MnCO3掺杂对SnO2·Ni2O3·Nb2O5压敏材料性的影响

研究并分析了Ni3+掺杂和Co2+掺杂对SnO2压敏电阻致密度和电学非线性性能的影响.研究了掺Mn2+对SnO2@Ni 2O3@Nb2O 5压敏材料性能的影响.发现x(MnCO3)为0 10%时,压敏电阻具有最高的视在电场(EB=686 89 V/mm)和最好的电学非线性性能(α=1 2 9).样品的收缩率和致密度变化趋势不一致,这是因为样品的致密度是由收缩率和MnCO3的挥发量两因素共同决定的.     

MnCO3掺杂对SnO2·Ni2O3·Nb2O5压敏材料性能的影响

研究并分析了Ni3+掺杂和Co2+掺杂对SnO2压敏电阻致密度和电学非线性性能的影响.研究了掺Mn2+对SnO2@Ni 2O3@Nb2O 5压敏材料性能的影响.发现x(MnCO3)为0 10%时,压敏电阻具有最高的视在电场(EB=686 89 V/mm)和最好的电学非线性性能(α=1 2 9).样品的收缩率和致密度变化趋势不一致,这是因为样品的致密度是由收缩率和MnCO3的挥发量两因素共同决定的.     

Mn掺杂的SnO2·ZnO·Nb2O5压敏材料

研究了MnCO3掺杂对SnO2-ZnO-Nb2O5压敏材料压敏-介电性能的影响,研究中发现,掺入x(MnCO3)为0.08%的样品显示出最高的非线性系数(α=8.2),最高的势垒高度(φB=1.11eV),最高的击穿电场(E=466.67V/mm)。研究中同时发现,SnO2-ZnO-Nb2O5压敏材料的相对介电常数在573～673K间出现峰值,峰值随MnCO3掺入量的增加而增大,掺入x(MnCO3)为0.3%的样品在593K时,显示出最高的相对介电常数(εr=1.886×104)。     

MnO_2掺杂量对BaCo_(0.05)Co_(0.1)Bi_(0.85)O_3厚膜NTCR电性能影响

以新型BaCo0.05Co0.1Bi0.85O3材料为基体,掺杂不同摩尔分数x(MnO2),在840℃下烧结4h制备了NTC厚膜电阻。借助XRD、SEM和直流阻温特性测试仪,研究x(MnO2)对电阻相组成、微结构及电性能的影响。结果表明:所得的NTC厚膜热敏电阻主要物相为具有钙钛矿结构的BaCo0.05Co0.1Bi0.85O3,且表面致密。当x(MnO2)超过5%时,有新相BaMnO3开始沿晶界析出,获得小尺寸晶粒;厚膜电阻的室温电阻率ρ25及B25/85值随x(MnO2)增加而升高;当x(MnO2)为10%时,ρ25从初始的13.5?·mm升高为810.0?·mm,B25/85值从600K升高到2049K。     

MnCO_3掺杂量对Z型六方铁氧体电磁性能的影响

采用固相反应法制备了Z型六方铁氧体(Ba3Co2Fe24O41)。研究了MnCO3掺杂量对Z型六方铁氧体的显微结构、电磁性能的影响。结果表明:掺杂MnCO3时,Z型六方铁氧体的高频电磁性能得到了显著提高;当w(MnCO3)为0.6%时,Z型六方铁氧体的起始磁导率μi和300MHz时的Q值分别从12.3和6.3提高到了13.6和15.2;同时其ε′和300MHz时的tanδ分别从82.0和0.13降低到了20.4和0.02,有望成为高频电感用材料。     

MnCO3掺杂对BMT陶瓷介电性能的影响

采用传统电子陶瓷工艺合成了MnCO3掺杂的Ba(Mg1/3Ta2/3)O3(BMT)微波介质陶瓷,并研究了MnCO3掺杂量对陶瓷微波介电性能的影响.实验结果发现,添加少量的MnCO3能改善BMT陶瓷的烧结性能,当w(MnCO3)=2%时,陶瓷致密化烧结温度由纯相时的1 650℃以上降至1 350℃,且表观密度提高到7.482 g/cm3以上,烧结体密度可达理论密度的98%,材料的微波性能达到最佳值:介电常数εr=25.09,品质因数与频率之积Q·f=99 000 GHz(8 GHz),谐振频率温度系数τf=0.5×10-6/℃.     

Bi_2O_3掺杂对Mn-Cu-Ca系负温度系数热敏电阻性能的影响

通过在Mn-Cu-Ca系负温度系数热敏电阻器(NTCR)配方中掺杂质量分数x%的Bi2O3(x=0,0.5,1,2.4,4.8,7),采用传统固相反应法制备了单层圆片式热敏电阻元件,研究了该元件的微观结构和电性能。实验结果表明:Bi2O3存在于晶界处,Bi2O3的存在增大了元件的晶粒尺寸,同时影响元件的气孔率。Bi2O3的引入降低了元件的室温电阻率,拓宽了元件的使用温区。当Bi2O3的添加量为质量分数4.8%时,元件具有较低的室温电阻率(6?·cm)及较宽的使用温区(室温~240℃)。     

MnCO3掺杂对BaTiO3-Nb2O5-CO3O4陶瓷性能的影响

为了提高BaTiO3-Nb2O5-Co3O4( BNC)陶瓷的介电常数,采用传统固相反应法制备了MnCO3掺杂的BNC陶瓷,研究了MnCO3掺杂量以及烧结温度对BNC陶瓷致密度及介电性能的影响.结果表明:MnCO3的掺杂提高了BNC陶瓷的介电常数,降低了介质损耗.当MnCO3掺杂量为摩尔分数0.5％时,BNC陶瓷相对介...     

(Ba,Co,Nb)掺杂SnO2压敏材料电学非线性的研究

通过对样品的伏安特性，晶界势垒的测量和分析，研究了BaCO3对新型(Co，Nb)掺杂SnO2压敏材料微观结构和电学性质的影响。晶界势垒高度测量表明，SnO2晶粒尺寸的迅速减小是压敏电压急剧增高的原因。对Ba含量增加引起SnO2晶粒减小的根源进行了解释。掺杂x(BaCO3)=0．4％的SnO2压敏电阻击穿电压为最小(140V／mm)；掺杂x(BaCO3)-0．8％的SnO2压敏电阻具有最高非线性系数(α=19．6)，最高的势垒电压(ψB=1．28eV)。     

Na掺杂对ZnO压敏材料电学性能的影响

研究了Na2CO3对ZnO压敏材料电学性能的影响。当掺入的Na2CO3之摩尔分数x从0增加到0.2%时,ZnO压敏材料的击穿电压从209 V/mm增加到934 V/mm,1 kHz时的相对介电常数从1 158降到57。晶界势垒高度测量表明:在实验范围内,Na对势垒高度的影响较小。ZnO晶粒的变小是压敏电压急剧升高和介电常数减小的主要原因。对Na2CO3掺杂量的增加引起ZnO晶粒减小的原因进行了解释。     

BaSnO3陶瓷的制备及其电性能研究

以BaCO3、SnO2为原料,微量SiO2、Bi2O3、Sb2O3作烧结助剂,Ta2O5作施主,采用传统的固相反应法,制备出相对密度达97%~99%,平均粒径约为8μm的BaSnO3半导体陶瓷。采用Na2CO3或Li2CO3与Mn(NO3)2的组合作受主掺杂可有效增强BaSnO3陶瓷的晶界效应。当x(Mn(NO3)2)为1%时,BaSnO3陶瓷电阻率达3.3×106Ω.cm,晶粒电阻率为4.3Ω.cm,视在介电常数为1.9×104(1 kHz),经电导激活能测试,估算出晶界势垒约为0.5 eV。     

Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint

The influence of the crystallographic orientation of Sn-3.0 wt%Ag-0.5 wt%Cu flip-chip joints and underfill on electromigration was investigated. The current density applied in our tests was 15 kA/cm² at 160 °C. Various times to failure of the test samples show a clear dependence of the electromigration behavior on the Sn grain orientations. Different microstructural evolutions were observed in all solder bumps in correlation with the crystallographic orientations of the Sn grains after an electromigration test. The primary failure of the solder joints was caused by dissolution of the Cu electrode at the cathode interface. Rapid dissolution of the Cu electrode occurred when the c-axis of the Sn grains was parallel to the direction of electron flow. On the other hand, slight dissolution of the Cu electrode was observed when the c-axis of the Sn grains was perpendicular to the direction of electron flow. Some grain boundaries interrupt the migration of Cu and the trapped Cu atoms form new grains of intermetallic compounds at the grain boundaries. In addition, underfill inhibits serious deformation of solder bumps during current stressing.     

SrTiO_3双功能陶瓷中TiO_2掺杂的作用

研究了ＴｉＯ２掺杂对ＳｒＴｉＯ３电容－压敏双功能陶瓷晶粒生长特性和电性能的作用规律。研究结果表明ＴｉＯ２添加量较小时瓷体不能实现半导化。随着ＴｉＯ２添加量的增大,烧结后的表观电阻率减小,压敏电压和非线性指数减小,表观介电常数增大。ＳＥＭ观察发现ＴｉＯ２添加量较小时晶粒内部出现裂痕,较多的ＴｉＯ２添加量利于晶粒的长大。     

Cu grain growth in interconnects trenches - Experimental characterization of the overburden effect

With the reduction of dimensions in interconnect copper lines, metal resistivity is seen to increase. This phenomenon is due to electron scattering on both sidewalls and grain boundaries. To reduce the grain boundary contribution and then resistivity, it becomes important to control microstructure. This paper focuses on the grain growth mechanism in a Damascene architecture. In this architecture, trenches are filled with copper. It is shown that the remaining copper on the top surface - the overburden - plays a key role in the final microstructure in the lines. Electrical results and observations are presented and discussed in terms of overburden grains extension inside the trenches. A method is proposed to quantify this grain extension.     

EBSD研究取向硅钢晶粒取向和晶界结构

采用扫描电镜结合EBSD技术分析了取向硅钢初次再结晶晶粒的取向和晶界结构。初次再结晶晶粒中以30°～55°的大角晶界为主,Goss取向晶粒含量小于5%,且经常生长在（111）〈112〉取向的晶粒周围。同时测定了二次再结晶晶粒的实际取向,并计算出与Goss取向的取向差关系。     

镁铝尖晶石陶瓷的高温Mo-Mn金属化机理研究

采用活化Mo-Mn法对镁铝尖晶石陶瓷进行了金属化封接实验,并通过对镁铝尖晶石陶瓷金属化层的显微结构及金属化层中元素在金属化层与陶瓷中分布情况的分析,探讨了镁铝尖晶石陶瓷的Mo-Mn金属化机理。研究发现,镁铝尖晶石瓷的金属化机理与目前较成熟的95%氧化铝瓷的金属化机理存在很大不同。镁铝尖晶石瓷金属化时,Mn元素沿晶界实现固相扩散迁移,固溶于瓷中,与镁铝尖晶石形成Mn:Mg Al2O4尖晶石相;同时,Mg元素沿晶界析出进入金属化层的玻璃相,填充于Mo海绵骨架中。     

Microtexture and mesotexture in high-Jc Bi-2223

The microstructure of high-J_c Bi-2223 powder-in-tube tapes was studied using x-ray and electron diffraction. Although the c-axis is nominally aligned perpendicular to the tape surface (FWHM∼20‡), x-ray phi scans and pole figures show no evidence of any in-plane texture, either macroscopically or locally. Electron backscatter diffraction patterns acquired in a scanning electron miscroscope (SEM) were used to measure individual grain orientations. Grain boundary misorientation between adjacent grains was described by rotation angles and axes (i.e. the disorientation) and compared with theoretical values of ideal coincidence site lattices (CSLs). Data collected from over 113 spatially correlated grains resulting in 227 grain boundaries, show that over 40% of the boundaries are small angle. In addition, 8% of the boundaries were found to be within the Brandon criterion for CSLs (larger than ⌆1 and less than ⌆50). Grain boundary “texture maps” derived from the SEM image and orientation data reveal the presence of percolative paths between low energy boundaries.     

Thermal Conductivity Reduction in CoSb<Subscript>3</Subscript>–CeO<Subscript>2</Subscript> Nanocomposites

CoSb₃ + x% CeO₂ nanocomposites (x = 1, 3, 5) were synthesized by ball-milling and spark plasma sintering. Scanning electron microscopy showed that some CeO₂ nano-inclusions sit at the boundaries of CoSb₃ grains. These inclusions also reduce the sizes of the CoSb₃ grains and crystallites by inhibiting their growth during sintering. Hall-effect measurements show that the CeO₂ inclusions modify the charge-carrier concentration in CoSb₃. The variations of the electrical resistivity for the 1% and 3% CeO₂ samples can at least partially be attributed to these modifications of the carrier concentration. Nonetheless, the resistivity increase in the 5% CeO₂ sample can unambiguously be ascribed to the presence of the CeO₂ inclusions. Thermal conductivity is systematically reduced (by more than 15% at 300 K) upon CeO₂ addition. Phonon diffusion by the increased number of CoSb₃ grain boundaries is one of the mechanisms involved in this reduction.     

钛酸钡陶瓷离子缺位对晶界势垒的影响

利用电容-电压关系研究了施主Nb掺杂BaTiO_3陶瓷离子缺位对晶界势垒的影响,得出了样品在不同冷却速率下的晶界势垒高度和载流子浓度,其值与施主掺杂含量和样品的冷却速率相关,此结果可由在高、低施主掺杂含量下,晶粒边界处和晶粒体离子缺位的区别来解释。     

取向硅钢二次再结晶行为分析

采用＂中断法＂研究了取向硅钢二次再结晶过程中的异常长大行为,确定了二次再结晶发生的温度范围。通过对各温度下样品的EBSD微观取向分析,确定了缓慢升温时不同阶段晶粒尺寸及取向分布的变化;分析了二次再结晶过程中高斯取向晶粒与晶粒尺寸的关系及取向差分布;讨论了高能晶界理论、高迁移率晶界理论、表面气氛等对高斯晶粒长大的贡献。