低变工艺的应用与革除铜洗工艺的研究

低变工艺的优点是(以吨氨计):①节约蒸汽600kg;②节电50kwh;③节氨6kg;④可增产液氨、碳铵产量3％。本文对在应用低变工艺的基础上,如何进一步采用甲烷化工艺以代替传统的铜洗工艺进行了论述。介绍了应用甲烷化工艺的要求及其措施;甲烷化工艺代替铜洗工艺的流程安排;铜洗工艺与甲烷化工艺设备投资、经济效益比较。     

加变投产对铜洗再生工艺的影响

我公司为中型氮肥企业 ,合成氨原料气的精制采用铜洗工艺。 2 0 0 4年 7月 1 5日发现再生铜氨液中Cu2 开始上涨 ,停止加空气 ,仍涨至工艺指标高限 2 5mg/L ,并于 1 6日开始超标 ,最高涨至 39 4mg/L。其间采取增大铜液循环量、提高入口CO含量、调整再生温度等多项措施 ,7月 2 6日Cu2 含量降至工艺指标范围内。究其原因 ,主要是加变投产后 ,铜洗入口CO含量大幅降低 ,铜氨液再生温度偏高 ,加之其他原因使装置连续低负荷运转 ,造成铜氨液再生过程中起还原作用的CO大幅减少 ,引起铜氨液中Cu2 急速上涨 ,铜比失调。1　铜洗入口CO减少对铜…     

双甲工艺运行总结

0 前言 公司2003年进行了“双高一优”扩产技术改造。改造前一直采用传统的铜洗工艺，该工艺的主要缺点是：一方面存在电解铜、醋酸、液氨等物料消耗，另一方面再生气氨回收系统产生大量的稀氨水需要处理，给污水零排放造成很大压力。改造后，公司采用了湖南安淳公司设计的双甲工艺，取消了铜洗工段，一方面彻底解决了铜液、稀氨水污染问题，另一方面物料消耗大幅度降低，同时副产甲醇，为公司创造了可观的经济效益。     

高压深度净化工艺的开发及应用

针对原气体净化采用铜洗工艺流程存在的问题,进行了工艺改进。介绍了高压深度净化新工艺的工艺流程,设备改造及运行效果。     

应用能量回收机改造铜洗工艺技术经济分析

介绍了电动往复式高压柱塞泵和液压驱动往复泵的结构特点，分析了能量回收机的工作原理。针对铜洗工艺流程现状，对采用能量回收机改造铜洗工艺进行了技术经济分析和节能效益总结。     

合成氨生产中非等压醇烷化工艺应用的可行性分析

在合成氨装置中,采用清洁生产工艺--非等压醇烷化工艺替代目前的铜洗工艺,从源头上彻底消除原铜洗工序的因排放废水、废气造成对环境的污染;在减少污染的同时节省能耗,降低合成氨的生产成本.     

铜洗再生气净化试验的工艺研究

针对铜洗再生气氨含量高的现状和特点 ,提出了控制氨含量在50×10 -6以下的工艺方法     

200kt／a合成氨醇烷化工艺应用总结

安徽晋煤中能化工股份有限公司1^#合成氨生产装置包括1套咖1200mm氨合成系统、1套西1200mm中压醇化系统和1套西1000mm中压醇化系统,净化采用传统的铜洗工艺。由于传统的铜洗工艺落后,消耗高、污染大,根据发展需要及工艺比较,公司决定采用技术成熟、节能环保的醇烷化工艺取代原有的铜洗工艺,以提升气体的净化程度,达到节能降耗、扩能增效的目的。     

铜洗工艺中出现的问题及对策

山东恒通化工股份有限责任公司化肥厂合成氨系统醇氨生产能力为180kt／a。原料气的最终净化仍然采用铜洗精炼工艺。铜洗装置有两台铜洗培（Φ1000mm和Φ700mm），1台Φ2000mm的再生器。自1995年两台铜塔改用规整填料以来，工艺操作相对稳定，尤其是合成系统增加联醇装置后，经过调整优化工况，铜洗装置的负荷大幅度降低，工艺操作平稳，各项消耗也大幅度下降。     

醇烃化精制工艺运行总结

<正>广西柳州化工股分有限公司合成分厂(以下简称柳化合成分厂)合成氨原料气的净化精制原采用传统的铜洗工艺。铜洗工艺的缺点主要表现在操作不稳定、设备检修频繁、生产运行及检修费用高、现场环境差且污染严重等。为了保护环境、降低生产成本、节能减排,柳化合成分厂决定采用湖南安淳高新技术有限公司(以下简称安淳公司)的醇烃化工艺代替铜洗工艺,该装置于     

印刷线路板动态蚀刻研究

为了优选酸性氯化铜蚀刻工艺条件,提高工作效率,采用喷射法动态试验,研究了影响印刷线路板铜箔蚀刻速率的因素.结果表明,当氯化铜质量浓度为150～250 g/L,盐酸浓度为1.6～3.0 mol/L,氟化钾浓度为1.4～1.6 mol/L,操作温度50 ℃左右,试样运动速率2.14 m/s时,蚀刻效果最佳,最高蚀刻速率接近60 μm/min.适当加大喷淋量有利于提高蚀刻速率.     

超声电解下超细铜粉粒度特性研究

超细铜粉是指粒径介于10-9～10-5m的微小铜粒子,它具有导电导热性能好、粒径小、耐腐蚀、表面光洁、流动性强等特点,在力学、电学、化学和电极材料的制造等领域有许多特异性能和极大的潜在应用价值.在室温下探讨了电流密度、溶液浓度、超声频率以及时间对超细铜粉粒度分布的影响规律,采用扫描电镜对超细铜粉做了物相分析.结果表明:...     

溶剂萃取法从化学镀铜废液中回收铜

采用溶剂萃取法研究了从含强络合剂的化学镀铜废液中回收铜的可行性，结果表明：从含酒石酸钾钠的化学镀铜废液萃取铜时，采用LIX54萃取剂，在pH值为6－10之间，铜的萃取率大于99％，然后通过反萃，可以得到能回用于化学镀铜生产线的硫酸铜溶液。     

树叶镀金工艺

介绍了一种金叶子制作工艺,工艺流程包括热碱去叶肉,氯化亚锡敏化,银盐活化,化学镀铜,定型,加厚和电镀真金等.指出了工序的注意事项.     

Soft-sensor for copper extraction process in cobalt hydrometallurgy based on adaptive hybrid model

In the process of copper extraction in cobalt hydrometallurgy, the copper concentration of raffinate solution needs to be monitored and controlled simultaneously. It is difficult to measure such concentration online by existing instruments and sensors. Soft sensor technique has been became an online supplement measurement for process monitoring and control. In this paper, an adaptive hybrid modeling method for copper extraction process is proposed. The proposed model is composed of simplified first principle model and block-wise recursive PLS model. The former based on material balancing calculation with some assumptions is used to describe the extraction process in general; and the latter is constructed to compensate the unmodeled characteristic and deal with the time-variant feature. A model rectification strategy is also employed to correct the final output and increase the prediction accuracy. The proposed model has been used in a cobalt hydrometallurgy pilot plant, and the prediction results indicate that the adaptive hybrid model is more precise and efficient than the other conventional models.     

Influence of pH on the synthesis and properties of polypyrrole on copper from phytic acid solution for corrosion protection

Polypyrrole (PPy) films were deposited on copper from “green” inhibitor of phytic acid solution for corrosion protection of copper. The corrosion protection property of the PPy layer was studied by an immersion test in a NaCl aqueous solution. The polymerization process of PPy on copper changed with the pH values of phytic acid solution and current density applied. When one oxidized bare copper in phytic acid solution at various pHs containing pyrrole monomer, a thin layer consisting of complex compound of Cu-phytate was firstly formed, followed by the formation of the PPy layer doped with phytate anion on the complex compound layer. The complex compound layer passivated the copper surface and its thickness increased with the lower pH value of the solution and the lower current density applied. It was found that the PPy coating prepared in the phytic acid solution at pH 4 exhibit the most protective property against copper corrosion.     

Study on EDTA‐chelated copper adsorption by granular activated carbon

Equilibrium and kinetic experiments on uptake of single‐species copper, EDTA, and EDTA‐chelated copper by an H‐type granular activated carbon under various factors, such as pH, ionic strength and EDTA concentration were carried out in this study. Adsorption of copper ions was increased with an increase in solution pH when the solution contained single‐species or EDTA‐chelated copper ions. The solution pH increased significantly from its lower initial value, which resulted from the adsorption of hydrogen ions by the carbon. The efficiency for the single‐species metal ion removal was increased from 5 to 95% when the solution pH was increased from 2 to 7.5. EDTA‐chelated metal ion removal, however, was increased from 7 to 97% as the pH was increased from 1.5 to 7.5. EDTA adsorption percentages increased when the solution pH was increased and the initial concentration was decreased. Slightly higher EDTA‐chelated copper removal was observed when the ionic strength was higher and the ratio of EDTA to copper concentrations was 1:1. Kinetic experiments demonstrated that the copper adsorption occurred rapidly in the first hour. No further change in the removal was observed after 3 and 6 h for single‐species or EDTA‐chelated, respectively. The EDTA‐chelated copper adsorption kinetics was enhanced with an increase in EDTA concentration and a decrease in ionic strength. © 2000 Society of Chemical Industry     

碳纤维布化学镀铜工艺的研究

采用以甲醛为还原剂的化学镀铜液,用硝酸银作活化剂,在碳纤维布表面沉积出连续、均匀、有光泽的化学镀铜层。研究了不同前处理工艺对碳纤维布化学镀铜的影响。采用扫描电子显微镜表征了化学镀铜层的表面形貌,并用数字电压表测试了碳纤维布化学镀铜前后的导电性。     

Influence of ultrasound irradiation on the adsorption of bovine serum albumin on copper

The effect of irradiation by power ultrasound on the adsorption of proteins on copper has been investigated, using bovine serum albumin (BSA) as a model protein in pH 7 phosphate buffer solution. Open circuit potential measurements, cyclic voltammetry and electrochemical impedance spectroscopy were used to characterise the copper/solution interface. Electrochemical impedance measurements at potentials close to the open circuit potential showed that pulsed ultrasound irradiation removes the naturally formed copper oxide films in phosphate buffer solution, and that their re-formation can lead to an oxide film with different electrical characteristics. Adsorption of BSA blocks the surface, decreasing or increasing the interfacial resistance, depending on the applied potential and the oxide characteristics, as well as changing the interfacial capacitance. This study augurs well for application of the combination of electrochemical impedance plus ultrasound to other systems. Special issue dedicated to Prof. Tony Wragg.     

Effect of benzotriazole (BTA) addition on Polypyrrole film formation on copper and its corrosion protection

Benzotriazole (BTA) was added in a conducting Polypyrrole (PPy) film prepared on copper in oxalic acid aqueous solution containing pyrrole monomer to improve corrosion protection by the PPy film and reduce copper corrosion. When BTA was added in the preparation solution, the copper surface was covered by a BTA–Cu complex layer before the anodic polymerization of PPy was started. On the copper surface with the BTA layer, the initial dissolution of copper was inhibited and the PPy polymerization-deposition was started immediately after the anodic current was imposed. The PPy film thus formed was doped with oxalic ions and ionized BTA and was homogeneous in thickness and strongly adhesive. The PPy film containing BTA protected the copper from corrosion in 3.5 wt.% NaCl solution. In 400 h of immersion, copper dissolution was inhibited with 80% protection efficiency relative to that of bare copper.