自补偿摩擦表面微观形貌分析

进行了钢－铜摩擦副的原始表面、常规润滑油和自补偿滑油润滑下的表面微观形貌测试和分析;对自补偿润滑下和常规润滑下钢、铜表面的粗糙度和表面轮廓特征参数进行了比较;研究了载荷、摩擦行程对自补偿润滑下钢、铜表面微观形貌的影响;得出了钢－铜摩擦副的磨损在一定范围内与载荷无关、其磨损不随摩擦行程线性增加、自补偿添加剂ＳＷ４更适应于重载工况和经过大的摩擦行程后仍起作用等结论。     

超疏水表面膜的制备

通过化学气相沉积的方法,在具有规则微形貌的硅片表面沉积硅的有机物制备出了超疏水表面,进而对表面的润湿性进行了对比。结果表明:不同的成膜时间和微形貌的结构尺寸直接影响着表面的润湿性;表面的接触角随着时间的增长而增大,但有一时间极限,此后接触角基本不受影响;当微形貌深度一定,随着形貌宽度的增加接触角无明显变化,但超过某一临界值时,接触角下降明显,不再形成超疏水表面。     

表面形貌数字模拟及其影响因素的分析研究

应用计算机模拟技术对一些机械切削加工过程进行模拟,得到的表面形貌能接近真实形貌,能辅助我们深入研究各种影响因素.     

化学织构化硅表面OTS自组装膜形貌及性能表征

用40%NH4F对Si(100)表面进行化学织构化,然后用十八烷基三氯硅烷(OTS)进行分子自组装,在织构化表面谷底区域形成液体凝聚(LC)相分子薄膜。织构化表面的典型山丘直径约30 nm,高约7 nm;典型的LC相OTS单层膜原子力显微镜(AFM)厚度约2.3 nm。随着反应时间的延长,OTS薄膜的LC相面积覆盖率逐渐增加,30m in后达到70%左右的平衡值。OTS组装8 min后的表面静态接触角即达108°左右,且表面接触角不再随反应时间的延长或LC相面积覆盖率的增加而明显变化。组装的OTS薄膜能显著改善织构化硅表面的摩擦学性能。     

分子沉积(MD)膜表面形貌的测量及影响因素

利用原子力显微镜 (AFM)考察了单层磺化酞菁铜 (CuTsPc)MD膜硅表面随载荷和扫描速率变化的盒维数 ,对单层CuTsPcMD膜硅表面进行了表面形貌的测量 ,并分析了形貌信息中的摩擦力信息对表面形貌信号的影响。结果表明 ,单层CuTsPcMD膜硅表面具有较好的分形几何特性 ,分形是表面的固有属性 ;不同类型的硅表面具有的盒维数基本不变。表面形貌的信息里包含的摩擦力信息是表面形貌测量中的重要影响因素 ,载荷和扫描速率通过影响摩擦力对表面形貌的测量产生影响 ,但载荷影响程度不大 ,且没有较明显的规律 ;扫描速率增加能引起表面粗糙度和表面高度的降低。     

表面形貌的Motif评定方法及其发展

Motif方法是一种新的表面形貌评定方法，通过设定不同的阈值，可以将波度和表面粗糙度分离开来，它强调大的轮廓峰和谷对功能的影响，在评定中选取了重要的轮廓特征，而忽略了不重要的特征，介绍了2维Motif的参数和合并条件，然后对3维Motif方法的定义，评定参数及算法等进行了综述，并提出了推广这一评定方法需要注意的问题。     

X射线激光自支撑Mo滤光膜的制备及特性研究

用直流平面磁控溅射方法在抛光玻璃衬底上淀积Mo薄膜,将薄膜在真空环境中进行热处理,用扫描探针显微镜(SPM)方法观察了薄膜的表面形貌,X-射线衍射方法分析了薄膜中应力各向异性特征及其与淀积时溅射气体压强和真空热处理的关系.发现薄膜中晶粒具有明显的择优取向,内应力沿径向对称分布,切向应力比径向应力更具有压应力特性,应力的各向异性特征与溅射原子的入射方向有关.真空热处理对薄膜中压应力的释放作用不明显,然而能有效地释放薄膜中的张应力.用HF酸腐蚀衬底的方法制备了自支撑Mo薄膜,发现脱膜前后薄膜表面微观形貌未产生大的变化.     

X射线激光自支撑Mo滤光膜的制备及特性研究

用直流平面磁控溅射方法在抛光玻璃衬底上淀积Mo薄膜,将薄膜在真空环境中进行热处理,用扫描探针显微镜(SPM)方法观察了薄膜的表面形貌,X-射线衍射方法分析了薄膜中应力各向异性特征及其与淀积时溅射气体压强和真空热处理的关系.发现薄膜中晶粒具有明显的择优取向,内应力沿径向对称分布,切向应力比径向应力更具有压应力特性,应力的各向异性特征与溅射原子的入射方向有关.真空热处理对薄膜中压应力的释放作用不明显,然而能有效地释放薄膜中的张应力.用HF酸腐蚀衬底的方法制备了自支撑Mo薄膜,发现脱膜前后薄膜表面微观形貌未产生大的变化.     

X射线激光自支撑Mo滤光膜的制备及特性研究

用直流平面磁控溅射方法在抛光玻璃衬底上淀积 Mo薄膜 ,将薄膜在真空环境中进行热处理 ,用扫描探针显微镜 ( SPM)方法观察了薄膜的表面形貌 ,X-射线衍射方法分析了薄膜中应力各向异性特征及其与淀积时溅射气体压强和真空热处理的关系。发现薄膜中晶粒具有明显的择优取向 ,内应力沿径向对称分布 ,切向应力比径向应力更具有压应力特性 ,应力的各向异性特征与溅射原子的入射方向有关。真空热处理对薄膜中压应力的释放作用不明显 ,然而能有效地释放薄膜中的张应力。用 HF酸腐蚀衬底的方法制备了自支撑 Mo薄膜 ,发现脱膜前后薄膜表面微观形貌未产生大的变化。     

Preparation and characterization of nanoporous polyimide films from triblock copolyimides

Nanoporous polyimide films were prepared from triblock copolyimides. A thermally labile polymer, poly(propylene glycol), was incorporated into polyimides based on 4,4-(hexafluoroisopropylidene)diphthalic anhydride to obtain triblock copolyimides. Nanofoams were formed by thermolysis of the labile block. The thermal properties of the copolymers were investigated by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The nanopores were characterized by scanning electron microscopy (SEM).     

金属W薄膜晶体取向与表面形貌

对采用磁控溅射法制备金属W薄膜,研究了不同厚度W薄膜退火晶体取向和表面结构的动态演变过程.结果表明:在较薄的膜中,表面能最低的晶面(110)处于支配地位,导致(110)择优取向增强;薄膜表面结构颗粒尺寸增大.当薄膜超过临界厚度,应变能开始起主导作用,薄膜(110)择优取向程度随厚度的增加而下降,表面结构颗粒减小.薄膜晶体取向和表面结构都存在厚度尺寸效应,这依赖于表面能和应变能的动态平衡过程.薄膜表面形貌和晶体结构之间存在对应关系.     

物理气相沉积技术的研究进展与应用

介绍了物理气相沉积技术的新工艺、新进展及其特点,总结了物理气相沉积技术的一些新应用.指出特殊功能复合膜的制备、复合膜的研究与应用以及超硬膜制备将是物理气相沉积技术今后研究的重点.     

Morphologic and cathodoluminescence studies of diamond films by scanning electron microscopy

Using recent papers on scanning electron microscopy (SEM) of chemical vapor deposition (CVD) diamond films, two analytical applications of the SEM are discussed: the morphologic investigations (secondary electron emission mode) and the recognition of impurities and defects [cathodoluminescence (CL) mode]. Studies of CVD diamond films by SEM demonstrate that the morphologies of these films are affected by synthesis conditions, especially by substrate temperature, methane concentration, and total pressure in the reactor. CL spectra and images are useful tools for clarifying the relationship between emission centers and different types of defects generated during the process of diamond crystal growth. The paper shows that the investigations of the morphology, crystallinity, local CL emission, as well as the surface distribution of CL spectra on CVD diamond films by SEM led to the correlative information for quality estimation of films in comparison with natural diamond.     

Morphology selection for cupric oxide thin films by electrodeposition

Polycrystalline cupric oxide thin films were deposited using alkaline solution bath employing cathodic electrodeposition method. The thin films were electrodeposited at various solution pH. The surface morphology and elemental analyzes of the films were studied using scanning electron microscopy (SEM) and energy dispersive X-ray analysis, respectively. SEM studies revealed that the surface morphology could be tailored suitably by adjusting the pH value during deposition. Mesh average on multiple lattice mode atomic force microscopy image was obtained and reported.     

Fractal characteristics and microstructure evolution of magnetron sputtering Cu thin films

How to describe surface morphology characteristic and microstructure evolution are the hottest researches of current thin film researches.But in traditional characterization of surface morphology,the roughness parameters are scale related.And the microstructure evolution of thin film during post-treatment is usually not considered in detail.To give a better understanding of the roughness of thin films topography,fractal method is carried out.In addition,microstructure evolution of thin films is analyzed based on the crystallography and energy theory.Cu thin films are deposited on Si(100) substrates by magnetron sputtering,and then annealed at different temperatures.Surface topography is characterized by atomic force microscope(AFM).Triangular prism surface area(TPSA) algorithm is used to calculate the fractal dimension of the AFM images.Apparent scale effect exists between the surface morphology roughness and film thickness.Relationship between the fractal dimension and roughness is analyzed by linear regression method and linear relationship exists between fractal dimension and surface roughness root mean square(RMS).Fractal dimension can be characterized as a scale independence parameter to represent the complex degree and roughness level of surface.With the increase of annealing temperature,surface roughness and fractal dimension decrease.But when the annealing temperature exceeds the recrystallization temperature,due to the agglomeration and coalescence of Cu grain,surface roughness and fractal dimension increase.Scale effect and changing regularity of grain growth and shape evolution for different film thickness under different annealing temperatures are analyzed.Based on minimum total free energy,regularity of grain growth and changing is proposed.The proposed research has some theory significance and applicative value of Cu interconnect process and development of MEMS.     

AZO薄膜理想表面形貌的制备与加工工艺优化

非晶硅薄膜太阳能电池主要采用掺氟氧化锡(FTO)导电玻璃作为基板,但FTO薄膜雾度较低、表面形貌无法优化,导致无法得到较优的陷光结构,从而限制了太阳能电池的转换效率。为了进一步提升太阳能电池的转换效率,探讨了替代型的掺铝氧化锌(AZO)薄膜,通过优化前段磁控溅射镀膜工艺和后段湿化学蚀刻工艺,用以平衡AZO薄膜的光电性能和雾度,从而获得具有理想表面形貌的AZO导电玻璃,使其成为理想的非晶硅薄膜太阳能电池的基板材料。实验表明,经工艺优化后制作的AZO导电玻璃可提升光电转换效率。     

DLC薄膜的表面形貌及其摩擦学性能研究

以真空蒸发碳离子束辅助镀膜法制备了DLC薄膜，通过原子力显微镜(AFM)和扫描电子显微镜(SEM)观察了该薄膜的表面形貌，对该薄膜的表面形貌对其摩擦学行为的影响进行了研究。研究发现：用真空蒸发碳离子束辅助镀膜的方法制备的类金刚石薄膜表面光滑，颗粒均匀，粒度小，摩擦因数降低；DLC薄膜比弹簧钢片及Ti6Al4V球基体耐磨；DLC薄膜的摩擦学性能在摩擦过程中会进一步改善。