非掺杂n型氮化镓外延层的光致发光

研究了热处理对非掺杂 n型氮化镓外延层光致发光谱的影响和光谱中各发光带强度与温度之间的关系 .热处理后 ,光谱中的带边峰和黄光峰的强度较热处理前都有明显降低 .黄光峰强度随温度升高的衰减速度要比带边峰慢得多 .由这些实验结果得出结论 :光谱中的带边峰是由自由激子和束缚在一浅施主能级的束缚激子的谱线重合而成 ,这个浅施主能级很有可能是由氮空位产生 ;黄色荧光的机制应为自由电子或施主能级向深受主能级的跃迁 ,并且黄色荧光肯定和氮化镓中的一内部缺陷产生的深受主能级有关 ,该内部缺陷很有可能是镓空位 .     

Si-implantation activation annealing of GaN up to 1400°C

Implant activation annealing of Si-implanted GaN is reported for temperatures from 1100 to 1400°C. Free electron concentrations up to 3.5×10²⁰ cm⁻³ are estimated at the peak of the implanted profile with Hall mobilities of ∼60 cm²/Vs for annealing at 1300°C for 30 s with an AIN encapsulant layer. This mobility is comparable to epitaxial GaN doped at a similarly high level. For annealing at ≥1300°C, the sample must be encapsulated with AIN to prevent decomposition of the GaN layer. Channeling Rutherford backscattering demonstrates the partial removal of the implant damage after a 1400°C anneal with a minimum channeling yield of 12.6% compared to 38.6% for the as-implanted spectrum. Scanning electron microscope images show evidence of decomposition of unencapsulated GaN after a 1300°C anneal and complete sublimation after 1400°C. The use of AIN encapsulation and annealing at temperatures of ∼1300°C will allow the formation of selective areas of highly doped GaN to reduce the contact and access resistance in GaN-based transistors and thyristors.     

氮化镓研制中的退火技术

总结了 Ga N薄膜生长和器件制备中退火技术的应用情况 ,其中涉及退火工艺过程、作用机理以及由此产生的影响。     

氮化镓注镁(Mg:GaN)的光致发光

利用低压MOCVD在蓝宝石衬底上外延生长了GaN,用离子注入法掺入Mg杂质,退火后,进行光致发光测量,观察到显著的蓝光发射和黄带发射.光谱分析给出了与注入Mg离子相关的GaN禁带中能级的精细结构,其中: 间位Mg(Mgi)能级(导带下170meV)到替位Mg(MgGa)受主能级(价带上250meV)的跃迁产生了415nm发光峰; 该能级到价带上390meV能级的跃迁,以及带有紧邻N空位的替位Mg(MgGaVN)能级(导带下310meV)到 MgGa受主能级的跃迁,均产生了438nm发光峰.另外,退火使GaN晶格结构部分恢复,再现了黄带发射.     

退火对离子注入GaN产生的深能级的影响

我们最近报道了大剂量Al+注入原生GaN后对其光学性质的影响。表明Al+的注入可能产生了某种深能级电子陷阱 ,由于电子陷阱俘获导带电子 ,导致发光猝灭。而经一定条件的退火处理 ,可使深的电子陷阱发生变化 ,因而与缺陷间的跃迁相关的黄色荧光可得到一定程度的恢复。由于注入样品的电阻率高达 1 0 1 2 Ω·cm ,因此不能用已有的常规方法测量。我们为此发展了一种称为“光增强电流谱”(PSCS)新方法 ,用于测量高阻样品中的深能级。研究发现 ,在经过快速退火处理的样品中 ,不能消除由于注入产生的准连续深能级带 ;而在某种常规条件退火的样品中 ,发现了 5个位于导带下 1 .77eV ,1 .2 4eV ,1 .1 6eV ,0 .90eV和 0 .86eV的深电子陷阱 ,它们都是Al+注入经退火后形成的稳定结构。实验发现退火使注入产生的准连续深能级带转变为独立的深能级结构 ,虽不能使GaN的本征发光得到恢复 ,但对黄色荧光的恢复是有利的。此研究有助于了解退火处理对离子注入的GaN的电学结构与发光产生的影响。PSCS的意义在于它适用于测量一切高阻半导体样品中与非辐射跃迁相联系的深陷阱能级 ,而不仅仅适用于测量Al+注入GaN产生的深陷阱能级     

退火温度对硅基GaN薄膜质量的影响

采用电泳沉积法在Si(111)衬底上制备GaN薄膜,并研究退火温度对GaN薄膜晶体质量、表面形貌和发光特性的影响。傅立叶红外吸收谱(FTIR)、X射线衍射(XRD)和扫描电镜(SEM)的测试结果表明所得样品为六方纤锌矿结构的GaN多晶薄膜,随退火温度的升高,晶粒尺寸增大,结晶化程度提高。室温下光致发光谱的测试发现了位于367 nm处的强发光峰和437 nm处的弱发光峰,其发光强度随退火温度的升高而增强,但发光峰的位置并不发生移动。     

热退火对Mg掺杂InGaN/GaN异质结特性的影响

系统地研究了氧气氛围中退火温度对Mg掺杂InGaN/GaN异质结电学特性及光学性能的影响.电流电压特性和表面方块电阻的测试表明,与p-GaN相比,p-InGaN/GaN异质结的最佳退火温度较低,而且容易与非合金化的Ni/Au电极形成欧姆接触.分析认为InGaN具有的较小带隙能量和p-InGaN/GaN异质结中存在强烈的极化效应以及InN较高的平衡蒸汽压是引起以上结果的主要原因.p-InGaN/GaN异质结10 K的光致荧光光谱中存在两个分别位于2.95 eV和2.25 eV的发光峰,随着材料退火温度的提高,这两个发光峰的强度逐渐降低.提出了类施主补偿中心参与的与H相关的络合物与Mg受主的复合发光机制,对退火前后光致荧光光谱的变化进行了解释.     

Fluorine behavior in BF 2 + implanted polysilicon films subjected to rapid thermal annealing

The physical and electrical properties of BF ₂ ⁺ implanted polysilicon films subjected to rapid thermal annealing (RTA) are presented. It is found that the out diffusion ofF and its segregation at polysilicon/silicon oxide interface during RTA are the major causes ofF anomalous migration. Fluorine bubbles were observed in BF ₂ ⁺ implanted samples at doses of 1×10¹⁵ and 5×10¹⁵ cm⁻² after RTA.     

Effect of annealing temperature on 1.5 μm photoluminescence from Er-lmplanted 6H-SiC

The effect of post-implantation anneal on erbium-doped 6H-SiC has been investigated. 6H-SiC has been implanted with 330 keV Er⁺ at a dose of 1 × 1013 /cm2. Er depth profiles were obtained by secondary ion mass spectrometry (SIMS). The as-implanted Er-profile had a peak concentration of∼1.3 × 10¹⁸/cm³ at a depth of 770Å. The samples were annealed in Ar at temperatures from 1200 to 1900°C. The photoluminescence intensity integrated over the 1.5 to 1.6 μm region is essentially independent of annealing temperature from 1400 to 1900°C. Reduced, but still significant PL intensity, was measured from the sample annealed at 1200°C. The approximate diffusivity of Er in 6H SiC was calculated from the SIMS profiles, yielding values from 4.5 × 10⁻¹⁶ cm²/s at 1200°C to 5.5 × 10⁻¹⁵ cm²/s at 1900°C.     

Annealing studies of photoluminescence spectra from multiple Er3+ centers in er-implanted GaN

A study of selectively excited photoluminescence (PL) at ∼ 6K in Er-im planted GaN as a function of annealing temperature (400–1000°C) has detected nine different Er³⁺ centers with distinct ∼ 1540 nm ⁴I_13/2 → ⁴I_15/2 Er³⁺ PL spectra and different activation temperatures. However, most of the optically active implanted Er atoms are incorporated at annealing temperatures as low as 400°C on a single type of center for which PL can only be excited efficiently by direct intra-4f shell absorption and is not strongly pumped by either above-gap or broad-band below-gap absorption. This strongly suggests that this high-concentration Er³⁺ center is an isolated, isoelectronic center consistent with Er³⁺ substituted on a Ga site. In contrast, a very small fraction of the Er atoms that form a variety of Er-defect/impurity complexes dominate the Er³⁺ emission spectra excited by above-gap and broad-band below-gap absorption because of their larger cross sections for both carrier capture and optical absorption.     

Activation annealing of Si-implanted GaN up to 1500°C using a novel RTP technique

A novel rapid thermal processing (RTP) unit called Zapper™ has recently been developed by MHI Inc. and the University of Florida for high temperature thermal processing of semiconductors. This Zapper™ unit is capable of reaching much higher temperatures (>1500°C) than conventional tungsten-halogen lamp RTP equipment and achieving high ramp-up and ramp-down rates. Implant activation annealing studies of Si⁺-implanted GaN thin films (with and without an AlN encapsulation layer) have been conducted using the Zapper™ unit at temperatures up to 1500°C. The measurements of electrical properties of such annealed samples have led to the conclusion that high annealing temperatures and AlN encapsulation are needed for the optimum activation efficiency of Si⁺ implants in GaN. It has clearly been demonstrated that the Zapper™ unit has tremendous potential for RTP annealing of semiconductor materials, especially for wide bandgap compound semiconductors that require very high processing temperatures.     

Si离子注入和退火温度对GaN黄光的影响

对光致发光谱中无黄光和有强黄光的两组GaN样品作了Si离子注入 ,研究了Si离子注入及退火温度对其黄光的影响 .当退火温度升高时 ,不管是哪一组样品 ,其黄光强度和黄光强度与带边发光带强度之比都是增强的 .无黄光的GaN样品在注入Si离子并经退火后出现明显的黄光 ;而有强黄光的GaN样品经相同处理后 ,其黄光强度较原生样品大大降低 .实验结果表明离子注入加上适当退火会在GaN中引入与黄光有关的深受主缺陷从而使黄光强度增加 ,此外 ,在离子注入过程中GaN表面不仅可以吸附离子注入引入的点缺陷 ,而且还能够吸附GaN中原有的与黄光有关的点缺陷 ,这种吸附作用随离子注入剂量增加而变强 .     

Electrical and optical activation studies of Si-implanted GaN

Comprehensive and systematic electrical and optical activation studies of Si-implanted GaN were made as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1×10¹³ cm^?2 to 5×10¹⁵ cm^?2 at room temperature. The samples were proximity-cap annealed from 1050°C to 1350°C with a 500-Å-thick AlN cap in a nitrogen environment. The optimum anneal temperature for high dose implanted samples is approximately 1350°C, exhibiting nearly 100% electrical activation efficiency. For low dose (≤5×10¹⁴ cm^?2) samples, the electrical activation efficiencies continue to increase with an anneal temperature through 1350°C. Consistent with the electrical results, the photoluminescence (PL) measurements show excellent implantation damage recovery after annealing the samples at 1350°C for 20 sec, exhibiting a sharp neutral-donor-bound exciton peak along with a sharp donor-acceptor pair peak. The mobilities increase with anneal temperature, and the highest mobility obtained is 250 cm²/Vs. The results also indicate that the AlN cap protected the implanted GaN layer during high-temperature annealing without creating significant anneal-induced damage.     

The structural changes in CdS-CdTe thin films due to annealing

Thin film solar cells based upon CdS-CdTe heterojunctions have become an important alternative to silicon based devices. The film structures formed during fabrication are critical to cell efficiency and thus their study is fundamental to improving device performance. We have used synchrotron x-ray diffraction to investigate the effect of a post deposition anneal upon the film structures and, in particular, have examined the dynamic formation of intermixed regions adjacent to the original, metallurgical interface. Our results have enabled us to produce a dynamic model for the structural changes which includes the extent of interdiffusion. We show that, for a 400 nm CdTe film in the presence of chlorine, the original CdS and CdTe layers are completely transformed into layers with average compositions CdS_0.93Te_0.07 and CdTe_0.94S_0.06, respectively. We present evidence that the interdiffusion occurs during or following a recrystallization and that, to a limited extent, these changes also occur without chlorine.     

Excitation mechanisms of multiple Er3+ sites in Er-implanted GaN

Site-selective photoluminescence (PL) and photoluminescence excitation (PLE) spectroscopies carried out at 6K on the ∼1540 nm ⁴I_13/2→⁴I_15/2 emissions of Er³⁺ in Er-implanted GaN have revealed the existence of four different Er³⁺ sites and associated PL spectra in this semiconductor. Three of these four sites are excited by below-gap, impurity- or defect-related absorption bands, with subsequent nonradiative energy transfer to the Er³⁺ 4f electrons; a fourth site is excited by direct Er³⁺ 4f shell absorption. PLE spectra obtained by selectively detecting Er³⁺ PL from each of the three sites pumped by broad below-gap absorption bands are compared with the PLE spectra of broad PL bands attributed to implantation damage-induced defects in the Er-implanted GaN. This comparison enables us to distinguish broad-band, below-gap optical excitation processes for Er³⁺ emission that are attributable to (1) absorption due to implantation damage-induced defects; (2) absorption due to defects or impurities characteristic of the as-grown GaN film; and (3) an Er-specific absorption band just below the band gap which may involve the formation of an Er-related isoelectronic trap. The two sites excited by impurity-or defect-related absorption bands are also strongly pumped by above-gap excitation, while the sites pumped by the Er-related trap and direct 4f shell absorption are not. This observation indicates that excitation of Er³⁺ luminescence in crystalline semiconductor hosts by either optical or electrical injection of electron-hole pairs is dominated by trap-mediated carrier capture and energy transfer processes. These trap-mediated processes may also control the thermal quenching of Er³⁺ emission in semiconductors.     

快速热退火对真空蒸镀ITO InGaN/GaN蓝光LED的影响

制作了8milX 10mil的InGaN/GaN 蓝光LED(λ=460nm),采用了真空蒸镀在P-GaN上淀积了240nm的ITO。对不同温度下(100℃至550℃)热退火ITO的电学特性和光学特性进行了比较分析。实验发现,450℃下热退火ITO电阻率低至1.19X10_-4Ω?cm,而此温度下得到高透射率94.17%。在20mA注入电流下,正向电压和输出功率分别为3.14V and 12.57mW。另外,550℃ITO退火下制备的LED光通量最大,为0.49lm,这是因为此温度下透射率较大。     

原位退火对磁控溅射制备的ZnS薄膜微结构和发光性能的影响

采用射频磁控溅射技术在玻璃衬底上制备了系列ZnS薄膜,利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)和荧光分光光度计研究了Ar气氛中300～500℃原位退火对薄膜微结构和发光性能的影响.结果表明,退火温度对ZnS薄膜的结晶性能和晶粒大小的影响不大,但会显著影响其发光特性.低温退火处理的薄膜的PL谱具有多个发光峰,...     

Redistribution of implanted dopants in GaN

Donor (S, Se, and Te) and acceptor (Mg, Be, and C) dopants have been implanted into GaN at doses of 3–5×10¹⁴ cm⁻² and annealed at tem peratures up to 1450°C. No redistribution of any of the elements is detectable by secondary ion mass spectrometry, except for Be, which displays behavior consistent with damageassisted diffusion at 900°C. At higher temperatures, there is no further movement of the Be, for peak annealing temperature durations of 10 s. Effective diffusivities are ≤2×10⁻¹³ cm²·s⁻¹ at 1450°C for each of the dopants in GaN.     

溅射后退火反应法制备GaN薄膜的结构与发光性质

报道了用溅射后退火反应法在 Ga As (110 )衬底上制备 Ga N薄膜 .XRD、XPS、TEM测量结果表明该方法制备的 Ga N是沿 c轴方向生长的六角纤锌矿结构的多晶薄膜 .PL测量结果发现了位于 36 8nm处的室温光致发光峰.     

Effect of the post-gate annealing on the gate reliability of AlGaN/GaN HEMTs

In this paper,we investigated the effect of post-gate annealing (PGA) on reverse gate leakage and the reverse bias reli-ability of Al0.23Ga0.77N/GaN high electron mobility transistors (HEMTs).We found that the Poole-Frenkel (PF) emission is domin-ant in the reverse gate leakage current at the low reverse bias region (Vth ＜ VG ＜ 0 V) for the unannealed and annealed HEMTs.The emission barrier height of HEMT is increased from 0.139 to 0.256 eV after the PGA process,which results in a reduction of the reverse leakage current by more than one order.Besides,the reverse step stress was conducted to study the gate reliabil-ity of both HEMTs.After the stress,the unannealed HEMT shows a higher reverse leakage current due to the permanent dam-age of the Schottky gate.In contrast,the annealed HEMT shows a little change in reverse leakage current.This indicates that the PGA can reduce the reverse gate leakage and improve the gate reliability.