电流密度和施镀温度对铝合金表面Ni-SiC-MoS2复合镀层显微组织的影响

目的研究电镀工艺参数中的电流密度和施镀温度对铝合金表面Ni-Si C-MoS_2复合镀层组织形貌及成分的影响。方法利用复合电镀的方法在铝合金上制备Ni-Si C-MoS_2复合镀层。通过扫描电子显微镜、能谱仪以及显微硬度仪,分析不同电流密度和施镀温度下复合镀层的组织结构、成分、界面之间的结合情况以及显微硬度。结果电流密度为4 A/dm2时,镀层与基体的结合差,镀层表面粗糙不平;当电流密度增加到5 A/dm2时,镀层与基体结合紧密,并且镀层表面平整;当电流密度增大到6 A/dm2时,镀层表面平整度变差。施镀温度为40℃时,镀层厚度较薄;施镀温度为50℃时,镀层与基体结合良好,镀层表面平整;当施镀温度上升到60℃时,镀层与基体结合处出现裂纹,镀层质量下降。随电流密度和施镀温度的升高,镀层中Si C和MoS_2摩尔分数先增加后减小,显微硬度先增大后减小。结论采用复合电镀的方法在铝合金表面可以制备出Ni-Si C-MoS_2复合镀层,当电流密度为5 A/dm2、施镀温度为50℃时,制备出的Ni-Si C-MoS_2复合镀层表面平整,厚度均匀,Si C与MoS_2摩尔分数可分别达到10.40%和0.77%。复合镀层的显微硬度与其Si C含量成正比,最高可达357.7HV0.01,是基体合金硬度的3.7倍。     

电沉积方式对Cu-nanoAl_2O_3复合镀层组织结构和显微硬度的影响

用直流和单脉冲电镀法制备了Cu-nanoAl2O3复合镀层。通过扫描电镜观察了镀层的表面形貌,用X射线衍射仪分析了镀层的微观晶体结构,分别研究了影响直流和单脉冲纳米复合镀层显微硬度的各种因素。结果表明,与直流电镀方法相比,脉冲电镀方法使镀层晶粒尺寸变小,在T=24℃,Al2O3、粒子添加量25g/L、搅拌速度240r/min、阴极平均电流密度4A/dm2条件下,直流电沉积Cu-nanoAl2O3复合镀层硬度最大,在直流电镀工艺条件基础上选择频率为200Hz、工作比为0.3的单脉冲工艺条件制备的复合镀层硬度最大。     

Ni-Co-Mn合金的电镀工艺优化及与金刚石复合镀的摩擦磨损性能

通过电镀法制备Ni-Co-Mn三元合金并进行工艺优化,同时制备Ni-Co-Mn-金刚石复合镀层,采用硬度、纳米划痕、SEM、EDS、摩擦磨损等分析镀层性能。结果表明:Ni-Co-Mn三元合金电镀最佳主盐配方为Ni SO4 280g/L、Co SO4 11 g/L、Mn SO4 1 g/L;镀液温度低于50℃时镀层易"烧焦",高于60℃时,镀层硬度及结合力下降;当电流密度增大至3 A/dm2时,有利于形成平整致密的镀层;当电流密度超过5 A/dm2时,镀层表面易出现析氢、积瘤等缺陷;最佳电镀工艺条件下的镀层硬度达520.7 HV,膜基结合力达25.52 N;Mn含量越高,镀层硬度越大;Co含量越高,镀层与基体结合越好;Ni-Co-Mn-金刚石复合镀层的硬度达890.2 HV,摩擦因数为0.72,体积磨损率仅为5.46×10-6 mm3/(N·m),金刚石与胎体Ni-Co-Mn合金结合牢固,复合镀层的磨削性好,耐磨性强。     

直流电沉积法制备纳米晶体镍镀层及其热稳定性的研究

利用直流电沉积技术,系统分析电流密度和镀液糖精浓度对纳米晶体镍性能的影响。电流密度在0.5-1.5 A/dm2 范围内时,可调节糖精浓度制备出415-603Hv的显微硬度宽分布的纳米晶镀层。小电流密度0.5 A/dm2 时,随糖精浓度增大,镀层(200) 面衍射强度增强,结构由(111), (200)双织构向(200)面转变,且镀层内应力值降低,增大到1.2g/L时,内应力降为0MPa。镀层晶粒尺寸为28~98nm时,直到600℃晶粒才开始长大,结构稳定性较好;晶粒尺寸为10nm时,晶粒在317℃异常长大,其结构稳定性显著下降。     

镀银铜棒的制备与表面形貌的研究

采用无氰电镀银的工艺在纯铜基体上沉积具有纳米尺寸晶粒结构的银层。在不同的电流密度和电镀时间工艺下制备出一系列镀银试样。利用SEM、EDS和XRD对镀层的表面形貌和晶体结构进行分析。结果表明:优化后的电流密度为0.10 A/dm~2、电镀时间为40 min。在该参数下,所制备的镀层光亮、晶粒圆润均匀,(220)晶面为最优取向晶体面。     

磁控溅射银镀层和电镀银镀层硬度及结合性对比研究

采用电镀与中频-直流磁控溅射技术分别在Inconel 718镍基高温合金基体表面制备银镀层。使用维氏显微硬度计和微纳米划痕仪分别测量两种镀层在室温下、工况使用温度退火后、极限温度退火后的硬度与附着力;借助SEM、EDS观察测试镀层的微观形貌以及元素构成在不同保温处理后的变化。结果表明,在室温25℃下磁控溅射银镀层的显微硬度是139.7 HV,其硬度与电镀银镀层相比增强45.5%;附着力为40 N,是电镀法制得的3倍。保温处理后由于中频-直流磁控溅射法制得的银镀层的单个晶粒平均尺寸更小且分布更均匀,镀层与基体间界面的氧化被更好地抑制。相比传统电镀银镀层,400℃下磁控溅射银镀层硬度与结合性相比电镀银镀层有显著提高;但在650℃下优势较小,24 h后两种镀层都出现脱落。     

电沉积纳米镍-钻合金在金刚石工具制备中的应用研究

采用纳米镍一钴镀层制备电镀金刚石工具以期提高工具的性能。通过考察脉冲参数、细化添加剂、硫酸钴对镀层显微硬度的影响,得出结论：细化添加剂、硫酸钴都能细化晶粒,两者有竞争关系;改变峰值电流密度和开通时间可以细化晶粒,脉冲周期过短会造成晶粒粗化。镀层中钴的质量分数为9％,表面较光整,平均晶粒尺寸在14nm左右,显微硬度达到609HV。确定了制造金刚石工具最佳的电镀工艺参数,由其制得的工具平均寿命比纳米镍镀层材料工具高16％。     

电沉积纳米镍-钴合金在金刚石工具制备中的应用研究

采用纳米镍-钴镀层制备电镀金刚石工具以期提高工具的性能。通过考察脉冲参数、细化添加剂、硫酸钴对镀层显微硬度的影响,得出结论:细化添加剂、硫酸钴都能细化晶粒,两者有竞争关系;改变峰值电流密度和开通时间可以细化晶粒,脉冲周期过短会造成晶粒粗化。镀层中钴的质量分数为9%,表面较光整,平均晶粒尺寸在14nm左右,显微硬度达到609HV。确定了制造金刚石工具最佳的电镀工艺参数,由其制得的工具平均寿命比纳米镍镀层材料工具高16%。     

无氰电镀液中超声电沉积耐腐蚀纳米晶铜镀层

通过超声辅助电沉积法,在无氰络合电镀液中以高阴极电流密度在钕铁硼磁体上电沉积获得纳米晶铜防护镀层,研究了不同超声波频率下的镀层形貌、晶粒尺寸、显微硬度和耐腐蚀性能。结果表明,随着超声波频率的增加,络合电镀液体系的铜电沉积有效阴极电流密度显著增加,相应的阴极电流效率也提高,从而获得致密的纳米晶铜镀层。在阴极电流密度为4.0 A·dm^-2和超声波频率为40 kHz的条件下,能够获得平均晶粒尺寸为18.8 nm的铜镀层。超声辅助电沉积法还能促进烧结钕铁硼基体盲孔内的铜沉积,从而改善基体与镀层之间的结合力。在同样的镀层厚度下,烧结钕铁硼表面所沉积镀层的耐腐蚀性随超声波频率的提高而优化。     

Ni-P-α-Al2O3纳米复合电镀工艺研究

采用复合电镀技术,在黄铜表面制备高硬度的Ni-P-α-Al2O3纳米复合镀层,研究了阴极电流密度、纳米α-Al2O3添加量、镀液pH值、镀液温度和电镀时间对镀层硬度的影响。结果表明:当镀液温度为45℃,阴极电流密度为4A/dm2,镀液pH值为4.0,电镀时间为40min,镀液中纳米α-Al2O3的质量浓度为10g/L时,所得镀层均匀、细致、平滑,经适当热处理后,显微硬度可达到1 332HV。     

The effect of current density on the grain size of electrodeposited nanocrystalline nickel coatings

The aim of this work was to investigate the effect of current density on the grain size of electrodeposited nickel coatings. For this purpose, nanocrystalline nickel coatings were deposited from a Watts bath containing 5 g/l sodium saccharin as an additive, by direct current electroplating at different current densities. X-ray diffraction analysis and modified Williamson–Hall relation were used to determine the average grains size of the coatings. The experimental results showed that the coating grains size decreased sharply by increasing the current density from 10 mA/cm² to 75 mA/cm². Nanocrystalline nickel coating with average grain size smaller than 30 nm can be achieved at the current densities higher than 50 mA/cm². Furthermore, a general and simple theoretical model based on atomistic theory of electrocrystallization has been made in order to find out the relationship between the grain size and current density. According to this model the variation of log (d) versus log (i) was linear which is in accordance with experimental results for the current densities lower than 75 mA/cm².     

超声条件下脉冲电镀 Ni-纳米 Al2 O3 复合镀层及其显微硬度研究

目的优选脉冲参数,以获得具有较高显微硬度的复合镀层。方法超声条件下,采用脉冲电镀方法制备Ni-纳米Al2O3复合镀层。以显微硬度作为性能指标,对比考察平均电流密度、占空比、频率和施镀时间的影响。结果 Ni-纳米Al2O3复合镀层的显微硬度随着平均电流密度升高,占空比增大,频率升高,均呈现出先增后减的趋势,而随着施镀时间延长,呈现出近似递减的趋势。结论在平均电流密度8 A/dm2、占空比0.6、频率1.5 k Hz、施镀时间3 min的条件下,制备的Ni-纳米Al2O3复合镀层显微硬度最高,约为427.1HV。较高复合量的纳米微粒有效起到了弥散强化和细晶强化作用,改善了复合镀层结构致密程度,进而提高了显微硬度。     

Microstructure and properties of nanocrystalline nickel coatings prepared by pulse jet electrodeposition

The fabrication of nanocrystalline nickel coatings was conducted by pulse jet electrodeposition on the substrate of 45# carbon steel. The effects of average current density on the surface morphology, microstructure, average grain size and microhardness of nickel coatings were investigated by scanning electron microscopy (SEM), X-ray diffractometry (XRD) and microhardness measurement. In addition, the corrosion resistances of coating and substrate were compared. It is revealed that the nickel coatings prepared by pulse jet electrodeposition exhibit a fine-grained structure with a smooth surface and a high density, although some pores and defects are still present in coatings. With the increase of average current density, the average grain size of nickel coatings is reduced at first and then increased. The coating with the optimum compactness, the smallest average grain size (13.7 nm) and the highest microhardness are obtained at current density of 39.8 A/dm2. The corrosion resistance is obviously increased for the coatings prepared by pulse jet electrodeposition; however, the corrosion rate is increased after a certain period due to the penetration of the corrosive media.     

Characterization of nanocrystalline Co–W coatings on Cu substrate,electrodeposited from a citrate-ammonia bath

Cobalt–tungsten nanocrystalline coatings were electrodeposited on copper substrate using different current densities. The deposited coatings were single phase solid solution with an average grain size of about 18 nm, showing a nodular type of surface morphology. By increasing the deposition current density, the density of nodules was increased, with no obvious variation in grain size. Electrochemical impedance spectroscopy (EIS) confirmed the codeposition of tungsten through reduction of tungsten oxide film formed during the electrodeposition process. However, the role of ternary complexes in the bath cannot be ruled out, especially at lower cathodic potentials. The Co–W coating deposited at lower current densities showed higher tungsten content, microhardness, wear resistance and friction coefficient. However, this coating showed an inferior corrosion resistance. By increasing the deposition current density, a low tungsten coating with high corrosion resistant was obtained. This is attributed to the lower value of exchange current density of water reduction in the present of oxygen (i₀^H2O) achieved on the coating with lower tungsten content.     

Effect of nanocrystalline grain size on the electrochemical and corrosion behavior of nickel

Nanocrystalline nickel of different grain sizes (8–28 nm) was produced by electrodeposition using Watt's bath. Saccharine addition to the bath and pulsed current deposition were effective in lowering the grain size of the deposits. The grain size and microstrain of deposits was determined by X-ray diffraction analysis. The microhardness of nanocrystalline Ni ranged between 572 and 724 kg/mm². The electrochemical behavior of nanocrystalline Ni was evaluated in 1 mol/l H₂SO₄ and compared with that of coarse-grained nickel. All the nickel samples exhibited active–passive potentiodynamic polarization behavior. The zero current potential, passive current density and breakdown potential generally increased with decrease in grain size. The increased passive current density for nanocrystalline nickel confirmed the defective nature of passive film that forms on nanocrystalline nickel. The tendency for localized corrosion was lower in case of nanocrystalline nickel as indicated by increased breakdown potential. Tafel and linear polarization tests revealed that the corrosion rate of freshly exposed surfaces of Ni decreased with grain size, thereby indicating greater hindrance to anodic dissolution in nanocrystalline Ni. The magnitude of compressive microstrain in the Ni deposits increased with decrease in grain size.     

Mechanical attrition enhanced Ni electroplating

Ni coating was deposited on carbon steel by a mechanical attrition enhanced electroplating (MAEE) process. The electroplating was conducted in a traditional Watts' solution and the mechanical attrition action was applied by impact of glass balls on the sample surface with a special vibrating frequency. It is shown that the attrition has significant effects on the microstructure and the characteristics of electroplated Ni coating. When the current density is below a limited current density (i_L), the growth of grains is hindered under the mechanical attrition action and the nucleation of Ni grains processes at a high rate. Thus the Ni coating deposited has smooth surface morphology, refined grain size, pore-free, and with increased microhardness and excellent corrosion resistance. When the current density is above i_L, Ni dendrites formed by conventional electroplating can be cold-welded together by the moving glass balls, resulting in a compact Ni coating. Therefore, high-dense Ni coatings can be plated at a high current density and deposition rate.     

Microstructure and Performances of Nanocrystalline Zinc-nickel Alloy Coatings

THE STUDY on zinc-nickel alloy coatings isdeveloped rapidly because of their higher corrosionresistance and better mechanical characteristics[1-8].The zinc-nickel coatings provide improved corrosionprotection for steels in relatively aggressiveenvironments.It has been found that the maximumprotective ability can be reached with the nickel contentbetween12%and15%[9].Recently,several newzinc-nickel alloy technologies have been developed[10-15]and further researches for better coating andchara…     

Influence of pulse parameters on the microstructure and microhardness of nickel electrodeposits

Square-wave cathodic current modulation was used to electrodeposit fine-grained nickel from an additive-free and saccharin-containing Watts bath. The influence of pulse on-time, off-time, peak current density and saccharin on the grain size, surface morphology, crystal orientation, and microhardness was determined. The study showed that at constant off-time and peak current density, the crystal size of the deposits was found initially to decrease with pulse on-time before it started to increase with further increase in on-time. The crystal orientation progressively changed from a (111) texture at the on-time of 0.1 ms to a strong (200) texture at an on-time of 8 ms. An increase in the pulse off-time at constant on-time and peak current density resulted in a progressive increase in crystal size. However, the crystal orientation remained unaffected with increasing off-time. An increase in peak current density resulted in considerable refinement in crystal size of the deposits. The crystal orientation progressively changed from an almost random distribution at the lowest peak current density of 0.2 A/m² to a strong (200) texture at a peak current density of 2.0 A/m². The nanocrystalline nickel with grain size in the order of 30 nm can be produced from saccharin-containing Watts' baths. In contrast, when using an organic-free Watts' bath and similar pulse-plating conditions, the grain size can only be refined down to about 80-100 nm. The microhardness of deposits is related with grain size: when the grain size is large, the microhardness is consistent with Hall-Petch law (HPL); when the grain size is ultrafine, “nano-effect” would be generated, the microhardness is against HPL.