Modelling finite-size PCBs for radiated EMI analysis

Typical printed circuit boards (PCBs) in the EMI regulated frequency range 30-1000 MHz are electrically finite-sized. The conventional full-wave method is not suitable for modelling finite-sized PCBs because of the assumption of infinite ground and substrate. The authors present a full-wave moment method approach for computing radiated electromagnetic interference produced by realistic finite-size PCBs. Numerical agreement with another approach is demonstrated     

PCB中基于DS-EBG结构的宽频带电源噪声抑制

电磁能带隙（EBG）结构能有效解决高频电源完整性问题,但不利于PCB的微型化设计。文章将三维立体封装中使用的双层EBG（DS-EBG）结构应用到PCB电源完整性设计中。通过理论分析证明了它的宽频带电源噪声抑制性能,并利用Ansoft公司SIwave软件进行仿真,成功对理论分析进行了验证。     

一种基于互补环缝谐振器抑制SSN的新方法

针对高速PCB上抑制同步开关噪声(SSN)的问题,提出了一种将互补环缝谐振器(CSRR)刻蚀在电源平面上,抑制电源/地平面间的电场波动噪声传播的方法。采用基于有限元算法的HFSS软件对该结构进行仿真分析,结果表明:与理想参考平面和电磁带隙结构相比,刻蚀了该CSRR结构的电源分配网络具有较好的宽带全向SSN噪声抑制能力,在抑制深度为-40 dB时,其阻带覆盖从0.26 GHz到超过20 GHz以上的频率范围。     

Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

The high speed and low power trend has imposed more and more importance on the design of the power distribution network (PDN) using multilayer printed circuit boards (PCBs) for modern microelectronic packages. This paper presents a fast and efficient analysis methodology in frequency domain for the design of a PDN with a power/ground plane pair, which considers the effect of irregular shape of the power/ground plane and densely populated via-holes. The presented method uses parallel-plate transmission line theory with equivalent circuit model of unit-cell grid considering three-dimensional geometric boundary conditions. Characteristics of PDNs implemented by perforated planes including a densely populated via-hole structure is quantitatively determined based on full-wave analysis using the finite-difference time-domain (FDTD) periodic structure modeling method and full-wave electromagnetic field solver. Using a circuit simulator such as popularly used SPICE and equivalent circuit models for via-hole structure and perforations, the authors have analyzed input-impedance of the power/ground plane pair. Since the presented method gives an accurate and fast solution, it is very useful for an early design of multilayer PCBs.     

Hybrid S-Parameters for Transmission Line Networks With Linear/Nonlinear Load Terminations Subject to Arbitrary Excitations

We propose a generalized S-parameter analysis for transmission lines (TLs) with linear/nonlinear load terminations subject to arbitrary plane-wave and port excitations. S-parameters are prevalently used to model TLs such as cable bundles and interconnects on printed circuit boards (PCBs) subject to port excitations. The conventional S-parameter approach is well suited to characterize interactions among ports. However, nontraditional port excitations associated with plane-wave coupling to physical ports at TL terminals lead to forced, as well as propagating, modal waves, necessitating a modification of the standard S-parameter characterization. In this paper, we consider external plane-wave excitations, as well as port (internal) sources, and propose a hybrid S-parameter matrix for characterization of the associated microwave network and systems. A key aspect of the approach is to treat the forced waves at the ports as constant voltage sources and induced propagating modal waves as additional entries (hybrid S-parameters) in the S-parameter matrix. The resulting hybrid S-matrix and voltage sources can be subsequently exported to any circuit solver such as HSPICE and Agilent's Advanced Design System for the analysis of combined linear and nonlinear circuit terminations at ports. The proposed method is particularly suited for susceptibility analysis of cable bundles and PCBs for electromagnetic interference evaluations. It also exploits numerical techniques for structural and circuit domain characterization and allows for circuit design optimization without a need to perform any further computational electromagnetic analysis     

Radiated susceptibility on the printed-circuit-board level: simulation and measurement

The electromagnetic field coupling into the traces on a printed circuit board (PCB) is investigated. Based on a simplified equivalent-wire model, a practical simulation method is presented, which enables an efficient treatment by the method of moment, with minimum computational and modeling effort. Validation by analytic and measurement results shows an acceptable accuracy within the limits of quasi-TEM propagation. The gigahertz transverse electromagnetic cell is found to be a suitable means for measuring the field coupling into PCBs. To reduce additional common-mode coupling, special care has to be taken for the length of the measurement cable connected to the PCB within the cell.     

Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures

As digital circuits become faster and more powerful, direct radiation from the power bus of their printed circuit boards (PCB) becomes a major concern for electromagnetic compatibility engineers. In such multilayer PCBs, the power and ground planes act as radiating microstrip patch antennas, where radiation is caused by fringing electric fields at board edges. In this paper, we introduce an effective method for suppressing PCB radiation from their power bus over an ultrawide range of frequencies by using metallo-dielectric electromagnetic band-gap structures. More specifically, this study focuses on the suppression of radiation from parallel-plate bus structures in high-speed PCBs caused by switching noise, such as simultaneous switching noise, also known as Delta-I noise or ground bounce. This noise consists of unwanted voltage fluctuations on the power bus of a PCB due to resonance of the parallel-plate waveguiding system created by the power bus planes. The techniques introduced here are not limited to the suppression of switching noise and can be extended to any wave propagation between the plates of the power bus. Laboratory PCB prototypes were fabricated and tested revealing appreciable suppression of radiated noise over specific frequency bands of interest, thus, testifying to the effectiveness of this concept.     

Parasitic modes on printed circuit boards and their effects on EMCand signal integrity

In this paper, parasitic modes, such as slotline, parallel plane, and surface wave (SW) modes, commonly found on printed circuit boards (PCBs) are analyzed and their effects on electromagnetic compatibility (EMC) and signal integrity are discussed. The analysis is based on numerical simulations using the finite difference time domain (FDTD) method which is shown to be very well suited for rigorous modeling of parasitic mode effects. The EMC and signal integrity problems discussed include power loss, crosstalk, ground bounce, and free space radiation. Design guidelines for improved EMC and signal integrity are derived from the results obtained. Comprehensive simulation and characterization of SWs using FDTD is presented for the first time     

Fast multipole method for time domain PEEC analysis

High-speed electronic circuits are becoming more and more important in modern communication systems, thus leading to an increasing interest in printed circuit boards, interconnect, and packaging. Nowadays, full-wave numerical methods are widely used in order to investigate both signal integrity and electromagnetic compatibility issues arising in PCBs design. When broadband information is desired and transient effects dominate, it is more efficient using time domain numerical techniques, which may scale better than corresponding frequency-domain methods. This paper presents the derivation of the time domain partial element equivalent circuit (PEEC) method enhanced by the three-dimensional (3D) fast multipole method (FMM). It is shown that combining the full-wave time domain PEEC method with the FMM allows performing the analysis of electrically large electronic systems, which reduces both memory and CPU-time requirements. Several examples are presented confirming the capability of the proposed approach to provide a significant reduction of the computational complexity associated with the transient analysis of large systems.     

Extraction of Dielectric Constant and Loss Tangent Using New Rapid Plane Solver and Analytical Debye Modeling for Printed Circuit Boards

Dielectric material properties of printed circuit boards (PCBs) are needed by designers working in various areas such as signal integrity, antennas, and embedded RF components. Among many methods to extract the material properties, the full sheet resonance technique is commonly used on PCBs due to its simplicity. The disadvantage of this method is that an analytical equation is used to extract the dielectric constant, which is accurate only for lossless dielectrics. In this paper, a new method is presented to solve the inaccuracy issue of the extraction of the dielectric constant by applying customized electromagnetic simulation based on a new rapid plane solver instead of analytical equations. For PCB dielectrics, the loss tangent tends to be flat over several decades. The dielectric constant then varies as a function of frequency based on the Kronig–Kramers relations. This paper introduces a new Debye type of a model for the complex permittivity of such dielectrics. The parameters of the Debye model can be obtained analytically without requiring any curve fitting. The resulting Debye model can then be easily integrated in SPICE or a finite-difference time-domain simulator.      

Detailed CFD Modelling of EMC Screens for Radio Base Stations: A Parametric Study

The objective of this paper is to make a parametric study of the hydraulic resistance and flow pattern of the flow after an electromagnetic compatibility screen and between two printed circuit boards (PCBs) in a model of a 90$^{circ}$ subrack cooling architecture. The parametric study is carried out using a detailed 3-D model of a PCB slot. The detailed model was experimentally validated in a previous paper by the authors. Seven parameters were investigated: velocity, inlet height, screen porosity, PCB thickness, distance between two PCBs, inlet-screen gap and screen thickness.      

Miniaturised electromagnetic bandgap structures for broadband switching noise suppression in PCBs

A novel concept for ultra-wideband suppression of switching noise in high-speed printed circuit boards (PCBs) is proposed, implemented and tested. This concept consists of using non-symmetrical, embedded electromagnetic bandgap (EEBG) structures in conjunction with material with high dielectric constants. The proposed design modifies the classical EEBG structures to achieve a high degree of miniaturisation and an unprecedented broadband suppression of switching noise.     

高速高密度PCB的RE问题

随着数字产品的时钟频率越来越高,信号上升时间（下降时间）越来越短,PCB的RE越来越严重,已逐步成为影响产品EMC性能的重要因素之一,PCB设计过程中必须采取综合措施抑制RE。从高速高密度PCB设计的角度,总结了PCB级RE的主要来源,分析了PCB级RE的基本规律,给出了PCB级RE的抑制对策。讨论与结论对高速高密度P...     

超视距低空电波传播模式研究分析

文中提出了一种电波传播模式分析方法. 通过对PJ (Paulus-Jeske)波导进行参数估计,实现蒸发波导的完备性建模;采用抛物方程法分析气象环境中的二维电波传播路径损耗分布,利用最大值池化降低数据量,并采用自适应聚类分析实现电波传播模式分析,进而建立海杂波衰减规律与电波传播模式之间的映射,统计条件概率. 结果表明,蒸发波导环境下海杂波衰减与电波传播模式之间具有相关性,分析结果能够展示蒸发波导中的电波传播模式,并且能够为海杂波反演大气波导提供先验条件概率分析.     

Model of the electromagnetic fields inside a cuboidal enclosurepopulated with conducting planes or printed circuit boards

We examine the extension of a simple and versatile model of the electromagnetic fields in an equipment enclosure with an aperture to include the effects of loading the enclosure with conducting planes or printed circuit board structures (PCB). Modeling results are compared with experimental measurements of the shielding effectiveness in a cuboidal enclosure loaded with both grounded and ungrounded conducting planes and/or PCBs with a range of grounded and ungrounded tracks. Measurement results are compared with full electromagnetic simulations and the simple model to demonstrate the accuracy and range of validity of the simple model     

电磁兼容扫描仪在产品研制中的应用

介绍了一种电磁兼容扫描仪（EMC-Scanner）,它可对PCB、电缆、元器件、整机进行扫描测量,并以二维或三维方式直观地展示其电磁辐射频率分量和辐射方位等测量结果。结合实例,阐述了EMC测量在EMC设计中的重要性。     

High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

We experimentally demonstrated the great advantages of a high dielectric constant thin film electromagnetic bandgap (EBG) power distribution network (PDN) for the suppression of power/ground noises and radiated emissions in high-performance multilayer digital printed circuit boards (PCBs). Five-layer test PCBs were fabricated and their scattering parameters measured. The power plane noise and radiated emissions were measured, investigated and related to the PDN impedance. This successfully demonstrated that the bandgap of the EBG was extended more than three times, covering a range of hundreds of MHz using a 1-cm /spl times/ 1-cm EBG cell, the SSN was reduced from 170 mV to 10 mV and the radiated emission was suppressed by 22 dB because of the high dielectric constant thin film EBG power/ground network.     

基于非均匀特异媒质的赋形天线设计

在PCB板表面蚀刻不同尺寸的微带单元结构,构建非均匀特异媒质层,并将其放置在天线辐射单元前方,利用非均匀特异媒质层对电磁波不同的反射系数,实现对天线辐射波束的赋形。设计了由不同尺寸正方形贴片组成的非均匀特异媒质层,并放置于工作频率为5.8 GHz的矩形贴片天线前方。仿真和测试表明:该非均匀特异媒质层能够在基本保持贴片天线工作频点和回波损耗曲线不变条件下,通过调整与贴片天线距离,实现辐射波束由笔形波束向宽角波束和马鞍形波束的赋形转换。为赋形天线设计提供了一种有效的新方法。     

Novel FDTD simulation method using multiple-analysis-space for electromagnetic far field

Wide-band undesired electromagnetic noise near electronic systems, which includes small noise source like the printed circuit board (PCB), is a current problem in the field of electromagnetic interference. However, the estimation method for the electromagnetic noise near a system under test has not been established. This paper proposes a newly developed estimation method of the electromagnetic noise for a wide area, from near to far field, using the finite difference time-domain (FDTD) method. The proposed FDTD simulation method is an estimation technique for near to far field with multiple analysis spaces (MAS). The MAS has an internal analysis space (IAS) and an external analysis space (EAS). The analysis near a radiation source can be calculated in the IAS. The EAS is the outside space from IAS, which is for calculation of the far field. It is expected that the proposed FDTD method by MAS (FDTD-MAS) decrease in the calculation cost in terms of computational time and memory costs, especially for estimation of radiation from PCB. The principle procedure of the FDTD-MAS method is described in the first part of this paper. As example of advantages of the calculation and confirmation of the calculation accuracy, the electric field distributions radiated from a 1-GHz half-wavelength dipole antenna in an IAS of 0.3/spl times/0.3 m/sup 2/ area and an EAS of 7/spl times/7 m/sup 2/ area are used as examples. When the cell size ratio of IAS to EAS is changed from 6 to 20, the FDTD and theoretical values show good agreement. It is indicated that the FDTD-MAS simulation method is one of the most powerful tools for the estimation of electromagnetic noise from near field to far field from small and thin source.