Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Polyimide (PI) composites containing one-dimensional SiC nanowires grown on two-dimensional graphene sheets (1D–2D SiC_NWs-GSs) hybrid fillers were successfully prepared. The PI/SiC_NWs-GSs composites synchronously exhibited high thermal conductivity and retained electrical insulation. Moreover, the heat conducting properties of PI/SiC_NWs-GSs films present well reproducibility within the temperature range from 25 to 175 °C. The maximum value of thermal conductivity of PI composite is 0.577 W/mK with 7 wt% fillers loading, increased by 138% in comparison with that of the neat PI. The 1D SiC nanowires grown on the GSs surface prevent the GSs contacting with each other in the PI matrix to retain electrical insulation of PI composites. In addition, the storage modulus and Young’s modulus of PI composites are remarkably improved in comparison with that of the neat PI.     

Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

Aluminum oxide and aluminum nitride with different sizes were used alone or in combination to prepare thermally conductive polymer composites. The composites were categorized into two systems, one including composites filled with large-sized aluminum nitride and small-sized aluminum oxide particles, and the other including composites filled with large-sized aluminum oxide and small-sized aluminum nitride. The use of these hybrid fillers was found to be effective for increasing the thermal conductivity of the composite, which was probably due to the enhanced connectivity offered by the structuring filler. At a total filler content of 58.4 vol.%, the maximum values of both thermal conductivities in the two systems were 3.402 W/mK and 2.842 W/mK, respectively, when the volume ratio of large particles to small particles was 7:3. This result was represented when the composite was filled with the maximum packing density and the minimum surface area at the same volume content. As such, the proposed thermal model predicted thermal conductivity in good agreement with experimental values.     

Thermal conductivity of graphene nanoplatelets filled composites fabricated by solvent-free processing for the excellent filler dispersion and a theoretical approach for the composites containing the geometrized fillers

The thermal conductivity of polymer composites containing nanofillers such as GNP (graphene nanoplatelet) and carbon black (CB) was investigated using experimental and theoretical approaches. We developed a fabrication method that allows different shapes and sizes of nanofillers to be highly dispersed in polymer resin. When the bulk and in-plane thermal conductivities of the fabricated composites were measured, they were found to increase rapidly as the GNP filler content increased. The in-plane thermal conductivity of composites with 20 wt.% GNP filler was found to reach a maximum value of 1.98 W/m K. The measured thermal conductivities were compared with the calculated values based on a micromechanics model where the waviness of nanofillers could be taken into account. The waviness of the incorporated GNP filler is an important physical factor that determines the thermal conductivity of composites and must be taken into consideration in theoretical calculations.     

Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Cu/diamond composites were fabricated by spark plasma sintering (SPS) after the surface pretreatment of the diamond powders, in which the diamond particles were mixed with copper powder and tungsten powder (carbide forming element W). The effects of the pretreatment temperature and the diamond particle size on the thermal conductivity of diamond/copper composites were investigated. It was found that when 300 μm diamond particles and Cu–5 wt.% W were mixed and preheated at 1313 K, the composites has a relatively higher density and its thermal conductivity approaches 672 W (m K)⁻¹.     

Highly thermally conductive POSS-g-SiCp/UHMWPE composites with excellent dielectric properties and thermal stabilities

Polyhedral oligomeric silsesquioxane grafting thermally conductive silicon carbide particle (POSS-g-SiCp) fillers, are performed to fabricate highly thermally conductive ultra high molecular weight polyethylene (UHMWPE) composites combining with optimal dielectric properties and excellent thermal stabilities, via mechanical ball milling followed by hot-pressing method. The POSS-g-SiCp/UHMWPE composite with 40 wt% POSS-g-SiCp exhibits relative higher thermal conductivity, lower dielectric constant and more excellent thermal stability, the corresponding thermally conductive coefficient of 1.135 W/mK, the dielectric constant of 3.22, and the 5 wt% thermal weight loss temperature of 423 °C, which holds potential for packaging and thermal management in microelectronic devices. Agari’s semi-empirical model fitting reveals POSS-g-SiCp fillers have strong ability to form continuous thermally conductive networks.     

Synergetic effect of thermal conductive properties of epoxy composites containing functionalized multi-walled carbon nanotubes and aluminum nitride

This study investigates the thermal conductivity of epoxy composites containing two hybrid fillers which are multi-walled carbon nanotubes (MWCNTs) and aluminum nitride (AlN). To form a covalent bonds between the fillers and the epoxy resin, poly(glycidyl methacrylate) (PGMA) were grafted onto the surface of nano-sized MWCNTs via free radical polymerization and micro-sized AlN was modified by zirconate coupling agent. Results show that functionalized fillers improve thermal conductivity of epoxy composites, due to the good dispersion and interfacial adhesion, which is confirmed by scanning electron microscope. Furthermore, the hybrid fillers provide synergetic effect on heat conductive networks. The thermal conductivity of epoxy composites containing 25 vol.% modified AlN and 1 vol.% functionalized MWCNTs is 1.21 W/mK, comparable to that of epoxy composites containing 50 vol.% untreated AlN (1.25 W/mK), which can reduce the half quantity of AlN filler used.     

Effect of silica coating thickness on the thermal conductivity of polyurethane/SiO2 coated multiwalled carbon nanotube composites

Silica coated multiwalled carbon nanotubes (SiO₂@MWCNTs) with different coating thicknesses of ∼4 nm, 30–50 nm, and 70–90 nm were synthesized by a sol–gel method and compounded with polyurethane (PU). The effects of SiO₂@MWCNTs on the electrical properties and thermal conductivity of the resulting PU/SiO₂@MWCNT composites were investigated. The SiO₂ coating maintained the high electrical resistivity of pure PU. Meanwhile, incorporating 0.5, 0.75 and 1.0 wt% SiO₂@MWCNT (70–90 nm) into PU, produced thermal conductivity values of 0.287, 0.289 and 0.310 W/mK, respectively, representing increases of 62.1%, 63.3% and 75.1%. The thermal conductivity of PU/SiO₂@MWCNT composites was also increased by increasing the thickness of the SiO₂ coating.     

The thermal conductivity of Al(OH)3 covered MWCNT/epoxy terminated dimethyl polysiloxane composite based on analytical Al(OH)3 covered MWCNT

Aluminum-hydroxide-covered multi-walled carbon nanotubes (A–MWCNT) were fabricated as a thermally conductive material. The thermal conductivity of A–MWCNT was estimated based on Casimir theory. The effective thermal conductivity of A–MWCNT was estimated at about ∼26 W/mK. The thermal conductivity of A–MWCNT/epoxy-terminated polydimethylsiloxane (ETDS) composite was examined as a function of A–MWCNT loading, and the results showed the maximum value at 1.5 wt% of A–MWCNT loading, above which it decreased slightly. The effective medium approximation (EMA) developed by Maxwell–Garnett (M–G) was used to analyze the thermal conducting behavior of the composite. The experimental results showed negative deviation from the expected thermal conductivity, k_e, beyond 1.5 wt% of A–MWCNT loading, because the composites containing A–MWCNT were strongly affected by interfacial resistance. The interfacial resistance value calculated from M–G approximation increased when filler loading was higher than 1.5 wt% because of the folded and partially agglomerated A–MWCNT along with insufficient interfacial interactions.     

Synergistic effect of hybrid graphene nanoplatelet and multi-walled carbon nanotube fillers on the thermal conductivity of polymer composites and theoretical modeling of the synergistic effect

We found that the thermal conductivity of polymer composites was synergistically improved by the simultaneous incorporation of graphene nanoplatelet (GNP) and multi-walled carbon nanotube (MWCNT) fillers into the polycarbonate matrix. The bulk thermal conductivity of composites with 20 wt% GNP filler was found to reach a maximum value of 1.13 W/m K and this thermal conductivity was synergistically enhanced to reach a maximum value of 1.39 W/m K as the relative proportion of MWCNT content was increased but the relative proportion of GNP content was decreased. The synergistic effect was theoretically estimated based on a modified micromechanics model where the different shapes of the nanofillers in the composite system could be taken into account. The waviness of the incorporated GNP and MWCNT fillers was found to be one of the most important physical factors determining the thermal conductivity of the composites and must be taken into consideration in theoretical calculations.     

Enhanced thermal conductivity and dielectric properties of Al/β-SiCw/PVDF composites

Polymeric composites with high thermal conductivity, high dielectric permittivity but low dissipation factor have wide important applications in electronic and electrical industry. In this study, three phases composites consisting of poly(vinylidene fluoride) (PVDF), Al nanoparticles and β-silicon carbide whiskers (β-SiC_w) were prepared. The thermal conductivity, morphological and dielectric properties of the composites were investigated. The results indicate that the addition of 12 vol% β-SiC_w not only improves the thermal conductivity of Al/PVDF from 1.57 to 2.1 W/m K, but also remarkably increases the dielectric constant from 46 to 330 at 100 Hz, whereas the dielectric loss of the composites still remain at relatively low levels similar to that of Al/PVDF at a wider frequency range from 10⁻¹ Hz to 10⁷ Hz. With further increasing the β-SiC_w loading to 20 vol%, the thermal conductivity and dielectric constant of the composites continue to increase, whereas both the dielectric loss and conductivity also rise rapidly.     

A facile assembly of polyimide/graphene core–shell structured nanocomposites with both high electrical and thermal conductivities

Polyimide/reduced graphene oxide (PI/r-GO) core–shell structured microspheres were fabricated by in-situ reduction of graphene oxide (GO), which was coated on the surface of PI microspheres via hydrogen bonding and π–π stacking interaction. The highly ordered 3D core–shell structure of PI/r-GO microspheres with graphene shell thickness of 3 nm was well characterized by scanning electron microscope (SEM), transmission electron microscopy (TEM) and Raman spectra. The glass transition temperature (T_g) of PI/r-GO microspheres was slightly increased because of the interaction of r-GO and PI matrix while the temperature at 5% weight loss (T_5%) of PI/r-GO microspheres was decreased due to the side effect of reductant hydrazine hydrate. The PI/r-GO nanocomposites exhibited highly electrical conductivity with percolation threshold of 0.15 vol% and ultimate conductivity of 1.4 × 10⁻² S/m. Besides, the thermal conductivity of PI/r-GO nanocomposites with 2% weight content of r-GO could reach up to 0.26 W/m K.     

Heterogeneously structured conductive carbon fiber composites by using multi-scale silver particles

This paper reports a new approach to enhance the through-thickness thermal conductivity of laminated carbon fabric reinforced composites by using nanoscale and microscale silver particles in combination to create heterogeneously structured continuous through-thickness thermal conducting paths. High conductivity of 6.62 W/(m K) with a 5.1 v% silver volume fraction can be achieved by incorporating these nanoscale and microscale silver particles in EWC-300X/Epon862 composite. Silver flakes were distributed within the inter-tow area, while nanoscale silver particles penetrated into the fiber tows. The combination of different sizes of silver fillers is able to effectively form continuous through-thickness conduction paths penetrating fiber tows and bridging the large inter-tow resin rich areas. Positive hybrid effects to thermal conductivity were found in IM7/EWC300X/sliver particle hybrid composites. In addition, microscale fillers in resin rich areas showed less impact on tensile performance than nanoscale particles applied directly on fiber surface.     

Fabrication of diamond/aluminum composites by vacuum hot pressing: Process optimization and thermal properties

Diamond/Al composites were prepared by vacuum hot pressing (VHP) to get high thermal properties. The sintering temperature, pressure and time in the VHP process were optimized. Microstructures, thermal properties, interface reaction product and its effect on the properties of the composites were investigated. The result shows that the sintering temperature and time are key parameters to get high thermal property of the composites. The composites with 20–55 vol% diamond sintered at 650 °C for 90 min under a pressure of 67 MPa exhibit thermal conductivities of 320–567 W/mK, over 90% of the theoretical predictions by the differential effective medium (DEM) scheme. The high thermal conductivity is attributed to the favorable interface conductance, while the formation of aluminum carbide at diamond–Al interface is found to be negative.     

Preparation of low-density polyethylene/low-temperature expandable graphite composites with high thermal conductivity by an in situ expansion melt blending process

A facile strategy with the advantages of low cost and ease of mass production was presented to prepare low-density polyethylene (LDPE)/low-temperature expandable graphite (LTEG) composites with relatively high thermal conductivity by an in situ expansion melt blending process. LTEGs were expanded and delaminated into graphite multi-layers and graphite nanoplatelets during processing which synergistically created more thermo-conducting paths in the composites and hence led to great improvements in thermal conductivity. Thermal conductivity of the composite with 60 wt% of LTEG loading was increased by 23 times as compared to the pure LDPE, increasing from 0.47 to 11.28 W/mK. The incorporation of LTEG decreased the melting temperature and the degree of crystallinity of LDPE. Percolation threshold of both the electrical conductivity and rheological measurements was observed at about 8 vol% of LTEG loading. Moreover, the LDPE/LTEG composites showed better thermal stability compared to the pure LDPE.     

Evaluation of transverse thermal conductivity of Manila hemp fiber in solid region using theoretical method and finite element method

The transverse thermal conductivity of Manila hemp fiber in solid region K_sf was evaluated using theoretical method (Hasselman–Johnson’s model) and finite element method (FEM). It was found that the results of them are similar to each other: 0.1847 W/(mK) from Hasselman–Johnson’s model and 0.1849 W/(mK) from FEM. The evaluated data of K_sf was used to estimate the transverse thermal conductivity of Manila hemp fiber composites compared with the experimental data showing good agreement.     

Enhanced conductivity behavior of polydimethylsiloxane (PDMS) hybrid composites containing exfoliated graphite nanoplatelets and carbon nanotubes

Polydimethylsiloxane (PDMS) hybrid composites consisting of exfoliated graphite nanoplatelets (xGnPs) and multiwalled carbon nanotubes functionalized with hydroxyl groups (MWCNTs-OH) were fabricated, and the effects of the xGnP/MWCNT-OH ratio on the thermal, electrical, and mechanical properties of polydimethylsiloxane (PDMS) hybrid composites were investigated. With the total filler content fixed at 4 wt%, a hybrid composite consisting of 75% × GnP/25% MWCNT-OH showed the highest thermal conductivity (0.392 W/m K) and electrical conductivity (1.24 × 10⁻³ S/m), which significantly exceeded the values shown by either of the respective single filler composites. The increased thermal and electrical conductivity found when both fillers are used in combination is attributed to the synergistic effect between the fillers that forms an interconnected hybrid network. In contrast, the various different combinations of the fillers only showed a modest effect on the mechanical behavior, thermal stability, and thermal expansion of the PDMS composite.     

Flexible and high thermal conductivity thin films based on polymer: Aminated multi-walled carbon nanotubes/micro-aluminum nitride hybrid composites

Multi-walled carbon nanotubes functionalized with amino groups (MWCNT-NH₂) were prepared via the chemical modification of the carboxyl groups introduced on the surface of MWCNT. The synthesized materials and untreated micro-aluminum nitride (micro-AlN) particles were embedded in a polymer resin, viz. epoxy-terminated dimethyl siloxane. The thermal diffusivity and conductivity of all of the composites continuously improved with increasing the content of fillers. A thermal conductivity of 3.81 W/mK was achieved at an MWCNT-NH₂ loading of 3 wt% and micro-AlN loading of 70 wt% while their flexibility was maintained. This result is due to the high aspect ratio of the MWCNT-NH₂ which allows a heat conductive percolation network to be established between the micro-AlN particles. Also, all of the composites fabricated by the optimized process endured about 200,000 bending cycles without rupturing or losing their thermal conductivity.     

Thermal conductivity of Cu–Zr/diamond composites produced by high temperature–high pressure method

Copper matrix composites reinforced with about 90 vol.% of diamond particles, with the addition of zirconium to copper matrix, were prepared by a high temperature–high pressure method. The Zr content was varied from 0 to 2.0 wt.% to investigate the effect on interfacial microstructure and thermal conductivity of the Cu–Zr/diamond composites. The highest thermal conductivity of 677 W m⁻¹ K⁻¹ was achieved for the composite with 1.0 wt.% Zr addition, which is 64% higher than that of the composite without Zr addition. This improvement is attributed to the formation of ZrC at the interface between copper and diamond. The variation of thermal conductivity of the composites was correlated to the evolution of interfacial microstructure with increasing Zr content.     

Production and characterization of lightweight vermiculite/geopolymer-based panels

The production and the properties of lightweight composite panels, with expanded vermiculite as lightweight aggregate and geopolymer as binder, were investigated. Different compositions of the geopolymer binders (metakaolin or alumina-based) and two sizes of expanded vermiculite were tested. The produced composites were subjected to microstructural analyses, as well as to thermal and mechanical tests. Densities ranged between 700 and 900 kg/m³, while the average strength and thermal conductivity were about 2 MPa and 0.2 W/mK, respectively. Results show that lightweight composites can be produced with satisfactory density and mechanical and thermal properties compared with other materials used in building sector, such as plasterboard or cellular concrete.     

Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu composites

Thermal conductivity of SiCp/Cu composites was usually far below the expectation, which is usually attributed to the low real thermal conductivity of matrix. In the present work, highly pure Cu matrix composites reinforced with acid washed SiC particles were prepared by the pressure infiltration method. The interfacial microstructure of SiCp/Cu composites was characterized by layered interfacial products, including un-reacted SiC particles, a Cu–Si layer, a polycrystalline C layer and Cu–Si matrix. However, no Cu₃Si was found in the present work, which is evidence for the hypothesis that the formation of Cu₃Si phase in SiC/Cu system might be related to the alloying elements in Cu matrix and residual Si in SiC particles. The thermal conductivity of SiCp/Cu composites was slightly increased with the particle size from 69.9 to 78.6 W/(m K). Due to high density defects, the real thermal conductivity of Cu matrix calculated by H–J model was only about 70 W/(m K). The significant decrease in thermal conductivity of Cu matrix is an important factor for the low thermal conductivity of SiCp/Cu composites. However, even considered the significant decrease of thermal conductivity of Cu matrix, theoretical values of SiCp/Cu composites calculated by H–J model were still higher than the experimental results. Therefore, an ideal particle was introduced in the present work to evaluate the effect of interfacial thermal resistance. The reverse-deduced effective thermal conductivities of ideal particles according to H–J model was about 80 W/(m K). Therefore, severe interfacial reaction in SiCp/Cu composites also leads to the low thermal conductivity of SiCp/Cu composites.