镀TiC金刚石/铝复合材料的热膨胀性能

采用气压浸渗法制备了金刚石体积分数为65%的铝基复合材料,分析了复合材料的显微组织并对热膨胀系数(CTE)进行了测试,研究了镀TiC金刚石/铝复合材料的热膨胀性能。结果表明,金刚石颗粒在铝合金基体中分布均匀,组织致密;TiC镀层有效地改善了金刚石颗粒与铝合金基体间选择性粘结现象,增强了金刚石与基体间的界面结合;镀TiC使复合材料热膨胀系数明显降低,Turner模型和Kerner模型的均值可以预测其热膨胀系数,而对于未镀层的复合材料则可以用Kerner模型进行预测。     

电子封装用金刚石/铝复合材料的显微组织与热膨胀性能

在金刚石表面镀钛改善金刚石与铝合金之间的界面结合,并用气压浸渗工艺制备镀钛金刚石颗粒增强铝基复合材料。对复合材料的显微组织进行了研究,测试了复合材料的热膨胀系数。结果表明,镀钛金刚石颗粒与铝合金基体之间界面结合良好,材料的断裂以基体断裂为主,同时存在一定量的界面断裂;选用形貌规则的金刚石有利于提高复合材料中金刚石的体积分数,从而降低复合材料的热膨胀系数。     

颗粒镀层对银/金刚石复合材料导热性能的影响

作为新一代热管理材料,金刚石-银基复合材料(Ag/diamond)有望满足高端军用或航空航天电子设备的应用。采用盐浴镀对金刚石颗粒进行表面镀TiC,通过真空热压烧结制备复合材料,主要探讨金刚石颗粒镀层对复合材料导热性能的影响。实验结果表明:金刚石经过镀TiC处理后,TiC镀层明显改善了颗粒-基体的界面结合,所得复合材料的热导率远远高于未镀层复合材料的热导率。通过理论模型分析表明:TiC镀层后Ag/diamond复合材料的界面热阻降低至5×10-7(m2·K)/W,大大提高了界面的热传导性能。     

金刚石/碳化硅/铝复合材料的热膨胀性能

采用气压浸渗法制备金刚石/碳化硅/铝复合材料,研究复合材料的断口形貌以及界面反应,测试复合材料的热膨胀性能。结果表明:金刚石表面Ti镀层使得其选择性粘附不同于未镀钛金刚石的,而在各个面上均粘附有Al,金刚石与基体间有着良好的界面结合,断裂方式以基体断裂为主,其界面反应后,Ti以Al3Ti和Ti-Al-Si等金属间化合物的形式析出,提高金刚石/铝界面的结合强度,降低复合材料的热膨胀系数;随着金刚石颗粒粒径的增大,金刚石和碳化硅颗粒间粒径比的增大增加了整个复合材料的体积分数,从而降低了其热膨胀系数;金刚石颗粒粒径增大导致热膨胀系数升高。这两方面共同影响复合材料的热膨胀系数,但前者起主导作用;金刚石和碳化硅在不同配比下的热膨胀系数随着复合材料中碳化硅含量的增加逐渐增大,Terner模型与Kerner模型的计算平均值能较好地预测实验结果。     

颗粒尺寸对SiCp/Mg复合材料热膨胀性能的影响

设计并采用真空气压浸渗法制备了不同颗粒尺寸的高体积分数SiCp/AZ91D镁基复合材料,研究了颗粒尺寸对镁基复合材料热膨胀性能的影响.结果表明,改变颗粒尺寸是调节镁基复合材料热膨胀性能的一种非常有效的手段.相同体积分数复合材料的热膨胀系数随颗粒尺寸的减小而逐渐降低,不同体积分数的SiCp复合材料的热膨胀系数与复合材料的界面面积成反比关系;减小颗粒尺寸与提高颗粒体积分数一样,能有效降低复合材料的热膨胀系数;颗粒尺寸对镁基复合材料热膨胀性能的作用机制主要是通过复合材料的界面面积、致密度及其镁基体的位错密度来实现的.     

镀层厚度对镀钛金刚石/铝复合材料热导率的影响

通过在金刚石表面镀钛来改善金刚石和铝基体之间的弱界面结合,并用气压浸渗法制备体积分数为60%的镀钛金刚石/铝复合材料。研究镀钛后金刚石颗粒的物相组成、不同镀层厚度和不同颗粒尺寸下复合材料的热导率;用H-J和DEM模型预测复合材料的热导率,并将预测结果与实验值进行对比。结果表明,镀钛后金刚石颗粒的物相由金刚石、碳化钛和钛三相组成;随着镀层厚度的增加,界面传热系数减小,复合材料的热导率减小;颗粒的尺寸越小,这种变化趋势越明显;相对于H-J模型,DEM模型更能准确地预测镀钛金刚石增强的复合材料的热导率;通过计算得出镀钛金刚石/铝复合材料的临界镀层厚度为1.5μm,当超过此临界镀层厚度时,镀层反而不利于复合材料热导率的提高。     

TiC增强高锰钢基复合材料的组织与磨料磨损性能

采用凝固析出方法制备了不同体积分数TiC增强的高锰钢基复合材料,系统研究了复合材料的显微组织和磨料磨损性能。热处理后,复合材料由奥氏体和TiC两相组成,TiC颗粒均匀分布在高锰钢基体中,颗粒与基体界面清洁。磨料磨损实验表明,TiC颗粒的引入提高了复合材料耐磨性能。然而,复合材料的耐磨损性能随着TiC体积分数的增加而降低。研究结果表明,随着TiC体积分数的提高,陶瓷颗粒尺寸增大且部分形成团簇,陶瓷颗粒在磨损过程中发生破碎从而提高磨损率。     

电子封装用SiCP/Al复合材料的热膨胀性能

采用气压浸渗方法制备了SiCP／Al（SiC颗粒增强铝基复合材料）。研究了复合材料的工程热膨胀系数CTE和物理CTE随体积分数的变化关系。结果表明，随着SiC颗粒体积分数的增加，复合材料的工程CTE减小，物理CTE也减小。相比双尺寸SiC，／Al，单尺寸颗粒的SiCP／Al物理CTE曲线随温度增长不规则，这可以归结于SiC颗粒与基体合金接触表面积较小.     

SPS+热轧法制备的B_4C/Ti复合材料组织及力学性能的研究

采用不同体积分数的碳化硼粉与钛粉通过放电等离子烧结(SPS)和轧制的方法制备钛基复合材料板材,并对所制备复合材料的密度、显微硬度、微观组织、物相、拉伸性能以及断口形貌等进行了系统研究。结果表明:随着碳化硼颗粒含量的提升,烧结态和轧制态复合材料的密度和显微硬度也相应上升。XRD分析显示,TiC与TiB在碳化硼颗粒与钛基体之间形成,3vol%B_4C的轧制态钛基复合材料的最大抗拉强度能够达到800 MPa,抗拉强度的提高是由于TiC与TiB的作用。断裂主要发生在B4C颗粒和B4C颗粒与基体的界面之间。     

TiC增强高锰钢基复合材料的组织与磨损性能

高锰钢是传统的耐磨材料。为进一步提升高锰钢的耐磨性能,使其能满足复杂工况的使用要求,本文采用凝固析出方法制备了不同体积分数TiC增强的高锰钢基复合材料,系统研究了复合材料的显微组织和磨料磨损性能。热处理后,复合材料由奥氏体和TiC两相组成,TiC颗粒均匀分布在高锰钢基体中,颗粒与基体界面清洁。磨料磨损实验表明,TiC颗粒的引入提高了复合材料耐磨性能。然而,复合材料的磨损性能随着TiC体积分数的增加而降低。研究表明这是因为随着TiC体积分数的提高,陶瓷粒径尺寸增大且部分形成团簇,陶瓷颗粒在磨损过程中发生破碎从而提高磨损率。     

Microstructure and thermal expansion of Ti coated diamond/A1 composites

A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix, and the Ti coated diamond particles reinforced Al matrix composites were prepared by gas pressure infiltration for electronic packaging. The surface structure of the Ti coated diamond particles was investigated by XRD and SEM. The interfacial characteristics and fracture surfaces were observed by SEM and EDS. The coefficient of thermal expansion(CTE) of 50% (volume fraction) Ti coated diamond particles reinforced Al matrix composites was measured. The Ti coating on diamond before infiltration consists of inner TiC layer and outer TiO₂ layer, and the inner TiC layer is very stable and cannot be removed during infiltration process. Fractographs of the composites illustrate that aluminum matrix fracture is the dominant fracture mechanism, and the stepped breakage of a diamond particle indicates strong interfacial bonding between the Ti coated diamond particles and the Al matrix. The measured low CTEs (5.07×10⁻⁶−9.27×10⁻⁶K⁻¹) of the composites also show the strong interfacial bonding between the Ti coated diamond particles and the Al matrix.     

Thermal properties of diamond/Al composites by pressure infiltration: comparison between methods of coating Ti onto diamond surfaces and adding Si into Al matrix

This study was pertained to the effects of Ti coating on diamond surfaces and Si addition into Al matrix on the thermal conductivity(TC) and the coefficient of thermal expansion(CTE) of diamond/Al composites by pressure infiltration.The fracture surfaces,interface microstructures by metal electro-etching and interfacial thermal conductance of the composites prepared by two methods were compared.The results reveal that Ti coating on diamond surfaces and only12.2 wt% Si addition into Al matrix could both improve the interfacial bonding and increase the TCs of the composites.But the Ti coating layer introduces more interfacial thermal barrier at the diamond/Al interface compared to adding 12.2 wt% Si into Al matrix.The diamond/Al composite with 12.2 wt% Si addition exhibits maximum TC of 534 W·m~(-1)·K~(-1)and a very low CTE of 8.9×10~(-6)K~(-1),while the coating Ti-diamond/Al composite has a TC of 514 W·m~(-1)·K~(-1)and a CTE of 11.0×10~(-6)K~(-1).     

Improved Thermal Performance of Diamond-Copper Composites with Boron Carbide Coating

B₄C-coated diamond (diamond@B₄C) particles are used to improve the interfacial bonding and thermal properties of diamond/Cu composites. Scanning electron microscopy, x-ray diffraction, and x-ray photoelectron spectroscopy were applied to characterize the formed B₄C coating on diamond particles. It is found that the B₄C coating strongly improves the interfacial bonding between the Cu matrix and diamond particles. The resulting diamond@B₄C/Cu composites show high thermal conductivity of 665 W/mK and low coefficient of thermal expansion of 7.5 × 10^?6/K at 60% diamond volume fraction, which are significantly superior to those of the composites with uncoated diamond particles. The experimental thermal conductivity is also theoretically analyzed to account for the thermal resistance at the diamond@B₄C-Cu interface boundary.     

热处理对金刚石/2024Al复合材料微观组织和热物理性能的影响

采用挤压铸造法制备粒径为5μm、体积分数为50%的金刚石/2024Al 复合材料。退火处理后对其金相组织界面反应、界面结合情况以及金刚石颗粒的内部缺陷进行观察与分析,并对其热物理性能进行测试与研究。结果表明,金刚石/2024Al 复合材料的组织致密,无明显的气孔、夹杂等缺陷;颗粒为不规则多边形,有棱角,分布比较均匀。透射电镜观察表明,部分金刚石颗粒内部有位错和层错存在,而2024Al 基体中的位错密度较大,金刚石/2024Al界面处有较多的界面反应物生成,可能为Al2Cu。复合材料在20~100°C温度区间内的平均热膨胀系数为8.5×10-6°C-1,退火处理的复合材料其热膨胀系数有一定程度的降低;随着温度的升高,复合材料的平均热膨胀系数也呈现增加的趋势。复合材料的热导率约为100 W/（m·K）,退火处理能够提高复合材料的热导率。     

近零膨胀ZrW2 O8/Al6013复合材料的制备与性能

介绍了模压浸渗复合法制备ZrW2Os/Al6013复合材料的工艺过程,并对该复合材料的组织和热膨胀性能进行了初步探讨.结果表明,复合材料中ZrW2O8与Al未发生界面反应,铝液均匀致密地分布在ZrW2O8颗粒间隙中,没有大面积聚结和偏析发生,最终得到致密度高、ZrW2Os体分比高、基体金属与ZrW2O8结合强度高、近零膨胀(热膨胀系数为3×10-6K-1)的ZrW2O8/Al6013复合材料.     

Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings

The interfacial thermal conductance (ITC) and thermal conductivity (TC) of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.     

气压熔渗法制备高导热金刚石/Cu–B合金复合材料

以硼质量分数为0.5%的Cu–B合金为金属基体以及平均粒径为500 μm的金刚石颗粒为增强体,采用气压熔渗法制备金刚石/Cu–B合金复合材料,研究气压参数对其组织结构和热物理性能的影响规律。结果表明:随着气压升高,金刚石与Cu–B合金之间的界面结合效果、导热性能均增强,热膨胀系数减小;当气压为10 MPa时,其界面结合效果最优,界面处生成的碳化物层将金刚石完全覆盖,且100 ℃时的样品热导率为680.3 W/(m·K),热膨胀系数为5.038×10?6 K?1,满足电子封装材料的热膨胀系数要求。      

Interface and thermal expansion of carbon fiber reinforced aluminum matrix composites

Two kinds of unidirectional PAN M40 carbon fiber(55%,volume fraction) reinforced 6061Al and 5A06Al composites were fabricated by the squeeze-casting technology and their interface structure and thermal expansion properties were investigated.Results showed that the combination between aluminum alloy and fibers was well in two composites and interface reaction in M40/5A06Al composite was weaker than that in M40/6061Al composite.Coefficients of thermal expansion(CTE) of M40/Al composites varied approximately from(1.45-2.68)×10-6 K-1 to(0.35-1.44)×10-6 K-1 between 20 °C and 450 °C,and decreased slowly with the increase of temperature.In addition,the CTE of M40/6061Al composite was lower than that of M40/5A06Al composite.It was observed that fibers were protruded significantly from the matrix after thermal expansion,which demonstrated the existence of interface sliding between fiber and matrix during the thermal expansion.It was believed that weak interfacial reaction resulted in a higher CTE.It was found that the experimental CTEs were closer to the predicted values by Schapery model.     

界面改性对SiCf/Cu基复合材料热膨胀性能的影响

研究了SiCf/Cu基复合材料分别在有无Ti6Al4V界面改性涂层两种情况下的纵向热膨胀行为,并采用扫描电镜对热循环后的试样进行显微形貌观察。结果表明,界面结合强度对纤维增强金属基复合材料的纵向热膨胀行为有很大影响。对于没有Ti6Al4V涂层的复合材料,其热膨胀行为不稳定,在经历连续两次热循环后,其纵向均表现为正的残余应变,原因是基体发生了严重的界面脱粘、滑移和膨胀;而对于有Ti6Al4V涂层的复合材料,其纵向热膨胀系数明显减小,两次热循环后其尺寸保持稳定,纤维/基体界面结合也保持稳定。