新型电力电子器件封装用导热胶粘剂的研究

通过在环氧树脂中加入不同量的具有高导热系数的填料（氧化铝、氮化铝、碳化硅）,并研究加入填料后环氧树脂的导热性能随填料填充体积分数的变化规律,研制出了具有高导热能力的新型导热胶粘剂。     

高导热环氧树脂复合绝缘材料的制备与性能研究

环氧树脂等高分子聚合物材料热导率低,长期使用时,存在热导致的故障和绝缘失效等隐患.通过向环氧树脂中填充具有高导热性和高绝缘性的微米氮化硼和纳米氧化铝填料制备高导热复合绝缘材料,研究填料填充量及配比对复合材料导热性能和绝缘性能的影响.结果表明:当总填充量为30％,微米h-BN与纳米A12O3的质量比为3∶1时,复合材料的热导率、击穿时间和复介电常数虚部ε"分别为1.182 0W/(m·K)、31.9 s和0.034,比环氧树脂分别提升了697％、21.4％和406％,且复合材料在高频高压电场下具有良好的耐受性能.     

高导热绝缘漆的研制及其在低压电机上的应用

以不饱和聚酯改性环氧树脂为基体,采用硅烷偶联剂表面改性后的金刚石、碳化硅和氧化铝微粉为填料分别制备高导热绝缘漆,分析3种填料对绝缘漆的防沉淀性、导热系数、击穿电压和粘度的影响,采用3种改性填料复合制备了一种高导热绝缘漆,并在低压电机的整机上进行应用试验。结果表明:加入未改性填料的绝缘漆易产生沉淀现象,而加入硅烷偶联剂表面改性填料的绝缘漆储存稳定性好,不易沉淀;添加改性后的金刚石、碳化硅和氧化铝微粉填料后的绝缘漆,其导热系数随微粉含量的增加均有所提高、电气强度随微粉含量的增加而降低、粘度随微粉含量的增加而增大;3种改性填料复合使用制备的高导热绝缘漆导热系数可达0.432W/(m·K),粘度69 s,电气强度23.4 MV/m。电机温升同比下降7 K,电机效率提高0.97%。     

环氧树脂/功能化氮化硼纳米片复合电介质的制备及性能研究

采用γ-缩水甘油醚氧丙基三甲氧基硅烷（KH560）对氮化硼纳米片（BNNS）进行表面改性,然后将其掺入环氧树脂基体中,制备了环氧树脂/功能化氮化硼纳米片（EP/BNNS-KH560）复合材料。对功能化氮化硼纳米片的结构及形貌进行测定,并对EP/BNNS-KH560复合材料的性能进行研究。结果表明：BNNS表面成功接枝KH560,在透射电子显微镜下展现出透明薄层结构;宽能级间隙的BNNS-KH560填料的加入可以保持复合材料的高电绝缘性、优异的介电性能和力学性能,使其热稳定性提高,并能在环氧树脂基体中形成良好的导热通道,有效改善复合材料的导热性能。当复合材料中BNNS-KH560质量分数为20%时,复合材料的导热系数可达到0.51 W/(m·K)。     

微米氮化硼-纳米氧化铝复合环氧材料的导热与绝缘特性

环氧树脂(epoxy resin,EP)以其粘附力强、绝缘性能好等优点,在电气领域中得到广泛应用.但环氧树脂的低热导率限制其在器件中的使用,尤其在高频条件下.文中通过多巴胺改性微米氮化硼和纳米氧化铝,将制备的微纳米二元填料填充环氧树脂,研究环氧树脂复合材料的导热性能和电气绝缘性能.结果表明,质量分数22.5％BN和7....     

电子封装用环氧树脂/氮化硼导热复合材料的研究进展

环氧树脂(EP)是常用的电子封装材料,向环氧树脂中添加高导热氮化硼(BN)填料是提高环氧树脂复合材料热导率的有效方法之一。本文介绍了电子封装用环氧树脂基复合材料的导热机理,综述了近年来电子封装用环氧树脂/氮化硼复合材料的研究进展,最后展望了环氧树脂/氮化硼导热复合材料的发展前景。     

导热聚酰亚胺绝缘薄膜材料的研究进展

随着先进电子及高频通信技术的发展,聚酰亚胺薄膜作为重要的聚合物绝缘材料面临越来越高的导热性能要求.传统聚酰亚胺薄膜的本征导热系数较低,无法满足电子元器件的快速散热需求.近年来,研究人员对导热聚酰亚胺薄膜材料开展了大量研究,通过加入无机导热填料获得了具有良好导热性能的聚酰亚胺基复合薄膜.本文综述了国内外在导热聚酰亚胺绝缘薄膜材料方面的最新研究进展,详细讨论了聚酰亚胺/导热填料复合薄膜的导热行为,系统阐述了导热性能的影响因素,包括填料类型、尺寸、加入量、填料与基体的界面相互作用等,并对高性能聚酰亚胺基导热绝缘薄膜材料面临的技术挑战进行了总结与展望.     

BNNSs/液晶环氧纤维复合薄膜的导热性能

液晶环氧树脂导热性能较差,耐热性不够高,使得电力、电子器件运行过程中散热困难,温度升高导致环氧树脂绝缘发生劣化,大大影响了电力、电子器件的使用可靠性和寿命。该文开发了制备高取向度液晶环氧纤维薄膜的静电纺丝方法和工艺,结合真空抽滤方法向纤维薄膜中填充纳米氮化硼(nano boron nitride,BNNSs),进一步制备了填充取向型纳米氮化硼/液晶环氧纤维复合导热薄膜,研究了液晶环氧纤维直径和BNNSs填充浓度对BNNSs/液晶环氧树脂导热复合薄膜的导热性能和交流击穿强度的影响规律。结果表明:液晶环氧树脂纤维薄膜的面内热导率随着纤维直径的减小而增大,当纤维直径减小至280 nm时,热导率为0.699 W/(m·K);当填充BNNSs导热填料后,BNNSs/液晶环氧树脂导热复合薄膜的面内热导率随填料浓度增大而急剧上升,在填充量为15%时可以达到5.88 W/(m·K),比280 nm直径的纯薄膜提高了779%。同时发现,液晶环氧树脂纤维薄膜在直径较细的情况下交流击穿强度较高,280 nm纤维薄膜的击穿强度为26.55 kV/mm,BNNSs导热填料的添加可以减小薄膜复合材料的热击穿,填充...     

环氧树脂基导热绝缘复合材料的研究进展

分析了环氧树脂基导热绝缘复合材料的导热机理,主要从填料的种类、粒径、用量、表面处理及复配等方面综述了环氧树脂基高导热绝缘复合材料的研究进展,并对环氧树脂基导热绝缘复合材料的应用前景及重点研究方向进行了展望.     

高强度导热三元乙丙橡胶复合材料的性能研究

通过多尺度氧化铝、纳米氧化锌单一填料填充以及两者复合填充三元乙丙橡胶,研究导热填料对三元乙丙橡胶复合材料拉伸强度和导热系数的影响,制备具有较高力学性能的三元乙丙橡胶导热复合材料,并测试了其绝缘性能.结果表明:使用多尺度氧化铝、纳米氧化锌复配填充,且两者的填充量均为200份时,得到的复合材料导热系数达1.16 W/(m·K),拉伸强度达5.01 MPa,撕裂强度达21.12 N/mm.     

Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound

Epoxy resin compounds are manufactured with silica glass and aluminum nitride as filling material at various filling ratios. The thermal conductivity and electrical properties, like dielectric loss or electric strength, are measured and compared as regards to an utilization as electrical insulator.     

Charge storage in double layers of thermally grown silicon dioxideand APCVD silicon nitride

Experimental results on charge storage and discharge in double layers of silicon dioxide and silicon nitride will be reported and discussed. SiO₂ with a thickness of 300 nm was thermally grown on silicon wafers, while cover layers of Si₃N₄ with thicknesses of 50, 100, and 150 nm were deposited chemically at atmospheric pressure. The samples were charged by the point-to-grid corona method. At room temperature, the measured surface potential V was stable during a period of almost three years. Isothermal measurements under different environmental conditions showed an improved charge retention compared to a single layer grown silicon dioxide. After ~3 h at 300°C, the observed voltage drop was <10% for the double layers and ~60% for bare SiO₂. Similar results were obtained under a humid condition of 95%RH and 60°C. Besides, thermally stimulated current (TSC) was measured in setup with a temperature ramp of 200°C/h. For the double layers, a current peak with a maximum temperature at ~500°C was observed. The measured current in the range of 300 to 400°C, the location of current maxima observed in thermally grown silicon dioxide or APCVD silicon nitride, was negligible. In addition to improved electret properties the internal stress in the investigated double layers can be adjusted by a proper thickness ratio of oxide layer to nitride layer. Therefore double layers of silicon dioxide and nitride seem to be promising materials for integrated sensors and actuators based on the electret effect     

有机硅环氧体系粘合剂的研制与性能研究

利用含活性氨基的有机硅树脂SR22000与环氧树脂中的环氧基进行开环加成反应,获得了有机硅环氧体系;然后以甲基四氢苯酐(MTHPA)、K-12、N-30为固化剂,制得了有机硅环氧体系粘合剂,并对其在凝胶化时间和粘度、拉伸剪切强度、活化能等性能进行了研究。结果表明:以MTHPA为固化剂的ES6M粘合剂的粘度最低,凝胶化时间最长;以K-12、N-30为固化剂的ES6K和ES6N粘合剂的室温粘结强度较大。     

PECVD低功率沉积氮化硅薄膜研究

为了减少太阳能电池氮化硅薄膜生产工艺中的缺陷、提高太阳能电池的转换效率,采用等离子增强化学气相沉积法在射频功率较低的条件下,对N型单晶硅片表面进行氮化硅沉积,获得与高射频功率沉积时相同膜厚和折射率的氮化硅膜,通过试验分析了低功率沉积工艺对电池电参数、对膜厚均匀性的影响。结果表明,在低功率沉积工艺条件下,有助于改善膜厚均匀性,使膜厚不均匀度由12%下降到6%,太阳能电池转换效率提高了0.05个百分点。     

新型环氧胶粘剂的制备及其性能研究

采用两种固化剂十二烯基琥珀酸酐(K-12)和甲基四氢苯酐(MTHPA)与改性胺类潜伏性固化剂(LRC30)联合固化环氧胶粘剂,对比测试了两种胶粘剂的粘度、凝胶化时间和拉伸强度。结果表明:两种新型环氧胶粘剂的拉伸剪切强度相差不大,都在27 MPa以上,具有优异的粘接性能;表观活化能为70~75 kJ/mol;制胶48 h后60℃下用K-12固化的胶粘剂的粘度比用MTHPA固化的胶粘剂的粘度大,都可达35 P以上。     

云母带粘合剂导热系数的研究

多胶云母带广泛应用于大型高压电机的主绝缘材料,其导热性直接影响到空冷电机的温升及绝缘的可靠性。采用保护热流计法导热仪、浸渍法密度计研究了目前应用比较成熟的多胶云母带粘合剂的热传导性能及其与密度的关系。结果表明:酚类固化体系的导热系数明显高于TOA体系和桐马体系;酚类固化体系中引入TOA增韧后降低了固化物的导热系数;导热系数与密度存在一定的关系,密度较大的固化物其导热系数一般也较大。     

超支化聚芳酰胺接枝氮化硼/环氧复合材料的制备与性能研究

采用两步法将超支化聚芳酰胺接枝到氮化硼粒子表面,并将其掺入到环氧树脂中,制备了一系列复合材料,并对复合材料的微观形貌、玻璃化转变温度、导热性能及电气强度进行了测试研究。结果表明:超支化聚芳酰胺接枝氮化硼粒子在环氧树脂中有较好的分散性,复合材料的电气强度、玻璃化转变温度和导热系数均得到了提高。     

Double antireflection coating layer with silicon nitride and silicon oxide for crystalline silicon solar cell

Anti-reflection coating (ARC) film effectively reduces the reflection of sunlight on the silicon wafer surface and then increases substantially the solar cell conversion efficiency. In this work, we carried out experiments to lessen the reflectance and thus improve the conversion efficiency with double AR coating layer with silicon nitride and silicon oxide by plasma enhanced chemical vapor deposition (PECVD) for the silicon solar cells. The optimized thicknesses and refractive indices of each ARC layer were calculated with Essential Macleod program and the theoretical method. The single antireflection layer of silicon nitride was applied with 800 Å thickness and its cell showed the conversion efficiency as 17.45 %. For the double layer AR coating (DLARC), silicon nitride layer was deposited first using SiH₄ and NH₃, and then, silicon oxide was deposited with SiH₄ and N₂O. The thicknesses of SiN_x and SiO₂ were 800 Å and 1400 Å for DLARC-1 and 500 Å and 1000 Å for DLARC-2, respectively. As a result, the reflectance of DLARCs was lower than single SiN_x and then yielded increase of short-circuit current and conversion efficiency. The completed solar cell with DLARCs showed conversion efficiencies of 17.57 % for DLARC-1 and 17.76 % for DLARC-2. This indicates that the double AR coating layer is effective to obtain the high efficiency solar cell with PECVD.     

Photonic Crystal and Plasmonic Silicon-Based Light Sources

Efficient silicon (Si)-compatible emitters can realize inexpensive light sources for a variety of applications. In this paper, we study both photonic crystal (PC) and plasmonic nanocavities that enhance the emission of Si-compatible materials. In particular, we examine the coupling of silicon nanocrystals (Si-NCs) to silicon nitride PC cavities and Si-NCs in silicon dioxide to plasmonic gratings, both for enhancement of emission in the visible wavelengths. In addition, we also observe the enhancement of the 1530 nm emission from erbium-doped silicon nitride films coupled to Si PC cavities. Finally, we analyze the loss mechanisms associated with the hybrid silicon nitride/silicon system, and propose advancements in the designs of PC and plasmonic cavities for the emitters described in this paper.      

Candidate organic electrolytes for electric double-layer capacitor application

Electricdouble layercapacitor(EDLC )isauniqueelectro chemicalenergystoragedevicewhichexhibitsmuchgreatercapaci tancethanconventionalcapacitors Italsooffersmuchhigherpow erdensitythanconventionalbatteries (C2 H5) 4 NBF4 PCisfre quentlyusedaselectrolyteinEDLCsforitsrelativelyhighelectro chemicalandthermalstability[1-2 ] However ,theconductivityof(C2 H5) 4 NBF4 PCisratherlowandtheviscosityisquitehigh AcetonitrilehasahighconductivityandhasalreadybeenusedassolventintheEuropeanmarketforcap…