Study of Cu diffusion behavior in low dielectric constant SiOC(-H) films deposited by plasma-enhanced chemical vapor deposition

Carbon doped silicon oxide (SiOCH) thin films deposited using plasma-enhanced chemical vapor deposition (PECVD) are commonly used in multilevel interconnect applications. To enhance the electrical performance, the deposited SiOC(-H) films were annealed in a vacuum at various temperatures ranging from 250 to 450 °C. A Cu electrode was then deposited using thermal evaporation. The drift rate of Cu⁺ ions in the SiOC(-H) films with the Cu/SiOC(-H)/p-Si(100)/Al metal-insulator-semiconductor (MIS) structures after annealing was evaluated by C-V measurements with a flatband shift caused by bias-temperature stress (BTS). The samples were stressed at different temperatures of 150 to 275 °C and electric fields up to 1.5 MV/cm to examine the penetration of Cu⁺ ions into the SiOC(-H) films. The Cu⁺ ion drift diffusion behavior was observed by high-resolution transmission electron microscopy and depth profile analysis of the Auger electron spectra. The drift diffusion experiments suggested that the Cu⁺ ion drift rate in the of SiOC(-H) films increased with increasing annealing temperature. A thermal stress and BTS were used to evaluate the impact of Cu penetration on the dielectric properties of the SiOC(-H) films.     

Effect of evaporated copper and aluminum on post-annealed SiOC(-H) films deposited using plasma-enhanced chemical vapor deposition

Low dielectric constant SiOC(-H) films were deposited on p-type Si(100) substrates by plasma-enhanced chemical vapor deposition (PECVD) using dimethyldimethoxysilane (DMDMOS, C₄H₁₂O₂Si) and oxygen gas as precursors. We studied the detailed electrical characterization of SiOC(-H)/p-Si(100) interfaces using different experimental parameters for using the multilevel interconnections in ultra large-scale integrated circuits (ULSI). To improve the SiOC(-H)/p-Si(100) interface, the wafer was cleaned using the RCA process and rinsed with deionized water. The deposited SiOC(-H) films were annealed at different temperatures ranging from 250 to 450 °C in a vacuum. The interface properties of the SiOC(-H)/p-Si(100) with Cu/SiOC(-H)/p-Si(100)/Al metal-insulator-semiconductor (MIS) structures were investigated by capacitance-voltage (C-V) measurement with a flat band shift by electric field stress. Trapped charge, fixed oxide charge, and the interface trap density of SiOC(-H) films were related to the dielectric breakdown and leakage current density at the SiOC(-H)/p-Si(100) interface. From these analyses, detailed electrical properties defining the interface states of the MIS structures were reported.     

Crystal structure and optical absorption investigations on β-In2S3 thin films

The crystal structure of annealed β-In₂S₃ thin films with different thickness was investigated by X-ray diffraction technique. Lattice parameters, crystallite size and microstrain were calculated. It was found that the lattice parameters are independent on film thickness, while annealing temperatures increase them. Crystallite sizes were increased with the increase of the film thickness and improved by annealing temperatures. In all cases, the microstrains were decreased gradually with the increase in both film thickness and annealing temperatures. Optical properties of β-In₂S₃ thin films were performed in the spectral range from 400 to 2500 nm to determine the optical constants (n and k), the high frequency dielectric constant, ε_∞, the lattice dielectric constant, ε_L, and the energy gap. The optical constants were found to be independent on film thickness in the range from 200 to 630 nm. The high frequency dielectric and lattice dielectric constants of the as-deposited film increased by annealing temperatures. The energy gap for the as-deposited In₂S₃ was found to be 2.60 eV and increased to 2.70 and 2.75 eV by annealing at 423 and 473 K for 1 h, respectively.     

Characterization of poly(vinylidene fluoride-trifluoroethylene) 50/50 copolymer films as a gate dielectric

Thin films of poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) 50/50 copolymer were prepared by spin coating on p-Si substrate. Thermal behavior of the film was observed by measuring the film thickness with ellipsometry as a function of the temperature and abrupt volume expansion was observed at 130–150 °C. Capacitance-voltage (C-V) and current-voltage (I-V) behavior of the aluminum/P(VDF-TrFE)/p-Si MIS (metal-insulator-semiconductor) structures were studied and dielectric constant of the P(VDF-TrFE) film was measured to be about 15.3 at optimum condition. No hysteresis was observed in the C-V curve for films as deposited and annealed (70–200 °C). Films annealed at temperatures higher than the volume expansion temperature showed substantial surface roughness due to the crystallization. Flat band voltage (V_FB) of the MIS structure with as deposited films was about −0.3 V and increased up to −2.0 V with annealing. This suggested that positive charges were generated in the film. Electronic properties of the annealed P(VDF-TrFE) film at above melting temperature were degraded substantially with larger shift in flat band voltage, low dielectric constant and low breakdown voltage. Organic thin film transistor with pentacene active layer and P(VDF-TrFE) as a gate dielectric layer showed a mobility of 0.31 cm²/V·s and threshold voltage of −0.45 V.     

The influence of annealing temperatures on the properties of Bi2VO5.5/LaNiO3/Si thin films

Bi₂VO_5.5 ferroelectric thin films were fabricated on LaNiO₃/Si(100) substrate via chemical solution deposition. Ferroelectric and dielectric properties of the thin films annealed at 500-700 °C were studied. The thin film annealed at 700 °C exhibited more favorable ferroelectric and dielectric properties than those annealed at lower temperatures. The values of remnant polarization 2P_r and coercive field E_c for the film annealed at 700 °C are 10.62 µC/cm² and 106.3 kV/cm, respectively. The leakage current of the film is about 1.92 × 10^− 8 A/cm² at 6 V. The possible mechanism of the dependence of electrical properties of the films on the annealing temperature was discussed.     

Structural and electrical characteristics of chemical solution derived (Bi3.2La0.4Nd0.4)Ti3O12 thin films

(Bi_3.2La_0.4Nd_0.4)Ti₃O₁₂ (BLNT) thin films were prepared on Pt/Ti/SiO₂/Si substrates by using chemical solution deposition technique, and the effects of annealing temperatures in the range of 550-750 °C on structure and electrical properties of the thin films were investigated. X-ray diffraction analysis shows that the thin films have a bismuth-layered perovskite structure with preferred (117) orientation. The surface morphology observation by field-emission scanning electron microscopy confirms that films are dense and smooth with uniformly distributed grains. The grain size of the thin films increases with increasing annealing temperature; meanwhile, the structural distortion of the thin films also increases. It was demonstrated that the thin films show good electrical properties. The dielectric constant and dielectric loss are 191 and 0.028, respectively, at 10 kHz for the thin film annealed at 600 °C, and the 2Pr value of the thin film annealed at 700 °C is 20.5 μC/cm² at an electric field of 500 kV/cm.     

The structures of low dielectric constant SiOC thin films prepared by direct and remote plasma enhanced chemical vapor deposition

Two structures of low dielectric constant (low-k) SiOC films were elucidated in this work. Low-k thin film by remote plasma mode was mainly composed of inorganic Si-O-Si backbone bonds and some oxygen atoms are partially substituted by CH₃, which lowers k value. The host matrix of low-k thin films deposited by direct plasma mode, however, was mainly composed of organic C-C bonds and “M” and “D” moieties of organosilicate building blocks, and thus the low dipole and ionic polarizabilities were the important factors on lowering k value.     

Enhancement of photosensitivity by annealing in Bi2S3 thin films grown using SILAR method

Bi₂S₃ thin films were grown by successive ionic layer adsorption and reaction method (SILAR) onto the glass substrates at room temperature. The as prepared thin film were annealed at 250 °C in air for 30 min. These films were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM) and electrical measurement systems. The X-ray diffraction patterns reveal that Bi₂S₃ thin film have orthorhombic crystal structure. SEM images showed uniform deposition of the material over the entire glass substrate. The optical energy band gap observed to be decreased from 1.69 to 1.62 eV for as deposited and annealed films respectively. The I–V measurement under dark and illumination condition (100 W) show annealed Bi₂S₃ thin film gives good photoresponse as compared to as deposited thin film and Bi₂S₃ thin film exhibits photoconductivity phenomena suggesting its useful in sensors device. The thermo-emf measurements of Bi₂S₃ thin films revealed n-type electrical conductivity.     

Deposition and dielectric properties of CaCu3Ti4O12 thin films deposited on Pt/Ti/SiO2/Si substrates using radio frequency magnetron sputtering

Polycrystalline CaCu₃Ti₄O₁₂ thin films were deposited on Pt(111)/Ti/SiO₂/Si substrates using radio frequency magnetron sputtering. The phase formation and the physical quality of the films were crucially dependent on the substrate temperature and oxygen partial pressure. Good quality films were obtained at a substrate temperature of 650 °C and 4.86 Pa total pressure with 1% O₂. The dielectric constant (∼ 5000 at 1 kHz and 400 K) of these films was comparable to those obtained by the other techniques, eventhough, it was much lower than that of the parent polycrystalline ceramics. For a given temperature of measurements, dielectric relaxation frequency in thin film was found to be much lower than that observed in the bulk. Also, activation energy associated with the dielectric relaxation for the thin film (0.5 eV) was found to be much higher than that observed in the bulk ceramic (0.1 eV). Maxwell-Wagner relaxation model was used to explain the dielectric phenomena observed in CaCu₃Ti₄O₁₂ thin films and bulk ceramics.     

Improved dielectric properties of chemical solution derived Pb0.5Sr0.5TiO3 thin films by a layer-by-layer annealing method

Pb_0.5Sr_0.5TiO₃ thin films were prepared on Pt/TiO₂/SiO₂/Si and LaNiO₃ (LNO)/Si substrates by using chemical solution deposition technique, and a layer-by-layer annealing method was used in an attempt to improve the dielectric properties of the thin films. The structure, dielectric, and ferroelectric properties of the thin films were investigated. Improved dielectric properties of the thin films were clearly confirmed: the dielectric constant and dielectric loss for the films on Pt/TiO₂/SiO₂/Si substrates annealed at 650 °C were 1064 and 0.027, respectively, at 1 kHz, with a dielectric tunability of more than 50%; similarly, the films prepared on LNO/Si substrates, showed a high dielectric constant of 1280 and a low dielectric loss of 0.023, at 1 kHz. P-E hysteresis loop measurements indicated that the remanent polarization and coercive field for the films on Pt/TiO₂/SiO₂/Si substrates annealed at 650 °C were 15.7 μC/cm² and 51 kV/cm, respectively.     

Study of reactive sputtering titanium oxide for metal-oxide-semiconductor capacitors

Metal oxide semiconductor (MOS) capacitors with titanium oxide (TiO_x) dielectric layer, deposited with different oxygen partial pressure (30, 35 and 40%) and annealed at 550, 750 and 1000 °C, were fabricated and characterized.Capacitance-voltage and current-voltage measurements were utilized to obtain, the effective dielectric constant, effective oxide thickness, leakage current density and interface quality. The obtained TiO_x films present a dielectric constant varying from 40 to 170 and a leakage current density, for a gate voltage of − 1 V, as low as 1 nA/cm² for some of the structures, acceptable for MOS fabrication, indicating that this material is a viable high dielectric constant substitute for current ultra thin dielectric layers.     

Low-temperature crystallization of sol-gel-derived lead zirconate titanate thin films using 2.45 GHz microwaves

Lead zirconate titanate (PZT) thin films of thickness 420 nm were deposited on Pt/Ti/SiO₂/Si substrate using a spin coating sol-gel precursor solution, and then annealed using 2.45 GHz microwaves at a temperature of 450 °C for 30 min. The film has a high perovskite content and high crystallinity with a full width at half maximum of 0.35°. The surface roughness of the PZT thin film was 1.63 nm. Well-saturated ferroelectric properties were obtained with a remanent polarization of 46.86 μC/cm² and coercive field of 86.25 kV/cm. The film also exhibited excellent dielectric properties with a dielectric constant of 1140 and a dissipation factor of 0.03. These properties are superior to those obtained by conventional annealing at a temperature of 700 °C for 30 min.     

Large area Ba1 − xSrxTiO3 thin films for microwave applications deposited by pulsed laser ablation

Large area Ba_1 − xSr_xTiO₃ (BST) thin films with x = 0.4 or x = 0.5 were deposited on 75 mm diameter Si wafers in a pulsed laser deposition (PLD) chamber enabling full-wafer device fabrication using standard lithography. The deposition conditions were re-optimized for large PLD chambers to obtain uniform film thickness, grain size, crystal structure, orientation, and dielectric properties of BST films. X-ray diffraction and microstructural analyses on the BST films grown on Pt/Au/Ti electrodes deposited on SiO₂/Si wafers revealed films with (110) preferred orientation with a grain size < 100 nm. An area map of the thickness and crystal orientation of a BST film deposited on SiO₂/Si wafer also showed (110) preferred orientation with a film thickness variation < 6%. Large area BST films were found to have a high dielectric tunability of 76% at an electric field of 400 kV/cm and dielectric loss tangent below 0.03 at microwave frequencies up to 20 GHz and a commutation quality factor of ~ 4200.     

Effects of post-deposition annealing temperature and ambient on RF magnetron sputtered Sm<Subscript>2</Subscript>O<Subscript>3</Subscript> gate on n-type silicon substrate

Samarium oxide (Sm₂O₃) thin films with thicknesses in the range of 15–30 nm are deposited on n-type silicon (100) substrate via radio frequency magnetron sputtering. Effects of post-deposition annealing ambient [argon and forming gas (FG) (90% N₂ + 10% H₂)] and temperatures (500, 600, 700, and 800 °C) on the structural and electrical properties of deposited films are investigated and reported. X-ray diffraction revealed that all of the annealed samples possessed polycrystalline structure with C-type cubic phase. Atomic force microscope results indicated root-mean-square surface roughness of the oxide film being annealed in argon ambient are lower than that of FG annealed samples, but they are comparable at the annealing temperature of 700 °C (Argon—0.378 nm, FG—0.395 nm). High frequency capacitance–voltage measurements are carried out to determine effective oxide charge, dielectric constant and semiconductor-oxide interface trap density of the annealed oxide films. Sm₂O₃ thin films annealed in FG have smaller amount of effective oxide charge and semiconductor-oxide interface trap density than those oxide films annealed in argon. Current–voltage measurements are conducted to obtain barrier heights of the annealed oxide films during Fowler–Nordheim tunneling.     

Bottom electrodes dependence of microstructures and dielectric properties of compositionally graded (Ba1−xSrx)TiO3 thin films

Compositionally graded (Ba_1−xSr_x)TiO₃ (BST) thin films, with x decreasing from 0.3 to 0, were deposited on Pt/Ti/SiO₂/Si and Ru/SiO₂/Si substrates by radio frequency magnetron sputtering technology. The microstructure and dielectric properties of the graded BST thin films were investigated. It was found that the films on Ru electrode have better crystallization, and that RuO₂ is present between the Ru bottom electrode and the graded BST thin films by X-ray diffraction and SEM analysis. Dielectric measurement reveals that the graded BST thin films deposited on Ru bottom electrode have higher dielectric constant and tunability. The enhanced dielectric behavior is attributed to better crystallization as well as smaller space charge capacitance width and the formation of RuO₂ that is more compatible with the BST films. The graded BST films on Ru electrode show higher leakage current due to lower barrier height and rougher surface of bottom electrode.     

Growth of Bi1.5MgNb1.5O7 thin films on Pt/Ti/SiO2/Si substrates by RF magnetron sputtering

In this letter, bismuth magnesium niobate (Bi_1.5MgNb_1.5O₇, BMN) thin films were deposited on Pt/Ti/SiO₂/Si substrates by using radio-frequency magnetron sputtering at various substrate temperatures. Based on the phase compositions and microstructures of these samples, we discussed the nucleation and growth of the BMN thin films and how the substrate temperature influenced these processes. The thin film begins to crystallize at 450 °C, and the annealed films were all composed of the cubic pyrochlore phase with a strong (222)-preferred orientation. The film deposited at 450 °C exhibited a large dielectric constant of 173, and a tunability of 26.6 % was obtained at a max dc bias field of 0.8 MV/cm.     

Enhancement on effective piezoelectric coefficient of Bi3.25Eu0.75Ti3O12 ferroelectric thin films under moderate annealing temperature

Bi_3.25Eu_0.75Ti₃O₁₂ (BET) thin films were deposited on Pt/Ti/SiO₂/Si(111) substrates by a metal-organic decomposition method. The effects of annealing temperatures 600-800 °C on microstructure, ferroelectric, dielectric and piezoelectric properties of BET thin films were studied in detail. The spontaneous polarization (87.4 × 10^− 6 C/cm² under 300 kV/cm), remnant polarization (65.7 × 10^− 6 C/cm² under 300 kV/cm), the dielectric constant (992.9 at 100 kHz) and the effective piezoelectric coefficient d₃₃ (67.3 pm/V under 260 kV/cm) of BET thin film annealed at 700 °C are better than those of the others. The mechanisms concerning the dependence of the enhancement d₃₃ are discussed according to the phenomenological equation, and the improved piezoelectric performance could make the BET thin film a promising candidate for piezoelectric thin film devices.     

Optical and dielectric properties of CuAl2O4 films synthesized by solid-phase epitaxy

The synthesis and properties of CuAl₂O₄ thin films have been examined. The CuAl₂O₄ films were deposited via reactive direct current magnetron sputter using a CuAl₂ target. As-deposited films were amorphous. Post-deposition annealing at high temperature in oxygen yielded solid-phase epitaxy on MgO. The film orientation was cube-on-cube epitaxy on (001) MgO single-crystal substrates. The films were transparent to visible light. The band gap of crystalline CuAl₂O₄ was determined to be ∼ 4 eV using a Tauc plot from the optical transmission spectrum. The dielectric constant of the amorphous films was determined to be ∼ 20-23 at 1-100 kHz.     

Preparation and characterization of highly (1 1 1)-oriented (Pb,La)(Zr,Ti)O3 thin films by sol-gel processing

Lanthanum modified lead zirconate titanate (Pb_0.91La_0.09)(Zr_0.65Ti_0.35)O₃ (PLZT) ferroelectric thin films were grown on Pt/Ti/SiO₂/Si(1 0 0) and fused quartz substrates using a sol-gel method with rapid thermal annealing processing. The results showed that the highly (1 1 1)-oriented pervoskite PLZT thin film growth on Pt/Ti/SiO₂/Si(1 0 0) substrates. The electrical measurements were conducted on PLZT films in metal-ferroelectric-metal capacitor configuration. The PLZT thin films annealed at 600 °C showed well-saturated hysteresis loops with remanent polarization and coercive electric field values were 10.3 μC/cm² and 36 kV/cm, respectively, at an applied field of 300 kV/cm. At 100 kHz, the dielectric constant and dielectric loss of the film are 682 and 0.021, respectively. The PLZT thin film on fused quartz substrate, annealed at 600 °C, exhibited good optical transmittance, the band gap of optical direct transitions is 3.89 eV.     

Dielectric and tunable properties of Pb0.25BaxSr0.75−xTiO3 thin films fabricated by a modified sol-gel method

A modified sol-gel method was used to fabricate (Pb_0.25Ba_x Sr_0.75−x)TiO₃ (PBST) thin films with x = 0.05,0.1,0.15 and 0.2 on Pt/TiO₂/SiO₂/Si substrate. The structure, surface morphology, dielectric and tunable properties of PBST thin films were investigated as a function of barium content (x). X-ray diffraction and scanning electron microscopy analysis showed that we could get pure PBST perovskite phase and relative fine density thin films with smooth surface. It was found that the crystal lattice constant, grain size, room temperature dielectric constant, dielectric loss and tunability of Ba solutionizing PST thin films increased with the increase in Ba content. For (Pb_0.25Ba_0.2Sr_0.55)TiO₃ thin film, it had the highest dielectric constant of 1390 and the largest tunability of 80.6%. The figure of merit parameter reached a maximal value of 28.9 corresponding to the (Pb_0.25Ba_0.05 Sr_0.7)TiO₃ thin film, whose dielectric constant, dielectric loss and tunability measured at 1 MHz were 627, 0.024 and 69.4%, respectively.