自动ACF邦定机硬件系统

随着电子行业迅猛的发展与劳动市场劳动力紧缺,LCM专用设备的自动化、高效率已成为该行业发展的趋势。为了满足市场跟客户的需求,研发了全自动ACF邦定机,重点介绍了全自动ACF邦定机工作原理,设计及硬件系统选型中难点与重点。     

整合型液晶邦定机

用于液晶显示屏制作过程中的邦定技术目的是使TCP或FPC(柔性电路板)与ITO玻璃之间建立稳定连接的生产工艺,是液晶显示屏制作过程中的主要设备之一.介绍了针对液晶显示器制作工艺开发出的整合型邦定机,整合了各向异性导电膜(ACF)机构、预压对位机构、主压邦定机构.重点介绍了该设备的工作原理、系统控制设计、软件控制并指出了...     

母差保护 TA 断线原因分析及处理

母差保护装置 TA 断线报警原因有很多,很多时候并不是真正的 TA 断线,但往往会对运行、检修人员造成误解,本文针对母差保护装置“TA 断线”原因和处理方法进行了简要分析     

母差保护TA断线原因分析及处理

母差保护装置TA断线报警原因有很多,很多时候并不是真正的TA断线,但往往会对运行、检修人员造成误解,本文针对母差保护装置＂TA断线＂原因和处理方法进行了简要分析。     

旋转式预邦定机图像对位方案的改进

图像对位是预压邦定机重要的组成部分,好的图像对位方法可以提高产品的合格率及工作效率.介绍了旋转式预邦定机图像对位控制方案的硬件与软件的设计及原理,阐述了旋转式预邦定机正反面对位在同一台设备上的实现及在工作台X向平移玻璃基板监视器上图像移动的方向一致.     

FOG邦定工艺及其不良分析

根据ACF材料的组成和连接原理介绍了FOG邦定工艺(包括ACF预贴、预邦定、主邦定和检验);阐述了FOG邦定工艺的关键控制点:压力控制、温度控制及高温状态下压头的平行度要求;通过图表和数据分析提出了不良现象的分析以及相应的解决方案.FOG邦定工艺及其关键控制点的研究有利于提高相关工艺制程的合格率.     

FOG制造工艺及其关键技术

介绍了ACF技术和FOG工艺(ACF预贴、预邦定、主邦定和检测);详细阐述了FOG制造工艺的关键技术压力控制、温度控制及高温状态下压头的平行度要求;通过图表和数据分析提出了相应的解决方案,合理的气路设计提高邦定压力的精度和脉冲控温技术,利用有限元设计软件进行压头结构设计.FOG制造工艺及其关键技术的研究对我们研发相关设备具有重要的指导意义.     

热水器温度控制板设计

以89C52单片机为核心,设计了热水器温度控制板,从硬件结构和软件设计方面阐述了该系统的实现原理,给出了系统相关的电路原理图和程序框图。该热水器温度控制板实现了温度测量、温度设定、实时显示水温、缺水报警、定时关机等功能。并设计了故障报警功能,大大方便了用户的使用,提高了热水器的安全性。     

FOG邦定机的脉冲加热控制技术

FOG邦定机是用于将TCP或FPC柔性电路板与ITO玻璃之间建立稳定连接的工艺设备,脉冲本压是FOG邦定的关键工艺。针对本压中的脉冲加热技术,从脉冲加热工作原理、加热系统设计、控温部分组成、系统控制设计及其关键技术等多个方面进行了论述。结合脉冲加热的应用效果,验证了所设计的脉冲加热控制方案在FOG邦定机中的可行性。     

基于74148构成的16路数显报警器的设计与仿真

介绍了一种以中规模集成电路74148优先编码器为主,配合7447和门电路等中小规模集成器件,用断线触发报警代替热释电红外传感器,设计了一种以声音报警和数码显示为一体的防盗报警器。通过应用EWB5.0仿真软件进行设计和模拟仿真,该设计实现了优先报警、多路数字显示等功能。能满足普通用户的需求,对生产制作价格低廉、布控点多、...     

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

In this paper, a novel anisotropic conductive film (ACF) flip chip bonding method using ultrasonic vibration for flip chip interconnection is demonstrated. The curing and bonding behaviors of ACFs by ultrasonic vibration were investigated using a 40-kHz ultrasonic bonder with longitudinal vibration. In situ temperature of the ACF layer during ultrasonic (U/S) bonding was measured to investigate the effects of substrate materials and substrate temperature. Curing of the ACFs by ultrasonic vibration was investigated by dynamic scanning calorimetry (DSC) analysis in comparison with isothermal curing. Die adhesion strength of U/S-bonded specimens was compared with that of thermo-compression (T/C) bonded specimens. The temperature of the ACF layer during U/S bonding was significantly affected by the type of substrate materials rather than by the substrate heating temperature. With room the temperature U/S bonding process, the temperature of the ACF layer increased up to 300degC within 2 s on FR-4 substrates and 250degC within 4 s on glass substrates. ACFs were fully cured within 3 s by ultrasonic vibration, because the ACF temperature exceeded 300degC within 3 s. Die adhesion strengths of U/S-bonded specimens were as high as those of T/C bonded specimens both on FR-4 and glass substrates. In summary, U/S bonding of ACF significantly reduces the ACF bonding times to several seconds, and also makes bonding possible at room temperature compared with T/C bonding which requires tens of seconds for bonding time and a bonding temperature of more than 180degC.     

Anisotropic Conductive Film Bonding by Making Use of a High-Power Diode Laser

Anisotropic conductive film (ACF) bonding between liquid crystal displays (LCDs) and driver integrated circuits (ICs) is one of the key technologies for developing high-resolution LCDs. The bonding pitch between LCD and tape carrier package (TCP), which influences the total reliability of LCD modules, depends on the characteristics and bonding conditions of ACF used. So, the bonding process between TCP and a glass panel with ACF using a high-power diode laser as a heat source for curing is preliminarily tested in this experiment. Also, laser transient thermal simulation was performed to analyze the thermal response of the assembly process for a package using ACF. The temperature on the ACF layer goes up to 180 degC (ACF curing temperature) within 1 s after exposure to laser light. This paper reports an effective bonding method using a diode laser, which accomplishes a fine-pitch ACF bonding and determines the optimum ACF bonding condition effectively     

Thermal stability performance of anisotropic conductive film at different bonding temperatures

In this work the effect of different bonding temperatures on the thermal stability of anisotropic conductive films (ACFs) was investigated. A thermogravimetric analyzer (TGA) was utilized to determine the thermal decomposition temperature of ACF. The experimental results showed that the temperature for maximum decomposition rate of ACF, T_m decreased with increasing bonding temperature. The results obtained from Fourier transform infrared spectroscopy (FTIR), which was used to examine the curing degree and also chemical changes in the ACF, showed some networks scissoring happened on C–N bond during the bonding process. This was the main reason why the ACF bonded at high temperature 225.0 °C, gave relatively low thermal stability. Four point probe was used to measure the contact resistance performance before and after thermal aging at 260 and 300 °C. The contact resistance results suggested that ACF bonded with 10 s at 205.0 °C, yielding a curing degree of 85.0% was the best bonding parameter to obtain a low contact resistance after thermal aging. FTIR results showed there was a significant increase in the absorbance peak of carbonyl group after thermal aging. Thermal oxidation reactions which were taken place at high bonding and aging temperature had broken the polymer networks in the ACF and caused electrical failure.     

Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection

The effects of different bonding parameters, such as temperature, pressure, curing time, bonding temperature ramp and post-processing, on the electrical performance and the adhesive strengths of anisotropic conductive film (ACF) interconnection are investigated. The test results show that the contact resistances change slightly, but the adhesive strengths increase with the bonding temperature increased. The curing time has great influence on the adhesive strength of ACF joints. The contact resistance and adhesive strength both are improved with the bonding pressure increased, but the adhesive strengths decrease if the bonding pressure is over 0.25 MPa. The optimum temperature, pressure, and curing time ranges for ACF bonding are concluded to be at 180–200 °C, 0.15–0.2 MPa, and 18–25 s, respectively. The effects of different Teflon thickness and post-processing on the contact resistance and adhesive strength of anisotropic conductive film (ACF) joints are studied. It is shown that the contact resistance and the adhesive strength both become deteriorated with the Teflon thickness increased. The tests of different post-processing conditions show that the specimens kept in 120 °C chamber for 30 min present the best performance of the ACF joints. The thermal cycling (−40 to 125 °C) and the high temperature/humidity (85 °C, 85% RH) aging test are conducted to evaluate the reliability of the specimens with different bonding parameters. It is shown that the high temperature/humidity is the worst condition to the ACF interconnection.     

ACF各向异性导电胶的工艺评价方法

ACF作为一种实装材料,可以方便地实现精细电极的导通连接。其原理是通过加热、加压、树脂受热固化、ACF中的导电粒子连接上下电极,从而实现电极固定和电极导通。实际上受ACF成份的影响,每种ACF的特性都不一样,而在生产应用中,温度、压力、时间、位置、辅助材料等因素又会对连接的效果产生影响。为了确保ACF适用于厂内的工艺,把ACF的应用风险降低。评价一种ACF的过程,通常分为单体评价、工艺评价和产品评价。文中将以屏侧ACF为例,讨论ACF工艺评价的方法。     

环境对各向异性导电胶膜性能参数的影响

各向异性导电胶膜(ACF)的玻璃转化温度T_g是它的一个重要性能参数,用差示扫描热示计(DSC)分别测定商用各向异性导电胶膜固化前和固化后的玻璃转化温度,并确定不同的固化时间对它的玻璃转化温度的影响,以及高温高湿(85℃,85%RH)环境对它的玻璃转化温度影响,得到各向异性导电胶玻璃转化温度下降是其粘接强度下降的原因之一。     

Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages

The work presented in this paper focuses on the behavior of anisotropically conductive film (ACF) joint under the dynamic loading of flip chip on glass (COG) and flip chip on flexible (COF) substrate packages. Impact tests were performed to investigate the key factors that affect the adhesion strength. Scanning electron microscopy (SEM) was used to evaluate the fractography characteristics of the fracture. Impact strength increased with the bonding temperature, but after a certain temperature, it decreased. Good absorption and higher degree of curing at higher bonding temperature accounts for the increase of the adhesion strength, while too high temperature causes overcuring of ACF and degradation at ACF/substrate interface––thus decreases the adhesion strength. Higher extent of air bubbles was found at the ACF/substrate interface of the sample bonded at the higher temperature. These air bubbles reduce the actual contact area and hence reduce the impact strength. Although bonding pressure was not found to influence the impact strength significantly, it is still important for a reliable electrical interconnect. The behaviors of the conductive particles during impact loading were also studied. From the fracture mode study, it was found that impact load caused fracture to propagate in the ACF/substrate interface (for COG packages), and in the ACF matrix (for COF packages). Because of weak interaction of the ACF with the glass, COG showed poor impact adhesion.     

环境对各向异性导电胶膜性能参数的影响

各向异性导电胶膜(ACF)的玻璃转化温度Tg是它的一个重要性能参数,用差示扫描热示计(DSC)分别测定商用各向异性导电胶膜固化前和固化后的玻璃转化温度,并确定改变固化时间对它的玻璃转化温度的影响,以及高温高湿(85℃,85%RH)环境对它的玻璃转化温度的影响,得到各向异性导电胶玻璃转化温度下降是其粘接强度下降的原因之一。     

倒装芯片各向异性导电胶互连的剪切结合强度

采用冲击试验方法研究了各向异性导电胶膜(ACF)互连的玻璃和柔性基板上倒装芯片(COG和COF)的剪切结合强度.结果表明:COF比COG的剪切强度高.ACF的固化程度达85 %时有最大的结合强度.键合温度、导电颗粒状态、缺陷等因素对ACF互连的结合强度有较大影响,而键合压力的影响不大.