共查询到18条相似文献,搜索用时 62 毫秒
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本文首先针对半导体可靠性测试项目一电迁移的基本原理、可靠性问题、电迁移效应的防护措施及失效判定作概括性的介绍。第二部分主要介绍自制电迁移自动测试系统开发的目的。并比较国外进口电迁移自动测试系统的效率,最后以实验证明自制电迁移自动测试系统的性能和功能可以取代进口的同类产品,达到降低企业成本及节省产品验证时程的目的。 相似文献
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The effect of a thin layer of SiO2 (50 nm) on the electromigration behavior of Al/ 0.8wt.%Si/0.5wt.%Cu metallization, passivated by spin-on-glass, phosphorus
silicate glass and silicon nitride as part of the complementary metal oxide semiconductor technology fabrication process was
studied. It is found that voids were formed along the edge of the metallization line as opposed to formation at triple point
of grain boundaries. At the same stress current of 1 × 106 A/cm2, thicker metallization layer (600 nm) showed an improvement in median time to failure (MTF) (1.4 times) with smaller void
size (0.2 to 0.4 μm) over one without an underlying oxide, whereas if the metallization thickness is thin (300 nm), the MTF
is degraded (0.6 times) with larger void size formed (0.3 to 1.0 μm). 相似文献
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In flip-chip solder joints, thick Cu and Ni films have been used as under bump metallization (UBM) for Pb-free solders. In
addition, electromigration has become a crucial reliability concern for fine-pitch flip-chip solder joints. In this paper,
the three-dimensional (3-D) finite element method was employed to simulate the current-density and temperature distributions
for the eutectic SnPb solder joints with 5-μm Cu, 10-μm Cu, 25-μm Cu, and 25-μm Ni UBMs. It was found that the thicker the UBM is the lower the maximum current density inside the solder. The maximum current
density is 4.37 × 104 A/cm2, 1.69 × 104 A/cm2, 7.54 × 103 A/cm2, and 1.34 × 104 A/cm2, respectively, when the solder joints with the above four UBMs are stressed by 0.567 A. The solder joints with thick UBMs
can effectively relieve the current crowding effect inside the solder. In addition, the joint with the thicker Cu UBM has
a lower Joule heating effect in the solder. The joint with the 25-μm Ni UBM has the highest Joule heating effect among the four models. 相似文献
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As IC devices scale down to the submicron level, the resistance-capacitance (RC) time delays are the limitation to circuit
speed. A solution is to use low dielectric constant materials and low resistivity materials. In this work, the influence of
underlying barrier Ta on the electromigration (EM) of Cu on hydrogen silsesquioxane (HSQ) and SiO2 substrates was investigated. The presence of a Ta barrier not only improves the adhesion between Cu and dielectrics, but
also enhances the crystallinity of Cu film and improves the Cu electromigration resistance. The activation energy obtained
suggests a grain boundary migration mechanism and the current exponent calculated indicates the Joule heating effect. 相似文献
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Standard Wafer Level Electromigration Accelerated Test (SWEAT) has become a common fast wafer level reliability test for electromigration in industry. However, its ability to detect changes in processes and its correlation with conventional electromigration test result has come under close scrutiny. From the perspective of reliability statistics, SWEAT also has other pitfalls that render its test results questionable. In this work, these pitfalls are highlighted, and alternative wafer-level electromigration tests are discussed. The arguments that the SWEAT is not appropriate for evaluation of electromigration of metal lines are presented. SWEAT as a tool to evaluate electromigration lifetime of metal lines is not recommended unless the pitfalls are seriously looked at. 相似文献
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The Cu pillar is a thick underbump metallurgy (UBM) structure developed to alleviate current crowding in a flip-chip solder
joint under operating conditions. We present in this work an examination of the electromigration reliability and morphologies
of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated ∼62 μm Cu onto Cu substrate pad metallization using the Sn-3Ag-0.5Cu solder alloy. Three test conditions that controlled average
current densities in solder joints and ambient temperatures were considered: 10 kA/cm2 at 150°C, 10 kA/cm2 at 160°C, and 15 kA/cm2 at 125°C. Electromigration reliability of this particular solder joint turns out to be greatly enhanced compared to a conventional
solder joint with a thin-film-stack UBM. Cross-sectional examinations of solder joints upon failure indicate that cracks formed
in (Cu,Ni)6Sn5 or Cu6Sn5 intermetallic compounds (IMCs) near the cathode side of the solder joint. Moreover, the ~52-μm-thick Sn-Ag-Cu solder after long-term current stressing has turned into a combination of ~80% Cu-Ni-Sn IMC and ~20% Sn-rich
phases, which appeared in the form of large aggregates that in general were distributed on the cathode side of the solder
joint. 相似文献
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The Cu alloying effect in the Sn(Cu) solder line has been studied. The Sn0.7Cu solder line has the most serious electromigration
(EM) damage compared to pure Sn and Sn3.0Cu solder lines. The dominant factor for the fast EM rate in Sn0.7Cu could be attributed
to the relatively small grain size and the low critical stress, i.e., the yielding stress of the Sn0.7Cu solder line. Also,
we found that the shortest Sn0.7Cu solder line, 250 μm, has the most serious EM damage among three solder lines of different
lengths. The back stress induced by EM might not play a significant role on the EM test of long solder lines. A new failure
mode of EM test was observed; EM under an external tensile stress. The external stress is superimposed on the stress profile
induced by EM. As a result, the hillock formation was retarded at the anode side, and void formation was enhanced at the cathode. 相似文献