A numerical and experimental study on gap compensation and wavelength selection in UV-lithography of ultra-high aspect ratio SU-8 microstructures

This paper presents a study on UV-lithography of thick SU-8 resist using air gap compensation and optimal wavelength selection for ultra-high aspect ratio microstructures. Both numerical simulations and experiments were conducted to study effects of different lithography conditions: broadband light source with and without air gap compensation, filtered light source with glycerol liquid, and filtered light source with Cargille refractive index matching liquid. A thick PMMA sheet was used as an optical filter to eliminate most of the i-line components of a broadband light source. Using the filtered light source and gap compensation with the Cargille refractive index liquid perfectly matching that of SU-8, patterns with feature sizes of 6 μm thick, 1150 μm tall (aspect ratio of more than 190:1) and high quality sidewalls were obtained. Microstructures with height up to 2 mm and good sidewall quality were also obtained and presented. The study also proved that Cargille refractive index matching liquid is compatible with UV-lithography of SU-8 and may be used as an effective air gap compensation solution.     

SU-8胶微结构的尺寸公差研究

对SU-8胶微结构的尺寸及其公差进行了定量研究.在考虑了SU-8的吸收系数和折射系数对紫外光刻尺寸精度影响的基础上,根据菲涅耳衍射理论建立了紫外曝光改进模型和尺寸公差模型,对SU-8微结构的尺寸及其公差进行数值模拟.以硅为基底,进行了SU-8胶紫外光刻的实验研究.实验中掩模的特征宽度分别取50 μm、100μm、200μm和400 μm,SU-8胶表面的曝光剂量分别取400mJ/cm2和800mJ/cm2,测量了SU-8胶微结构的顶部线宽、底部线宽和SU-8胶的厚度,数值模拟结果与实验结果基本吻合.可以用本文的模型来预测SU-8微结构的尺寸及其公差.     

Fabrication of barrier ribs of PDP via powder injection molding

In this paper, an attempt was made to explore a possibility of powder micro injection molding process in manufacturing ceramic microstructures such as barrier ribs of plasma display panel. The barrier ribs are glass matrix composites with ceramic powder (alumina and/or titania) filler. In this molding process, a thermosetting paste was molded into polydimethlsilosane soft molds prepared by replication of thick film resist (SU-8) molds. The SU-8 mold was patterned with UV-lithography. The effects of powder content in the paste on paste viscosity and sintering characteristics of molded samples were examined. In addition, effect of molding speed on pore trapping in the microstructure was studied. These results indicated that the powder micro injection molding process at ambient temperature has merits of low-pressure injection molding process with superior mold release characteristics.     

UV-LIGA interferometer biosensor based on the SU-8 optical waveguide

SU-8 resist was used as a core/cladding waveguide material to fabricate a Mach–Zehnder interferometer (MZI) for biochemical sensing. The refractive index of the SU-8 resist was fine-tuned with a Δn of 0.004 for single-mode transmission. The UV lithography processes of the SU-8 resist were also optimized to pattern the high resolution (1 μm) and high aspect ratio (A_R = 6) Y-branch structure of the optical interferometer. Optical measurements reveal that the SU-8 MZI chip can efficiently transmit the NIR laser (λ = 1310 nm) with a total loss less than 6 dB. When one branch of the MZI is in contact with the analyte, the interfered intensity stabilizes after the soaking time exceeds 5 min. NaCl solution with a concentration of 10⁻⁹ g/l can be detected using the SU-8 MZI chip. In the future, the polymer MZI chip can be mass-produced by molding process (or the LIGA process). The low-cost, label-free, real-time and high-sensitivity MZI chip will benefit many applications related to biological, environmental and industrial detection.     

Fabrication of a polymeric tapered HARMs array utilizing a low-cost nickel electroplated mold insert

A simple low-cost technique has been developed to fabricate a mold insert for replicating polymeric tapered high aspect ratio microstructures. A backside exposure technique is used to first obtain a tapered sidewall structure as an electroplating mold in SU-8 photoresist on a glass wafer. Nickel electroplating is utilized to form the mold insert. The lowest average surface roughness of the nickel mold insert on the side that interfaces with the glass wafer during electroplating is measured to be 7.02 nm. A novel technique involving use of titanium putty is introduced here to reduce cost and effort required to fabricate the mold insert. Replication of tapered microstructures in polymeric materials utilizing the fabricated mold insert is demonstrated here in polydimethylsiloxane by a direct molding process and in polymethyl methacrylate by hot embossing. The fabrication details for the mold insert are described. Advantages and disadvantages of the use of titanium putty for achieving superior metal surface finish are given.     

Process research of high aspect ratio microstructure using SU-8 resist

SU-8 is a negative, epoxy type, near-UV photoresist. This resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications using standard lithography equipment. However, in practice, SU-8 has shown to be very sensitive to process parameter variation. The orthogonal array was used in our experiments in order to improve the lithography quality and analyze the interaction among the parameters. The analyses show that the interaction between the exposure dose and post exposure bake has played an important role in adhesion between SU-8 resist and the substrate. The proposed process conditions are given. The output structure has straight sidewall profile, fine line and good space resolution. The aspect ratio is larger than 20. Moreover, several metallic films are used as substrates. The Ti film with oxidation treatment was found to have the strongest adhesion to the resist. The result will help to open possibilities for low-cost LIGA-type process for MEMS applications.     

Network properties and acid degradability of epoxy-based SU-8 resists containing reactive gamma-butyrolactone

SU-8 is an octafunctional epoxy-based negative resist supplied with a reactive diluent, gamma-butyrolactone (GBL). This paper characterizes the network properties and acid degradability of cured SU-8 resists with varying GBL monomer content and ultraviolet (UV) irradiation time. The SU-8/GBL network structure was characterized by Fourier transform infrared (FTIR) spectroscopy, ¹³C nuclear magnetic resonance (NMR) spectroscopy and gas chromatography–mass spectrometry (GC/MS). GBL was found to copolymerize with epoxy to bridge two neighbouring epoxy groups and does not homopolymerize. The maximum GBL:SU-8 molar ratio whereby all GBL fully reacted with available epoxy functionalities in the network was found to be 8:1. Excess GBL beyond the maximum GBL:SU-8 ratio remains in the network as a plasticizer. GBL content and UV irradiation time affect glass transition temperature (T_g), epoxy conversion and molecular weight between cross-links (M_c) which were measured by dynamic mechanical analysis (DMA) and FTIR. The mechanism of cross-linked network acid degradation was found to be surface erosion. Lower epoxy conversion, higher M_c and higher GBL content resulted in a higher dissolution rate, which can be exploited in applications requiring SU-8 removal. A patterned SU-8 grating with relatively high-GBL content (10%) was successfully used as a template for Cu electroforming.     

Fabrication of a freestanding micro mechanical structure using electroplated thick metal with a HAR SU-8 mold

In this thesis, fabrication technology of a freestanding micro mechanical structure using electroplated thick metal with a high-aspect-ratio SU-8 mold was studied. A cost-effective fabrication process using electroplating with the SU-8 mold was developed without expensive equipment and materials such as deep reactive-ion etching (DRIE) or a silicon-on-insulator (SOI) wafer. The process factors and methods for the removal of SU-8 were studied as a key technique of the thick metal micro mechanical structure. A novel method that removes cross-linked SU-8 completely without leaving remnants of the resist or altering the electroplated microstructure was utilized. The experimental data pertaining to the relationship between the geometric features and the parameters of the removal process are summarized. Based on the established SU-8 removal process, an electroplated nickel comb structure with high-aspect-ratio SU-8 mold was fabricated in a cost-effective manner. In addition, a freestanding micro mechanical structure without a sacrificial layer was successfully realized. The in-plane free movements of the released freestanding structure are demonstrated by electromagnetic actuation. This research implies that various types of MEMS devices can be developed at a low-cost with design flexibility.     

Indirect removal of SU-8 photoresist using PDMS technique

SU-8 photoresist shows superior images for thick film lithography and has been utilized as an electroplating mold. However, crosslinked SU-8 is difficult to remove reliably from high-aspect-ratio microstructures (HARMs) without damage or alteration to the electroplated metal. In this paper, an indirect SU-8 removal method is proposed. Instead of directly using SU-8 microstructure as the electroplating mold, a polydimethysiloxane (PDMS) replica is employed. The metallic micromold insert obtained through this method can be easily peeled off from the PDMS replica, meanwhile with high resolution and smooth surfaces.     

High aspect ratio multi-level mold inserts fabricated by mechanical micro machining and deep etch X-ray lithography

 Complex microstructures can be fabricated in large quantities by thermoplastic molding processes. The shape of the microstructures is determined mainly by the mold insert. Until now, multi-level mold inserts have been fabricated either by deep etch X-ray lithography and electroforming, Harmening et al. (1992), or by milling of a brass substrate, Schaller et al. (1995). In both cases there are limitations on structuring either by the fabrication effort or by the sizes of the smallest available milling heads. To avoid these limitations on structuring, a new process for manufacturing multi-level mold inserts has been developed at Forschungszentrum Karlsruhe. Milling, drilling, deep etch X-ray lithography and electroforming have been combined to manufacture a mold insert which is characterized by high aspect ratios with small lateral dimensions and various level heights. Samples with two levels and an aspect ratio of 15 have been manufactured. Much higher aspect ratios seem to be achievable. This paper covers the fabrication process, first tests, and experimental results of manufacturing a multi-level mold insert for molding three-dimensional components of a microvalve system. Received: 30 October 1995 / Accepted: 17 January 1996     

High aspect ratio multi-level mold inserts fabricated by mechanical micro machining and deep etch X-ray lithography

Complex microstructures can be fabricated in large quantities by thermoplastic molding processes. The shape of the microstructures is determined mainly by the mold insert. Until now, multi-level mold inserts have been fabricated either by deep etch X-ray lithography and electroforming, Harmening et al. (1992), or by milling of a brass substrate, Schaller et al. (1995). In both cases there are limitations on structuring either by the fabrication effort or by the sizes of the smallest available milling heads. To avoid these limitations on structuring, a new process for manufacturing multi-level mold inserts has been developed at Forschungszentrum Karlsruhe. Milling, drilling, deep etch X-ray lithography and electroforming have been combined to manufacture a mold insert which is characterized by high aspect ratios with small lateral dimensions and various level heights. Samples with two levels and an aspect ratio of 15 have been manufactured. Much higher aspect ratios seem to be achievable. This paper covers the fabrication process, first tests, and experimental results of manufacturing a multi-level mold insert for molding three-dimensional components of a microvalve system. The development of this technology has been supported by the European Community as part of the Esprit project IMICS.     

Microlens array fabrication by backside exposure using Fraunhofer diffraction

In UV-lithography, a gap between photoresist and UV-mask results in diffraction. Fresnel or near-field diffraction in thick positive and negative resists for microstructures resulting from a small gap in contact or proximity printing has been previously investigated. In this work, Fraunhofer or far-field diffraction is utilized to form microlens arrays. Backside-exposure of SU-8 resist through Pyrex 7740 transparent glass substrate is conducted. The exposure intensity profile on the interface between Pyrex 7740 glass wafer and negative SU-8 resist is modeled taking into account Fraunhofer diffraction for a circular aperture opening. The effects of varying applied UV-doses and aperture diameters on the formation of microlens arrays are described. The simulated surface profile shows a good agreement with the experimentally observed surface profiles of the microstructures. The paper demonstrates the ease with which a microlens array can be fabricated by backside exposure technique using Fraunhofer diffraction.     

A quantitative study on the adhesion property of cured SU-8 on various metallic surfaces

SU-8 has received wide attention in recent years because of its application in the fabrication of high aspect ratio microstructures and devices. This negative resist is known for its excellent lithography properties using ultraviolet light source. As the microfabrication technology based on UV-lithography of SU-8 finds wide applications, a good understanding and characterization of cured SU-8 polymer on various substrate materials are therefore very important. A good adhesion on various substrate materials is essential to both the fabrication process and to the functionality of any final products that have cured SU-8 as part of the structural material. There are very limited studies reported in this important area in the literature. This paper presents a theoretical and experimental work to quantitatively study the adhesion properties of cured SU-8 on some of the most commonly used metallic surface materials. The adhesion strengths of cured SU-8 samples on Au, Ti, Cu, Cr, and Ni coated glass substrates were measured following ASTM-C633 standard. A detailed analysis of the experimental results was also provided based on the atomic structures and electron configurations of the respective metals.     

Fabrication method of two-level polymeric microstructure with the help of deep X-ray lithography

Two- or multi-level microstructures are getting more important in several applications such as multi-component micro optical elements and various microfluidic systems. In the present study, a simple and efficient method is newly proposed for a fabrication of the two-level polymeric microstructures. Making a mother two-level microstructure consists of two processes: (1) the hot embossing process for a fabrication of microstructures on a PMMA substrate, and (2) the deep X-ray lithography using the hot embossed substrate for a high aspect ratio microstructure fabrication, resulting in a high aspect ratio microstructure containing smaller microstructures on its surface. Making use of so fabricated two-level microstructures as a mother structure, one could achieve a mass replication of the same microstructures via injection molding process with a metallic mold insert obtained by a nickel electroforming onto the mother microstructure. In order to demonstrate the proposed method, a polymeric high aspect ratio microstructure having smaller square microstructures on its top surface was fabricated. The fabricated two-level microstructure shows fine vertical sidewalls, which is a characteristic feature of the deep X-ray lithography. In addition, a metallic mold insert for a mass replication was fabricated by a nickel electroforming process.     

Free-standing SU-8 microfluidic chips by adhesive bonding and release etching

Free-standing SU-8 chips with enclosed microchannels and high density of fluidic inlets have been made in a three-layer process which involves SU-8 to SU-8 adhesive bonding and sacrificial etching. With this process we can fabricate microchannels with depths ranging from 10 to 500 μm, channel widths from 10 to 2000 μm and lengths up to 6 cm. The process is optimized with respect to SU-8 glass transition temperature. Thermal stresses and thickness non-uniformities of SU-8 are compensated by novel mask design features, the auxiliary moats. With these process innovations filling of microchannels can be prevented, non-bonded area is minimized and bonding yields are 90% for large-area microfluidic chips. We have released up to 100 mm in diameter sized microfluidic chips completely from carrier wafers. These free-standing SU-8 chips are mechanically strong and show consistent wetting and capillary filling with aqueous fluids. Fluidic inlets were made in SU-8 chips by adding one lithography step, eliminating through-wafer etching or drilling. In our process the inlet size and density is limited by lithography only.     

Inexpensive, quickly producable X-ray mask for LIGA

 The capability to produce X-ray masks inexpensively and rapidly is expected to greatly enhance the commercial appeal of the LIGA process. This paper presents a process to fabricate X-ray masks both inexpensively (under $1000) and rapidly (within a few days). The process involves one UV lithography step and eliminates the need for an intermediate X-ray mask. The X-ray mask produced by this process consists of a 125 μm thick graphite membrane that supports a gold-on-nickel absorber pattern. The thickness of the absorber structures is great enough to supply sufficient contrast even when radiation sources with high characteristic photon energies up to 40 keV are utilized and/or when deep exposures are desired. The mask fabrication process is initiated by spin coating 30–50 μm of SU-8 directly on a graphite membrane. The SU-8 is then patterned using a UV mask. Gold-on-nickel absorber structures are electroplated directly onto the SU-8 covered graphite. Once the remaining SU-8 is removed, attaching the graphite membrane to a frame completes the mask. To test the performance of the mask, a nickel mold insert was fabricated. A sheet of PMMA 500 μm in thickness was bonded to a nickel substrate, then exposed to X-rays through the mask, and developed. Electroplating nickel into the patterned PMMA sheet produced a mold insert. SEM pictures taken of the SU-8, the X-ray mask, and the mold insert are shown. This method of rapidly producing an inexpensive X-ray mask for LIGA resulted in a mold insert with smooth, vertical sidewalls whose dimensions were within two micrometers of the UV mask dimensions. Received: 12 December 1998/Accepted: 2 February 1999     

A novel device of passive and fixed alignment of optical fiber

In the microoptics field, precise alignment is very important to reduce the coupling losses in optical links. In this paper, a novel device of passive and fixed alignment of optical fiber is proposed. The rectangular V-groove formed by one sidewall of SU-8 resist and the substrate is used to position the optical fiber, and the leaf spring with flexure hinge clamps it. The spring is fabricated by the sacrificial layer technique. The clamping force provided by the spring acts on the upper semi-circle of the optical fibers cross section, so that the device need not use the additional cover on the optical fiber to perform the vertical location and the final fixing. It has simple structure and process, and is convenient to assemble and integrate with other microparts. The coupling of two optical fibers using the devices in our experiment has less than 1.5 dB insert loss.     

Flexible SU-8 microstructures for neural implant design

This work investigates the use of SU-8 microstructures for applications within flexible neural implants. Six different microstructures are fabricated and tested in both tension and bending to determine their Young’s modulus and their failure stress when deformed about a small radius of curvature. A numerical model is presented that accurately predicts the performance of the structures under bending, and physical testing shows that stresses of up to 300 MPa are achievable.     

High aspect ratio tapered hollow metallic microneedle arrays with microfluidic interconnector

We present a novel microfabrication method for a tapered hollow metallic microneedle array and its complete microfluidic packaging for drug delivery and body fluid sampling applications. Backside exposure of SU-8 through a UV transparent substrate was investigated as a means of fabricating a dense array of tall (up to 400 μm) uniformly tapered SU-8 pillar structures with angles in the range of 3.1–5° on top of the SU-8 mesa. Conformal electroplating of metals on top of the array of the tapered SU-8 pillars, lapping of the tip of the metallic microneedles with planarizing polymer, and removal of the SU-8 sacrificial layers resulted in an array of tapered hollow metallic microneedles with a fluidic reservoir on the backside. A microfluidic interconnector assembly was designed and fabricated using SU-8 and conventionally machined PMMA in a way that it has a male interconnector, which directly fits into the fluidic reservoir of the microneedle array at one end and the other male interconnector, which provides fluidic interconnection to external devices at the other end. The fluid flow rate was measured and it showed 0.69 μL/s. per microneedle when the pressure of 6.89 KPa (1 psi) was applied.     

Manufacture of a micro-sized piezoelectric ceramic structure using a sacrificial polymer mold insert

There have been technical limitations to manufacture microstructures due to difficulty of demolding during replication process of high aspect ratio microstructure in mass production technologies. In the present study, the fabrication of a novel sacrificial micro mold insert and powder injection molding process using such a micro mold insert is proposed and developed. It utilizes a synchrotron radiation to fabricate the shape of polymer based sacrificial mold inserts and then these mold inserts were exposed at X-ray once more to adjust its solubility. This second X-ray exposure facilitates dissolving of mold inserts instead of demolding process which have difficulties like pattern collapses or defects in case of precise replication process. In this manner, severe problems of demolding process in conventional mass production technologies can be efficiently overcome. To verify the usefulness of the proposed technique, polymer based micro mold inserts with several tens of micrometer sized structure for piezoelectric sensor applications were fabricated using X-ray micromachining process radiated synchrotron. The solubility of mold inserts were optimized by the second X-ray exposure without an X-ray mask and then subsequent powder injection molding process was utilized with a piezoelectric based material. Finally, piezoelectric ceramics with micrometer-scale and high aspect ratio of 5 were successfully fabricated, verifying that the present sacrificial mold system is useful for the precise replication process such as the fabrication of microstructure with high aspect ratio or complicated structure.