Si基GaN功率器件的发展态势

宽禁带半导体材料GaN作为第三代半导体材料具有传统半导体材料所不具备的优异性能,在高频、高压、高温和大功率器件领域具有重要的应用。介绍了硅基GaN(GaN-on-Si)器件提高性能的技术路线,以及与之相关的材料集成技术。     

X波段50W GaN功放管的应用研究

氮化镓(GaN)作为新一代半导体材料,具有高功率容量和高热容性等特点,所以GaN微波功率器件成为近几年研究的热点。随着GaN功放管的功率不断提高,以氮化镓(GaN)为基础的微波功率器件的应用取得了很大的进步。本文对氮化镓(GaN)功率器件的特点和现状进行了介绍,并对X波段50W GaN功放管的电路设计、影响电路的因素进行了分析和研究。最后完成了一个X波段50W固态功放的设计,并给出了测试结果。     

GaN技术发展新趋势

氮化镓(GaN)是第三代半导体的典型代表,受到学术界和产业界的广泛关注,正在成为未来超越摩尔定律所依靠的重要技术之一。对于射频(RF)GaN技术,在电信和国防两大主要应用增长行业,尤其是军用领域对先进雷达和通信系统不断增加的需求,推动了RF GaN器件向更高频率、更大功率和更高可靠性发展。文章梳理了在该领域中GaN RF/微波HEMT、毫米波晶体管和单片微波集成电路(MMIC)、GaN器件空间应用可靠性和抗辐射加固等技术发展的脉络。在功率电子方面,对高效、绿色和智能化能源的需求拉动GaN功率电子、电源变换器向快速充电、高效和小型化方向发展。简述了应用于纯电动与混合动力电动汽车(EV/HEV)、工业制造、电信基础设施等场合的GaN功率器件的研发进展和商用情况。在数字计算特别是量子计算前沿,GaN是具有应用前景的技术之一。介绍了GaN计算和低温电子技术研究的几个亮点。总而言之,对GaN技术发展几大领域发展的最新趋势作了概括性描述,勾画出技术发展的粗略线条。     

GaN功率开关器件的发展与微尺度功率变换

GaN材料具有高的击穿场强、高的载流子饱和速度和能形成高迁移率、高密度的二维电子气,使得GaN功率开关器件具有关断电压高、导通电阻小、工作频率高等特点。GaN功率开关器件将成为高效率与超高频(UHF)电力电子学发展的重要基础之一。综述了GaN功率开关器件的发展历程、现状、关键技术突破、应用研究和微功率变换集成。重点评估了常开和常关两类GaN功率开关器件的异质结外延材料的结构、器件结构优化、器件的关键工艺、增强型器件的形成技术、器件性能、可靠性、应用特点和微系统集成。最后总结了新世纪以来GaN新一代电力电子器件技术进步的亮点。     

GaN功率开关器件的发展与微尺度功率变换北大核心CSCD

GaN材料具有高的击穿场强、高的载流子饱和速度和能形成高迁移率、高密度的二维电子气,使得GaN功率开关器件具有关断电压高、导通电阻小、工作频率高等特点。GaN功率开关器件将成为高效率与超高频(UHF)电力电子学发展的重要基础之一。综述了GaN功率开关器件的发展历程、现状、关键技术突破、应用研究和微功率变换集成。重点评估了常开和常关两类GaN功率开关器件的异质结外延材料的结构、器件结构优化、器件的关键工艺、增强型器件的形成技术、器件性能、可靠性、应用特点和微系统集成。最后总结了新世纪以来GaN新一代电力电子器件技术进步的亮点。     

富士通半导体明年计划量产氮化镓功率器件

<正>富士通半导体(上海)有限公司近日宣布采用其基于硅基板的氮化镓(GaN)功率器件的服务器电源单元成功实现2.5 kW的高输出功率,富士通半导体计划将于2013年下半年开始量产这些GaN功率器件。这些器件可广泛用于电源增值应用,对实现低碳社会做出重大贡献。与传统硅基功率器件相比,基于GaN的功率器件具有导通电阻低和能够进行高频操作等特性。而这些特性恰恰有利于提高电源单元转换效率,并使电源单元更加紧凑。富士通半导体计划在硅基板上进行GaN功率     

国外GaN功率器件衬底材料和外延技术研发现状

GaN基功率器件的衬底和外延技术的发展对于器件性能的提升和成本的降低起着非常重要的作用.介绍了国外SiC基、Si基以及新型金刚石基GaN功率器件衬底材料和GaN外延技术的研发现状.重点讨论了大尺寸衬底技术(6英寸SiC衬底、8英寸Si衬底)、GaN HEMT与Si CMOS器件异质集成技术以及金刚石基GaN HEMT材料集成技术的研发进展.分析了GaN功率器件材料技术的发展趋势,认为更大尺寸更高质量衬底和外延材料制作、外延技术的改进、金刚石等新型衬底材料研发以及GaN基材料与Si材料的异质集成技术等将是未来研究的重点.     

氮化物半导体电子器件的若干研究进展

近年来,氮化物半导体电子器件和材料研究有了重大的进展。在国家自然科学基金资助下,西安电子科技大学、北京大学和中科院微电子所完成了国家自然科学基金重点项目《GaN宽禁带微电子材料和器件重大基础问题研究》。致力于通过氮化物电子材料和器件的基础物理机理研究提高GaN电子材料的结晶质量和电学性能、发展新结构GaN异质结材料研究,获得高性能的GaN HEMT微波功率器件。本文主要介绍该项目在GaN微波功率HEMT和新型高k栅介质MOS-HEMT、InAlN/GaN材料的生长和物性缺陷分析以及HEMT器件研制、GaN异质结的量子输运和自旋性质研究以及GaN材料高场输运性质和耿氏器件等几个方面取得的研究进展。     

GaN基增强型HEMT器件的研究进展

随着电力转换系统功率密度和工作频率的不断提高,需要开发性能优于传统半导体的功率器件。作为第三代半导体材料的典型代表,氮化镓（GaN）被认为是提高大功率电力系统转换效率的新一代功率器件的主要候选材料。在操作类型方面,增强型（也称为常关型）器件具有安全、能简化电路设计以及更优的电路拓扑设计等优势,在行业应用中更具吸引力。总结并对比了目前国际上主流的GaN基增强型器件的结构和制备工艺,着重介绍了基于栅凹槽结构的功率器件技术,特别是栅槽刻蚀后的界面处理、栅介质层的优化技术。围绕器件的关键指标,总结了材料外延结构、欧姆接触、场板以及钝化工艺对器件性能的影响,提出了未来可能的技术方案。     

被写进“十四五”的氮化镓(GaN),各场景应用齐头并进

氮化镓作为一种第三代半导体材料,近两年时间里在消费类电源市场中得到了广泛应用。尤其是随着各大手机、笔电品牌纷纷入局氮化镓快充,氮化镓功率器件的性能得到进一步验证,同时也加速了氮化镓技术在快充市场中的普及。目前快充电源市面.上的应用的氮化镓主要以三种形式,分别是GaN单管功率器件,内置驱动器的GaN功率芯片,以及内置控制器、驱动器、GaN功率器件的合封芯片。其中以GaN单管功率器件发展最为迅速,尤其是十四五规划出台以来,国家加大了对第三代半导体扶持力度,基于不同品牌GaN器件开发的快充产品也相继量产。     

Progress in Group Ⅲ nitride semiconductor electronic devices

Recently there has been a rapid domestic development in groupⅢnitride semiconductor electronic materials and devices.This paper reviews the important progress in GaN-based wide bandgap microelectronic materials and devices in the Key Program of the National Natural Science Foundation of China,which focuses on the research of the fundamental physical mechanisms of group III nitride semiconductor electronic materials and devices with the aim to enhance the crystal quality and electric performance of GaN-based electronic materials, develop new GaN heterostructures,and eventually achieve high performance GaN microwave power devices.Some remarkable progresses achieved in the program will be introduced,including those in GaN high electron mobility transistors(HEMTs) and metal-oxide-semiconductor high electron mobility transistors(MOSHEMTs) with novel high-k gate insulators,and material growth,defect analysis and material properties of InAlN/GaN heterostructures and HEMT fabrication,and quantum transport and spintronic properties of GaN-based heterostructures,and highelectric -field electron transport properties of GaN material and GaN Gunn devices used in terahertz sources.     

提高GaN功率器件开关频率的技术途径

GaN基增强型高速开关器件是提升X波段微系统集成放大器工作效率的核心器件.介绍了凹槽栅结构、F-注入等制作GaN基增强型器件的关键技术,同时分析了场板、介质栅等对器件击穿特性的影响.针对影响GaN基功率器件开关特性的主要因素,重点分析了提高增强型GaN基功率器件开关频率的主要技术途径.减小器件的接触电阻、沟道方块电阻可以降低器件电阻对频率的影响.小栅长器件中栅电容较低,电子的沟道渡越时间较短,也可以提高器件的频率特性.此外,由于GaN基的功率器件频率高,设计应用在GaN器件上的栅驱动电路显得尤为重要.     

AlGaN/GaN hybrid MOS-HEMT analytical mobility model

Since it is naturally normally-off, the hybrid AlGaN/GaN MOS-HEMT has a tremendous potential for an advanced GaN-based power switch. An analytical model for the hybrid AlGaN/GaN HEMT on-resistance is presented in this paper. The methodology presented here can aid the designers to understand the physics and to electrically characterize the new generation of GaN based devices. The models proposed here can also easily be implemented in TCAD simulation packages where models for GaN devices are not mature.     

p型GaN欧姆接触的研究进展

宽带隙的GaN作为半导体领域研究的热点之一,近年来发展得很快.p型GaN的欧姆接触问题一直阻碍高温大功率GaN基器件的研制.本文讨论了金属化方案的选择、表面预处理和合金化处理等几个问题,回顾了近年来p型GaN欧姆接触的研究进展.     

Si衬底GaN基材料及器件的研究

GaN具有禁带宽、热导率高等特点,广泛应用于光电子和微电子器件领域.Si衬底GaN基材料及器件的研制将进一步促进GaN基器件与传统器件工艺的集成,因而具有很高的研究价值.介绍了Si衬底GaN基材料生长及特性方面的研究现状和GaN基器件的进展情况.     

GaN based transistors for high power applications

Unique properties of GaN and related semiconductors make them superior for high-power applications. The maximum density of the two-dimensional electron gas at the GaN/AlGaN heterointerface or in GaN/AlGaN quantum well structures can exceed 2×10¹³ cm⁻², which is more than an order of magnitude higher than for traditional GaAs/AlGaAs heterostructures. The mobility-sheet carrier concentration product for these two dimensional systems might also exceed that for GaAs/AlGaAs heterostructures and can be further enhanced by doping the conducting channels and by using “piezoelectric” doping. Current densities over 20 A mm⁻¹ can be reached in GaN-based high electron mobility transistors (HEMTs). These high current values can be combined with very high breakdown voltages in high-power HEMTs, which are expected to reach several thousand volts. Recent Monte Carlo simulations point to strong ballistic and overshoot effects in GaN and related materials, which should be even more pronounced than in GaAs-based compounds but at much higher electric fields. This should allow us to achieve faster switching, minimizing the power dissipation during switching events. Self-heating, which is unavoidable in power devices, raises operating temperatures of power devices well above the ambient temperature. For GaN-based devices, the use of SiC substrates allows to combine the best features of both GaN and SiC technologies; and GaN/SiC-based semiconductors and heterostructures should find numerous applications in power electronics.     

Gallium-nitride-based materials for blue to ultravioletoptoelectronics devices

Breakthroughs in materials growth have enabled extremely high-efficiency blue and green GaN light emitting diodes (LEDs) to be achieved for the first time. Blue LEDs with external quantum efficiency exceeding 9% have enabled hybrid GaN/phosphor white lamp LEDs. GaN LEDs complete the primary color spectrum and have enabled bright and reliable full-color solid-state displays to be realized. Recently, room-temperature operation of continuous wave current-injection blue-violet lasers emitting at 417 nm has further increased the possible applications for GaN-based opto-electronic devices. In this paper, we review the key technologies for GaN-based materials and devices. Developments in the methods for thin-film deposition by metalorganic chemical vapor deposition and molecular beam epitaxy and resulting film properties are highlighted     

GaN基光电子材料及器件的研究

GaN材料是性能优越的化合物半导体,与其相关的合金材料可以制作出高亮度蓝光、绿光发光二极管、紫外探测器、半导体蓝色激光器(LD)等具有重要应用价值的光电子器件,因而备受重视,本文综述了GaN基光电子器件研究开发现状及其应用前景。     

Low-Frequency Noise Characteristics in Ion-Implanted GaN-Based HEMTs

Low-frequency noise characteristics in ion-implanted GaN/AlGaN/GaN and AlGaN/GaN HEMTs were investigated. The normalized spectral noise density was about 6 dB lower in GaN/AlGaN/GaN HEMTs than in AlGaN/GaN HEMTs. The normalized spectral noise density dependence on the gate length Lg indicates that the main origin of low-frequency noise is at the region under the gate in both devices. The Hooge parameters alphaH for both devices are on the order of 10^-1-10^{- 2}. The ion implantation process introduces a lot of defects in the source/drain regions, but the values of alphaH are comparable with those for conventional GaN-based HEMT devices. The values of alphaH are also lower in GaN/AlGaN/GaN HEMTs than in AlGaN/GaN HEMTs, which is due to the decrease of surface potential fluctuations in GaN/AlGaN/GaN HEMTs.