Surface tension isotherms of a free surface and grain boundaries in the Cu-Sn system

Surface tension of pure copper and its alloys with Sn has been measured at 1000°C in a hydrogen atmosphere. Surface tension of a free surface equaled 1.81 N/m for pure copper, and 1.55, 1.38, and 1.28 N/m for the alloys with 0.05, 0.22, and 0.33 at % Sn, respectively; surface tension at grain boundaries equaled 0.5 N/m for pure copper, and 0.36, 0.3, and 0.23 N/m for the alloys, respectively. Based on these data, the concentration dependence of tin absorption at a free surface and grain boundaries has been calculated. Parameters of Sn absorption at grain boundaries and a free surface of copper have been compared with those of Sb and Bi.     

乙二醇介质中铜微粉表面化学镀银的研究

在新生成的铜微粉表面化学镀银,用扫描电镜、X射线衍射仪、动态光散射粒径测试仪和热重仪对粉体进行表征和性能测试,分析了粉体导电性、抗氧化性及粒径大小和分布的影响因素。结果表明:在乙二醇介质中采用液相还原法,通过葡萄糖预还原,用甲醛进行二次还原,控制银与铜物质的量之比为2∶1,可得到抗氧化性、导电性良好的银包铜微粉。     

铜/银合金纳米粒子的制备及表征

研究了铜/银合金纳米粒子的制备方法,用抗坏血酸做还原剂,制备了粒径小的纳米铜粉。由于纳米铜粉的稳定性差,易氧化,为了提高其稳定性,在制备的纳米铜粉中加了少量的Ag+,在纳米铜粉表面还原制备出银纳米层覆盖于在铜上。所制备的纳米铜/银合金纳米粒子稳定性好,具有纳米粒子的效应,有望应用于印制电路的制造。该制备方法可以减少传统印制电路板制作方法的工序,节约资源,且减少对环境的污染。     

纳米银的制备及其表征

采用液相化学还原法以抗坏血酸为还原剂,十二烷基硫酸钠为表面活性剂,在不同温度磁力搅拌的作用下,还原硝酸银溶液,制备成球形的纳米银粒子。利用紫外分光光度计考察反应温度、AgNO3浓度以及还原剂浓度对纳米银粒径的影响,利用XRD来观察纳米银粒子的晶型,用SEM观察纳米银粒子的表面结构以及粒径大小的分布范围。在AgNO3浓度为0.08mol/L、抗坏血酸浓度为0.1mol/L、温度为20℃时,制备的纳米银粉末纯净而均匀,平均粒径为30nm。     

云锦扁金线的金层含金量测定

云锦妆花缎是云锦中的高端产品,其中的扁金线的金层含金量一直没有检测方法。采用王水溶解云锦扁金线,进行ICP-AES法测定主成分金,次成分银、铜,按照金在检测的所有主要金属元素总和的相对占比来计算含金量。方法精密度分别为金13.1%~16.5%;银2.69%~6.54%;铜5.58%~9.92%,加标回收率分别为金96.5%~98.0%、银97.4%~100.0%、铜90.4%~101%。     

Radiotracer Study of Electrochemical Displacement on Metals

Radiotracer studies of the displacement of silver from silver nitrate solutions by copper, iron and nickel have been made, using Ag¹¹⁰. The rate of displacement is increased by oxidizing the surface and by increasing the silver-nitrate concentration; in the case of copper it is greater for annealed surfaces than for cold-rolled.     

Viscous Flow of Copper at High Temperatures

Changes in length of copper foils of varying thickness and grain size were measured under such conditions of low stress and high temperature that it is believed that creep was predominately the result of interboundary diffusion of the type recently discussed by Conyers Herring. The surface tension of copper was calculated and results confirmed previous work within the limits of experimental error. Under the assumption of viscous flow, viscosities were calculated as a function of temperature and grain size. Predictions of the Nabarro-Herring theory of surface grain boundary flow were borne out fully and the Herring theory of diffusional viscosity is strongly supported.     

超细银包覆BaTiO3粉体的制备

讨论了金属-陶瓷复合材料超细银包覆BaTiO3粉体的制备条件，采用扫描电镜，激光粒度分布仪，比表面积分析仪及X射线荧光光谱仪表征了复合粉末颗粒的形貌和粉体的团聚状态。讨论了银在钛酸钡粉末表面的包覆形式。采用化学镀的方法在BaTiO3表面沉积金属银。在天然高分子表面活性剂的保护下，Ag(NH3)2^ 被水合肼还原得到分散性良好的不同含银量的复合粉体。最佳的反应条件是：银含量0．1％～0．5％，Sodium Alginate／Ag(质量比)20％，粉末中Ag含量小于80％，反应时间120min，水合肼浓度0．8％。实验表明所得颗粒是银包覆在BaTiO3表面的形成一定银层厚度的复合体系。     

Effect of Mesh Resolution on the Particle Deformation during Cold Spraying by Eulerian Formulation

Numerical simulations focusing on the impacting behavior of cold sprayed particles were usually conducted by the Lagrangian formulation.However,the calculated outputs were much dependent on the meshing size owing to the excessive element distortion.Therefore,the Eulerian formulation becomes attractive,because it can avoid the extreme distortion of elements.In the present study,a copper particle impact on the same material substrate in cold spraying was simulated using the Eulerian formulation available in the ABAQUS software(Ver 6.8).The dependency of the calculated outputs on the meshing resolution were detailedly investigated.Results show that the meshing resolution not only has an effect on the shape of the deformed particle,but also it can significantly influence the maximum plastic strain and temperature under a given impact velocity.In addition,the copper particle deformation process at the critical velocity of 310 m/s shows that a jet composed of both of the particle and substrate materials can be formed and gets elongated with the impact time.     

Ag-Cu合金纳米颗粒的低温合成与热学性能

采用一种简单的低温化学还原方法,在水溶液中利用NaBH4作为还原剂还原醋酸或硫酸铜,制备了Ag-Cu纳米颗粒.反应过程中通入氮气来防止生成的合金被氧化.采用XRD、紫外-可见光谱、颗粒尺寸测试、EDS分析、TG-DTA分析和SEM观察等手段来表征合成的Ag-Cu纳米颗粒.XRD分析表明,所合成的Ag-Cu纳米颗粒的晶粒尺寸为15nm左右.紫外-可见光谱分析证实了纳米颗粒的生成.EDS分析表明,样品中存在Ag和Cu.SEM观察表明,所制备的样品的平均晶粒尺寸为40 nm.TG-DTA研究表明,合金的熔点与颗粒尺寸有关.     

超声场下银胶体的制备

在超声场作用下，以聚乙烯毗咯烷酮为保护剂，硝酸银为前驱物，经硼氢化钾还原制备了稳定的银胶体。研究了保护剂和还原剂用量、超声时间和超声功率等因素对银胶体稳定性的影响，利用透射电镜、选区电子衍射和分光光度等技术对制备的银胶体进行了表征。结果表明：银纳米粒子为面心立方（fcc）结构；PVP与AgNO3质量比为1：1时，PVP可有效保护银粒子，获得了球形颗粒：AgNO3与KBH4摩尔比为1：2时，可制得分散较好的直径约为20nm的类球形银纳米颗粒；在超声场作用下，银胶体的分散性和稳定性增强。随着超声功率的增大，银纳米粒子直径变小，粒径分布变窄。超声50min制得的银胶体主要以球形纳米颗粒形式存在，粒径在10nm-20nm范围内，稳定性好。     

银粉形貌及粒径对银浆性能的影响

将银粉、有机载体和玻璃粉按一定比例混合制成导电银浆。银浆通过丝网印刷在硅基片上,保温烧结。采用SEM、四探针法研究银粉的不同粒径与形貌对银浆烧结厚膜层方阻的影响。结果表明,随着球形银粉粒径增大,银膜方阻先减小后增大,当球形银粉粒径在2μm时银膜方阻最小,为4.44?/□;当2μm片状银粉和2μm球形银粉混合加入时,银膜方阻最小,为3.95 m?/□;随着片银的含量增加,银膜方阻先减小后增大,当片状银粉为50%时银膜方阻最小,为3.92 m?/□。     

氢还原硝酸银气溶胶制备纳米银粉(英文)

采用高频超声波发生器生成硝酸银气雾滴,然后用氢气还原硝酸银制备纳米银粉。研究前驱体浓度和反应温度对产物粒径、形貌和晶粒尺寸的影响。在200℃的氢气气氛中,以硝酸银为原料制得的纳米银粉中含有氧化物。当反应温度超过200℃时可以制得纯银粉;X射线衍射分析表明,所制得样品的晶粒尺寸为29～47nm。研究表明反应温度对产物的粒径有明显影响。随着前驱体浓度的增加,所得纳米粉末的晶粒尺寸增加。SEM观察表明,产物银粉呈球形,粒径为210～525nm。反应温度和前驱体浓度对产物粒径有明显影响。     

Research on a New Synthesis Technology of La-Mg-Ni System Alloys and Microstructure of La0.67Mg0.33Ni3.0 Alloys

在常温条件下,以硬脂酸银为前驱体,受阻酚为还原剂,三苯基磷为还原促进剂,采用超声化学法制备了银纳米粒子.考察影响银纳米粒子形成的实验因素,并利用透射电子显微镜、紫外可见吸收光谱及X射线衍射仪对银纳米粒子进行了表征.结果表明,在一定条件下所得银纳米粒子的平均粒径为6.8 nm,尺寸分布为6.2 nm至7.4 nm,具有良好的稳定性和均一性.溶剂蒸发后,银纳米粒子可形成二维有序纳米阵列.探讨了银纳米粒子的形成机理.     

硝硫混酸与Ag、Cu反应的动力学

用失重法探讨了硝硫混酸此例、浸出温度和时间等因素对银的溶解和铜的钝化的影响。结果表明:在一定的[HNO_3]范周内,较高温度时,银的溶解符合一级反应规律;求得银的溶解量与时间、HNO_3起始浓度等的关系式和相应的反应活化能;铜在此条件时是钝化的。本实验再一次证实了银的溶解和铜的钝化机理的正确性,也为银、铜的分离提供了实验依据。     

Synthesis of ultrafine copper particles by complex-reduction-extraction method

A novel chemical process for producing well-defined copper particles with satisfied anti-oxidation property was described. The resultant particles were characterized by X-ray diffractometry and scanning electron microscopy. The results show that well-dispersed nano-copper particles with 70 nm in diameter are obtained from the water/organic solution containing 0.2 mol/L Cu2. ion, with ammonia as ligand and ascorbic acid as reductant. In this process, the formation of copper-ligands in aqueous solution causes initial copper ions concentration very low, which is not only good to obtain homogeneous initial reaction solution, but also slower the initially drastic nucleation reaction rate. This makes the process more convenient for delaying the nuclei processes and for controlling the ultimate copper particles size. In addition, oleic acid acts as both a phase-transfer agent and a particle protector coordinating their carboxyl end groups on the new generated copper particles surface, the carbon tails of the oleic acids are pointed outwards from the surface of the synthesized particles. This organic film also seems to play an important role to prevent the new generated copper particles from oxidation.     

晶硅太阳能电极银浆用银粉的后处理方法综述

随着晶硅太阳能电池制备技术的发展,对其导电银浆用银粉的形貌、分散性、表面性质和粒径分布等提出了更高的要求。除了提高银粉本身结构特性外,银粉的后处理是解决以上问题并能实现其应用的关键步骤。在分析国内外近20年来40余篇相关文献的基础上,总结了晶硅太阳能电极银浆用银粉的后处理方法,主要包括表面改性(化学改性法、机械复合法及原位生成粒子法)和银粉粒度分级处理(机械振动筛分级和气流分级),并对上述方法的优缺点进行了总结分析与展望。     

无氰镀银层高温防变色性能初步探究

目的探寻无氰镀银层高温变色的原因,以增强无氰镀银层的防高温变色性能。方法采用硫代硫酸盐体系在紫铜片上镀银,并进行无惰性气体保护的300℃×1 h烘烤。借助扫描电镜(SEM)观察镀层高温烘烤后的微观形貌,采用能谱仪(EDS)检测镀层中各元素的含量与分布,探讨银层厚度、供电方式、后处理工艺对镀层防高温变色性能的影响。结果当直流电镀层厚度达到9μm,脉冲电镀层厚度达到6μm时,镀层经高温烘烤后不变色。而经水溶性银保护剂、重铬酸钾、PMTA处理后的镀层(厚6μm)均在高温烘烤后发生了变色情况。扫描电镜观察显示,高温变色镀层表面有凸起状裂纹,能谱仪检测到有铜原子外渗现象。结论高温下铜原子的外渗导致了镀层变色。采用脉冲方式进行电镀,可以使镀银层孔隙率降低。通过增加镀银层厚度和采用脉冲电镀,能够提高镀银层的防高温变色性能。     

Effects of silver powder particle size on the microstructure and properties of Ag-Yb<Subscript>2</Subscript>O<Subscript>3</Subscript> electrical contact materials prepared by spark plasma sintering

Ag-Yb₂O₃ electrical contact materials were fabricated by spark plasma sintering (SPS). The effects of silver powder particle size on the microstructure and properties of the samples were investigated. The surface morphologies of the sintered samples were examined by optical microscope (OM), and the fracture morphologies were observed by scanning electron microscopy (SEM). The physical and mechanical properties such as density, electrical resistivity, microhardness, and tensile strength were also tested. The results show that the silver powder particle size has evident effects on the sintered materials. Comparing with coarse silver powder (5 μm), homogeneous and fine microstructure was obtained by fine silver powder (≤0.5 μm). At the same time, the electrical conductivity, microhardness, and tensile strength of the sintered samples with fine silver powder were higher than those of the samples with coarse silver powder. However, silver powder particle size has little influence on the relative densities, which of all samples (both by fine and coarse silver powders) is more than 95%. The fracture characteristics are ductile.     

Surface characteristics of rapidly solidified nickel-based superalloy pow-ders prepared by PREP

The surface microstructure and the surface segregation of FGH95 nickel-based superalloy powders prepared through plasma rotating electrode processing (PREP) have been investigated by using SEM and AES. The results indicate that the surface microstructure of powders changes from dendrite into cellular structure as the particle size of powders de-crease, and the predominant precipitates solidified on the particle surfaces were identified as MC' type carbides enriched with Nb and Ti. It was also indicated that along with the depth of particle surfaces, the segregation layer of S, C and O ele-ments are thick, and that of Ti, Cr elements are thin for large size powders while they are in reverse for median size parti-cles.