环境中具有一定的修复应用潜能。     

A comparative EPR study of ion implantation induced damage in Si, Si1−xGex (x ≠ 0) and SiC

Electron Paramagnetic Resonance (EPR) measurements have been made to investigate the build up of damage in silicon in relaxed crystalline Si_1−xGe_x (x = 0.04, 0.13, 0.24, 0.36) and in 6H-SiC as a result of increasing the ion dose from low levels (10¹² cm⁻²) up to values (10¹⁵ cm⁻²) sufficient to produce an amorphous layer. Si, Si_1−xGe_x (x ≠ 0) and SiC were implanted at room temperature with 1.5 MeV Si, 2 MeV Si and 0.2 MeV Ge ions respectively. A comparison is made between the ways in which the type and population of paramagnetic defects depend on ion dose for each material.