Microstructure－properties relationship of transient liquid phase diffusion bonded a third generation single crystal superalloy joint

Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.     

Transient liquid-phase bonding of superalloy K465 using a Ni-Cr-Fe-B-Si amorphous interlayer alloy

A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding) of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile properties of the joints were investigated.There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210℃ for 30 min.The isothermal solidification is complete after bonding at 1210℃ for 4 h.The relationship of the average width of the remnant eutectic zone and bonding time at 1210℃ is nonlinear.The tensile strength of the bonded joint at room temperature and 900℃ is comparable to that of K465 alloy.     

Effect of Magnesium on Microstructure Refinements and Properties Enhancements in High-Strength CuNiSi Alloys

Microalloying is an effective method to improve the comprehensive properties of copper alloys.The effects of magnesium on the microstructure,mechanical properties and anti-stress relaxation properties of CuNiSi alloys have been investigated.Results demonstrated that magnesium plays significant roles in refining the dendritic microstructure of the as-cast ingot,accelerating the precipitation decomposition,improving the mechanical properties and increasing the anti-stress relaxation properties.The incremental strength increase is due to the Orowan strengthening from the nanoscale Ni_2 Si and Ni_3 Al precipitates.As compared with the Cu-6.0 Ni-1.0 Si-0.5 Al(wt%) alloy,the ultimate tensile strength of the designed Cu-6.0 Ni-1.0 Si-0.5 Al-0.15 Mg(wt%) alloy increases from 983.9 to 1095.7 MPa,and the electrical conductivity decreases from 27.1 to 26.6% IACS,respectively.The stress relaxation rates of the designed Cu-6.0 Ni-1.0 Si-0.5 Al-0.15 Mg alloy are 4.05%at 25℃,6.62% at 100℃and 9.74% at 200℃after having been loaded for 100 h,respectively.Magnesium significantly promotes nucleation during precipitation and maintains small precipitate size.     

Effect of bonding parameters on microstructure and properties of Si3S4／Si3S4 joint brazed by Cu-Zn-Ti filler alloy

Si3N4 ceramic was jointed to Si3N4 ceramic using a filler alloy of Cu-Zn-Ti at 1 123-1 323 K for 0.3- 2.7 ks. Ti content in the Cu-Zn-Ti filler alloy was 15% (molar fraction). The effect of bonding parameters on the microstructure and mechanical properties of the Si3N4/Si3N4 joint were investigated. The results indicate that with increasing brazing temperature from 1 123K to 1 323 K and brazing time from 0.3 ks to 2.7 ks, the thickness of the interracial reaction layer between the filler alloy and the Si3 N4 ceramic and the size and amount of the reactant products in the filler alloy increase, leading to an increase in shear strength of the joint from 163 MPa to 276 MPa. It is also found that the fracture behavior of the Si3 N4/Si3 N4 joint greatly depends on the microstructure of the joint.     

Transient liquid phase diffusion bonding of a single crystal superaUoy DD6

DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added as the melting point depressant. The results show that it is difficult to obtain the joints with the microstructures completely homogeneous. For the joint TLP diffusion bonded at 1290℃ for 12h, about half areas of the beam possessed αγ γ′ microstructure, nearly identical with that of the base metal, and the other local areas consisted ofT-solution, borides, etc. Prolonging the bonding time to 24h, the inhomogeneous areas in the joint reduced, and the joint property improved. The joint stress-rupture strength at 980℃ and 1100℃ reached 90%-100% and 70%-80% of those of the base metal respectively.     

Effects of nano TiN addition on the microstructure and mechanical properties of TiC based steel bonded carbides

TiC based steel bonded carbides with the addition of nano TiN were prepared by vacuum sintering techniques.The microstructure was investigated using scanning electron microscopy（SEM） and transmission electron microscopy（TEM）,and the mechanical properties,such as bending strength,impact toughness,hardness,and density,were measured.The results indicate that the grain size becomes small and there is uniformity in the steel bonded carbide with nano addition;several smaller carbide particles are also found to be inlaid in the rim of the larger carbide grains and prevent the coalescence of TiC grains.The smaller and larger carbide grains joint firmly,and then the reduction of the average size of the grains leads to the increase in the mechanical properties of the steel bonded carbides with nano addition.But the mechanical properties do not increase monotonously with an increase in nano addition.When the nano TiN addition accounts for 6-8 wt.% of the amount of steel bonded carbides,the mechanical properties reach the maximum values and then decrease with further increase in nano TiN addition.     

Characterization of diffusion-bonded joint between Al and Mg using a Ni interlayer

Aluminum and magnesium were joined through diffusion bonding using Ni interlayer. The microstructure and mechanical performance of the Al/Ni/Mg joints at different temperatures was investigated by means of scanning electron microscope(SEM), electro-probe microanalyzer(EPMA), X-ray diffraction(XRD), Vickers hardness testing, and shear testing. The results show that the addition of Ni interlayer eliminates the formation of Mg–Al intermetallic compounds and improves the bonding strength of the Al/Mg joints. The Al/Ni/Mg joints are formed by the diffusion of Al, Ni and Mg, Ni. The microstructure at the joint interface from Al side to Mg side is Al substrate/Al–Ni reaction layer/Ni interlayer/Mg–Ni reaction layer/Mg substrate multilayer structure. The microhardness of the Mg–Ni reaction layer has the largest value of HV 255.0 owing to the existence of Mg_2Ni phase.With the increase of bonding temperature, the shear strength of the joints increases firstly and then decreases.The Al/Ni/Mg joint bonds at 713 K for 90 min, exhibiting the maximum shear strength of 20.5 MPa, which is greater than that of bonding joint bonded directly or with Ag interlayer. The fracture of the joints takes place at the Mg–Ni interface rather than the Al–Ni interface, and the fracture way of the joints is brittle fracture.     

Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.     

Diffusion bonding of Ti-6Al-4V to ZQSn10-10 in vacuum

The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.     

Effect of Heat Input on Microstructure and Mechanical Properties of Joints Made by Bypass-Current MIG Welding–Brazing of Magnesium Alloy to Galvanized Steel

Experiments were carried out with bypass-current MIG welding–brazing of magnesium alloy to galvanized steel to investigate the effect of heat input on the microstructure and mechanical properties of lap joints. Experimental results indicated that the joint efficiency tended to increase at first and then to reduce with the increase of heat input. The joint efficiency reached its maximum of about 70% when the heat input was 155 J/mm. The metallurgical bonding between magnesium alloy and steel was a thin continuous reaction layer, and the intermetallic compound layer consisted of Mg–Zn and slight Fe–Al phases. It is concluded that bypass-current MIG welding–brazing is a stable welding process, which can be used to achieve defect-free joining of magnesium alloy to steel with good weld appearances.     

Formation process, microstructure and mechanical property of transient liquid phase bonded aluminium-based metal matrix composite joint

1　INTRODUCTIONThealuminium basedmetalmatrixcomposites(MMCs)areadvancedmaterialsthathavesuperiorproperties ,especiallyincreasedstiffness ,highstrength ,goodwearresistanceandsuperiorelevatedtemperatureproperties .Theyhavereceivedconsider ableattentionascandidatesforadvancedindustrialapplications[1,2 ] .But ,theirapplicationshavebeenseverelyrestrictedbythelackofasuitablejoiningmethod[3] .AlthougthfusionweldingmethodscanbeusedtojointheMMCs ,themethodsnormallytendtoresultinunfavourablejoint…     

不同连接温度下12Cr1MoV钢TLP连接接头组织与性能变化研究

选用FeNiCrSiB为中间层合金,采用不同连接温度对珠光体耐热钢12Cr1MoV进行瞬时液相扩散连接,并对连接接头进行力学性能检测和微观组织观察,结果表明:当连接温度由1150℃增加到1200℃时,12Cr1MoV接头的抗拉强度和微观组织都得到了改善,并结合不同的微观组织状态讨论了连接温度对连接过程中液相最大宽度W_(max)的影响作用.     

Cu-Sn体系LTTLP连接接头强度与断口分析

文中通过研究连接时间和连接温度对Cu/Sn/Cu体系LTTLP连接接头力学性能的影响规律及观察接头断口形貌,分析了接头组织对其断裂过程的影响机制.结果表明,连接温度为300℃时,随着连接时间的增加,接头抗减强度先增加后保持不变,由连接15 min时的16.9 MPa增高至连接120 min后的超过30 MPa;Cu₃Sn型接头的力学性能最优,且残留少量Cu₆Sn₅晶粒时亦不会降低其接头强度;从Sn型接头至Cu₃Sn型接头的转变,接头断裂模式由韧性断裂逐渐过渡到脆性断裂.连接温度从260℃升高至350℃,对Cu₃Sn型接头的抗剪强度影响不大,始终保持在30 MPa以上,接头断裂模式均为解理断裂.     

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase (TLP) bonding of CoCuFeMnNi high entropy alloy (HEA) was studied. The TLP bonding was performed using AWS BNi-2 interlayer at 1050 °C with the TLP bonding time of 20, 60, 180 and 240 min. The effect of bonding time on the joint microstructure was characterized by SEM and EDS. Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time. For samples bonded at 20, 60 and 180 min, athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn₃Si intermetallic compound. For all samples, the γ solid solution was formed in the isothermal solidification zone of the bonding zone. To evaluate the effect of TLP bonding time on mechanical properties of joints, the shear strength and micro-hardness of joints were measured. The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints. The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min, respectively.     

单晶高温合金的过渡液相扩散焊

为了探明单晶过渡液相(TLP)扩散焊接头组织与性能的关系,采用扫描电镜(SEM)研究接头微观组织,并进行力学性能测试. 结果表明,接头由连接区和基体区所组成. 当等温凝固过程未完成时,连接区由等温凝固区和快速凝固区组成,而等温凝固区主要由γ和γ'相组成,快速凝固区主要是由共晶组织组成. 当等温凝固完成而固态均匀化过程不充分时,连接区由等温凝固区和分布在接头中心的硼化物相组成. 采用低温等温凝固,高温固态均匀化的焊接工艺可以获得高性能的接头.     

连接压力对管道瞬时液相连接接头组织性能的影响

把锅炉用20钢管在开放式管道瞬时液相扩散焊机上进行连接,采用氩气保护,焊接温度1180℃、保温时间3min、中间层材料选用非晶箔BNi2,通过改变连接压力,研究其对连接接头组织性能的影响.结果表明,当连接压力为4MPa时,所得连接接头的性能良好,满足要求.     

采用Al及Al-12Si中间层的AZ31B镁合金TLP接头的组织和性能

采用Al及Al-12Si为中间层对AZ31B镁合金进行过渡液相扩散焊,用环境扫描电镜及万能试验机测试并分析了接头组织与强度之间的关系。研究结果表明：采用Al作为中间层时,随着保温时间的增加,Al12Mg17金属间化合物含量降低,接头强度升高;采用Al-12Si作为中间层时,含硅相Mg2Si对焊缝的强化提高了接头强度,但保温时间过长时,Mg2Si偏聚于焊缝中心会降低接头性能。     

采用冷喷涂铜涂层做中间层的镁合金与钢共晶接触反应钎焊工艺及接头性能

采用厚度为50 μm的冷喷涂铜涂层作为中间层,研究了连接温度和保温时间对AZ31B镁合金/钢异种金属接触反应钎焊接头剪切强度的影响规律.通过金相显微镜、扫描电镜（SEM）、X射线衍射仪（XRD）、显微硬度和剪切强度试验,研究了AZ31B镁合金/钢钎焊接头界面微观组织和力学性能.结果表明,当连接温度为530℃,保温时间为60 min时,接头剪切强度达到最大值36.9 MPa.AZ31B镁合金/钢钎焊接头界面反应产物主要为Mg₂Cu,α-Mg固溶体和Mg-Cu-Al三元相.Mg-Cu-Al三元相的尺寸和分布,以及08F钢侧是否存在Mg₂Cu共晶相共同决定了接头的强度.由钎焊接头断口可知,最佳工艺参数下断裂方式为脆性断裂与韧性断裂的混合方式.     

Ni3Al单晶高温合金过渡液相扩散焊工艺

采用KNi3中间层,对Ni3Al单晶高温合金进行过渡液相扩散焊,分析不同焊接保温时间的接头和基体组织的变化,测试接头的高温持久性能.结果表明,1 240℃保温12 h,TLP扩散焊接头局部区域有少量的γ＋γ＇共晶组织及小块状的硼化物组织,其它区域均为与基体组织一致的γ＋γ＇双相组织;基体γ＇相由四方形转变成不规则状.焊接接头在1 000℃高温持久强度达到标准状态的基体强度90%.试样组织出现γ＇相筏形化,焊缝区域筏形组织粗化,且形状不规则,与持久应力方向呈一定角度.