Three-dimensional kinematical analyses for surface grinding of large scale substrate

Sponsored by New Energy and Industrial Technology Development Organization (NEDO) and the Ministry of Education, Science and Culture (MESC) of Japan, this project has developed an advanced machining system for 300 mm silicon wafer, using fixed abrasive instead of conventional free slurry, to provide a totally integrated solution for achieving the surface roughness R_a<1 nm (R_y<5–6 nm) and the global flatness <0.2 μm/ 300 mm. Use of state-of-the-art technologies for ultra precision machine tools has made it possible to precisely control the motion and repeatability of each cutting edge. The behavior of each grain and its effect on surface generation become analytical in 2D manner [J JSPE 68(1) (2002) 125]. Taking one step further, this paper has developed a 3D model for infeed grinding which is often used in silicon grinding systems, and mathematically described the cutting path and effects on the surface roughness and flatness.     

石英玻璃的化学机械磨削加工

为了实现石英玻璃基板的高效、高质量加工,进一步改善光掩模设备的性能,进行了石英玻璃化学机械磨削(CMG)加工技术的研究。通过在磨削过程中主动增强磨粒、结合剂以及磨削液与工件的化学反应,并使化学反应与机械去除作用形成动态平衡,从而消除因材料脆性去除而造成的表面损伤等,实现了大口径玻璃工件的高表面质量、高形状精度的加工。针对石英玻璃CMG加工的特点,开发了CMG专用砂轮及磨削液,利用正交实验法优化了石英玻璃CMG加工工艺参数,分析了CMG加工过程中磨削压力、砂轮转速、磨削液流量、pH值等因素对加工表面粗糙度及加工效率的影响,并利用优化后的工艺参数加工得到了Ra为0.795nm的石英玻璃表面。加工后基板的光学性能和化学机械抛光(CMP)加工基板的光学性能相同,能够满足光掩模设备的性能需求。     

光纤石英玻璃基板微V槽阵列的精密磨削

针对脆性石英玻璃的微加工,利用自主研发的金刚石砂轮微尖端修整工艺,研发了光纤阵列石英玻璃微V槽磨削技术。分析了60°的微V槽形状偏差对光纤耦合损耗的影响,然后,研究了砂轮微尖端的误差补偿修整工艺。最后,实验分析了微V槽的磨削精度。理论分析显示:微V槽角度、间距和宽度的偏差分别控制在±0.42°、±1.04μm和±1.2μm以内时,耦合损耗小于0.5dB。实验结果表明:开发的数控磨削工艺可加工高精度的60°微V槽阵列;采用数控轨迹和角度补偿修整后,砂轮微尖端半径可平均达到10.46μm,角度精度为(60±0.22)°;对石英玻璃进行微磨削后,微V槽的角度偏差达到0.4°,尖端半径为10.5μm,宽度偏差为0.3μm,间距偏差为0.5μm,可保证光纤阵列的精密对接。     

Theoretical model of brittle material removal fraction related to surface roughness and subsurface damage depth of optical glass during precision grinding

Brittle material removal fraction (BRF) is defined as the area fraction of brittle material removed on machined surface. In the present study, a novel theoretical model of BRF was proposed based on indentation profile caused by intersecting of lateral cracks. The proposed model is related to surface roughness and the subsurface damage (SSD) depth of optical glass during precision grinding. To investigate the indentation profile, indentation tests of K9 optical glass were conducted using single random-shape diamond grains. The experimental results indicate that the indentation profile is an exponent function. To verify the proposed BRF model, BRF, surface roughness and SSD depth of K9 optical glasses were investigated by a series of grinding experiments with different cutting depths. The experimental results show that BRF is dependent on surface roughness and SSD depth. The relationship between BRF, surface roughness and SSD depth is in good accordance with the proposed theoretical model. The proposed BRF model is a reasonable approach for estimating surface roughness and SSD depth during precision grinding of optical glass.     

固着磨料加工碳化硅反射镜的初步实验研究

本文采用了一种有别于传统的加工碳化硅反射镜的工艺---固着磨料加工工艺。此工艺不但可以利用大颗粒金刚石磨料快速加工出较好的镜面质量,而且由于其固着磨料与工件相对运动关系固定,有利于精确加工。在工艺实验中,分别测得了W7,W5,W3.5,W1.5固着磨料丸片在特定转速和压力下对碳化硅材料的去除特性。通过多组去除量曲线,我们得出此工艺不仅有着较高的去除率,而且其稳定性非常良好。另外在表面粗糙度结果方面,最初使用W7丸片获得了粗糙度为42.758nm rms的镜面。我们不断减小所用丸片的粒度,工件表面粗糙度随之减小。在使用W1.5丸片抛光后,最终获得了粗糙度为1.591nm rms的光滑镜面。实验结果表明,固着磨料加工碳化硅反射镜工艺在某些加工阶段内可以取代传统的散粒磨料加工工艺,有着良好的应用前景。     

光学玻璃磁流变抛光液的研究与材料去除实验

根据磁流变抛光液的评价标准,合理选取了磁流变液的各成分,配制了三种型号磁流变抛光液。用配制的抛光液对K9玻璃进行了定点抛光实验,证明了该磁流变液性能良好,达到了预期的材料去除效果。得到了材料去除率曲线规律,以及单位时间材料去除深度微观空间形貌,为建立磁流变抛光材料去除函数模型提供了依据。     

固结磨料精磨手机面板玻璃的实验研究

固结磨料精磨工艺具有加工效率高和清洁方便等突出优点。采用正交实验法,研究了精磨压力、时间、转速和抛光液浓度等参数对固结磨料精磨手机面板玻璃的材料去除率MRR和表面粗糙度Sa的影响,并综合优化获得高材料去除率和优表面品质的工艺参数。结果表明精磨的最佳工艺参数组合为:精磨压力为0.1 MPa,转速为160 r/min,精磨时间5 min,抛光液浓度10%。     

微操作玻璃微针磨针仪研究

采用树脂结合剂金刚石砂轮磨盘可以实现玻璃微针的高效磨削。磨针仪主轴支承结构消除了电机对磨盘端面跳动的影响。采用显微镜和CCD摄像系统直接观察对针和磨削进给过程。通过试验确定了磨针仪合理的调速范围和许可的磨盘跳动量值。     

Development of binder-free CMG abrasive pellet and finishing performance on mono-crystal sapphire

Chemo-mechanical-grinding (CMG) is a fixed abrasive process by integrating chemical reaction and mechanical grinding for sapphire wafer finishing, and shows advantages in surface integrity, geometric controllability and waste disposal. However, the material removal rate (MRR) obtained by the traditional CMG wheel is not high enough to meet the requirement from the mass production of sapphire wafers. As a potential solution, a new CMG wheel with extremely high abrasive concentration has been proposed. This paper targets on developing of binder-free abrasive pellets (BAP) with 100 wt% abrasive as well as investigating the performance of BAP in sapphire wafer finishing. The results of CMG experiment reveal that the MRR and surface roughness (Ra) of sapphire wafer finished by BAP constructed CMG wheel are able to reach 1.311 μm/h and 0.993 nm respectively. The characterization by Raman microscope indicates that the finished sapphire wafer also owns excellent subsurface integrity.     

保持磨除率恒定凸轮轴变速磨削的研究

推导出了保持磨除率基本恒定时,数控凸轮轴磨床磨削凸轮时凸轮轴转速变化的计算公式。     

An experimental study on the effect of magnetic field orientations and electrolyte concentrations on ECDM milling performance of glass

In this work, effects of magnetic field orientation, machining voltage and electrolyte concentration on electrochemical discharge machining (ECDM) performance have been studied. The microchannels have been machined on the glass substrate; microchannel's depth and surface quality have been taken as indexes of machining characteristic. Experimental results show that the Lorenz force of magnetic field affects a direction of bubble's motion, consequently, changes the electrochemical discharge behavior of electrolyte. The presence of magnetic field causes magnetohydrodynamic (MHD) convection which, by its turn, accelerates the repulsion of the bubbles from the cathodic surface. However, it should mention that the direction of bubble movement depends on the magnetic field orientation. If the magnetic field orientation induces upward Lorenz force (downward Lorenz force), the gas bubbles will repel from (will attract to) inter-electrode area. The obtained results demonstrate that when the magnetic field applies, the machined surface will be smoother for the lower concentration values of electrolyte and higher machining voltages. Enhancements of both the machining voltage and electrolyte concentration increase the machining depth. For the same values of applied voltages, application of magnetic field will also increase the machining depth in a certain machining process duration; this will be intensified for the lower values of electrolyte concentration. The results of this study explain how the combination of the magnetic field orientation and the values of machining voltage and electrolyte concentration should be defined in order to increase both the channel depth and surface quality.     

用于光学玻璃CMP的高效稀土抛光液研究

以纳米二氧化铈(CeO₂)为磨料,使用球磨与不同化学试剂(如pH值调节剂乙酸、丙酸、植酸和分散剂离子型表面活性剂、非离子型表面活性剂)的协同分散方法制备纳米CeO₂抛光液,研究酸性体系下不同抛光液的分散性能与抛光性能。研究表明,球磨时以乙酸为pH值调节剂,调节溶液pH值为3,料球比为1∶4,球磨时间为6 h,球磨后纳米CeO₂悬浮液分散效果较好。采用制备的纳米CeO₂抛光液对石英玻璃进行抛光实验。结果表明：在磨料质量分数为1%、pH为4的条件下,石英玻璃的材料去除速率最高为409 nm/min,粗糙度仅为0.03 nm;阳离子、非离子型表面活性剂均有助于提升酸性体系下CeO₂悬浮液的分散稳定性,而加入非离子表面活性剂AEO-9(脂肪醇聚氧乙烯醚)效果最佳,其能够在提高分散稳定性的基础上改善石英玻璃的表面质量。     

超声振动珩磨工艺参数优化的试验研究

利用自行研制的功率超声振动珩磨实验装置,对超声珩磨和普通珩磨的磨削效率进行了对比实验研究,并采用超声振动珩磨技术,对AZ91D镁合金材料进行了加工实验,以确定最佳油石参数及工艺参数。实验结果表明,超声珩磨在材料去除率和加工表面质量上均优于普通珩磨。实验获得的优化工艺参数可以满足对镁合金的实际加工需要。