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<正>目前,美国海军水面舰艇和潜艇是采用4种屈服强度的轧制钢板建造的,包括普通或中等强度(屈服强度为220~234MPa和314MPa)的HTS钢,高屈服强度(552MPa,原文献为80ksi;ksi为英制单位,读作:千磅/平方英寸,1ksi约为6.9MPa)的HY-80和HSLA-80钢;超高屈服强度(690MPa,原文献为100ksi)的HY-100和HSLA-100钢。 相似文献
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对C-276镍合金管材进行冷轧,并进行了不同温度的退火处理,研究了冷轧加工和退火处理对镍合金管材显微组织和力学性能的影响。结果表明:管材经50%变形量冷轧加工后,晶粒破碎,显微组织沿轧制方向呈现纤维状,抗拉强度1210 MPa,屈服强度1000 MPa,伸长率22%;1000℃退火时,显微组织处于回复阶段,仍为拉长的纤维状,抗拉强度为1160 MPa,屈服强度815 MPa,伸长率26%;1050℃退火时,轧制流线消失,部分组织发生再结晶,抗拉强度1050 MPa,屈服强度750 MPa,伸长率32%;1100℃退火时,显微组织发生完全再结晶,抗拉强度868 MPa,屈服强度397 MPa,伸长率53%,强度大幅下降,伸长率大幅上升;1150℃退火时,晶粒与1100℃退火相比没有明显变化,力学性能稳定,抗拉强度、屈服强度和伸长率分别为838 MPa、379 MPa和54.5%。 相似文献
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以焊接位置的抗剪强度为表征参数,将推拉力计测量推力换算成芯片焊点抗剪强度,对倒装LED封装中回流焊工艺参数进行了优化。试验结果表明,当回流炉温度设计不合理时,抗剪强度在30 MPa以下的数量比例达到17%,30~35 MPa占11%,35~40 MPa占11%,40~45 MPa占15%,45 MPa以上的个数仅占46%;而采用优化后的温度时,不存在35 MPa以下的抗剪强度,35~40 MPa占5%,40~45 MPa占6%,45 MPa以上的数量达到89%。可以看出不同的焊接温度设置对倒装LED芯片封装焊接抗剪强度能产生极大的影响,通过优化的回流焊工艺参数,可以有效的减小焊接面内空洞的大小及数量。 相似文献
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借助层流冷却工艺,对600 MPa高强度钢进行超快冷却,研究其抗拉强度、屈服强度和断后伸长率等力学性能的变化。结果表明,超快冷条件使钢的屈服强度和抗拉强度分别提高了90MPa和60 MPa,强度和韧性得到了提高。 相似文献
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《热加工工艺》2021,(3)
在2150热连轧生产线上对10.03 mm厚电阻焊石油套管用高强钢进行了研制。成分设计采用中低碳加少量Cr元素,提高淬透性;采用纯净钢冶炼、170 mm板坯连铸和轻压下工艺进行了试制。最终实物的夹杂物水平低于1.0级。热轧态卷板的屈服强度为380~450 MPa,抗拉强度为600~630 MPa;制管后钢管屈服强度升高较大,屈服强度达到480~520 MPa,抗拉强度达到600~650 MPa;钢管高温淬火后400~430℃回火,屈服强度达到850~880 MPa,抗拉强度950~980 MPa,满足API SPEC 5CT标准中规定的P110钢级;钢管高温淬火后550~590℃回火,屈服强度达到600~620 MPa,抗拉强度达到680~700 MPa,满足API SPEC 5CT标准中规定的L80钢级。 相似文献
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高强度Mg-Zn-Ca-Al合金的研究 总被引:1,自引:0,他引:1
采用铜模铸造法制备了Mg80Zn16-xCa4Alx(x=2、4、6)和Mg75Zn17Ca4Al4高强度镁合金,分别采用扫描电镜(SEM)、X射线衍射仪(XRD)和万能力学实验仪研究了合金的组织、断口形貌、相组成和力学性能.试验结果表明.Mg80Zn16-xCaAlx(x=2、4、6)和Mg75Zn17Ca4Al4合金的压缩强度分别为560 MPa、560MPa、540MPa和635 MPa,屈服强度分别为310MPa、310MPa、330MPa和600MPa.合金具有高达2.67×105 N·m·kg-1的比强度,Mg75Zn17Ca4Al4合金的屈服强度是稀土高强度镁合金断裂强度的2倍.其他合金的屈服强度与稀土高强度镁合金的断裂强度相当.所研究的系列镁合金是目前所报道的强度和塑性最高的不含过渡族金属的镁合金. 相似文献
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深冷处理对Al-Fe-V-Si耐热铝合金力学性能的影响 总被引:1,自引:0,他引:1
研究了深冷处理对喷射沉积耐热铝合金8009的影响。结果表明,深冷处理合金的室温强度从405.9MPa rjymgc 453.4MPa,高温强度从196.8MPa提高到208.4MPa,同时晶体(111)面衍射明显加强。 相似文献
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通过拉伸、硬度及导电率测试等方法,系统探究了6005A铝合金固溶冷却后停放时间对型材弯曲性能及时效延迟时间对合金型材性能的影响。研究表明,6005A铝合金固溶后停放48 h之内,合金的强度快速升高,抗拉和屈服强度分别从140.5 MPa和37 MPa升至207 MPa和96 MPa;硬度从43.6 HV升至66 HV。杯突值和加工硬化指数n值的变化指出,6005A铝合金最佳的固溶后停放时间不应超过24 h。时效延迟时间在3 h之内的铝合金的性能变化明显,抗拉强度和屈服强度从293.3 MPa和277 MPa下降至262 MPa和245 MPa,伸长率从15%降至12.6%,最佳的时效延迟时间应小于3 h;延迟时间超过10 d后,抗拉和屈服强度呈“断崖式”下降至256 MPa和231 MPa。 相似文献
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研究了在1260℃烧结时,烧结时间对Ti-6Al-4V烧结坯力学性能的影响.结果表明平均晶粒尺寸为45 μm的氢化-脱氢粉末样品在1 260C烧结3 h~6 h,其相对密度为95.6%~96.7%、拉伸强度648 MPa~686 MPa、屈服强度526 MPa~615 MPa,但延伸率仅小于4%.90%气雾化(晶粒尺寸为32.5 μm)和10%氢化-脱氢混合粉末样品在1 260℃烧结2 h~6 h,其相对密度大于95%、拉伸强度800 MPa~848 MPa、屈服强度712 MPa~762 MPa、延伸率7.4%~9.5%.混合粉末样品的力学性能几乎达到美国ASTM粉末冶金的标准. 相似文献
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LIU Changqing LI Meishuan JIN Zhujing WU Weitao Corrosion Science Laboratory Institute of Corrosion Protection of Metals Academia Sinica Shenyang China research assistant Institute of Corrosion Protection of Metals Academia Sinica Shenyang China 《金属学报(英文版)》1993,6(8):126-129
The cantilever bending test,particularly monitored by an acoustic emission technique,was adopted to measure the tensile and interfacial adhesive strengths of the HCD ionplated fine TiN film on pure Ti substrate.The behaviors of film damaging were foundto be characterized by:an internal tensile stress which exceeded its tensile strength forTiN facing upward,and a shearing stress along film substrate interface which exceededits adhesive strength for TiN facing downward.The measured tensile and adhcsivestrengths are 603 and 242 MPa respectively. 相似文献
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偏压和氮分压对TiN膜层结构和膜/基体系性能的影响 总被引:4,自引:1,他引:3
采用多弧离子镀工艺在钛合金或低碳钢基材上制备TiN薄膜,研究了不同偏压及不同氮分压下制备的薄膜相结构、残余应力、膜/基体系硬度、膜/基结合及其摩擦磨损行为.结果表明:偏压影响TiN晶粒的择优取向,偏压绝对值越大则薄膜内部的残余应力也越大;偏压过高或过低都会降低薄膜与基材之间的结合强度,从而影响其摩擦学性能.氮分压上升,TiN熔滴粒度变大,Ti2N相减少,导致薄膜硬度提高;由过高或过低氮分压制备的膜/基体系在划痕试验中测得的临界载荷均较小;随着氮分压的增加,在试验范围内样品的摩擦因数下降但耐磨性并未获得预期的提高. 相似文献
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This investigation examined how titanium ion implantation pre-treatment affects the residual stress of TiN coatings on M2 high-speed steel. Ions were implanted by metal plasma ion implantation. The adhesion strength of the TiN coatings was enhanced by pre-treatment that implanted Ti into the M2 tool steel substrate. The implanted substrate functioned as a buffer layer between the deposited TiN and the tool steel substrate, resulting in variations of the residual stress. The residual stress determined by glancing-angle XRD demonstrates that the deposited TiN films on ion-implanted substrates exhibited reduced compressive stress, from − 3.95 to − 2.41 GPa, which corresponded to a decrease in the grain size of the TiN films. The texture of the TiN film was clearly transformed from the preferred orientation of (220) to (111), subsequently enhancing wear resistance against a tungsten ball. 相似文献
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QI Xuan 《中国有色金属学会会刊》2000,10(3)
1 INTRODUCTIONTheresidualstressinfilmshasimportantinfluenceonthepropertiesofafilm/substratesystem[1].Previousresearch[2]onTiC/AlrevealedthatthemagnitudeofresidualcompressivestressinTiCthinfilmsisasgreatas10GPa,whichdecreasesremarkablywiththeincreaseoftheth… 相似文献
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Ming Xu Liuhe Li Youming Liu Xun Cai Paul K. Chu 《Surface & coatings technology》2007,201(15):6707-6711
Nitrogen was implanted into aluminum substrate prior to magnetron sputtering of TiN films to introduce a modified layer between the TiN film and Al substrate. In another sample, a Ti interlayer was produced on the untreated substrate by means of magnetron sputtering. From the load-displacement curves obtained by the nano-indentation tests, the ring-like cracks appeared at 38 mN on the TiN/N+-implanted aluminum sample, 25 mN on the TiN/Ti/aluminum sample, and 18 mN on the TiN/untreated aluminum sample. The finite element method (FEM) was used to analyze the stress distribution at the interface of the various samples. The decline in the film base tensile stress and shear stress revealed the advantages of the pre-implanted substrate. All the numerical simulation results are consistent with the increased loading capacity obtained from the load-displacement curves. 相似文献
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采用PVD和CVD技术制备Cu/TiN/PI试样,研究表明,TiN薄膜可以有效地阻挡Cu向PI基板内部扩散,CVD工艺制备的Cu膜内部残余应力很小,Cu膜有相对高的结合强度;而PVD制备的Cu膜,在有TiN阻挡层存在的情况下,Cu膜内存在拉应力,拉应力降低了Cu膜结合强度,300℃退火可以消除膜内残余应力,结合强度提高。 相似文献
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The Effect of Diffusion Barrier and Bombardment on Adhesive Strength of CuCr Alloy Films 总被引:1,自引:0,他引:1
WANG Jian-fengl SONG Zhong-xiao XU Ke-wei'''' WANG Yuan'''' . State Key Laboratory for Mechanical Behavior of Materials Xi''''an Jiaotong University Xi''''an China . Key Lab for Physical Electronics Devices Ministry of Education Xi ''''an Jiaotong University Xi''''an China 《材料热处理学报》2004,25(5)
COPPER is a highly promising alternative material toaluminum-based alloys for the new generation of ULSIcircuits owing to its low electrical resistivity and highelectromigration resistance1.However,Cu line or filmcannot completely show its advantages since Cu caneasily diffuse into silicon substrate and the adhesivestrength between Cu and Si is not well enough in somecases.To alloy pure copper with small amounts ofsolutes can not only enhance the electromigrationresistance but also improv… 相似文献
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热处理对PI基板铜薄膜金属化TiN阻挡层的影响 总被引:1,自引:0,他引:1
聚酰业胺(PI)材料具有介电常数低,分解温度高及化学稳定性好等优点,是很有前途的电子封装材料。Cu具有低的电阻和高的抗电迁移能力,足PI基板金属化的首选材料。采用物理气相沉积(PVD)方法在PI基板上沉积Cu薄膜,利用TiN陶瓷薄膜阻挡Cu向PI基板内部扩散。研究热处理条件下TiN陶瓷薄膜阻挡层的阻挡效果、Cu膜电阻变化以及Cu膜的结合强度,俄歇谱图分析表明TiN可以有效地阻挡Cu向PI内的扩散。300℃热处理消除了Cu膜内应力,提高了Cu膜的结合强度。 相似文献