低损伤ICP刻蚀技术提高GaN LED出光效率

首先分析了在制作GaN基LED时,采用干法刻蚀技术会对材料的表面和量子阱有源区造成损伤,影响了GaN基LED的内量子效率。针对这个问题,研究实验采用感应耦合等离子反应刻蚀(ICP-RIE)技术,分别选择了氯气/三氯化硼(Cl2/BCl3)气体体系和氯气/氩气(Cl2/Ar)气体体系,通过优化射频功率、ICP功率、气体流量以及相应的真空度,得到了良好的刻蚀端面,对于材料造成的损伤较低,得到更好的I-V特性。实验结果表明,采用低损伤的偏压功率刻蚀后制作的LED器件,出光功率提升一倍以上,同时采用Cl2/Ar气体体系,改善了器件的I-V特性,有效提高了LED的出光效率。     

InGaN/GaN LEDs with a Si-doped InGaN/GaN short-period superlattice tunneling contact layer

Nitride-based light-emitting diodes (LEDs) with Si-doped n⁺-In_0.23Ga_0.77N/GaN short-period superlattice (SPS) tunneling contact top layer were fabricated. It was found that although the measured specific-contact resistance is around 1 × 10⁻² Ω-cm² for samples with an SPS tunneling contact layer, the measured specific-contact resistance is around 1.5×10⁰ Ω-cm² for samples without an SPS tunneling contact layer. Furthermore, it was found that one could lower the LED-operation voltage from 3.75 V to 3.4 V by introducing the SPS structure. It was also found that the LED-operation voltage is almost independent of the CP₂Mg flow rate when we grow the underneath p-type GaN layer. The LED-output intensity was also found to be larger for samples with the SPS structure.     

Electron beam-induced current investigation of GaN Schottky diode

In this article, we report the electron beam-induced current (EBIC) measurements in a GaN Schottky diode performed in the line-scan configuration. A theoretical model with an extended generation source was used to accurately extract some minority carrier transport properties of the unintentionally doped n-GaN layer. The minority hole diffusion length is found to increase from ∼0.35 μm near the junction to ∼1.74 μm at the bulk regions. This change is attributed to an increase of the carrier lifetime caused by the polarization effects, which are preponderant in this component. For depth distances exceeding 0.65 μm, it is shown that the measured current is produced by the reabsorption recombination radiation process. This corresponds to an absorption coefficient of 0.178 μm⁻¹, in good agreement with the optical absorption measurement.     

Growth and Characterizations of GaN-Based LEDs Grown on Wet-Etched Stripe-Patterned Sapphire Substrates

The material and electrical properties of GaN-based light-emitting diodes (LEDs) grown on wet-etched stripe-patterned substrates were investigated. Footprint-like patterns, located directly above the inclined groove sidewalls, were found on the as-grown LED surface. Cross-sectional transmission electron microscopy (TEM) showed that ‘tumor’-like structures with poor crystal quality were initiated on the inclined sidewalls, seeding dislocation bundles in the subsequently grown crystal. The high dislocation density slowed down the growth above the inclined sidewall, resulting in the uneven morphology. The fabricated devices showed over 30% enhancement in light output power as a result of improvements in both internal and extraction efficiencies.     

p-GaN与ITO欧姆接触的研究

针对GaN基发光二极管中p-GaN与透明导电薄膜ITO之间的接触进行研究,尝试找出透明导电层ITO的优化制程条件。将在不同氧流量、ITO厚度及退火温度下制备的透明电极ITO薄膜应用于GaN基发光二极管,来增加电流扩展,减小ITO与p-GaN欧姆接触电阻,降低LED工作电压及提高透过率、增强LED发光亮度。将ITO薄膜应用于218μm×363μm GaN基发光二极管LED,分析其在20 mA工作电流条件下正向电压和光输出功率的变化,在优化条件下制得的蓝光LED在直流电流20 mA下的正向电压3.23 V,光输出效率为23.25 mW。     

Optimized doping and contact scheme for low-voltage 275-nm deep ultraviolet LEDs

Deep ultraviolet light-emitting diode structures with a peak wavelength of 275 nm, as well as individual AlGaN:Mg layers, were grown by metalorganic chemical vapor deposition on (0001) silicon carbide. Control of the Mg profile in the devices reduced unwanted Mg-related emission at 320 nm to 1/224th of that emitted at the peak wavelength. An additional peak at 410 nm was observed to be related to oxygen incorporation in the film and confirmed with secondary ion mass spectroscopy (SIMS). Also investigated in an effort to improve hole injection were aluminum content, layer thickness, V/III ratio, activation temperature, and properties of the GaN:Mg contact layer and transparent contact metal stack. By optimizing this and other layers of the device, output powers of 0.84 mW at 1.3 A were obtained from packaged devices, with forward voltages as low as 4.9 V at 20 mA.     

晶圆键合技术在LED应用中的研究进展

简要介绍了晶圆键合技术在发光二极管(LED)应用中的研究背景,分别论述了常用的黏合剂键合技术、金属键合技术和直接键合技术在高亮度垂直LED制备中的研究现状,包括它们的材料组成和作用、工艺步骤和参数以及优缺点.其中,黏合剂键合是一种低温键合技术,且易于应用、成本低、引入应力小,但可靠性较差;金属键合技术能提供高热导、高电导的稳定键合界面,与后续工艺兼容性好,但键合温度高,引入应力大,易造成晶圆损伤;表面活化直接键合技术能实现室温键合,降低由于不同材料间热失配带来的负面影响,但键合良率有待提高.     

Fabrication and Emission Properties of a n-ZnO/p-GaN Heterojunction Light-Emitting Diode

报道了n-ZnO/p-GaN异质结构发光二极管的制备及其发光特性.采用金属有机气相外延技术在Mg掺杂p型GaN衬底上外延n型ZnO薄膜以形成p-n结.实验发现在一定配比的HF酸和NH4Cl溶液中,腐蚀深度和腐蚀时间呈线性关系,并且二氧化硅和ZnO的腐蚀速率得到很好的控制,这对器件制备的可靠性非常重要.电流-电压(I-V)特性测试显示该器件结构具有明显的整流特性.室温下,在正反向偏压状态下都可用肉眼观察到电致发光现象.同时,通过与光致发光谱进行比较,对电致发光谱中发光峰的起源和发光机制进行了探讨.     

InGaN/GaN multiple quantum well green light-emitting diodes prepared by temperature ramping

High-quality InGaN/GaN multiple-quantum well (MQW) light-emitting diode (LED) structures were prepared by a temperature-ramping method during metal-organic chemical-vapor deposition (MOCVD) growth. Two photoluminescence (PL) peaks, one originating from well-sensitive emission and one originating from an InGaN quasi-wetting layer on the GaN-barrier surface, were observed at room temperature (RT). The observation of high-order double-crystal x-ray diffraction (DCXRD) satellite peaks indicates that the interfaces between InGaN-well layers and GaN-barrier layers were not degraded as we increased the growth temperature of the GaN-barrier layers. With a 20-mA and 160-mA current injection, it was found that the output power could reach 2.2 mW and 8.9 mW, respectively. Furthermore, it was found that the reliability of the fabricated green LEDs prepared by temperature ramping was also reasonably good.     

深能级对白光LED的电致发光和I-V特性的影响

为了研究一种无荧光粉的单芯片白光发光二极管(LED)的光电性质,实际测量了它的升温电致发光光谱和升温电流-电压(I-V)特性,并测量了相似结构的蓝光LED以作对比。实验发现白光LED的电致发光光谱中有一个与有源区中的深能级相关的较宽的长波长发光峰,根据这个发光峰的强度与温度之间的依赖关系,通过数据拟合,得到了深能级的平均激活能,约为199 meV。由于有源区中存在大量深能级,也对白光LED的I-V特性产生一定影响,有源区中的深能级成为额外的载流子源,使白光LED的I-V特性表现出独特的性质。     

Temperature measurement in a silicon carbide light emitting diode by raman scattering

Raman spectra of the transverse-optic phonon mode from a light-emitting layer of a SiC diode have been measured. The phonon peak broadens and shifts to lower frequency with the rise of temperature when the injected current is increased. The frequency shift was compared with a result for bulk reference measured separately at various temperatures. We found that the temperature of the light-emitting layer reached 350°C at a current density of ∼200 A/cm².     

集成双稳半导体激光器输出光强的线性稳定性分析

从速率方程出发,利用线性稳定性分析方法,分析了单片集成双稳半导体激光器输出光强的稳定性。结果表明此类双稳半导体激光器具有很大的双稳范围。     

基于MAX1916的亮度可调LED驱动电路

发光二极管(LED)具有耗能少、寿命长、成本低等特点,近年来得到广泛应用。介绍了一种基于MAX1916芯片的亮度可调的LED驱动电路,利用改变脉宽的方法来改变LED的发光强度。     

Characteristics of Green Light-Emitting Diodes Using an InGaN:Mg/GaN:Mg Superlattice as p-Type Hole Injection and Contact Layers

Mg-doped InGaN/GaN p-type short-period superlattices (SPSLs) are developed for hole injection and contact layers of green light-emitting diodes (LEDs). V-defect-related pits, which are commonly found in an InGaN bulk layer, can be eliminated in an InGaN/GaN superlattice with thickness and average composition comparable to those of the bulk InGaN layer. Mg-doped InGaN/GaN SPSLs show significantly improved electrical properties with resistivity as low as ∼0.35 ohm-cm, which is lower than that of GaN:Mg and InGaN:Mg bulk layers grown under optimized growth conditions. Green LEDs employing Mg-doped InGaN/GaN SPSLs for hole injection and contact layers have significantly lower reverse leakage current, which is considered to be attributed to improved surface morphology. The peak electroluminescence intensity of LEDs with a SPSL is compared to that with InGaN:Mg bulk hole injection and contact layers.     

发光二极管的低频电容特性

通过自建装置精确测试了发光二极管(LED)的低频(小于102Hz)电学特性。电学测量表明,所有LED在低频下都表现出明显的负电容(NC)现象,且频率越低NC现象越明显。调制发光测量表明,相对发光强度在低频下表现出明显饱和现象,并且随频率增加而减小。比较电学和光学的测量结果可以证实,辐射发光是产生NC现象的主要原因。通过对LED电学测量结果的详细分析得出了NC随电压和频率的变化关系式。     

无凹槽AlGaN/GaN肖特基势垒二极管正向电流输运机制

研究了无凹槽AlGaN/GaN肖特基势垒二极管(SBD)的正向电流输运机制。分别采用Ni/Au和TiN作为阳极金属材料制备了无凹槽AlGaN/GaN SBD,对比了两种SBD的直流特性。并通过测量器件的变温I-V特性,研究了器件的正向电流输运机制。结果表明,TiN-SBD(0.95 V@1 mA·mm^-1)与Ni/Au-SBD(1.15 V@1 mA·mm^-1)相比实现了更低的开启电压,从而改善了正向导通特性。研究发现两种SBD的势垒高度和理想因子都强烈依赖于环境温度,通过引入势垒高度的高斯分布模型解释了这种温度依赖性,验证了正向电流输运机制为与势垒高度不均匀分布相关的热电子发射机制。     

Remarkable improvement in emission efficiency of ZnCdSe/Zn(S)Se LEDs by thermal annealing

Thermal annealing effects on optical and electrical characteristics for p-type and n-type II–VI compound layers (ZnSe, ZnSSe, and MgZnSSe) and on the emission efficiency of ZnCdSe/Zn(S)Se 6 quantum well (QW) light emitting diodes (LEDs) grown by molecular beam epitaxy were investigated. It was clarified that serious degradation of optical and electrical characteristics was not observed up to an annealing temperature of 400°C. In the case of p-MgZnSSe, the maximum permitted annealing temperature was lower than that of Zn(S)Se. The light output of the ZnCdSe/Zn(S)Se multi QW LEDs was enhanced by a factor of three at optimum thermal annealing conditions. The study suggests that this thermal effect for LEDs was produced by the improved crystal quality of ZnCdSe QWs by thermal annealing.     

Mercury cadmium telluride-based resonant cavity light emitting diode

A CdHgTe resonant cavity light emitting diode (RCLED) is proposed as a new infrared emitter. The device is prepared by molecular beam epitaxy on a CdZnTe substrate. A 10.5 periods Bragg mirror is first deposited. The cavity material is made of Cd_0.75Hg_0.25Te and contains a wide well (50 nm) designed to emit at 3.2 μm. The last three periods of the mirror are n-type doped while the cavity material is covered by a thin p-type CdZnTe layer. A gold layer closes the cavity, serving as the second mirror of a Fabry-Perot cavity tuned around 3.18 urn. It also provides an ohmic contact to the p-region. Under forward bias, the emission spectrum displays a narrow peak (8 meV full width at half maximum) corresponding to the cavity resonance. The position and linewidth of this line are independent of temperature. The directivity of the diode is also improved with respect to a conventional emitter, in agreement with theoretical expectations. Taking advantage of the spectral properties of the RCLED a new multispectral device has been fabricated.