Microwave Annealing of High Dose Al<Superscript>+</Superscript>-implanted 4H-SiC: Towards Device Fabrication

High-purity semi-insulating 8° off-axis 〈0001〉 4H-SiC was implanted with Al⁺ at different doses and energies to obtain a dopant concentration in the range of 5 × 10¹⁹–5 × 10²⁰ cm^?3. A custom-made microwave heating system was employed for post-implantation annealing at 2,000 °C for 30 s. Sheet resistance and Hall-effect measurements were performed in the temperature range of 150–700 K. At room temperature, for the highest Al concentration, a minimum resistivity of 3 × 10^?2 Ω cm was obtained, whereas for the lowest Al concentration, the measured resistivity value was 4 × 10^?1 Ω cm. The onset of impurity band conduction was observed at around room temperature for the samples implanted with Al concentrations ≥3 × 10²⁰ cm^?3. Vertical p ⁺-i-n diodes whose anodes were made by 1.5 × 10²⁰ cm^?3 Al⁺ implantation and 2,000 °C/30 s microwave annealing showed exponential forward current–voltage characteristics with two different ideality factors under low current injection. A crossover point of the temperature coefficient of the diode resistance, from negative to positive values, was observed when the forward current entered the ohmic regime.     

Diffusion of interstitial magnesium in dislocation-free silicon

The diffusion of magnesium impurity in the temperature range T = 600–800°C in dislocation-free single-crystal silicon wafers of p-type conductivity is studied. The surface layer of the wafer doped with magnesium by the ion implantation technique serves as the diffusion source. Implantation is carried out at an ion energy of 150 keV at doses of 5 × 10¹⁴ and 2 × 10¹⁵ cm^–2. The diffusion coefficient of interstitial magnesium donor centers (D _i ) is determined by measuring the depth of the p–n junction, which is formed in the sample due to annealing during the time t at a given T. As a result of the study, the dependence D _i (T) is found for the first time. The data show that the diffusion process occurs mainly by the interstitial mechanism.     

Electrical properties of Si:H/<Emphasis Type="Italic">p</Emphasis>-Si structures fabricated by hydrogen implantation

Hydrogenated silicon (Si:H) layers and Si:H/p-Si heterostructures were produced by multiple-energy (3–24 keV) high-dose (5×10¹⁶–3×10¹⁷ cm^?2) hydrogen implantation into p-Si wafers. After implantation, current transport across the structures is controlled by the Poole-Frenkel mechanism, with the energy of the dominating emission center equal to E _c ?0.89 eV. The maximum photosensitivity is observed for structures implanted with 3.2×10¹⁷ cm^?2 of hydrogen and annealed in the temperature range of 250–300°C. The band gap of the Si:H layer E _g ≈2.4 eV, and the dielectric constant ?≈3.2. The density of states near the Fermi level is (1–2)×10¹⁷ cm^?3 eV^?1.     

Formation of Precipitates in Si Implanted with <Superscript>64</Superscript>Zn<Superscript>+</Superscript> and <Superscript>16</Superscript>O<Superscript>+</Superscript> Ions

The results of studying the surface Si layer and precipitate formation in CZ n-Si(100) samples sequentially implanted with ⁶⁴Zn⁺ ions with a dose of 5 × 10¹⁶ cm² and energy of 100 keV and ¹⁶O⁺ ions with the same dose but an energy of 33 keV at room temperature so that their projection paths R_p = 70 nm would coincide are presented. The post-implantation samples are annealed for 1 h in an inert Ar medium in the temperature range of 400–900°C with a step of 100°C. The profiles of the implanted impurities are studied by time-of-flight secondary ion mass spectrometry. The Si surface is visualized using a scanning electron microscope, while the near-surface layer is visualized with the help of maps of elements formed by Auger electron spectroscopy with profiling over depth. The ZnO(002) texture is formed in an amorphized Si layer after the implantation of Zn and O ions. ZnO(102) crystallites of 5 nm in size are found in a recrystallized single-crystalline Si layer after annealing in Ar at 700°C.     

Dislocation-related luminescence in silicon,caused by implantation of oxygen ions and subsequent annealing

Multiple implantation of oxygen ions with energies of 0.1–1.5 MeV at doses of 7 × 10¹³?2 × 10¹⁴ cm^?2 and subsequent annealing in a chlorine-containing atmosphere at 900°C for 4 h give rise to dislocation-related luminescence in p-Si. A p → n conductivity-type conversion is also observed in this case in the surface layer of Si, which indicates that electrically active donor centers are formed in the process. Preliminary heat treatment of wafers covered with an erbium-doped film of tetraethoxysilane (TEOS) in argon at 1250°C for 1 h does not preclude the appearance of dislocation-related luminescence, but affects the parameters of the dislocation-related lines (peak positions and intensities).     

Special features of annealing of radiation defects in irradiated <Emphasis Type="Italic">p</Emphasis>-Si crystals

p-Si single crystals grown by the Czochralski method were studied; the hole concentration in these crystals was p = 6 × 10¹³ cm^?3. The samples were irradiated with 8-MeV electrons at 300 K and were then annealed isochronously in the temperature range T _ann = 100–500°C. The studies were carried out using the Hall method in the temperature range of 77–300 K. It is shown that annealing of divacancies occurs via their transformation into the B _s V ₂ complexes. This complex introduces the energy level located at E _v + 0.22 eV into the band gap and is annealed out in the temperature range of 360–440°C. It is assumed that defects with the level E _v + 0.2 eV that anneal out in the temperature range T _ann = 340–450°C are multicomponent complexes and contain the atoms of the doping and background impurities.     

Hot-implantation of nitrogen donors into p- type α-SiC and characterization of n+-p junction

N⁺ implantation into p-type a-SiC (6H-SiC, 4H-SiC) epilayers at elevated temperatures was investigated and compared with implantation at room temperature (RT). When the implant dose exceeded 4 × 10₁₅ cm₋₂, a complete amorphous layer was formed in RT implantation and severe damage remained even after post implantation annealing at 1500°C. By employing hot implantation at 500~800°C, the formation of a complete amorphous layer was suppressed and the residual damage after annealing was significantly reduced. For implant doses higher than 10¹⁵ cm⁻², the sheet resistance of implanted layers was much reduced by hot implantation. The lowest sheet resistance of 542Ω/ was obtained by implantation at 500 ~ 800°C with a 4 × 10¹⁵ cm⁻² dose. Characterization of n⁺-p junctions fabricated by N⁺ implantation into p-type epilayers was carried out in detail. The net doping concentration in the region close to the junction showed a linearly graded profile. The forward current was clearly divided into two components of diffusion and recombination. A high breakdown voltage of 615 ∼ 810V, that is almost an ideal value, was obtained, even if the implant dose exceeded 10¹⁵ cm⁻². By employing hot implantation at 800°C, the reverse leakage current was significantly reduced.     

Microwave Dielectric Properties of BiCu<Subscript>2</Subscript>PO<Subscript>6</Subscript> Ceramics with Low Sintering Temperature

A BiCu₂PO₆ microwave dielectric ceramic was prepared using a solid-state reaction method. As the sintering temperature increased from 800°C to 880°C, the bulk density of BiCu₂PO₆ ceramic increased from 6.299 g/cm³ to 6.366 g/cm³; the optimal temperature was 860°C. The best microwave dielectric properties [permittivity (? _r ) = ～16, a quality factor (Q × f) = ～39,110 GHz and a temperature coefficient of resonant frequency (τ _f ) = ～?59 ppm/°C] were obtained in the ceramic sintered at 860°C for 2 h. Then, TiO₂ with a positive τ _f (～+400 ppm/°C) was added to compensate the τ _f value. The composite material was found to have a near-zero τ _f (+2.7 ppm/°C) and desirable microwave properties (? _r  = 19.9, Q × f = 24,885 GHz) when synthesized at a sintering temperature of 880°C. This system could potentially be used for low-temperature co-fired ceramics technology applications.     

Electrical properties of InAs irradiated with protons

The results of studying the electrical properties of InAs irradiated with 5-MeV H⁺ ions at a dose of 2×10¹⁶ cm^?2 are reported. It is shown that, independently of the doping level and the conductivity type of the as-grown InAs, InAs always has the n⁺-type conductivity after irradiation (n≈(2–3)×10¹⁸ cm^?3). The phenomenon of pinning of the Fermi level in the irradiated material is discussed. The thermal stability of radiation damage in InAs subjected to postirradiation annealing at temperatures as high as 800°C was studied.     

Influence of the annealing temperature on the ferroelectric properties of niobium-doped strontium–bismuth tantalate

Characteristics of ferroelectric thin films of niobium-doped strontium–bismuth tantalate (SBTN), which were deposited by magnetron sputtering on Pt/TiO₂/SiO₂/Si substrates, are investigated. To form the ferroelectric structure, deposited films were subjected to subsequent annealing at 700–800°C in an O₂ atmosphere. The results of X-ray diffraction showed that the films immediately after the deposition have an amorphous structure. Annealing at 700–800°C results in the formation of the Aurivillius structure. The dependences of permittivity, residual polarization, and the coercitivity of SBTN films on the modes of subsequent annealing are established. Films with residual polarization 2P_r = 9.2 µC/cm², coercitivity 2E_c = 157 kV/cm, and leakage current 10^–6 A/cm² are obtained at the annealing temperature of 800°C. The dielectric constant and loss tangent at frequency of 1.0 MHz were ε = 152 and tan δ = 0.06. The ferroelectric characteristics allow us to use the SBTN films in the capacitor cell of high density ferroelectric random-access non-volatile memory (FeRAM).     

Electrical and optical activation studies of Si-implanted GaN

Comprehensive and systematic electrical and optical activation studies of Si-implanted GaN were made as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1×10¹³ cm^?2 to 5×10¹⁵ cm^?2 at room temperature. The samples were proximity-cap annealed from 1050°C to 1350°C with a 500-Å-thick AlN cap in a nitrogen environment. The optimum anneal temperature for high dose implanted samples is approximately 1350°C, exhibiting nearly 100% electrical activation efficiency. For low dose (≤5×10¹⁴ cm^?2) samples, the electrical activation efficiencies continue to increase with an anneal temperature through 1350°C. Consistent with the electrical results, the photoluminescence (PL) measurements show excellent implantation damage recovery after annealing the samples at 1350°C for 20 sec, exhibiting a sharp neutral-donor-bound exciton peak along with a sharp donor-acceptor pair peak. The mobilities increase with anneal temperature, and the highest mobility obtained is 250 cm²/Vs. The results also indicate that the AlN cap protected the implanted GaN layer during high-temperature annealing without creating significant anneal-induced damage.     

Photoluminescence Studies of Si-Doped Epitaxial GaAs Films Grown on (100)- and (111)A-Oriented GaAs Substrates at Lowered Temperatures

The electrical properties and photoluminescence features of uniformly Si-doped GaAs layers grown on GaAs substrates with the (100) and (111)A crystallographic orientations of the surface are studied. The samples are grown at the same As₄ pressure in the growth temperature range from 350 to 510°C. The samples grown on GaAs(100) substrates possess n-type conductivity in the entire growth temperature range, and the samples grown on GaAs(111)A substrates possess p-type conductivity in the growth temperature range from 430 to 510°C. The photoluminescence spectra of the samples exhibit an edge band and an impurity band. The edge photoluminescence band corresponds to the photoluminescence of degenerate GaAs with n- and p-type conductivity. The impurity photoluminescence band for samples on GaAs(100) substrates in the range 1.30–1.45 eV is attributed to V_As defects and Si_As–V_As defect complexes, whose concentration varies with sample growth temperature. Transformation of the impurity photoluminescence spectra of the samples on GaAs(111)A substrates is interpreted as being a result of changes in the V_As and V_Ga defect concentrations under variations in the growth temperature of the samples.     

Special features of formation and characteristics of Ni/21<Emphasis Type="Italic">R</Emphasis>-SiC Schottky diodes

The Ni/n-21R-SiC(0001) and \(Ni/n - 21R - SiC(000\bar 1)\) surface-barrier structures formed on 21R-SiC crystals doped to a concentration of (1–2)×10¹⁸ cm^?3 and grown by the Lely method were investigated prior to and after rapid thermal annealing (RTA) in vacuum (10^?2 Pa) in the temperature range of 450–1100°C. Using X-ray diffraction analysis and Auger analysis, it is shown that cubic NiSi₂ and orthorhombic δ-Ni₂Si and NiSi silicides coexist with pure Ni in starting samples. The RTA brings about a polymorphic transformation of these phases, which causes the transformation of a barrier contact to a rectifying one independently of the SiC face type, even at T?600°C. The physicochemical mechanisms of degradation of these barrier structures are discussed.     

Iodine Doping of CdTe and CdMgTe for Photovoltaic Applications

Iodine-doped CdTe and Cd_1?x Mg _x Te layers were grown by molecular beam epitaxy. Secondary ion mass spectrometry characterization was used to measure dopant concentration, while Hall measurement was used for determining carrier concentration. Photoluminescence intensity and time-resolved photoluminescence techniques were used for optical characterization. Maximum n-type carrier concentrations of 7.4 × 10¹⁸ cm^?3 for CdTe and 3 × 10¹⁷ cm^?3 for Cd_0.65Mg_0.35Te were achieved. Studies suggest that electrically active doping with iodine is limited with dopant concentration much above these values. Dopant activation of about 80% was observed in most of the CdTe samples. The estimated activation energy is about 6 meV for CdTe and the value for Cd_0.65Mg_0.35Te is about 58 meV. Iodine-doped samples exhibit long lifetimes with no evidence of photoluminescence degradation with doping as high as 2 × 10¹⁸ cm^?3, while indium shows substantial non-radiative recombination at carrier concentrations above 5 × 10¹⁶ cm^?3. Iodine was shown to be thermally stable in CdTe at temperatures up to 600°C. Results suggest iodine may be a preferred n-type dopant compared to indium in achieving heavily doped n-type CdTe.     

The electrical and optical properties of InP irradiated with high integrated fluxes of neutrons

The results of studying the electrical properties and optical-absorption spectra of InP irradiated with fast neutrons (E > 0.1 MeV and D_f.n ≤ 10¹⁹ cm^?2) and full-spectrum reactor neutrons (D_th.n ≤ 2.1 × 10¹⁹ cm^?2; the ratio of the fluxes was ?_th.n/?_f.n ≈ 1) are reported. The variations in these properties resulting from postirradiation annealing at temperatures as high as 900°C are also studied. The results of the optical studies indicate that, in InP irradiated heavily with neutrons, free charge carriers appear only after annealing at temperatures higher than 500°C. The efficiency of neutron-initiated transmutational doping and the quality of transmutationdoped InP are assessed.     

Specific features of the electrophysical parameters of NTD Si treated under different conditions of heat treatment

The effect of thermal annealing in the temperature range 800 ? T_ann ? 1200°C and of two cooling rates (v_cl = 1 and 15°C min^–1) upon a change in the concentration of charge carriers in the conduction band, their mobility, and tensoresistance in n-Si crystals doped by nuclear transmutation and doped with phosphorus impurity via the melt (during growth by the Czochralski method) was investigated. It is found that, after annealing of all of the crystals at T_ann = 1050–1100°C, the concentration of charge carriers is increased by a factor of 1.3–1.7 compared to the initial concentration (irrespective of the method of doping). The specific annealing-temperature-dependent effect of cooling with a rate of 15°C min^–1 on the properties of transmutation-doped n-Si:P crystals is detected.     

The electrical and optical properties of InAs irradiated with electrons (∼2 MeV): The energy structure of intrinsic point defects

The results of experimental studies of the electrical and optical properties of n-and p-InAs crystals irradiated with electrons at an energy of ～2 MeV and doses as high as D = 1 × 10¹⁹ cm^?2 are reported. Specific features of the annealing (at temperatures as high as 800°C) of radiation defects are also reported. The electronic structure of nonrelaxed V_As, V_In, As_In, In_As defects is calculated. A relation between the electrical properties and the Fermi level position in irradiated InAs on the one hand and the electronic structure of the intrinsic defects and special features of the energy-band spectrum of InAs on the other hand is discussed.     

Electroluminescent properties of strained <Emphasis Type="Italic">p</Emphasis>-Si LEDs

Electroluminescence (EL) in the range 1.0–1.65 μm from LEDs strained by four-point bending at 700°C has been studied at currents up to 400 mA. The LEDs are fabricated by implantation of B and P ions into p-Si wafers grown by the floating-zone (FZ-Si) and Czochralski (Cz-Si) methods followed by annealing at 700 and 1100°C. The intensity of dislocation-related EL is higher in the FZ-Si than in the Cz-Si samples. It is also higher in the samples subjected to low-temperature post-implantation annealing than in those that underwent the same annealing at a high-temperature. The current-related transformation of the FZ-Si EL spectra is described well by eight Gaussian lines. The peak positions are 1.22, 1.244, 1.26, 1.316, 1.38, 1.42, 1.52 and 1.544 μm, and they are independent of current. Dependences of the integral intensity and line width on current are studied.     

Electrical properties of ZnSiAs<Subscript>2</Subscript> irradiated with protons

The electrical properties of p-ZnSiAs₂ irradiated with protons (energy E = 5 MeV, dose D ≤ 2 × 10¹⁷ cm^?2) are studied. Experimental data and results of calculations are used to estimate the limiting position of the Fermi level in the band gap of the irradiated material (at the midgap E _g/2). The thermal stability of radiation defects in the temperature range from 20 to 610°C was analyzed.     

CdHgTe heterostructures for new-generation IR photodetectors operating at elevated temperatures

The parameters of multilayer Cd_xHg_1–xTe heterostructures for photodetectors operating at wavelengths of up to 5 μm, grown by molecular-beam epitaxy (MBE) on silicon substrates, are studied. The passivating properties of thin CdTe layers on the surface of these structures are analyzed by measuring the C–V characteristics. The temperature dependences of the minority carrier lifetime in the photoabsorption layer after growth and thermal annealing are investigated. Samples of p ⁺–n-type photodiodes are fabricated by the implantation of arsenic ions into n-type layers, doped with In to a concentration of (1–5) × 10¹⁵ cm^–3. The temperature dependences of the reverse currents are measured at several bias voltages; these currents turn out to be almost two orders of magnitude lower than those for n ⁺–p-type diodes.