基于离散绕组的磁场式时栅位移传感器及误差特性

针对高精度位移传感器难以加工的难题,提出一种基于离散绕组的磁场式时栅位移传感器。通过设计离散激励绕组排布方式与感应绕组的形状控制感应位移信号的变化规律,通过组合测量方式实现精密位移测量。通过理论建模、仿真分析与实验验证揭示了激励信号误差和安装偏差对传感器测量精度的影响规律。实验结果表明：两路激励信号的幅值不等和安装偏差都会在对极内测量精度中直接引入直流分量误差和2次谐波误差,其中2次谐波误差是误差的主要成分。安装偏差越大,2次谐波误差越大,动尺沿Z轴偏摆姿态对测量精度的影响最大,沿Y轴翻转姿态引入的误差次之,沿X轴俯仰姿态引入的误差最小。误差修正后传感器在144 mm的测量范围内,测量误差峰峰值为4.5μm,分辨力为0.15μm。通过毫米级尺寸的激励和感应绕组实现微米级精度测量,可显著降低传感器的制造难度,具有重要的工程应用价值。     

基于平面线圈线阵的直线时栅位移传感器

针对现有磁场式直线时栅位移传感器行波磁场产生过程中,齿槽的存在影响行波磁场的匀速性,提出基于平面线圈线阵的直线时栅位移传感器。无齿槽的结构形式提高了行波磁场的匀速性,可实现大极距下的高精度测量。传感器将施加正交信号的两相励磁线圈相间排列形成平面线圈线阵,产生的行波磁场通过磁场拾取线圈感应出电行波信号,处理后得到位移量。通过电磁场分析软件对传感器进行建模仿真,根据仿真结果得到测量误差;通过理论分析对测量误差进行分析溯源,并根据分析结果对传感器结构进行优化。基于分析和优化结果研制出传感器样机,并进行了精度实验。实验表明,传感器在240 mm内测量精度为±1μm,实现了精密测量。     

基于平面线圈的高分辨力时栅角位移传感器

针对现有时栅角位移传感器采用漆包线绕制工艺加工线圈,导致线圈布线不均且容易随时间发生变化进而影响测量精度的问题,提出一种基于PCB技术的新型时栅角位移传感器。该传感器通过在PCB基板的不同层上布置特定形状的激励线圈和感应线圈,形成两个完全相同并沿圆周空间正交的传感单元;当在两传感单元的激励线圈中分别通入时间正交的两相激励电流后,通过导磁定子基体和具有特定齿、槽结构的导磁转子对传感单元内的磁场实施精确约束,使两传感单元的感应线圈串联输出初相角随转子转角变化的正弦感应信号;最后通过高频时钟脉冲插补初相角实现精密角位移测量。利用有限元分析软件对传感器进行了建模和仿真。根据仿真模型制作了传感器实物,开展了验证实验,并对实验中角位移测量误差的频次和来源进行了详细分析。经过标定和补偿,最终获得了整周范围内误差在-2.82″~2.02″的时栅角位移传感器。理论推导、仿真分析和实验验证均表明,该传感器不仅能实现精密角位移测量,还能在激励线圈和感应线圈空间极距和信号质量不变的情况下,将位移测量的分辨力从信号源头提高1倍,且结构简单稳定、极易实现,特别适用于环境恶劣的工业现场。     

基于时变磁场类多普勒效应的位移测量方法

提出一种基于时变磁场类多普勒效应的位移测量方法。该方法通过在特定平面内布置带电导体,建立特定方向匀速移动的正弦分布时变磁场,利用被测运动使时变磁场内感应线圈的输出信号产生类多普勒频差,再通过测量频差解算出被测运动的位移。根据测量原理建立有限元模型对正弦时变磁场分布和感应信号频差进行模拟仿真。仿真结果表明:正弦分布磁场移动速度均匀,频差所对应的时间差累加与位移呈线性关系,线性度误差小于0.2%。根据仿真模型,采用多层印制电路板工艺设计并制作了位移传感器样机,进行类多普勒频差观察试验和位移测量精度比对试验。试验结果表明:时变磁场中感应线圈运动时产生明显的类多普勒频移,频差与运动速度呈线性关系;基于类多普勒效应的位移传感器可以有效地进行位移测量,在对定尺和动尺的加工和安装偏差、激励源及测量电路的电气偏差进行标定和修正后,传感器在200 mm的测量范围内,测量误差优于1?m。研究为低成本实现精密位移测量提供了一种可行的解决方案和可靠的理论依据。     

光强正交调制型位移传感器的数学模型与误差分析

针对传统光学位移测量方法对环境要求高和制造精度难以提高等问题,提出了一种以交变光场为测量媒介的新型线性位移检测方法。基于提出的方法,设计了一种光强正交调制型位移传感器。该方法采用基于光强正交变化的两路电驻波合成电行波信号,通过对行波信号时间先后的测量实现空间位移的测量。为了深入理解传感器的传感机理,推导了传感器的测量模型,分析了与传感机理相关的关键因素对测量误差的影响。根据测量原理和测量模型的理论分析,研制出传感器原理样机,通过实验测试了各种关键因素对测量误差的影响,并进一步优化设计了传感器结构与参数。实验显示,优化后的传感器在108mm测量范围内的测量精度达到±0.5μm,是一种新的无需精细刻划的位移检测方案。     

基于电涡流的多周期双极直线位移传感器

传统的基于电涡流的多周期位移传感器由于输出信号的周期重复性,难以解决断电重启后的绝对位置识别问题。 提出 一种基于电涡流的新型双极直线位移传感器。 经过理论与仿真分析,验证了随着滑片的滑动,接收线圈中感应电压的幅值呈现 正余弦变化。 设计了双极敏感结构,通过上极多周期接收线圈保证位移的精确测量。 下极布置单周期接收线圈对上级所处周 期进行识别。 通过感应信号偏移及幅值归一化处理算法提高精度,在实验室搭建传感器样机,以高精度电控平移台进行测试。 经测试,新型多周期双极电涡流直线位移传感器可以实现绝对位置测量,在 0~ 60 mm 量程内测量误差为 30 μm,最大非线性为 0. 08% 。 突破了传统多周期涡流式位移传感器绝对位置无法识别的局限。     

基于驻波调制方法的新型时栅位移传感器

现有的时栅位移传感器利用三相电机绕组方式形成行波磁场,再通过切割磁力线感应出行波电场,最后通过比相得到位移量.为了摆脱时栅位移传感器的三相电机绕组方式,简化测量工作机理,进行了磁路分析并设计了新的机械结构,采用驻波调制方法直接得到行波电场.实验表明按该方法设计的传感器达到了较高的测量精度,简化了制作工艺,降低了成本,推进了时栅进一步发展.     

变耦型时栅传感器及测头姿态对测量误差的影响

根据时栅传感器的测量原理,提出一种采用高频时钟脉冲作为测量基准的变耦型时栅位移传感器以提高位移测量的精度。该传感器通过改变激励线圈和感应线圈的耦合状态输出感应位移变化的行波信号来实现精密位移测量。进行了建模和仿真,研究了不同测头姿态下传感器的位移误差特性,并对其进行了谐波分析,得到了不同测头姿态对位移测量误差各次谐波的影响规律。根据传感器模型制作了传感器并开展了验证实验。仿真和实验结果均表明:不同测头姿态对位移测量误差的影响主要体现在对测量误差的1次、2次和4次谐波上,且俯仰姿态引入的附加误差最大,其余测头姿态下引入的位移测量附加误差均较小。若保证较佳的测头姿态,传感器在定尺和动测头间气隙厚度为0.3mm时的原始误差约为±18μm。实验分析结果与仿真结果基本一致。     

基于矩形永磁体磁场信息的6自由度微位移精密测量

利用矩形永磁体自身有规律分布的磁场信息,提出一种使用霍尔传感器阵列作为传感检测模块的非线性计算测量方案。该方法可实现空间六自由度的微位移精密测量,并能保证测量轴间的严格数学正交特性。此方案利用矩形永磁体分布磁场与空间位置间的对应关系,建立永磁体的磁感应强度空间分布数学关系B(X),作为测量模型,并设计均匀布置的霍尔传感器阵列检测空间磁感应强度B。然后,基于运动连续性原理,采用顺序求解法对测量模型B(X)进行快速解算。通过高斯白噪声条件下的500次蒙特卡洛仿真验证了此方案的可行性。试验结果表明,在微位移10 mm测量范围内,XY平动测量误差标准差小于80μm,Z向2 mm垂直位移范围内测量误差标准差小于10μm,转动?/6范围内测量误差标准差小于5 mrad。     

基于正交双行波磁场的平面二维时栅位移传感器

针对半导体行业、航空航天等领域对于精密二维位移测量的迫切需求,提出了一种基于正交双行波磁场的平面二维时 栅位移传感器。 传感器由定尺和动尺组成,定尺由导磁基体和沿 x、y 方向排列的两励磁线圈组成,动尺由导磁基体和沿 x、y 方 向排列的两层感应线圈组成。 当励磁线圈通入正余弦励磁信号时,在定尺上方产生分别沿 x 和 y 方向运动的正交双行波磁场。 通过对感应线圈输出的感应电信号进行解算得到 x 和 y 方向的位移值。 首先介绍了传感器的结构和工作原理,对传感器模型 进行了电磁场仿真;然后对仿真误差进行溯源分析,并优化传感器结构;最后采用印刷电路板技术制作了传感器样机,并设计相 应的电气系统进行实验验证。 实验结果表明该传感器在 160 mm×160 mm 测量范围内能够实现平面二维位移测量,x 方向节距 内位移误差峰峰值为 32. 8 μm, y 方向节距内位移误差峰峰值为 34. 5 μm。     

Minimal Realization of Linear Graph Models for Multi-physics Systems

An engineering system may consist of several different types of components,belonging to such physical"domains"as mechanical,electrical,fluid,and thermal.It is t...     

INTEGRAL EQUATION METHOD＇S APPLICATION IN HOLE-EDGE STRESS OF COMPOSITE MATERIAL PLATE WITH DIFFERENT SHAPED HOLES

The strength of composite plate with different hole-shapes is always one of the most important but complicated issues in the application of the composite material. The holes will lead to mutations and discontinuity to the structure. So the hole-edge stress concentration is always a serious phenomenon. And the phenomenon makes the structure strength decrease very quickly to form dangerous weak points. Most partial damage begins from these weak points. According to the complex variable functions theory, the accurate boundary condition of composite plate with different hole-shapes is founded by conformal mapping method to settle the boundary condition problem of complex hole-shapes. Composite plate with commonly hole-shapes in engineering is studied by several complex variable stress fimction. The boundary integral equations are founded based on exact boundary conditions. Then the exact hole-edge stress analytic solution of composite plate with rectangle holes and wing manholes is resolved. Both of offset axis loadings and its influences on the stress concentration coefficient of the hole-edge are discussed. And comparisons of different loads along various offset axis on the hole-edge stress distribution of orthotropic plate with rectangle hole or wing manhole are made. It can be concluded that hole-edge with continuous variable curvatures might help to decrease the stress concentration coefficient; and smaller angle of outer load and fiber can decrease the stress peak value.     

Non-monotonic material contrast in scanning ion and scanning electron images

30 keV Ga⁺ focused ion beam induced secondary electron (iSE) imaging was used to determine the relative contrast between several materials. The iSE signal compared from C, Si, Al, Ti, Cr, Ni, Cu, Mo, Ag, and W metal layers does not decrease with an increase in target atomic number Z₂, and shows a non-monotonic relationship between contrast and Z₂. The non-monotonic relationship is attributed to periodic fluctuations of the stopping power and sputter yield inherent to the ion–solid interactions. In addition, material contrast from electron-induced secondary electron (eSE) and backscattered electron (BSE) images using scanning electron microscopy (SEM) also shows non-monotonic contrast as a function of Z₂, following the periodic behavior of the stopping power for electron–solid interactions. A comparison of the iSE and eSE results shows similar relative contrast between the metal layers, and not complementary contrast as conventionally understood. These similarities in the contrast behavior can be attributed to similarities in the periodic and non-monotonic function defined by incident particle–solid interaction theory.     

Application of Feature Extraction through Convolution Neural Networks and SVM Classifier for Robust Grading of Apples

This paper proposes a novel grading method of apples,in an automated grading device that uses convolutional neural networks to extract the size,color,texture,an...     

分布动态载荷识别的抗噪处理

针对正交多项式频域法在用多种响应对矩形薄板进行载荷识别中抗噪性较差的问题,综合运用平均法、矩阵预处理和奇异值截断法等方法对之进行改善,并引入空间映射的思想,将该方法的应用范围拓展为复杂的模型.利用仿真算例,证实了该方法具有较好的抗噪性.     

基于MELTAC-N平台的核电厂安全级DCS环网研究与测试

针对工程实践中环网通讯相关问题的处理缺乏理论基础及国产化安全级DCS平台的开发缺乏成熟经验借鉴问题,对基于MELTAC-N平台核电厂安全级DCS环网的软硬件实现进行了研究。提出了安全级DCS环网双环网冗余设计、光切换开关设计等硬件设计方法,以及以RPR协议为基础,采用全数据收发策略的软件设计方法。在CPR1000安全级DCS平台上对安全级DCS环网的可靠性及实时性进行了评价,并进行了容错能力、响应时间及响应时间稳定性测试验证实验。结果表明,基于MELTAC-N平台安全级DCS环网软硬件设计具有较好的容错能力及响应时间稳定性。     

Short-Term Relay Quality Prediction Algorithm Based on Long and Short-Term Memory

The fraction defective of semi-finished products is predicted to optimize the process of relay production lines, by which production quality and productivity ar...     

End-to-End Multiview Gesture Recognition for Autonomous Car Parking System

The use of hand gestures can be the most intuitive human-machine interaction medium.The early approaches for hand gesture recognition used device-based methods....     

The laboratory simulation of abrasive wear

Abrasive wear has long been recognised as one of the most potentially serious tribological problems facing the operators of many types of plant and machinery; several industrial surveys have indicated that wear by abrasion can be responsible for more than 50% of unscheduled machine and plant stoppages. Locating the operating point of a tribological contact in an appropriate operational ‚map’︁ can provide a useful guide to the likely nature and origins of the surface degradation experienced in use, though care must be exercised in choosing the most suitable parameters for the axes of the plot. Laboratory testing of materials and simulations of machine contacts are carried out for a number of purposes; at one level for the very practical aims of ranking candidate materials or surface hardening treatments in order of their wear resistance, or in an attempt to predict wear lives under field conditions. More fundamentally, tests may be aimed at elucidating the essential physical mechanisms of surface damage and loss, with the longer term aim of building an analytical and predictive model of the wear process itself. In many cases, component surface damage is brought about by the ingress of hard, particulate matter into machine bearing or sealing clearances. These may be running dry although, more usually, a lubricant or service fluid is present at the interface. A number of standardised wear test geometries and procedures have been established for both two- and three-body wear situations, and these are briefly described. Although abrasive wear is often modelled as following an ‚Archard’︁ equation (i.e. a linear increase in material loss with both load and time, and an inverse dependence on specimen hardness) both industrial experience and laboratory tests of particularly lubricated contacts show that this is not always the case: increasing the hardness differential in an abrasively contaminated lubricated pair may not always reduce the rate of damage to the harder surface.     

Limits of topographic measurement by the scanning tunnelling and atomic force microscopes

Parameters describing the topographic character of a surface (height, surface wavelength, slope and curvature) can be derived from equivalent sinusoidal profiles. The response of a surface-measuring instrument may be modelled in terms of instrument parameters such as stylus radius, and scanning range and resolution. The performance of the instrument may then be mapped as a zone in amplitude-wavelength (AW) space to show the sinusoidal profiles it is capable of measuring. In a first-order analysis the STM and AFM are considered as equivalent to contact-stylus instruments with a notional stylus radius equal to the tip radius plus the gap. Comparisons between different instruments and types of instrument are readily made by mapping in AW space. The error arising from convolution of the sinusoidal profile with that of the finite tip may be quantified and plotted as contours in AW space.