氮化Si基ZnO/Ga_2O_3制备GaN薄膜

利用射频磁控溅射法在Si衬底上先溅射ZnO缓冲层,接着溅射Ga2O3薄膜,然后ZnO/Ga2O3膜在管式炉中常压下通氨气进行氮化,反应自组生成GaN薄膜。XRD测量结果表明,利用该方法制备的GaN薄膜是沿c轴方向择优生长的六角纤锌矿多晶结构的薄膜,利用SEM观测了其表面形貌,PL测量结果发现了位于351nm处的室温光致发光峰。     

Growth temperature dependence of epitaxial Gd2O3 films on Si(1 1 1)

This article reports on the epitaxy of crystalline high κ oxide Gd₂O₃ layers on Si(1 1 1) for CMOS gate application. Epitaxial Gd₂O₃ thin films have been grown by Molecular Beam Epitaxy (MBE) on Si(1 1 1) substrates between 650 and 750 °C. The structural and electrical properties were investigated depending on the growth temperature. The C–V measurements reveal that equivalent oxide thickness (EOT) equals 0.7 nm for the sample deposited at the optimal temperature of 700 °C with a relatively low leakage current of 3.6 × 10^?2 A/cm² at |V_g ? V_FB| = 1 V.     

MOCVD growth of cubic GaN on 3C-SiC deposited on Si (100) substrates

The growth of cubic GaN on 3C-SiC/Si(100) by metal-organic chemical vapor deposition (MOCVD) under various growth temperatures, thicknesses of 3C-SiC, and V/III ratios was studied. The fractions of cubic and hexagonal phases in the films were estimated from the integrated x-ray diffraction intensities of the cubic (002) and hexagonal (1011) planes. A smooth SiC layer, a high growth temperature, and a moderate V/III ratio are three key factors for the nucleation of the cubic phase and its subsequent growth. Hexagonal GaN with its c-axis perpendicular to the substrate preferentially grows at the low temperature of 750°C. The inclusion of the cubic phase increases with increasing growth temperature. The optimum growth conditions for dominant cubic GaN formation were a growth temperature of 950°C, a 1.5 μm thick SiC layer, and a V/III ratio of 1500. With these growth conditions, a cubic GaN layer with the cubic component of 91% was obtained.     

氨化Si基Ga2O3/Ta薄膜制备GaN纳米线

利用磁控溅射技术在Si衬底上制备Ga2O3/Ta薄膜,然后在900℃、氨气中退火合成了大量的一维单晶氮化镓纳米线.用X射线衍射、扫描电子显微镜、傅里叶红外吸收光谱、透射电子显微镜、选区电子衍射和光致发光谱对制备的氮化镓进行了表征.结果表明,制备的GaN纳米线是六方纤锌矿结构,其直径大约为50 nm,最大长度可达8 μm左右.室温下光致发光谱的测试发现了364 nm处有较强紫外发光峰.     

氨化Si基Ga2O3/Co薄膜合成GaN纳米线及其表征

采用磁控溅射技术先在Si衬底上制备Ga2O3/Co薄膜,然后在950"C下流动的氨气中进行氨化反应制备GaN纳米棒.应用X射线衍射、扫描电镜、傅里叶红外吸收光谱、选区电子衍射和高分辨透射电子显微镜对样品进行表征.结果表明,采用此方法得到了六方纤锌矿结构的GaN单晶纳米棒.观察发现纳米棒表面光滑.并讨论了GaN纳米棒的生长机制.     

氨化Si基Ga2O3/Co薄膜合成GaN纳米线及其表征

采用磁控溅射技术先在Si衬底上制备Ga2O3/Co薄膜,然后在950"C下流动的氨气中进行氨化反应制备GaN纳米棒.应用X射线衍射、扫描电镜、傅里叶红外吸收光谱、选区电子衍射和高分辨透射电子显微镜对样品进行表征.结果表明,采用此方法得到了六方纤锌矿结构的GaN单晶纳米棒.观察发现纳米棒表面光滑.并讨论了GaN纳米棒的生长机制.     

Si基氨化ZnO／Ga2O3薄膜制备GaN纳米线

利用射频磁控溅射法在Si(111)衬底上溅射ZnO中间层和Ga2O3薄膜，然后在管式炉中常压下通氨气对ZnO/Ga2O3薄膜进行氨化，高温下ZnO层在氨气气氛中挥发，而Ga2O3薄膜和氨气反应合成出GaN纳米线．X射线衍射测量结果表明利用该方法制备的GaN纳米线具有沿c轴方向择优生长的六角纤锌矿结构．利用扫描电子显微镜、透射电子显微镜、傅里叶红外透射谱、能量弥散谱及选区电子衍射观测并分析了样品的形貌、成分和晶格结构．研究发现ZnO层的挥发有利于Ga2O3和NH3反应合成GaN纳米线．     

Si基氨化ZnO/Ga2O3薄膜制备GaN纳米线

利用射频磁控溅射法在Si(111)衬底上溅射ZnO中间层和Ga2O3薄膜,然后在管式炉中常压下通氨气对ZnO/Ga2O3薄膜进行氨化,高温下ZnO层在氨气气氛中挥发,而Ga2O3薄膜和氨气反应合成出GaN纳米线.X射线衍射测量结果表明利用该方法制备的GaN纳米线具有沿c轴方向择优生长的六角纤锌矿结构.利用扫描电子显微镜、透射电子显微镜、傅里叶红外透射谱、能量弥散谱及选区电子衍射观测并分析了样品的形貌、成分和晶格结构.研究发现ZnO层的挥发有利于Ga2O3和NH3反应合成GaN纳米线.     

Selective dry etching of (Sc2O3)x(Ga2O3)1−x gate dielectrics and surface passivation films on GaN

(Sc₂O₃)_x(Ga₂O₃)_1?x films grown by molecular beam epitaxy show promise for use as surface passivation layers and gate dielectrics on GaN-based high electron mobility transistors. Completely selective, low-damage, dry etching of (Sc₂O₃)_x(Ga₂O₃)_1?x films with respect to GaN can be achieved with low-power inductively coupled plasmas of CH₄/H₂/Ar with etch rates in the range 200–300 Å/min. The incident ion energies are of order 100 eV, and no roughening of the underlying GaN was observed under these conditions. Similar etch rates were obtained with Cl₂/Ar discharges under the same conditions, but GaN showed rates almost an order of magnitude higher.     

Synthesis of the PZT films deposited on pt-coated (100) Si substrates for nonvolatile memory applications

Ferroelectric lead-zirconate-titanate (PZT) thin films were deposited by the pulsed laser deposition technique on Pt-coated (100) Si substrates. This study was focused on the investigation of the PZT film growth on (100) Si substrate at varying deposition parameters and electrical characterization of the films including hysteresis loop and fatigue properties by RT66A Standardized Ferroelectric Test System. PZT deposited at higher temperature (575°C in 450 mTorr O₂ partial pressure) showed the best crystalline structure. The remnant polarization and the retained polarization of the ferroelectric capacitors were 13 μC/cm² and 20 μC/cm², respectively. The crystallographic properties of the films were determined using the x-ray diffractometer method. The cross-sectional transmission electron microscope results showed very smooth interfaces among different layers of films.     

α-Al2O3上生长GaN过程中氮化的研究

在自行设计研制的电子回旋共振等离子体增强金属有机物化学气相沉积(ECR?蛳EMOCVD)装置上生长氮化镓(GaN)薄膜，以氮等离子体为氮源，三乙基镓（TEG）为镓源，蓝宝石（α?蛳Al2O3）为衬底。通过反射高能电子衍射、原子力显微镜、射线衍射实验数据分析，研究了ECR等离子体所产生的活性氢源和氮源对蓝宝石（α?蛳Al2O3）衬底的氮化作用, 结果表明：在ECR等离子体中，不掺入氢气，温度较低时可以明显提高α?蛳Al2O3衬底的氮化效果，获得平整的氮化层，且生长的氮化镓缓冲层质量是最好的。     

基于氧化镓纳米线阵列的气体探测器研究

氧化镓材料的电导在高温(400℃以上)下随环境气氛显著变化的电学性质可用于汽车尾气成分的检测。相比于薄膜材料,氧化镓纳米线阵列具有更大的比表面,增加了与待测气体接触面积,有可能大幅提高探测器的灵敏度。本文直接利用生长在衬底上的图形化氧化镓纳米线阵列制成气体探测元件,初步分析了纳米线未掺杂和掺杂条件下其对还原性气体的浓度变化的响应,探讨了反应过程的机理,为后续研究打下了基础。     

Formation of GaN Nanowires by Ammoniating Ga2O3 Films Deposited on Oxidized Al Layers on Si Substrate

Large quantities of gallium nitride（GaN） nanowires have been prepared via ammoniating the Ga2O3 films deposited on the oxidized aluminum layer at 950℃ in a quartz tube. The nanowires have been confirmed as crystalline wurtzite GaN by X-ray diffraction, X-ray photoelectron spectrometry scanning electron microscope and selected-area electron diffraction. Transmission electron microscope （TEM） and scanning electron microscopy（SEM） reveal that the nanowires are amorphous and irregular, with diameters ranging from 30 nm to 80 nm and lengths up to tens of microns. Selected-area electron diffraction indicates that the nanowire with the hexagonal wurtzite structure is the single crystalline. The growth mechanism is discussed briefly.     

Low-leakage MIS structures with 1.5-6 nm CaF2 insulating layer on Si(1 1 1)

Thin high-quality calcium fluorite films are grown on (1 1 1) silicon in the low- and middle- temperature molecular-beam epitaxy processes followed by annealing. Metal-insulator-semiconductor structures with such films exhibit much smaller leakage currents than the casual structures with silicon dioxide. They demonstrate also satisfactory wear-out characteristics. Low leakage is achieved not due to high permittivity, but due to restricted tunnel transparency of the fluorite owing to a large effective mass of carriers. Therefore, CaF₂ is a promising candidate for gate material in advanced field-effect transistors.     

Low threading dislocation density Ge deposited on Si (1 0 0) using RPCVD

Epitaxial Ge layer growth of low threading dislocation density (TDD) and low surface roughness on Si (1 0 0) surface is investigated using a single wafer reduced pressure chemical vapor deposition (RPCVD) system. Thin seed Ge layer is deposited at 300 °C at first to form two-dimensional Ge surface followed by thick Ge growth at 550 °C. Root mean square of roughness (RMS) of ∼0.45 nm is achieved. As-deposited Ge layers show high TDD of e.g. ∼4 × 10⁸ cm⁻² for a 4.7 μm thick Ge layer thickness. The TDD is decreasing with increasing Ge thickness. By applying a postannealing process at 800 °C, the TDD is decreased by one order of magnitude. By introducing several cycle of annealing during the Ge growth interrupting the Ge deposition, TDD as low as ∼7 × 10⁵ cm⁻² is achieved for 4.7 μm Ge thick layer. Surface roughness of the Ge sample with the cyclic annealing process is in the same level as without annealing process (RMS of ∼0.44 nm). The Ge layers are tensile strained as a result of a higher thermal expansion coefficient of Ge compared to Si in the cooling process down to room temperature. Enhanced Si diffusion was observed for annealed Ge samples. Direct band-to-band luminescence of the Ge layer grown on Si is demonstrated.     

(Ga,Mn)As on patterned GaAs(0 0 1) substrates: Growth and magnetotransport

A new type of (Ga,Mn)As microstructures with laterally confined electronic and magnetic properties has been realized by growing (Ga,Mn)As films on -oriented ridge structures with (1 1 3)A sidewalls and (0 0 1) top layers prepared on GaAs(0 0 1) substrates. The temperature- and field-dependent magnetotransport data of the overgrown structures are compared with those obtained from planar reference samples revealing the coexistence of electronic and magnetic properties specific for (0 0 1) and (1 1 3)A (Ga,Mn)As on a single sample.     

Ga2O3 films formed by electrochemical oxidation

The effect of oxygen plasma on gallium oxide films formed by electrochemical oxidation of n-GaAs wafers with a donor concentration N _d = (1–2) × 10¹⁶ cm⁻³ has been investigated. It is shown that the treatment in an oxygen plasma at a temperature of 50–90°C increases the concentration of β-phase crystallites, which causes an increase in the permittivity, a decrease in the dielectric dissipation factor, and a change in the conductivity of GaAs-〈gallium oxide〉-metal structures.     

Interfacial properties of self-assembled GaN nanowires on pre-processed Al2O3(0001) surfaces

Surface treatment of the foreign substrate is a critical factor influencing heteroepitaxial catalyst-free growth of nanowires, their crystal quality, their diameter and their areal density. To this end, catalyst-free growth of GaN nanowires on Al₂O₃(0001) by plasma-assisted molecular beam epitaxy was achieved using the following substrate surface treatments: (a) deposition of a Si_xN_y layer on nitridated Al₂O₃ surface, and (b) deposition of Si on bare Al₂O₃ surface. The nanostructure of GaN nanowires and GaN/Al₂O₃ interfaces was explored by quantitative high-resolution transmission electron microscopy and related analytical methods. Spontaneous growth of GaN nanowires was realized on the amorphous Si_xN_y layer, while a discontinuous crystalline zone in contact with Al₂O₃ was identified as partially strained AlN. Subsequently, GaN nanowires were directly grown on top of Al₂O₃ among stress-free Si islands. The orientation relation of these islands with the substrate was the [112]($\overline{1}\overline{1}1$)Si//[$1\overline{1}00$](0001)Al₂O₃, providing the minimum lattice misfit between the two structures. Increasing the Si deposition time a higher density of Si islands was realized, leading to non-coalesced nanowires of lower density and better structural quality. Hence, the presence of Si islands induced a mask-like effect on the nucleation of GaN nanowires that can be exploited for a controlled catalyst-free growth of nanowires.     

Low loss Nb2O5 films deposited by novel remote plasma sputtering

We report the deposition of Nb2O5 films on unheated BK-7 glass substrates using remote plasma sputtering system. The remote plasma geometry allows pseudo separation of plasma and target bias parameters, which offers complete deposition rate control. Using appropriate oxygen flow rates, high-density and low-loss Nb2O5 films are deposited with rates up to 0.49 nm/s. Lower deposition rates (~0.026 nm/s) can also be obtained by working at low target current and voltage and at low pressure. Nb2O5 films deposited at different rates have the refractive index of about 2.3 and the extinction coefficient as low as 6.9×10-5.     

ZnO films deposited on GaAs substrates with a SiO2 thin buffer layer

Sputter deposition of ZnO films on GaAs substrates has been investigated. ZnO films were radio frequency (rf)-magnetron sputter deposited on GaAs substrates with or without SiO₂ thin buffer layers. Deposition parameters such as rf power, substrate-target distance, and gas composition/pressure were optimized to obtain highly c-axis oriented and highly resistive films. Deposited films were characterized by x-ray diffraction, scanning electron microscopy (SEM), capacitance, and resistivity measurements. Thermal stability of sputter-deposited ZnO films (0.5–2.0 μm thick) was tested with a post-deposition heat treatment at 430°C for 10 min, which is similar to a standard ohmic contact alloying condition for GaAs. The ZnO/SiO₂/GaAs films tolerated the heat treatment well while the ZnO/GaAs films disintegrated. The resistivity (10¹¹ Ω-cm) of the ZnO films on SiO₂-buffered GaAs substrates remained high during the heat treatment. The post-deposition anneal treatment also enhances c-axis orientation of the ZnO films dramatically and relieves intrinsic stress almost completely. These improvements are attributed to a reduction of grain boundaries and voids with the anneal treatment as supported by SEM and x-ray diffraction measurement results.