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《Acta Materialia》2007,55(10):3337-3346
Grain boundary (GB) diffusion of 63Ni in polycrystalline Cu was investigated by the radiotracer technique in an extended temperature interval from 476 to 1156 K. The independent measurements in Harrison’s C and B kinetic regimes resulted in direct data of the GB diffusivity Dgb and of the so-called triple product P = s · δ · Dgb (s and δ are the segregation factor and the diffusional GB width, respectively). Arrhenius-type temperature dependencies for both the Dgb and P values were measured, resulting in the pre-exponential factors Dgb0=6.93×10-7 m2 s−1 and P0 = 1.89 × 10−16 m3 s−1 and the activation enthalpies of 90.4 and 73.8 kJ mol−1, respectively. Although Ni is completely soluble in Cu, it reveals a distinct but still moderate ability to segregate copper GBs with a segregation enthalpy of about −17 kJ mol−1.  相似文献   

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A dislocation-based boundary element model was used to simulate intergranular stress corrosion crack propagation in virtual microstructures. A Monte Carlo approach was used in which the propagation of approximately 100 cracks was calculated for different Voronoi generated microstructures. At every simulation step the model gave the position of the crack tip together with stress intensity factors KI and KII. Using a simple power-law-type crack growth rate da/dt=DpKmp, the depth of each particular crack can be calculated knowing the time the samples were exposed to the stress and corrosive environment. Existing experimental data giving crack depth distributions for Alloy 600, and XM-19 and 304 stainless steel are investigated and the best-fit crack growth law established. Alloy 600 in a light water reactor environment and XM-19 in high-temperature water both lead to mp = 3. While for 304 stainless steel in the more aggressive K2S4O6/H2SO4 (pH 2) an exponent mp = 0.8 was found.  相似文献   

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Reactive-sputtered epitaxial Ti1?xCrxN films are ferromagnetic in the range of 0.17 ? x ? 0.51 due to the Cr–N–Cr double-exchange interaction below the Curie temperature (TC). The TC first increases, then decreases as x increases, and a maximum of 120 K appears at x = 0.47. All of the films are metallic with a transition near TC. A resistivity minimum ρmin is observed below 60 K in the films with 0.10 ? x ? 0.51 due to the effects of the weak localization and electron–electron interaction. The negative magnetoresistance (MR) is caused by the double-exchange interaction below TC and the weak localization can also contribute to MR below Tmin where ρmin appears. The x-dependent electron carrier densities reveal that the ferromagnetism is not from the carrier-mediated mechanism. The anomalous Hall resistivity follows the relation of ρxyAρxx2, which is from the side-jump mechanism.  相似文献   

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H. Conrad  D. Yang 《Acta Materialia》2007,55(20):6789-6797
Two test types were employed to determine the effect of DC electric field E = 5–8.3 V cm−1 applied in the loading direction on the tensile flow stress of 3Y-TZP (do = 0.44 μm) at 1450–1600 °C. In type a, the field was applied continuously throughout the tensile test; in type b, the field was alternately applied and removed during the course of the tensile test. The field reduced the flow stress in both test types, but with an appreciably larger effect in the type a tests. The field, however, had no discernable effect on the stress exponent n=logε˙/logσ determined by strain rate change tests. The reduction in flow stress in the type b tests reversed upon removal of the field. It was interpreted to result from both Joule heating and a decrease in the energy to form the rate-controlling Zr4+ vacancies in the space charge zone adjacent to the grain boundaries. The calculated width of the space charge zone λ (=1.5–7.8 nm) and the ratio of the applied electric potential to the reduction in stress Δϕaσ (=18–19 μV/MPa) were in accord with predictions. The larger reduction in the flow stress in the type a tests is attributed to a greater retardation of grain growth by the field.  相似文献   

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