Design of EBG Power Distribution Networks With VHF-Band Cutoff Frequency and Small Unit Cell Size for Mixed-Signal Systems

Hybrid electromagnetic bandgap (EBG) power distribution networks (PDNs) with VHF-band cutoff frequency, small unit cell size, and wideband noise suppression characteristics are proposed. Commercial lumped chip inductors are used to implement inductive bridges between neighboring metal patches instead of conventional microstrip lines. A 1D analysis model of the EBG structure is developed to find a mathematical ground for the use of the lumped chip inductors in the EBG PDN designs. From 158 MHz to 4528 MHz a measured stopband bandwidth of 4.37 GHz is achieved with over -60 dB noise suppression levels.     

Analyze and Design High-Speed Power Delivery Networks Using New Multiinput Impedances in Printed Circuit Boards

In this paper, a new input impedance, the multiinput impedance, which includes all information of the full impedance matrix, is proposed to accurately analyze and design planar power delivery networks (PDNs) in high-speed printed circuit boards and packages. The multiinput impedance includes all of the potential impacts of the other operating active power ports in both low and high frequencies. A systematical power-delivery-network analysis and design method using the multiinput impedance is developed. The global and local characteristics of the decoupled PDN are well demonstrated by the multiinput impedance, which make the analysis and design of the modern decoupled PDNs more accurate and reliable. Numerical and measured results show that the proposed multiinput impedance can characterize both the global and local characteristics of the planar PDNs with high accuracy.      

Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

The high speed and low power trend has imposed more and more importance on the design of the power distribution network (PDN) using multilayer printed circuit boards (PCBs) for modern microelectronic packages. This paper presents a fast and efficient analysis methodology in frequency domain for the design of a PDN with a power/ground plane pair, which considers the effect of irregular shape of the power/ground plane and densely populated via-holes. The presented method uses parallel-plate transmission line theory with equivalent circuit model of unit-cell grid considering three-dimensional geometric boundary conditions. Characteristics of PDNs implemented by perforated planes including a densely populated via-hole structure is quantitatively determined based on full-wave analysis using the finite-difference time-domain (FDTD) periodic structure modeling method and full-wave electromagnetic field solver. Using a circuit simulator such as popularly used SPICE and equivalent circuit models for via-hole structure and perforations, the authors have analyzed input-impedance of the power/ground plane pair. Since the presented method gives an accurate and fast solution, it is very useful for an early design of multilayer PCBs.     

基于时间门方法的随机耦合模型在复杂腔体电磁预测中的应用

利用随机耦合模型(random coupling model,RCM)预测复杂腔体电磁效应时,通常要通过测量辐射阻抗来实现,但实验过程中满足混沌腔体以及耦合通道的腔体加工、实验过程模拟等条件要求较高,且实验步骤繁琐.为了克服上述问题,文中采用时间门方法(time gating method,TGM),通过对散射参数进行...     

Analyses of bounces on power distribution networks using an unconditionally stable finite-difference time-domain method

An unconditionally stable finite-difference time-domain (US-FDTD) method is utilized for analyzing the bounces on structures of power distribution networks (PDNs), which is a critical issue in the electromagnetic compatibility analysis of mobile devices. The US-FDTD method does not utilize the explicit leapfrog time scheme of conventional FDTD method and can solve problems with fine structures well, such as via, thin material and so on. By using this full-wave method, electromagnetic fields between power/ground plane pairs are analyzed and discontinuities of through-hole vias are taken into account in the modeling of PDNs.     

Electromagnetic interference (EMI) of system-on-package (SOP)

Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration.     

内置负载开缝腔体谐振效应抑制方法研究

开缝腔体谐振特性放大了进入腔内的耦合能量,对内部电子设备构成严重威胁。文中建立内含金属 隔板、吸波体等负载的圆柱腔体模型,提出了在隔板上涂覆吸波材料以抑制谐振的新方式,研究了吸波体电磁特性 对谐振的影响。结果表明:隔板越靠近腔体前壁放置、板间距越大,对内部场影响越小,谐振点出现位置越接近空腔 固有模式;谐振点处屏蔽效能(Shielding Efficiency, SE)的提升是隔板和吸波材料综合作用的结果,隔板可迫使谐振 点迁移,吸波材料能改善谐振特性,并且涂覆磁性吸波材料性能更优;在隔板双面涂敷吸波材料抑制高次谐振效果 更好;适当增加隔板上涂覆材料厚度或提高材料相对磁导率,都能实现和全腔内壁涂覆相同的谐振抑制效果,效费 比也更高;场强分布因传播模式不同而不同,强电场区应放置电性吸波体才有效。     

On the construction of hierarchical fuzzy systems models

A review of the basic ideas of fuzzy systems modeling is provided. We introduce a hierarchical-type fuzzy systems model called a hierarchical prioritized structure (HPS) and review its structure, operation, and the interlevel aggregation algorithm. We then turn to the issue of constructing the HPS. Consideration is first given to the case in which rules are provided by an expert. Detailed consideration is given to the problem of completing incomplete priorities by use of the principle of maximal buoyancy. A mathematical programming method is introduced for the implementation of this approach. The issue of tuning hierarchical models is addressed. We next introduce a dynamic approach to the formulation of an HPS directly from data that enables us to continually update our model as more observations become available. This approach allows a system's builder to start with a default model and include exceptions     

A circuital approach to evaluating the electromagnetic field on rectangular apertures backed by rectangular cavities

In this paper, the problem of evaluating the electromagnetic field on rectangular apertures backed by rectangular cavities is investigated. The electromagnetic-field distribution is derived by using a circuital model of an aperture and suitable forcing terms introduced into the equations related to the aperture model. The effects of a rectangular cavity on the aperture-field distribution are assessed by considering the rectangular cavity as a load impedance. The impedance value is obtained by modeling the rectangular cavity as a length of rectangular waveguide back-ended by a short. The distribution of the electromagnetic field on the aperture is used as an exciting source to evaluate, through a modal expansion, the electromagnetic field inside the cavity. Numerical simulations are in a good agreement with both other theoretical models and experimental data.     

On-Chip Power-Grid Simulation Using Latency Insertion Method

Ensuring the integrity of the power supply in the power distribution networks (PDNs) of a chip is essential for building reliable high-performance chips. To ensure the power integrity, accurate, and memory- and time-efficient simulation approaches for simulating the power-supply noise in the on-chip PDN are essential. In this paper, a finite-difference formulation based on the latency insertion method (LIM) has been employed for simulating the power-supply noise in the on-chip PDN. A new common-mode type equivalent circuit has been proposed. In this equivalent circuit, a capacitance to ideal ground may not be present at all the nodes. Further, the nodes can be capacitively coupled to each other. To avoid inverting a large nonbanded matrix, a small capacitance to ground is added to a node that did not have any capacitance to ground, and a small series inductance is added to any floating capacitor that did not have any series inductance. Approximate closed-form expressions to compute the values of these capacitances to ground and series inductances have been proposed. The accuracy of the LIM-enabled transient simulation and the accuracy of the proposed closed-form expressions have been demonstrated. The memory and time complexity of the simulation for each time step have been shown to be O(N_n) each, where N_n is the number of nodes in the equivalent circuit. Stability condition is derived for the first time for multidimensional inhomogeneous RLC circuit. A upper bound of the time step is derived from the stability condition. Using this bound on the time step, the runtime of the overall transient simulation has been estimated to be approximately proportional to N_n ^2-2.5 for N_n in the order of millions.     

Broad-band cavity-backed and capacitively probe-fed microstrippatch arrays

A hybrid full wave method for the analysis of probe-fed infinite phased arrays of single and stacked microstrip patches, backed by metallic cavities, is applied to investigate the combined utilization of the capacitive probe-feeding technique and the cavity enclosure of microstrip patches. The goal is to obtain broad-band microstrip antennas on thick substrates without the limitations due to the generation of surface waves of the conventional microstrip antennas on infinite substrates. A design procedure for the capacitive coupling is investigated and theoretical results for the active input impedance and radiation characteristics of different wide-band antenna designs are presented     

The effect of edge metal profiles on the accuracy of electrical modeling of advanced packages

Electronic package edge metal profiles have an effect on package characteristics on an order increasingly close to the tolerances expected for the package electrical performance. Several two-dimensional (2-D) tools are available that can be used to evaluate predesign and layout issues with nonrectangular edge profiles. However, tools that extract models from actual designs using the most up-to-date computer-aided design/computer-aided engineering (CAD/CAE) design and modeling flows do not yet take into account these real-world metal geometries. Variations in impedance and crosstalk associated with real profiles versus rectangular idealizations are identified for some typical cases and a computational procedure is discussed which may efficiently address this problem.     

金属腔体多耦合通道电磁特性研究

实际金属腔体常开有多个通道,使得腔内电磁环境变得复杂。以分析腔体多通道耦合电磁特性为出发点,建立平面波入射下矩形、圆柱腔体实例模型,引入对比系数作为评价手段,侧重研究孔缝、贯穿线缆两种耦合通道对腔内电磁场的影响,寻求共性规律。结果表明:腔外线缆长度变化不影响谐振点出现位置,随长度增加腔体屏蔽效能(SE)下降;腔内线缆随长度增加,谐振频率降低,两腔体具有如上共性结论。基于给定的模型及参数设定,通过比较系数可判断矩形腔体450 MHz 之前线缆耦合为主;贯穿线较长时, 510 MHz 之前圆柱腔体线缆耦合为主;贯穿线较短时,两个局部频点之外的其它频段孔缝耦合为主;涂覆磁损耗型吸波材料提升腔体SE 效果最好,且SE越低,提升效果越明显。     

二端口波混沌腔体短迹线随机耦合模型

经典随机耦合模型在对电子设备的电磁脉冲效应进行预测时, 边界条件设置在无穷远处, 存在短迹线效应问题.采用设置辐射阻抗短迹线调制系数的方法, 建立了二端口波混沌腔体短迹线随机耦合模型(Short-Orbit Random Coupling Model, SORCM), 统计分析了目标点处感应电压的均方根误差随短迹线最大长度的变化关系.在不同的频段范围内, 将SORCM计算结果的统计特性和实验结果进行了对比分析, 验证了所建立模型的正确性.和经典随机耦合模型相比, SORCM的计算结果更加接近实测结果, 可用于复杂电子设备电磁脉冲效应的预测和分析.     

Design of Aperture-Coupled Filters

A procedure for the design of aperture-coupled Filters is presented, based on the theory of conventional coupled circuits. This design procedure accounts for the relatively low insertion loss of aperture-coupled filters as compared with other known designs of microwave filters. The factors which contribute to this low value of insertion loss are the following: 1) Use of a high Q-mode configuration such as a cylindrical cavity in the TE/sub 011/ mode. 2) Aperture coupling of elements eliminating the losses of impedance transforming sections of transmission line. 3) A mechanical design which eliminates joints at critical points and also provides control over interior surface finishes.     

Unit cell approach to full-wave analysis of meander delay line using FDTD periodic structure modeling method

Unit cell modeling is performed to determine the effect of electromagnetic coupling on the propagation characteristics of a meander delay line, which is widely used in printed circuit boards and packages. Since the design of a delay line must guarantee several tens of picosecond timing margin in modern high-speed packages and board level interconnections, a penetrating understanding of the meander effect is essential. The propagation delay, the characteristic impedance, and the stop-band characteristic of the meander delay line have been carefully investigated based on a full-wave analysis using the finite-difference time-domain (FDTD) periodic structure modeling method. The periodicity of the meander line is utilized based on Floquet's theorem, resulting in a reduction of the computational domain in the FDTD simulation and providing a unit cell model of the meander line. The unit cell modeling of the meander delay line shows the effect of electromagnetic coupling in meander line structure on the reduction of the propagation delay. Also, an analysis based on the unit cell modeling was confirmed by time-domain reflection/transmission measurements.     

高频电磁防护织物屏蔽效能研究

由于非实心屏蔽体经常替代金属板进行电磁辐射的屏蔽和防护,文中基于电磁兼容理论和电磁分析的数值算法,从理论和仿真两方面对金属网格结构的远场屏蔽效果进行了分析。针对孔径宽度l、金属丝直径d和四边形的顶角θ的3个变量对屏蔽效能的影响问题进行研究,首先运用电磁仿真软件Hobbies进行建模和仿真计算,而后通过经验公式计算出不同网格尺寸对应的SE值,将仿真与估算的结果进行比对,得出结论。     

Noise Source Lumped Circuit Modeling and Identification for Power Converters

In this paper, a general lumped circuit modeling method is proposed to describe the conducted electromagnetic interference (EMI) coupling mechanism for the switching power converters. The EMI characteristics of the converters can be analytically deduced from a circuit theoretical viewpoint. The shunt and series impedance insertion method is introduced to identify the differential-mode (DM) and common-mode (CM) noise impedances and voltage sources. The procedure of parameters estimation for the noise models comprises several simple measurements and is convenient to be implemented. Experimental illustrations are also included to verify the validity of the proposed method. Comparison between the measured and predicted results shows that the EMI modeling method can provide adequate prediction of the EMI feature for power-switching converters     

Metal mesh couplers using evanescent waves at millimeter and submillimeter wavelengths

In this paper we introduce a metal mesh evanescent wave coupler that makes use of evanescent wave coupling between a metal mesh and a dielectric plate, as a quasi-optical component for millimeter and submillimeter wavelengths. The transmission properties of this type of couplers have been investigated experimentally and theoretically for both capacitive and inductive metal meshes in the frequency range from 40 GHz to 60 GHz. The transmittance of a capacitive metal mesh evanescent wave coupler can be adjusted more than 70% by changing the spacing between the capacitive mesh and the silicon plate less than 0.15 mm at around 57 GHz.