γ辐照导致中波碲镉汞光伏器件暗电流退化的机理研究

针对红外探测器在空间应用中受到高能粒子辐照后暗电流退化的问题,开展射线对中波碲镉汞（HgCdTe）光伏器件暗电流影响的研究。在室温和77 K温度下,利用60Co-射线对HgCdTe器件进行辐照试验,辐照试验结束后对低温辐照器件进行77 K低温退火和室温退火。通过比较辐照前后和退火后器件的I-V特性、R-V特性和零偏动态电阻R0参数,分析了辐照对HgCdTe器件暗电流的影响机制。试验结果表明:在总剂量为7 Mrad（Si）照条件下,器件暗电流未出现明显的退化;在77 K温度辐照条件下,器件暗电流随着总剂量的增加而增加,且暗电流退化幅度与辐照过程中的偏置有关。研究表明暗电流的退化源于辐照在器件中造成电离损伤,导致器件HgCdTe化层中的界面态和空穴陷阱电荷密度增加。     

浸渍提拉法制备有机介质层铝铟锌氧薄膜晶体管

利用溶液法的浸渍提拉工艺制备了以有机聚甲基丙烯酸甲酯(PMMA)为介质层、非晶铝铟锌氧化物(a-AIZO)为沟道层的顶栅共面结构薄膜晶体管(TFT),研究了沟道层退火温度对TFT性能的影响机理。结果表明:较低退火温度(如300和350℃)下处理的沟道层中存在未彻底分解的金属氢氧化物,其以缺陷态形式存在于TFT沟道层内或沟道层/介质层界面处,对导电沟道中电子进行捕获或散射,劣化TFT的迁移率、电流开关比以及亚阈值摆幅。综合来看,退火温度高于400℃下制备的a-AIZO适用于TFT器件的沟道层,相应的器件呈现出较高的迁移率(大于20cm2/(V·s))、较低的亚阈值摆幅(小于0.5V/decade)以及高于104的电流开关比。     

Ta2O5高k介电薄膜的制备及其电学性质的研究

用射频磁控溅射法制备了Ta2O5高介电薄膜,并对其进行了退火处理。用C-V,(G/ω)-V和I-V方法研究了Al/Ta2O5/p-Si结构的电学特性,观测到了C-V和(G/ω)-V的频散效应。认为串联电阻、Si/Ta2O5界面的界面态密度、边缘俘获是频散效应的主要原因,提取了界面态密度和边缘俘获电荷的大小。同时也研究了不同的退火温度对这些参数以及漏电流的影响,经600℃退火后,样品的电容最大,俘获电荷密度和漏电流最小,器件的电学性能最佳。     

Effect of microwave annealing on SOI MOSFETs: Post-metal annealing with low thermal budget

We investigate the effect of microwave irradiation (MWI) on silicon-on-insulator (SOI) based MOSFETs. The MWI technique is used for post-metal annealing (PMA) in air ambient, and compared with conventional thermal annealing in a forming gas ambient. This type of annealing not only constitutes a low cost, short time, low temperature, vacuum-free alternative to conventional post-metal annealing methods, but it also allows much lower thermal budgets, which, in turn, minimizes dopant motion, redistribution, and diffusion. The MWI treated MOSFETs showed superior electrical characteristics in terms of field effect mobility, on-off ratio, subthreshold swing, interface trap density, stability, and hot carrier effect immunity. Therefore, MWI technology is expected to become a promising annealing method for silicon-based processes, with low cost and low thermal budget.     

Analysis of current voltage characteristics oflow-temperature-processed polysilicon thin-film transistors

The relationship between device performance and trap state density in polysilicon films was investigated. The density in the silicon energy gap was obtained by fitting the calculated on-state current versus gate voltage curve to the measured one for low-temperature (⩽600°C) processed polysilicon TFTs fabricated under various conditions, such as different deposition temperatures and annealing methods for crystallization. On-state current was markedly improved by reducing the density near band edges in the gap, and the improvement was realized by depositing the films at around 500°C in an LPCVD system or employing laser annealing instead of thermal annealing at 600°C. Off-state current was reduced to a great extent by reduction of the density around the midgap by using a plasma-hydrogenation technique     

Increased resistance in p-type poly-Si resistors by thermal annealreduction interface charge

The effect of thermal annealing on characteristics of p-type poly-Si thin-film resistors was investigated. A significant increase was observed as the source/drain anneal temperature or anneal time was increased. The increased resistance is due to a reduction in current component arising from field-enhanced current via grain-boundary trap states at the drain end of the resistor. The reduction is this field-enhanced current arises primarily from a reduction of positive charge density at the top and bottom oxide/poly-Si interfaces of the thin-film resistor (and thus a reduction in the magnitude of the drain electric field) with increased annealing temperature and time     

Science and prospects for non-stoichiometry in dielectrics

Si nanodots (NDs) were produced in a silicon-rich dielectric matrix by plasma-enhanced chemical vapor deposition. After rapid thermal annealing at 900°C, the Si NDs have a mean diameter of 3 nm and a sheet density of 10¹¹/cm², as determined by the transmission electron microscopy. The photoluminescence (PL) spectrum is red-shifted after the annealing. The electroluminescence spectrum from Al/Si NDs embedded silicon nitride/ Si device structure was investigated. The spectrum was spread from 400 to 750 nm and is blue-shifted as compared to the PL spectrum. The device electrical characteristics, with as-deposited and annealed Si NDs embedded in the silicon nitride layer, were investigated at room temperature. The current transport was found to be strongly correlated to the Si NDs. The annealed Si NDs have lower energy states, which are consistent with the shift of the PL spectrum.     

Post deposition UV-induced O2 annealing of HfO2 thin films

UV-assisted annealing processes for thin oxide films is an alternative to conventional thermal annealing and has shown many advantages such as low annealing temperature, reducing annealing time and easy to control. We report in this work the deposition of ultra-thin HfO₂ films on silicon substrate by two CVD techniques, namely thermal CVD and photo-induced CVD using 222 nm excimer lamps at 400 °C. As-deposited films of around 10 nm in thickness with refractive indices from 1.72 to 1.80 were grown. The deposition rate measured by ellipsometry was found to be about 2 nm/min by UV-CVD, while the deposition rate by thermal CVD is 20% less than that by UV-CVD. XRD showed that the as-deposited HfO₂ films were amorphous. This work focuses on the effect of post deposition UV annealing in oxygen on the structural, optical and electrical properties of the HfO₂ films at low temperature (400 °C). Investigation of the interfacial layer by FTIR revealed that thickness of the interfacial SiO₂ layer slightly increases with the UV-annealing time and UV annealing can convert sub-oxides at the interface into stoichiometric SiO₂, leading to improved interfacial qualities. The permittivity ranges in 8–16, are lower than theoretical values. However, the post deposition UV O₂ annealing results in an improvement in effective breakdown field and calculated permittivity, and a reduction in leakage current density for the HfO₂ films.     

Electrical characteristics of MOSFETs using low-pressurechemical-vapor-deposited oxide

The electrical characteristics of MOSFETs and MOS capacitors utilizing thin (80-230 Å) low-pressure chemical-vapor-deposited (LPCVD) oxide films deposited at 12 Å/min are presented. MOSFETs using CVD oxides show good electrical characteristics with 70-90% of the surface mobility of conventional MOSFETs. The CVD oxides exhibit the same low leakage current and high breakdown fields as the thermal oxides, and significantly lower trapping and trap generation rates than thermally grown oxides. Interface state densities of ⩽3×10¹⁰ cm^-2 eV^-1 are obtained from CVD devices by using a short annealing in oxygen ambient following the deposition. These results indicate that these LPCVD oxide films may be promising dielectrics for MOS device application     

CdSe核辐射探测器中的MIS接触电极

对MIS(金属-绝缘体-半导体)接触电极的特性进行了系统的分析和实验观察.结果表明,负极的电子可以通过表面能级和热激发注入到Cd Se晶片中,且晶片表面的电子能级密度越高,电子注入就越快,探测器的漏电流也越大.对探测器进行适当的热处理,可以降低表面能级密度,从而抑制电子注入,降低探测器的漏电流,改善探测器的能量分辨率.     

Impact of annealing treatment on structural and dc electrical properties of spin coated tungsten trioxide thin films for Si/WO3/Ag junction diode

We report on the effect of the thermal annealing on structural and electrical properties of p-Si/n-WO₃/Ag junction diode. According to the XRD pattern, the WO₃ films exposed that the crystalline phase transformation of monoclinic to orthorhombic structure for an increasing annealing temperature. The SEM images show an abrupt change in the plate like grain growth and surface morphology. From the UV–visible analysis, the band gap energy decreases for the higher annealing temperature. The dc electrical characterization shows that the conductivity (σ_dc), activation energy (E_a) and pre-exponential factor (σ₀) values vary function of temperature. The Si/WO₃/Ag contact junction diode parameters of ideality factor (n), barrier height (Φ_B), leakage current density (J₀) and series resistance (R_s) were examined by the J-V method, Cheung's and Norde functions as a function of annealing temperature according to the thermionic emission method (TE). The values of n and Φ_B decrease with increasing annealing temperature and better the device performance on an optimized annealing temperature at 873 K. The temperature dependent of experimental n and Φ_B revealed the presence of inhomogeneity at WO₃-Ag interface. This behavior is modeled by assuming the existence of Gaussian distribution (GD) of barrier heights in temperature range 303–423 K.     

Effects of high temperature annealing on the device characteristics of Ga0.52In0.48P/GaAs and Al0.52In0.48P/GaAs heterojunction bipolar transistors

GaInP/GaAs and AlInP/GaAs heterojunction bipolar transistor (HBT) structures were grown by low pressure metalorganic vapor phase epitaxy and annealed at various temperatures up to 675°C for 15 min. Subsequent comparisons with HBTs fabricated on both annealed and unannealed control samples showed no effects for annealing up to and including 575°C, but significant changes in the electrical characteristics were observed at an annealing temperature of 675°C. For the GaInP/GaAs devices, the base current increased by a significant amount, reducing the gain and increasing the base current ideality factor from 1.07 to 1.9. Photoluminescence and electrical measurements on the structures indicated that both the emitter and base were affected by an increase in the recombination times in those regions. These effects were attributed to an out-diffusion of hydrogen from the base during annealing. The emitter of the AlInP/GaAs HBT was affected less by the hydrogen diffusion because of the larger bandgap. These observations have important implications for device performance dependence on the details of the temperature/time profile subsequent to the base growth.     

Effects of annealing on the hydrogen concentration and the performance of InGaP/InGaAsN/GaAs heterojunction bipolar transistors

The effects of rapid thermal annealing (RTA) on InGaP/InGaAsN heterojunction bipolar transistors (HBTs) with a carbon-doped base have been studied. The hydrogen and nitrogen concentrations in the base, as well as the direct current (DC) and radio frequency (RF) device performance, were studied as a function of the annealing temperature. A 30-sec anneal at 650°C and 700°C under N₂ ambient effectively eliminates hydrogen from the base. As the annealing temperature is increased, the base sheet resistance decreases, and the corresponding maximum frequency of oscillation increases. For all annealing temperatures studied, we found degradation in the DC gain, presumably caused by the increase of nitrogen concentration in the base region.     

A novel transient characterization technique to investigate trap properties in HfSiON gate dielectric MOSFETs-from single electron emission to PBTI recovery transient

A positive bias temperature instability (PBTI) recovery transient technique is presented to investigate trap properties in HfSiON as high-k gate dielectric in nMOSFETs. Both large- and small-area nMOSFETs are characterized. In a large-area device, the post-PBTI drain current exhibits a recovery transient and follows logarithmic time dependence. In a small-area device, individual trapped electron emission from HfSiON gate dielectric, which is manifested by a staircase-like drain current evolution with time, is observed during recovery. By measuring the temperature and gate voltage dependence of trapped electron emission times, the physical mechanism for PBTI recovery is developed. An analytical model based on thermally assisted tunneling can successfully reproduce measured transient characteristics. In addition, HfSiON trap properties, such as trap density and activation energy, are characterized by this method.     

Nanoscale imaging of dense fiber morphology and local electrical response in conductive regioregular poly(3-hexylthiophene)

We present a thermal annealing method for producing micrometer long and dense semi-crystalline fiber structures in poly(3-hexylthiophene) (P3HT) films. The thin film topology and local electrical properties are investigated by conductive atomic force microscopy (c-AFM), and three-dimensional device models are used to illustrate the effects of current spreading, anisotropic mobility and traps. In-plane current flow along high mobility fibers provides a mechanism for c-AFM contrast in fibrous films. The comparison of c-AFM results between the annealed and non-annealed P3HT films suggests that trap effects are pronounced in disordered P3HT thin films prior to thermal annealing. The methodologies we demonstrate here on the archetypal P3HT film can be generalized for understanding the correlation between structure and local electrical properties in a variety of polymer and polymer nanocomposite systems.     

Temperature influence on performance degradation of hydrogenated amorphous silicon solar cells irradiated with protons

This paper reports temperature influence on radiation degradation of hydrogenated amorphous silicon (a‐Si : H) solar cells. Degradation behaviors of a‐Si : H solar cells irradiated with protons at 331 K are compared with that at 298 K (room temperature). Variations with time in the post‐irradiation electrical properties are also investigated. It is found that the radiation degradation of the electrical properties at 331 K is significantly smaller than that at room temperature. Also, all the electrical properties (short‐circuit current, open‐circuit voltage, output maximum, and fill factor) recover with time after irradiation even at room temperature. The characteristic time of thermal annealing of short‐circuit current is larger as the temperature is higher. These results indicate that temperature during irradiation and elapsed time from irradiation to measurement is an important parameter for radiation degradation of a‐Si : H solar cells. Therefore, these parameters should be controlled in conducting the ground radiation tests. Copyright © 2012 John Wiley & Sons, Ltd.     

Two-dimensional nonisothermal carrier flow in a transistor structure under reactive circuit conditions

The current density and temperature distribution in a bi-polar power transistor operating in the switching mode under transient conditions has been computed as a function of circuit environment. A modeling was done of the turnoff of the transistor in a circuit containing resistive and inductive elements. Of particular interest was the study of the local current and temperature distribution achieved in the transistor during turnoff in a circuit with a large inductance; in the process of shutoff this inductance maintains the transistor collector current at a high value as the collector junction undergoes avalanche multiplication due to the high voltage induced across this junction by the inductive load. The length of time that the transistor remains in the high-current high-voltage mode during the turnoff transient determines the extent of current crowding and local heating in the device. The method of computation was to solve numerically the electrical carrier flow as well as Poisson's and the heat-flow equations in a two-dimensional model of an n⁺-p-n-n⁺transistor structure, as a function of time. The electrical boundary conditions on the emitter, base, and collector contacts were determined by considering the transistors interaction with its electric circuit environment. This interaction was calculated at each step in time, in an iterative fashion, as the transistor was turned off by extracting current from its base lead. The study permits the evaluation of a given bipolar transistor design with respect to current crowding, heating, and impact ionization in switching circuits containing inductive loads.     

基于GaAs基大功率激光器的热分析

The thermal characteristics of 808 nm Al Ga As/Ga As laser diodes(LDs) are analyzed via electrical transient measurements and infrared thermography. The temperature rise and thermal resistance are measured at various input currents and powers. From the electrical transient measurements, it is found that there is a significant reduction in thermal resistance with increasing power because of the device power conversion efficiency. The component thermal resistance that was obtained from the structure function showed that the total thermal resistance is mainly composed of the thermal resistance of the sub-mount rather than that of the LD chip, and the thermal resistance of the sub-mount decreases with increasing current. The temperature rise values are also measured by infrared thermography and are calibrated based on a reference image, with results that are lower than those determined by electrical transient measurements. The difference in the results is caused by the limited spatial resolution of the measurements and by the signal being captured from the facet rather than from the junction of the laser diode.     

Defect modification in ZnInSnO transistor with solution-processed Al2O3 dielectric by annealing

The properties of solution-processed Al₂O₃ thin films annealed at different temperatures were thoroughly studied through thermogravimetry–differential thermal analysis, UV–vis-NIR spectrophotometer measurements, scanning electron microscopy, X-ray diffraction, atomic force microscopy and a series of electrical measurements. The solution-processed ZnInSnO thin films transistors (TFTs) with the prepared Al₂O₃ dielectric were annealed at different temperatures. The TFTs annealed at 600 °C have displayed excellent electrical performance such as the field-effect mobility of 116.9 cm² V⁻¹ s⁻¹ and a subthreshold slope of 93.3 mV/dec. The performance of TFT device could be controlled by adjusting the annealing temperature. The results of two-dimensional device simulations demonstrate that the improvement of device performance are closely related with the reduction of interface defects between channel and dielectric and subgap density of stats (DOS) in the channel layer.     

星载荷热控制辐冷板激光致热计算分析

卫星的温度变化直接影响着电子器件的工作性能,为了研究辐冷板的温升效应对电子器件温度的影响,通过分析辐冷板的散热机理和辐冷板工作特性,采用有限元分析软件,对简化后的辐冷板模型进行了激光辐照热效应计算分析。以脉冲激光作为辐射源,对辐冷板进行照射,通过对其表面温度场进行数值模拟,得到了在脉冲激光照射下的瞬态温度场分布,并对模拟结果进行了分析和研究。发现电子器件在没有散热的情况下温度将升高64.5 K,在最大工作状态时激光的照射将严重影响热管的工作性能,而且热管的非正常工作将使电子器件温度升高,影响电子器件正常运行,为星上温度影响电子器件性能实验奠定了理论基础。