A Formaldehyde-Free Water-Resistant Soy Flour-Based Adhesive for Plywood

The phasing out of the use of urea–formaldehyde adhesive in the fabrication of interior‐used hardwood plywood requires development of environmentally friendly bio‐based wood adhesives. We recently reported that phosphorylation of soy flour (SF) using phosphoryl chloride (POCl₃) greatly improved the moisture resistance of soy flour adhesive. In the present study, we investigated the effects of inorganic oxidizing agents, such as NaClO₂ and Ca(NO₂)₂, to further improve the wet bonding strength of phosphorylated SF (PSF) wood adhesive. We report that addition of 1.8 % (wet weight basis) Ca(NO₂)₂ to phosphorylated SF (PSF) adhesive formulation containing 25 % soy flour solids increased the wet bonding strength to greater than 3 MPa at 140 °C hot‐press temperature. The water resistance testing of the glued three‐ply hardwood plywood panels passed the three‐cycle soak/dry test recommended by the American National Standard for Hardwood and Decorative Plywood/Hardwood Plywood and Veneer Association protocol (ANSI/HPVA HP‐1‐2004). Since the process involves only inorganic chemistry and no petroleum‐based chemicals such as formaldehyde or polyamidoamine–epichlorohydrin are used, the PSF + Ca(NO₂)₂ adhesive is non‐toxic and environmentally safe.     

Preparation of a New Type of Polyamidoamine and Its Application for Soy Flour-Based Adhesives

The most commonly used curing agents for soy-based adhesives are polyamines, which have the problem of low solid content and/or high viscosity. To overcome this problem, a new type of polyamidoamine (PADA) resin was synthesized and applied to soy flour-based adhesives to improve their water resistance. The PADA solution obtained had a high solid content of 50 wt% and low viscosity of 270 cP. The optimum weight ratio of soy flour/PADA/maleic anhydride to prepare adhesive was 40/7/1.68. The wet strength of plywood prepared at the optimum weight ratio was 0.82 MPa, which meant the plywood could be used as type II plywood according to the Chinese National Standard GB/T 9846.7-2004. The results of water-insoluble solid content measurement and SEM observation demonstrated that cured soy flour–PADA–maleic anhydride adhesive had a 16 % greater water-insoluble solid content than soy flour–NaOH adhesive. The cross-linking network formed by the reactions of PADA and MA would increase the water-insoluble solid contents and improve water resistance of cured soy flour-based adhesives.     

A Formaldehyde-Free Soy-Based Adhesive for Making Oriented Strandboard

A formaldehyde-free adhesive consisting of soy flour, polyethylenimine, maleic anhydride, and sodium hydroxide was investigated for making randomly oriented strandboard (R-OSB) and oriented strandboard (OSB). The hot-press conditions and the adhesive usage rate were optimized in terms of enhancing internal bond strength (IB), modulus of rupture (MOR), and modulus of elasticity (MOE) of the resulting R-OSB and OSB. The IB, MOR, and MOE were the highest at a hot-press temperature of 170°C, a hot-press time of 4–5 min, and an adhesive usage rate of 7%. The strengths of the OSB panels made with this formaldehyde-free adhesive were compared with those of commercial OSB panels purchased at a local Home Depot store.     

An All‐Natural Adhesive for Bonding Wood

A novel adhesive that is solely based on natural materials of defatted soy flour (SF) and magnesium oxide (MgO) has been investigated for preparation of five‐ply plywood panels. The resulting plywood panels met the industrial water‐resistant requirement for interior plywood. In this study, mechanisms by which an aqueous mixture of SF and MgO served as a strong and water‐resistant adhesive for bonding wood were investigated. SF was first fractionated into soy protein isolates (SPI), a water‐soluble fraction, and insoluble carbohydrates (ICs) that were mixed with MgO, respectively, for preparation of maple laminates. The water resistance of the resulting maple laminates was evaluated by a three‐cycle water‐soaking‐and‐drying (WSAD) test and a two‐cycle boiling‐water test (BWT). The mixture of MgO and the soluble fraction was not able to bond maple veneers together. The shear strengths of the resulting maple laminates before and after WSAD and BWT all had the following order: MgO–SPI > MgO–SF > SF only > MgO–IC. The water solubility of SF in the heat‐cured SF–MgO mixture was much lower than that of the heat‐cured SF. We believe that the low water solubility of SF–MgO and close interactions between MgO and soy proteins instead of soy carbohydrates were responsible for the superior strengths and high water resistance of the soy‐MgO adhesive.     

Chromatographic Analysis of the Reaction of Soy Flour with Formaldehyde and Phenol for Wood Adhesives

The desire to make more biobased and lower-cost bonded wood products has led to an interest in replacing some phenol and formaldehyde in wood adhesives with soybean flour. Improved knowledge of the soy protein properties is needed to relate resin chemistry to resin performance before and after wood bonding. To expose the soy protein’s functional groups, it needs to be disrupted, with minimal hydrolysis, to maximize its incorporation into the final polymerized adhesive lattice. The best conditions for alkali soy protein disruption were to maintain the temperature below 100 °C and react the soy flour with sodium hydroxide at pH 9–12 for about 1 hour. A gel permeation chromatography procedure was optimized to determine conditions for selectively breaking down the high molecular weight soy protein fragments that contribute to high adhesive viscosity. This method and extraction data were used to evaluate the reaction of the disrupted soy flour protein with formaldehyde and phenol to provide a stable adhesive. The results were used to develop more economical adhesives that are ideally suited for the face section of oriented strandboard.     

杨木胶合板专用UF树脂胶的研究

速生杨木用于生产胶合板是近年内开始的，为解决杨木胶合板的胶合强度较低，油漆后发生鼓泡等质量问题，本文从木材的ｐＨ值、缓冲容量等方面着手，研究杨木的特性，并研制了适合杨木胶合板生产的专用ＵＦ树脂胶。     

建筑用的新型SBS万能胶的研制

叙述了用SBS热塑性弹性体替代氯丁橡胶生产建筑万能胶，并对新型万能胶的制备方法、原料配比做了阐述，通过两种万能胶的原料成本的比较，说明了新型万能胶具有制备工艺简单、成本低廉等优点。     

Ultimate Tensile Stress over a Zone: A New Failure Criterion for Adhesive Joints

The objective of this work was to develop a criterion for predicting the static strength of adhesively-bonded joints. Although there is a large body of literature on this subject, no satisfactory criterion has been proposed in any publication to date. To obtain a criterion, finite element models of widely differing joint geometries were developed, in which the stresses in the adhesive bonds were calculated in great detail. These were then compared with test measurements. After examining two toughened epoxy adhe-sives, the authors have developed a failure criterion that predicts failure loads to within approximately 15% of measured values. This is: that the maximum principal stress must exceed the ultimate tensile stress of the adhesive material over a finite zone normal to the direction of maximum principal stress. The size of this zone is a property of the adhesive that can be determined from a combination of analysis and test.