Source localization and beamforming

Distributed sensor networks have been proposed for a wide range of applications. The main purpose of a sensor network is to monitor an area, including detecting, identifying, localizing, and tracking one or more objects of interest. These networks may be used by the military in surveillance, reconnaissance, and combat scenarios or around the perimeter of a manufacturing plant for intrusion detection. In other applications such as hearing aids and multimedia, microphone networks are capable of enhancing audio signals under noisy conditions for improved intelligibility, recognition, and cuing for camera aiming. Previous developments in integrated circuit technology have allowed the construction of low-cost miniature sensor nodes with signal processing and wireless communication capabilities. These technological advances not only open up many possibilities but also introduce challenging issues for the collaborative processing of wideband acoustic and seismic signals for source localization and beamforming in an energy-constrained distributed sensor network. The purpose of this article is to provide an overview of these issues     

Analog VLSI Circuit Implementation of an Adaptive Neuromorphic Olfaction Chip

In this paper, we present the analog circuit design and implementation of the components of an adaptive neuromorphic olfaction chip. A chemical sensor array employing carbon black composite sensing materials with integrated signal processing circuitry forms the front end of the chip. The sensor signal processing circuitry includes a dc offset cancellation circuit to ameliorate loss of measurement range associated with chemical sensors. Drawing inspiration from biological olfactory systems, the analog circuits used to process signals from the on-chip odor sensors make use of temporal "spiking" signals to act as carriers of odor information. An on-chip spike time dependent learning circuit is integrated to dynamically adapt weights for odor detection and classification. All the component subsystems implemented on chip have been successfully tested in silicon     

A 50 GHz GaAs FET MIC transmitter/receiver using hermetic miniatureprobe transitions

A very compact 50-GHz-band transmitter/receiver for a video link is described. The RF assemblies used in the system consist of 25/50-GHz frequency doublers, a 25-GHz dielectric-resonator oscillator, and a 25-GHz FM modulator. The circuits make extensive use of microwave integrated circuit (MIC) technology with all GaAs FETs as active elements. The frequency doublers exhibit a minimum conversion loss of 2.6 dB and a maximum output power of 11 dBm. The modulator is highly frequency stabilized by the dielectric resonator. Recently developed miniature probe microstrip-to-waveguide transitions permit the MIC assemblies to be installed compactly in hermetically sealed packages. Design considerations and experimental data for the transition are presented. Using these technologies a transmitting power of 10 dBm and a receiver noise figure of 13 dB have been obtained     

新型电子元件在机器人灵巧手微型五维力传感器中的应用

高性能的微型电子元件对于微型传感器的研制是十分重要的。本文介绍了应用新型电子元件设计的微型五维力传感器信号调理电路，并且描述了使用串行模数转换器实现传感器数字化输出的原理和可行性。     

集成微光机械振动传感器芯片制作工艺研究

介绍了一种新型集成微光机械振动传感器的工作原理和芯片制作工艺。以聚甲基丙烯酸甲酯为结构材料，采用旋涂和干法刻蚀技术，实现了光波导集成光路和悬臂梁-质量块微机械结构在硅基底上的集成。详细讨论了高分子聚合物微器件制作工艺中的关键技术、工艺难点以及解决措施。     

Breathing detection: towards a miniaturized, wearable, battery-operated monitoring system

This paper analyzes the main challenges associated with noninvasive, continuous, wearable, and long-term breathing monitoring. The characteristics of an acoustic breathing signal from a miniature sensor are studied in the presence of sources of noise and interference artifacts that affect the signal. Based on these results, an algorithm has been devised to detect breathing. It is possible to implement the algorithm on a single integrated circuit, making it suitable for a miniature sensor device. The algorithm is tested in the presence of noise sources on five subjects and shows an average success rate of 91.3% (combined true positives and true negatives).     

一种抗老化消除浮空点并自锁存的老化预测传感器

随着集成电路芯片制造工艺进入纳米阶段,电路可靠性问题变得越来越严重,以负偏置温度不稳定性效应为代表的电路老化也逐渐成为影响其性能的重要因素.基于老化预测的精确性和传感器功能的多样性,提出了一种抗老化、可编程的老化预测传感器.其中稳定性检测器部分利用反馈回路解决了浮空点问题,同时整合了锁存器部分,实现了对老化预测结果的自动锁存,从而增加了老化预测的精确度,减小了一定的面积开销.最后通过HSPICE模拟器仿真验证了该传感器的优越性,且与经典结构相比降低了约21.43％的面积开销.     

基于无线SAW压力传感器的FADS研究

嵌入式大气数据系统(FADS)是先进的大气数据系统。由于SAW压力传感器能进行无线测量,将无线SAW压力传感器应用于FADS,与MIMU相结合使之成为廉价的微型组合导航系统。研究了FADS的基本原理、无线双单端SAW谐振器压力传感器的基本原理以及相关应用电路模块,并利用HP Esoft软件和SAW谐振器等效电路对无线SAW压力传感器进行了仿真。研究表明,无线SAW传感器能应用到先进的大气数据系统,具有重要的应用价值。     

小型共面接口压差传感器

小型共面接口压差传感器是一种压力传感器,该传感器主要用于测量和控制两个油路压力差。该产品采用SOI硅晶圆材料制作硅压阻式压力敏感芯片,敏感元件的工作温度范围为-55~300℃,通过双芯体结构将油路的压力差信号转换成电信号,再利用精密的信号处理电路,将微弱的电信号进行放大处理,实现标准的模拟信号输出。     

Integrated circuit yield statistics

The random failure statistics for the yield of mass-produced semiconductor integrated circuits are derived by considering defect and fault formation during the manufacturing process. This approach allows the development of a yield theory that includes many models that have been used previously and also results in a practical control model for integrated circuit manufacturing. Some simpler formulations of yield theory that have been described in the literature are compared to the model. Application of the model to yield management are discussed and examples given.     

Barium Tetratitanate MIC Technology

Experimental results on BaTi/sub 4/O/sub 9/ microwave integrated circuit (MIC) characteristics, including microstrip dispersion and loss, have shown excellent agreement with the theoretical predictions. Precision measurements of temperature stability were conducted at 14 GHz. The high dielectric constant (epsilon/sub r/ = 37) and its negative temperature coefficient can be used in specialized MIC's for application to advanced microwave subsystems.     

Micromachined devices for wireless communications

An overview of recent progress in the research and development of micromachined devices for use in wireless communication subsystems is presented. Among the specific devices described are tunable micromachined capacitors, integrated high-Q inductors, micromachined low-loss microwave and millimeter-wave filters, low-loss micromechanical switches, microscale vibrating mechanical resonators with Q's in the tens of thousands, and miniature antennas for millimeter-wave applications. Specific applications are reviewed for each of these components with emphasis on methods for miniaturization and performance enhancement of existing and further wireless transceivers     

发展氮化镓集成电路的考虑

介绍了氮化镓微电子器件的优势和现状。提出将GaNHEMT作为微波器件用于混合微波集成电路(MIC)和微波单片集成电路(MMIC),在射频输出功率、器件优值等方面,均具有明显优点,并列举了成功的例子。为了加快发展MMIC,必须解决好几个关键问题,即提高材料质量和尺寸,完善制造工艺,克服器件电流下降、增益过早饱和与射频输出功率退化等现象。     

用于制造微波多芯片组件的LTCC技术

低温共烧陶瓷(LTCC)是实现微波多芯片组件(MMCM)的一种理想的组装技术,具有高集成密度、多种电路功能和高可靠性等技术优势.介绍了国内外应用于微波组件的LTCC技术发展现状,概述了LTCC的制造工艺流程,分析了其关键工艺难点,对LTCC基板电路的设计进行了详细阐述,并讨论了埋层电阻的设计和微带线和带状线间的垂直微波互联的方式.利用LTCC技术研制的微波多芯片组件,在现代雷达和通讯领域具有广泛的应用前景.     

相控阵用收发(T/R)组件

本文简要评逆相控阵用收发(T/R)组件的特点及发展概况,介绍了几种收发组件的电路,即混合微波集成电路(HMIC)、微型混合微波集成电路(MHMIC)以及单片微波集成电路(MMIC),并讨论了收发组件的制造工艺、电路组成、封装测试和成品价格。     

MMIC毫米波倍频器的研究

在介绍倍频器工作原理、各种实现方法及其优缺点的基础上,阐明了采用MMIC(单片微波集成电路)工艺实现高性能、高可靠性、小型化毫米波倍频器芯片的技术特点及应用需求,比较了单管和平衡两种不同结构MMIC毫米波倍频器的优点与不足,全面综述了国内外对MMIC毫米波倍频器的研究情况,介绍了MMIC毫米波倍频器的最新研究进展,展望了MMIC毫米波倍频器的发展趋势,提出了一些建议。     

CCD制造的关键工艺

CCD(电荷藕合器件)是一种在硅集成电路工艺线上制作的图像传感器．介绍了CCD的基本工作原理和制造的单项工艺,并详细介绍了其关键工艺：氧化、光刻、离子注入,还对各工艺所遇到的问题、相应的解决方法及发展状况进行了阐述。     

Design and Implementation of 160×192 Pixel Array Capacitive-Type Fingerprint Sensor

The application specific integrated circuit implementation of a capacitive fingerprint sensor system-on-chip (SOC), which embeds a 32-bit microcontroller for performing an identification algorithm, is described for user authentication on small, thin, and portable equipment. The SOC is composed of 160 × 192 array cells with a sensor detection circuit and an embedded 32-bit reduced instruction set computer (RISC) microcontroller. The proposed sensor detection circuit increases the voltage difference between a ridge and valley about 80% more than conventional circuits and minimizes an electrostatic discharge influence by applying an effective isolation structure. The 32-bit RISC microcontroller is embedded by a latch base for low power and low complexity. The test chip was fabricated on a 0.35 μm standard complementary metal oxide semiconductor 1-poly 4-metal process.