微连接接头在热疲劳过程中的破坏规律

同时采用电阻测量方法和疲劳裂纹观测方法分析表面贴装结构焊点的热疲劳破坏过程.通过研究焊点在热疲劳过程中的电阻值变化和热疲劳裂纹的扩展过程,来比较传统锡铅钎料焊点和无铅钎料SAC305焊点的热疲劳破坏规律.并结合有限元分析,研究焊点在热疲劳过程中的电阻值变化与裂纹扩展之间的关系,从而获得一种工程上较为实用的焊点热疲劳失效的电阻值经验判据.结果表明,SAC305无铅钎料焊点相对于传统锡铅钎料焊点而言,具有较为优异的抗热疲劳性能.根据试验研究和有限元分析结果建立了焊点在热疲劳过程中发生失效的电阻值经验判据.

Abstract：

The failure process of soldered joint in SMT was investigated by electrical resistance measurement method and crack observation method. The characteristics of electrical resistance value variation of lead-tin and lead-free soldered (SA(305) joints during the thermal fatigue test were obtained. And at the same time the crack propagation in soldered joint was observed. According to these measurements, the failure roles of lead-tin and lead-free soldered joint were compared. The relationship between electrical resistance value variation and crack propagation of soldered joint during thermal fatigue test was studied by FEM, and an empirical criterion to estimate the failure of the soldered joint in the thermal fatigue test was obtained based on electrical resistance value variation. The experimental results show that the lead-free soldered joint has a higher resistibility in therrnal fatigue than the traditional lead-tin soldered joint. The criterion based on electrical resistance value variation was founded from the experimental and simulation results.     

Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

The effects of Bi addition on the growth of intermetallic compound （IMC） formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190 ℃, respectively. The optical microscope （OM） and scanning electron microscope （SEM） were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray （EDX） and X-ray diffractometer （XRD）. The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.     

An exPerimental study of effect of solder joint geometry on thermal cycle life in SMT

The geometry of solder joint in SMT is one of the important factors which determine the solder joint reliability. In this study, a type of solder joint specimen has been designed and is subjected to thermal cycling to failure between -55℃ to 125℃ with a 36 ℃/min heating and cooling rate and 10 min temperature holding times. The solder joint geometry is castellated and controlled with different solder fillet shape and stand off height. A statistical analysis of the scattered thermal cycle lives of solder joints by two parameter Weibull's probability density function has been carried out in this paper. The experimental results show that the more reliable solder.joint geometry has flat or slight convex solder fillet with a stand off height larger than 0.1 mm. The results may be the recommended guideline to design optimal solder joint geometry.     

基于改进光照模型由SFS方法重构SMT焊点三维形状技术

在采用SFS方法重构SMT焊点三维形状技术中,由于焊点表面镜面反射而在图像中产生的亮点会影响重构形状,从而降低SMT焊点三维重构精度,为此提出一种改进光照模型,该模型不仅对物体表面漫反射分量进行了改进,同时考虑了物体表面镜面反射分量对表面重构所产生的影响,把漫反射分量和镜面反射分量线性叠加,在采用图像处理技术对焊点图像进行适当处理后,利用改进模型对SMT焊点进行三维重构.结果表明,采用改进光照模型与传统光照模型相比,改进光照模型能较好地减少镜面反射对重构结果的影响.

Abstract：

Three-dimensional shape and its accuracy are dissatisfactory because of the highlight caused by specular reflection when the shape from shading is used to reconstruct the three-dimensional soldered joint. An improved illumination model is proposed, which can modify the diffuse reflectance component based on the features of image shooting, make a hnear superposition for both specular reflectiori component and diffuse reflectance component. Then the improved illumination model is used to reconstruct the three-dimensional soldered joint after dealing with the soldered joint image by the proper image processing arithmetic. The experimental results show that the 3D shape by SFS based on the improved illumination model is more satisfactory in decreasing specular reflection influence than that of the traditional methods.     

Properties analysis of a new type of solder paste SACBN07

In this work,the wettability,aging and shear properties of a new type of lead-free solder paste Sn-07Ag-05Cu + BiNi (SACBN07) was investigated by conducting a series of comparison experiments with SAC305 and SAC0307 solder paste.The results show that weuability of SACBN07 is almost equal to SAC305,and better than that of SAC0307 solder paste.The thickness of intermetallic compound (IMC) layer in SACBN07/Cu is lower than that of other two types of solder joint after aging.And Cu3Sn layer of SACBN07/Cu is thinner than that of SAC305 and SAC0307.In addition,the SACBN07 solder joints perform the best shear strength among these three types of solder pastes.     

CSP器件无铅焊点可靠性的有限元分析

采用有限元方法对芯片尺寸封装(CSP)器件焊点可靠性进行模拟分析.运用Anand本构模型描述Sn3.OAg0.5Cu无铅焊点材料的粘塑性特性,研究了焊点的力学行为.结果表明,CSP焊点最大应力区为拐角芯片所下压的焊点上表面处,对焊点应力最大节点的时间历程后处理结果显示,温度循环载荷下,焊点应力呈周期性变化,并有明显的应力松弛和积累迭加效应.对三种常用不同焊点高度尺寸下的焊点应力进行对比分析,发现三种尺寸中,0.35 mm×0.18mm焊点的可靠性最好.还模拟对比了芯片厚度不同对焊点可靠性的影响,结果显示芯片厚度对焊点可靠性影响较小.

Abstract：

Finite element method was employed to analyze the reliability of soldered joint in a CSP device. Anand model was used to establish the constitutive equation of Sn3.0Ag0.5Cu solder, the stress behavior of soldered joint was studied. The results indicate that the maximal stress is located at the upper surface of the soldered joint which is under the outermost of chip. The phenomenon of stress relaxation and accumulated enhancement could be observed abviously from the curves of stress and temperature with time cycle. Reliability of soldered joints with three usually-used heights are compared, and the results shows that the 0.35 mm ×0.18 mm one has the best reliability. Moreover, the influence of chip thickness on the reliability of soldered joints are investigated in the last part, the simulation result indicates that the influence is little.     

Study on solder joint reliability of ceramic ball grid array component based on design of experiment method

Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints which have 25 different combinations of process parameters were designed. The numerical models of all the 25 CBGA solder joints were developed using the Sugrace Evolver. Utilizing the sugrace coordinate exported from the 25 CBGA solder joints numerical models, the finite element analysis models were set up and the nonlinear finite element analysis of the CBGA solder joints under thermal cycles were pegrormed by ANSYS. The thermal fatigue life of CBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis and the variance analysis were pegrormed. The results show that the fatigue life of CBGA solder joint is affected by the pad diameter, the stencil thickness, the ball diameter and the stand-off in a descending order, the best combination of process parameters results in the longest fatigue life is 0.07 mm stand-off, 0.125 mm stencil thickness of, 0.85 mm ball diameter and 0. 89 mm pad diameter. With 95% confidence the pad diameter has a significant effect on the reliability of CBGA solder joints whereas the stand-off, the stencil thickness and the ball diameter have little effect on the reliability of CBGA solder joints.     

The influence of temperature enhanced SnPb based on creep behavior of Cu particle composite soldered joints

Creep property of solder alloys is one of the important factors to affect the reliabdity of soldered joints in SMT （surface mount technology）. Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37 Pb based composite soldered joints and 63Sn37 Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37 Pb eutectic soldered joint.     

The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints

Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite soldered joints and 63Sn37Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37Pb eutectic soldered joint.     

Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads

This paper deals with a study on SnPb and lead-free soldered joint reliability of PLCC devices with different lead counts under three kinds of temperature cycle profiles, which is based on non-linear finite element method. By analyzing the stress of soldered joints, it is found that the largest stress is at the area between the soldered joints and the leads, and analysis results indicate that the yon Mises stress at the location slightly increases with the increase of lead counts. For PLCC with 84 leads the soldered joints was modeled for three typical loading （273 -398 K, 218 -398 K and 198 -398 K） in order to study the influence of acceleration factors on the reliability of soldered joints. And the estimation of equivalent plastic strain of three different lead-free solder alloys （ Sn3.8AG0. 7Cu, Sn3.5Ag and Sn37Pb ） was also carried out.     

底充胶叠层PBGA无铅焊点随机振动应力应变分析

建立了底充胶叠层塑料球栅阵列(plastic ball grid array, PBGA)无铅焊点三维有限元分析模型,研究了PBGA结构方式、焊点材料、底充胶弹性模量和密度对叠层无铅焊点随机振动应力应变的影响. 结果表明,底充胶可有效降低焊点内的随机振动应力应变;在其它条件相同下,对于Sn95.5Ag3.8Cu0.7,Sn96.5Ag3Cu0.5,Sn-3.5Ag和Sn63Pb37这四种焊料,采用Sn-3.5Ag的底充胶叠层焊点内的随机振动最大应力应变最小,采用Sn96.5Ag3Cu0.5的焊点内的最大应力应变最大;随着底充胶弹性模量的增大,叠层无铅内的随机振动应力应变值相应减小;随着底充胶密度的增大,叠层无铅内的随机振动应力应变值相应增大.     

电子互连无铅钎料及焊点蠕变行为研究进展

针对近年来无铅钎料及焊点的蠕变失效问题,综合评述了蠕变变形行为及其在焊点可靠性评估中的应用。首先系统地介绍无铅钎料的蠕变行为,探讨含合金元素/颗粒无铅钎料蠕变性能改性机制。其次评述焊点蠕变行为,探讨焊点成分以及不同基板材料对焊点蠕变特性影响的研究进展。再次结合具体电子器件,采用有限元模拟,分析基于有限元的焊点蠕变响应及疲劳寿命预测,评估焊点可靠性。最后针对无铅钎料及焊点蠕变行为的未来发展进行展望,分析其研究中存在的问题及解决办法,为焊点可靠性进一步研究提供理论支撑。     

RE对Sn2.5Ag0.7Cu/Cu焊点性能的影响

利用X射线衍射分析仪(XRD)和JSM-5610LV扫描电镜(SEM)研究RE含量对Sn2.5Ag0.7Cu/Cu焊点界面区显微组织、剪切强度和蠕变断裂寿命的影响。结果表明:Sn2.5Ag0.7CuxRE焊点界面区金属间化合物由靠近钎料侧Cu6Sn5和靠近Cu基板侧Cu3Sn构成;添加微量RE可细化Sn2.5Ag0.7Cu焊点内钎料合金的显微组织和改善钎焊接头界面区金属间化合物的几何尺寸及形态;当RE添加量为0.1%时,焊点的剪切强度最高,蠕变断裂寿命最长。     

基于正交设计的WLCSP柔性无铅焊点随机激励应力应变分析

对晶圆级芯片尺寸封装(wafer level chip scale package, WLCSP)柔性无铅焊点进行了随机振动应力应变有限元分析. 以1号柔性层厚度、2号柔性层厚度、上焊盘直径和下焊盘直径四个结构参数作为关键因素,采用正交表设计了16种不同结构参数组合的柔性焊点,获取了16组应力数据并进行了方差分析. 结果表明:焊点内最大应力应变随1号柔性层厚度和2号柔性层厚度的增加而减小;在置信度99%时,下焊盘直径和上焊盘直径对应力具有高度显著影响,在置信度95%时1号柔性层厚度和2号柔性层厚度对应力具有显著影响;各因素对应力影响排序为:下焊盘直径影响最大,其次是上焊盘直径,再次是1号柔性层厚度,最后是2号柔性层厚度.     

基于Anand模型SnAgCu-X焊点疲劳寿命预测

Anand模型采用有限元法模拟WLCSP器件Sn3.8Ag0.7Cu-X（Ce，Fe）无铅焊点在热循环载荷条件下的应力-应变响应，借助蠕变应变疲劳寿命预测模型SnAgCu，SnAgCuCe，SnAgCuFe焊点疲劳寿命.结果表明，在服役器件整体器件出现明显的变形现象，电路板翘曲严重.从中心到拐角焊点变形-应力-应变逐渐增加，芯片下拐角焊点成为整个结构潜在的危险区域.通过计算WLCSP器件SnAgCu、SnAgCuCe和SnAgCuFe三种焊点的疲劳寿命，证实了SnAgCuCe和SnAgCuFe焊点寿命明显高于SnAgCu焊点，证明了在SnAgCu中添加一定量的铈和铁可以显著提高SnAgCu焊点的使用寿命，分析结果为新型无铅钎料的研发提供理论支撑.     

基于三维X射线和Fisher准则的BGA焊点检测算法

为了提高BGA焊点检测的准确性,基于三维X射线和Fisher准则的基本原理,提出了一种BGA焊点的检测算法.首先采用Fisher准则对BGA断层图像进行分割,从而获得精确的焊点图像,然后提取了BGA焊点常见缺陷的面积特征、连续度特征、位置特征、圆度特征和空洞特征等,在此基础上,设计了一种基于Fisher准则的BGA 焊...     

无铅焊料制备的Y0.5Gd0.5Ba2Cu3O7-z涂层超导带材搭接接头的机电性能研究

由于单根Y0.5Gd0.5Ba2Cu3O7-z(YGdBCO)涂层超导带材的长度有限,因此在制造高温超导(HTS)器件时不可避免地需要接头。HTS设备的稳定运行在很大程度上取决于接头的品质,因为接头的机电性能通常低于母材。本研究应用Sn42Bi58焊料制作YGdBCO涂层超导带材搭接接头。与传统的Sn60Pb40焊料相比,无铅Sn42Bi58焊料对环境友好,且熔点降低了40℃,因此可在低于150℃的低温下进行焊接操作,有助于抑制超导带材在连接过程中的性能下降。通过测量自场和液氮温度下的电压-电流曲线,研究了加载压力,加压速度和搭接长度对YGdBCO接头临界电流,电阻和n值的影响。通过优化焊接技术,可在12.5 MPa的压强和50 N/s的加压速度下重复获得与母材临界电流相当的25 cm长的低阻接头,其电阻为4.35~5.58 nΩ。还对轴向拉伸作用下接头的力学行为进行了研究,单根带材和接头部分的临界轴向拉伸力分别为213和212 N。上述结果表明,与传统焊接技术相比,采用优化的无铅Sn42Bi58焊料制备低电阻、高拉伸特性的焊接接头的稳定性和重复性明显提升,为YGdBCO超导带材大规模运用的接头连接提供了一种有前景的选择。     

Plastic characterization and performance of SnAgCuBiNi/Cu lead-free BGA solder joints

Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu (SAC) lead-free ball grid array (BGA) solder joints. The dynamic hardness of two kinds of solder joints decreases with indentation depth increase. SAC0705BiNi/Cu exhibits a higher ultimate dynamic hardness and a smaller indentation depth than SAC305/Cu. Then the strain hardening phenomenon of SAC305/Cu is more obvious compared to that of SAC0705BiNi/Cu. The indentation creep of SAC0705BiNi/Cu solder joint is lower than that of SAC305/Cu solder joint before and after thermal shock. The creep rate sensitive index of SACBiNi/Cu solder joint is lower than that of solder joint. SAC0705BiNi/Cu solder joint is superior to SAC305/Cu solder joint in the anti-creep property. The plasticity of SAC0705BiNi/Cu and SAC305/Cu solder joints are similar. Compared with SAC305 solder, the SAC0705BiNi solder performs higher hardness and solder creep resistance and still maintains a good plasticity.     

基于概率排序的Chip类元件焊点检测方法

为了提高自动光学检测系统在焊点分类、检测准确性和检测速度等方面的性能,针对Chip类元件焊点提出了基于概率排序的检测方法.通过分析彩色焊点图像、建立各焊点类型的模型、定义检测区域、提取区域的面积、重心和色彩梯度特征,并以出现概率的高低规划各焊点类型的检测顺序,进而设计出Chip类元件的焊点检测算法.结果表明,所提方法能有效地检测Chip类元件8种常见的焊点类型,且检测速度获得了明显提高.详细的分类和准确的检测有利于SMT生产线的质量控制,而快速可靠的焊点检测利于提高生产线的效率.     

两种无铅钎料的抗蠕变性能与Sn60Pb40钎料的对比分析

对两种无铅钎料Sn-Ag-Cu-Bi和Sn-Ag-Sb模拟封装钎焊接头的蠕变和断裂行为进行了研究,并与传统的Sn60Pb40近共晶钎料进行了对比.结果表明,两种无铅钎料的抗蠕变能力均远优于Sn60Pb40近共晶钎料,其蠕变速率低且蠕变寿命长.钎焊接头蠕变断裂后的扫描电镜分析表明,两种无铅钎料钎焊接头的蠕变断裂呈现明显的沿晶断裂特征,而Sn60Pb40钎料钎焊接头的蠕变断裂机理则为穿晶断裂.