FDTD modeling incorporating a two-port network for I/O line EMIfiltering design

Electromagnetic interference (EMI) filters are often utilized on I/O lines to reduce high-frequency noise from being conducted off the printed circuit board (PCB) and causing EMI problems. The filtering performance is often compromised at high frequencies due to parasitics associated with the filter itself, or the PCB layout and interconnects. Finite difference time domain (FDTD) modeling can be used to quantify the effect of PCB layout and interconnects, as well as filter type, on the EMI performance of I/O line filtering. FDTD modeling of a T-type and π-type filter consisting of surface-mount ferrites and capacitors is considered herein. The FDTD method is applied to model PCB layout and interconnect features, as well as the lumped element components, including the nonlinear characteristics of ferrite surface-mount parts. The EMI filters with ferrites; are included in the modeling by incorporating the time-domain Y-parameters of the two-port network into the FDTD time-marching equations. Good agreement between the FDTD modeling and S-parameter measurements supports the new FDTD algorithm for incorporating two-port networks     

EMI mitigation with multilayer power-bus stacks and via stitchingof reference planes

General methods for reducing printed circuit board (PCB) emissions over a broad band of high frequencies are necessary to meet EMI requirements, as processors become faster and more powerful. One mechanism by which EMI can be coupled off a PCB or multichip module (MCM) structure is from high-frequency fringing electric fields on the DC power and reference planes at the substrate periphery. An approach for EMI mitigation by stitching multiple ground planes together along the periphery of multilayer PCB power-bus stacks with closely spaced vias is reported and quantified in this paper. Power-bus noise induced EMI and coupling from the board edges is the major concern herein. The EMI at 3 m for different via stitch spacing and layer thickness is modeled with the finite-difference time domain (FDTD) method. Design curves and an empirical equation are extracted from a parametric study to summarize the variation of the radiated EMI as a function of layer thickness and stitch spacing     

有限地平面上差分对共模噪声的分析

共模噪声是高速数字电路产生电磁干扰的主要原因,而共模电感又是共模噪声大小的决定因素。以多层板的微带线为模型,推导出在偏离地平面中心以及跨越不连续地平面的情况下,PCB上差分对共模电感的定量表达式,并对其共模噪声的特性进行了详细讨论。其结论可以帮助设计人员理解共模噪声产生机制,并针对具体电路走线定量分析,提前准确发现设计中潜在的问题。     

Numerical and experimental corroboration of an FDTD thin-slot modelfor slots near corners of shielding enclosures

Simple design maxims to restrict slot dimensions in enclosure designs below a half-wave length are not always adequate for minimizing electromagnetic interference (EMI). Complex interactions between cavity modes, sources, and slots can result in appreciable radiation through nonresonant length slots. The finite-difference time domain (FDTD) method can be employed to pursue these issues with adequate modeling of thin slots. Subcellular FDTD algorithms for modeling thin slots in conductors have previously been developed. One algorithm based on a quasistatic approximation has been shown to agree well with experimental results for thin slots in planes. This FDTD thin-slot algorithm is compared herein with two-dimensional (2-D) moment method results for thin slots near corners and plane wave excitation. FDTD simulations are also compared with measurements for slots near an edge of a cavity with an internal source     

Electromagnetic interference (EMI) of system-on-package (SOP)

Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration.     

Quantifying EMI resulting from finite-impedance reference planes

Parasitic inductance in printed circuit board (PCB) geometries can detrimentally impact the electromagnetic interference (EMI) performance and signal integrity of high-speed digital designs. This paper identifies and quantifies the parameters that affect the inductance of some typical PCB geometries. Closed-form expressions are provided for estimating the inductances of simple trace and ground plane configurations     

High-performance inter-PCB connectors: analysis of EMIcharacteristics

Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. Two experimental techniques, based on |S₂₁| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FDTD) modeling, were used as experimental and numerical tools for inter-printed-circuit-board (inter-PCB) connector evaluation. The EMI performance of a lab-constructed stacked-card connector, and a commercially available module-on-backplane connector were studied. EMI characteristics of the connectors are demonstrated by investigating a few aspects of the design: type of shield/ground blade for signal return, number and length of ground pins, signal pin designation, etc. Good agreement is achieved between the measurements and the FDTD modeled results     

基于补偿原理的逆变器EMI抑制方法研究

由于逆变器电源对输出接地电容的限制,对严重的共模电磁干扰难以用大容量的共模滤波器抑制共模噪声。文章介绍了一种新型的基于噪声电流补偿原理的电力电子装置无源干扰抑制技术,探讨了不同方案实现对共模噪声电流的补偿,并在一台DC/AC逆变器中进行了补偿测试。实验结果证实了该EMI抑制方法的有效性。     

Modeling and Measurement of Radiated Field Emission From a Power/Ground Plane Cavity Edge Excited by a Through-Hole Signal Via Based on a Balanced TLM and Via Coupling Model

A balanced transmission line model (TLM) and via coupling model is proposed for efficient simulation of radiated field emission from a power/ground plane cavity edge, where the radiated field emission is excited by a through-hole signal via in a multilayer package and printed circuit board (PCB). The radiated field emission is simulated and measured with a series of test boards. The simulation agrees fairly well with the measurement confirming the preciseness and usefulness of the proposed model. It is shown that the through-hole signal via is a considerable source of the radiated field emission as well as the signal loss. When the signal trace is switching vertically stacked reference planes, the signal return current path is disconnected at the via and the impedance becomes extremely high. A significant amount of insertion loss and radiated field emission is generated at resonance frequencies of the plane cavity. The effect of a decoupling capacitor fence (De-Cap Fence) at the edge of the board to mitigate the radiated field emission is examined. The proposed model confirms that the De-Cap Fence changes the resonance mode and frequency of the plane cavity, and reduces the radiated field emission     

一种预测印制电路板EMI的方法

在印刷电路板的设计阶段进行电磁兼容性(EMC)设计是十分重要的.本文介绍了一种预测印制电路板电磁干扰(EMI)的方法,得出微机开关电源PCB板的近场分布图,并以此为参考选择布线路径.     

Input impedance of a monopole antenna at the center of a finite ground plane

A technique for computing the input impedance of a monopole on a finite ground plane is provided. The case of an infinite ground plane is first examined, and then the concept of using a magnetic edge current as an equivalent source of diffraction on the limited size ground plane is introduced. The technique used is serf-consistent in that the circular ground plane considered is the limit of a polygonal ground plane as the number of sides tends to infinity. Good agreement has been demonstrated when the nearest edge of the ground plane is at least 0.3 wavelength from the base of the monopole.     

印刷电路板供电系磁性材料涂层的应用

印刷电路板（PCB）的电磁兼容问题,随着数字电路的工作频率越来越高而变得尤为重要。本文以印刷电路板中的电源接地层供电系构造为切入点,讨论与其相关的电磁兼容问题。在高频段,印刷电路板的电源和接地层构造相当于一个平行平板谐振器,对周围的电路产生电磁干扰（EMI）。基于全腔模模型,已经发展了用于高效准确计算供电系阻抗的快速算法。利用此算法,通过计算机仿真,结果表明PCB电源接地层导体内侧增加磁性材料涂层能够提高表面阻抗,进而减小端口输入阻抗的谐振峰并改善信号完整性。     

The theory of a singularity-enhanced FDTD method for diagonal metal edges

The complete theory of a singularity-enhanced finite-difference time-domain (FDTD) method for a sharp diagonal metal edge is presented. This method is very accurate and efficient for modeling printed microwave components with diagonal metal edges including some microstrip patch antennas, various other printed antennas, and printed transmission lines. Considering the singular nature of electromagnetic fields at a sharp metal edge, new FDTD equations are derived for all electric and magnetic nodes near the edge, using a contour-path subcell approach. The new FDTD equations for the affected nodes differ from the standard (Yee's) FDTD equations only by a few additional coefficients, for which complete mathematical expressions are given. Application of this method to several antenna and transmission-line problems demonstrated significantly improved accuracy over previous methods, without any noticeable computing overhead. A coarse grid can be used in conjunction with this method and hence the required computer memory and time can be reduced drastically. We have used the maximum allowed time step in all our applications and the method was always stable.     

高速PCB近区场电磁骚扰研究

分析了高速电子电路产生的电磁干扰(EMI)及相关印刷电路板(PCB)上电磁骚扰源的模型特征。利用电偶极子与磁偶极子模型分别对PCB上的共模辐射源和差模辐射源建模,着重探讨近区场辐射特征。以一种500MHz的高速电路为例,在MATLAB平台上分别对其电场与磁场进行仿真。结果表明,其近区场电场与磁场强度最高分别可达5×1011μV/m和9×1011μA/m。依据所使用模型及其仿真结果,有针对性地提出几种降低高速PCB电磁骚扰的方案,并比较了这几种方案的优劣。     

Study of the ground bounce caused by power plane resonances

We describe Delta-I noise caused by power plane resonances in multilayer boards. First, we study the effect of power plane resonances on the ground bounce of the system by performing finite-difference time-domain (FDTD) simulations. We simulate the voltage fluctuations at one point of the printed circuit board (PCB) due to a current surge between the power planes in a different point. Next, two methods to prevent this ground bounce effect are investigated. The first method consists of adding lumped capacitances to the design. The effect of one large capacitor is compared to the effect of adding a “wall” of smaller capacitors. A second approach is to isolate the chips by etching a slot around the sensitive integrated circuits (ICs) and connecting both sides by a small inductor. Both methods provide excellent protection against power plane resonances     

印制电路板电磁兼容设计浅析

文中介绍了印制电路板上电磁干扰辐射产生的主要原因,并对其产生的机理进行了详细的研究和分析,得出了能够减少电磁干扰的几种方法。在印刷电路板设计中,对单面板的线路板迹线的阻抗和PCB布线的分析以及对双层PCB板的设计分析,基本保证了印电路板的质量与可靠性,并减小了电肱干扰的影响。最后,通过对地线网络、地线面、输入输出地的结构、地线布线规则等几种接地方式进行较为详细的研究与分析,得出了进一步减小电磁干扰的方法。     

On the external inductive coupling of differential signalling on printed circuit boards

A study of the common-mode radiation behavior of differential signalling is presented, considering small current imbalances, which may originate from differential driver phase skew and circuit asymmetries. Two configurations are investigated, a solid ground plane and a ground plane with an open slit as an example of a ground-plane discontinuity. The external coupling voltage responsible for common-mode radiation is quantified through coupling inductances, for which closed-form expressions are derived and numerically validated. It is found that common-mode electromagnetic interference from differential signalling may become comparable to conventional single trace routing when traces are placed near the edge of the ground plane. For traces routed across a ground-plane discontinuity, differential signalling is only an effective means for reducing radiation when signal imbalance can be kept small.     

EMI from cavity modes of shielding enclosures-FDTD modeling andmeasurements

Electromagnetic interference (EMI) from slots and apertures resulting from coupling of interior sources through enclosure cavity modes in a rectangular test enclosure is reported. EMI from a specially designed test enclosure with slots or apertures excited by interior sources was studied experimentally and with finite-difference time-domain (FDTD) modeling. The measurements and FDTD modeling agree well. The results indicate that radiation at cavity mode resonances through slots and apertures of nonresonant dimensions can be as significant as the radiation at aperture or slot resonances. The agreement between the FDTD modeling and measurements demonstrates the usefulness of FDTD for investigating aspects of shielding enclosure design such as coupling to slots and apertures and slot interactions     

平直有耗地面上目标地波散射FDTD近一远场外推

由平直有耗地面上垂直电偶极子产生地波场的解析解和互易原理,本文导出了用FDTD方法处理目标地波散射问题时的近一远场外推公式。在数值结果验证了该公式的正确性之后,对海上一金属半球的地波散射场进行了求解,并以此与李清亮等(1997)提出的工程应用方法相对比,考察了工程应用方法的适用性。     

An FDTD/MoM hybrid technique for modeling complex antennas in thepresence of heterogeneous grounds

Calculating the current distribution and radiation patterns for ground-penetrating radar antennas is a challenging problem because of the complex interaction between the antenna, the ground, and any buried scatterer. Typically, numerical techniques that are well suited for modeling the antennas themselves are not well suited for modeling the heterogeneous grounds, and visa versa. For example the finite-difference time-domain (FDTD) technique is well suited for modeling fields in heterogeneous media, whereas the method of moments (MoM) is well suited for modeling complex antennas in free space. This paper describes a hybrid technique, based upon the equivalence principle, for calculating an antenna's current distribution radiation pattern when the antenna is located near an air-ground interface. The original problem is decomposed into two coupled equivalent problems: one for the antenna geometry and the other for the ground geometry, with field information passing between them via a rapidly converging iterative procedure. The fields in each region may be modeled using numerical techniques best suited to them. Results for several test cases are presented, using FDTD to model the ground problem and MoM for the antenna problem, that demonstrate the accuracy of this hybrid technique