共查询到20条相似文献,搜索用时 93 毫秒
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《塑料工业》2021,(8)
超声可显著提高胶黏剂的固化速率,加快胶接成型。采用双酚A型环氧树脂/低分子聚酰胺650体系胶黏剂树脂,以碳纤维增强复合材料(CFRP)/铝合金接头为黏接对象,通过超声工具头对接头中的CFRP板施加超声振动。通过差式扫描量热法(DSC)分析固化过程,证实对胶接接头施加超声振动可使胶黏剂的固化速率较常温固化提高26倍。通过监测振动过程中胶黏剂的温度变化,表明超声能够促进胶黏剂升温,有利于加速固化反应。对固化动力学方程进行变换,结合温度数据,建立超声辅助固化的变活化能模型,表明超声可显著降低固化反应活化能。通过傅里叶变换红外光谱(FTIR)分析发现超声可使环氧键、N—H键活化,提高反应活性。 相似文献
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无溶剂封口胶LZ—9701的研制 总被引:1,自引:0,他引:1
采用双酚A型环氧树脂CYD-128及高活性聚酰胺作为固化体系,配制成一种复合材料金属喷涂表面密封用无溶剂封口胶LZ-9701,并研究了固化工艺及性能。 相似文献
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《中国胶粘剂》2020,(1)
以双酚A型环氧树脂和邻甲酚醛环氧树脂复配作为基体树脂,双氰胺为固化剂,咪唑2E4MZ为促进剂,无溶剂法浸胶制备玻纤布半固化片。探讨了基体树脂和促进剂对半固化制备工艺的影响,着重研究了无溶剂法玻纤布浸胶工艺和半固化片制备工艺。研究结果表明:当w(双酚A型环氧)=15%、w(酚醛环氧704)=75%、w(双氰胺)=10%(相对于浸胶总质量而言),w(2E4MZ)=6%(相对于双氰胺质量而言),涂布机温度为110℃下浸胶可达到完全浸润玻纤布;半固化工艺为130℃/9 min时,可得到具有高的分解温度(360℃)、玻璃化转变温度(165℃),耐浸焊性时间长(242 s),击穿电压(46 kV)、介电常数(4.35)、剥离强度(1.45 N/mm)优异的玻纤布半固化片覆铜板。 相似文献
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在碱性催化剂(B-Cat)作用下,利用双酚A(A)、甲醛水溶液(F)为原料,合成了一种新型丙烯酸酯乳液胶用水溶性双酚A型酚醛树脂固化剂。研究了催化剂种类及用量、反应时间、反应温度、投料方式和投料比对产物合成的影响,并用红外光谱分析了产品的结构。结果表明,最佳工艺条件为:n(F)/n(A)=3.8~4.2;n(B-Cat)/n(A)=0.37;反应温度70~80℃;反应时间6 h。用此法合成的产物固含量高,水溶性好,贮存期长。用其固化丙烯酸酯乳液胶制得了聚酰亚胺挠性覆铜板(FCCL)样品,并测试和比较了所得样品的相关性能。 相似文献
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We investigated improvement of workability (viscosity), storage stability, and curing ability of thiirane resin for adhesive applications. The viscosity of bisphenol‐F thiirane resin was lower than that of bisphenol‐A thiirane resin, especially at low temperatures, thus improving ease of handling. Addition of diphenyl decyl phosphite improved its storage stability to a level similar to that of bisphenol‐A epoxy resin. The curing of bisphenol‐F thiirane resin increased three times faster by adding 2,4,6‐tris(dimethylaminomethyl)phenol (DMP‐30) as a tertiary amine. In applications of this new thiirane resin as civil and architectural adhesives, a superior curing ability at low temperature was attained. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2953–2957, 2001 相似文献
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Reactive interfacial agents are often used to homogenise the morphology of immiscible polymer blends and to improve the level of adhesion between the phases to achieve enhanced properties. This paper demonstrates the ability of hydroxyl methyl bisphenol A (HMBPA) to function as a reactive interfacial agent (compartibilizer) in a nitrile-epoxy film adhesive made from nitrile rubber (NBR) and solid epoxy resin blend. The curing of the adhesive film was achieved at 170° C by adding dicyandiamide, a latent curing agent for epoxy resin, and rubber vulcanising agents. Hydroxyl methyl bisphenol A resins with different hydroxyl methyl content, synthesised by the base-catalysed reaction of bisphenol A and formaldehyde in various mole ratios, were used to compatibilize a blend of nitrile rubber (NBR) and epoxy resin 50/50wt/wt. The effect of addition of HMBPA on the morphology, adhesive, thermal, and mechanical properties of the adhesive film was investigated. The nitrile-epoxy adhesive films were characterised by measurements of adhesive joint strength, stress-strain properties, DSC, TGA, TMA, DMA, and SEM. Results revealed that significant improvement in joint strength occurred at low levels of HMBPA, and the optimum strength was obtained at about 15 wt% of HMBPA in the blend. The hydroxyl methyl content in HMBPA was found to influence the properties of the adhesive film. The concept of strengthening the interphase between NBR and epoxy through the coupling reactions of HMBPA was used for interpreting the results. The effect of addition of silica, alumina, and aluminium fillers on the properties of the nitrile-epoxy adhesive film was also studied, and a comparison of properties with and without HMBPA is presented. 相似文献
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Reactive interfacial agents are often used to homogenise the morphology of immiscible polymer blends and to improve the level of adhesion between the phases to achieve enhanced properties. This paper demonstrates the ability of hydroxyl methyl bisphenol A (HMBPA) to function as a reactive interfacial agent (compartibilizer) in a nitrile-epoxy film adhesive made from nitrile rubber (NBR) and solid epoxy resin blend. The curing of the adhesive film was achieved at 170° C by adding dicyandiamide, a latent curing agent for epoxy resin, and rubber vulcanising agents. Hydroxyl methyl bisphenol A resins with different hydroxyl methyl content, synthesised by the base-catalysed reaction of bisphenol A and formaldehyde in various mole ratios, were used to compatibilize a blend of nitrile rubber (NBR) and epoxy resin 50/50wt/wt. The effect of addition of HMBPA on the morphology, adhesive, thermal, and mechanical properties of the adhesive film was investigated. The nitrile-epoxy adhesive films were characterised by measurements of adhesive joint strength, stress-strain properties, DSC, TGA, TMA, DMA, and SEM. Results revealed that significant improvement in joint strength occurred at low levels of HMBPA, and the optimum strength was obtained at about 15 wt% of HMBPA in the blend. The hydroxyl methyl content in HMBPA was found to influence the properties of the adhesive film. The concept of strengthening the interphase between NBR and epoxy through the coupling reactions of HMBPA was used for interpreting the results. The effect of addition of silica, alumina, and aluminium fillers on the properties of the nitrile-epoxy adhesive film was also studied, and a comparison of properties with and without HMBPA is presented. 相似文献
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以1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZ-DA)为固化剂,采用示差扫描量热法(DSC),TGA,红外光谱及剪切强度测试研究了双酚F环氧树脂/DHPZ-DA粘接体系固化行为及耐热性。由Kissinger和Ozawa方法计算得到固化体系的表观活化能分别为80.1 kJ/mol和84.3kJ/mol。由Crane方程求得的表观反应级数为0.93。该胶粘剂体系Tg>200℃,当双酚F环氧树脂与DHPZ-DA固化剂的物质的量比为10∶4时,其室温剪切强度与150℃老化24 h后的剪切强度均大于12 MPa,表现出良好的耐热性。 相似文献
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Phenyl glycidyl ether was used to react with solid metaphenylene diamine (MPDA) to produce N-(3-phenoxy-2-hydroxypropyl)-1,3-benzenediamine (NPHB). MPDA was intentionally formulated to have an excessive amount to obtain a new liquid MPDA–NPHB mixture. The mixed curing agent was indicated to have a few advantages over MPDA. The mixed curing agent was then used to cure diglycidyl ether of bisphenol A as cryogenic epoxy adhesive. The effects of the MPDA–NPHB content were systematically studied on the impact strength and shear strength at both room temperature and cryogenic nitrogen temperature of the epoxy adhesive. Moreover, two coupling agents with various contents were used to further enhance the shear strength of the optimal cryogenic epoxy adhesive. Finally, differential scanning calorimetry analysis showed that the modified adhesive showed a higher glass transition temperature than the unmodified adhesive. 相似文献