$hbox{TiN/ZrO}_{2}$/Ti/Al Metal–Insulator–Metal Capacitors With Subnanometer CET Using ALD-Deposited $hbox{ZrO}_{2}$ for DRAM Applications

We provide the first report of the structural and electrical properties of $hbox{TiN/ZrO}_{2}$/Ti/Al metal–insulator–metal capacitor structures, where the $hbox{ZrO}_{2}$ thin film (7–8 nm) is deposited by ALD using the new zirconium precursor ZrD-04, also known as Bis(methylcyclopentadienyl) methoxymethyl. Measured capacitance–voltage ($C$– $V$) and current–voltage ( $I$–$V$) characteristics are reported for premetallization rapid thermal annealing (RTP) in $hbox{N}_{2}$ for 60 s at 400 $^{circ}hbox{C}$, 500 $^{circ}hbox{C}$, or 600 $^{ circ}hbox{C}$. For the RTP at 400 $^{circ}hbox{C}$ , we find very low leakage current densities on the order of nanoamperes per square centimeter at a gate voltage of 1 V and low capacitance equivalent thickness values of $sim$ 0.9 nm at a gate voltage of 0 V. The dielectric constant of $ hbox{ZrO}_{2}$ is 31 $pm$ 2 after RTP treatment at 400 $^{circ}hbox{C}$.      

Temperature-Insensitive Dual-Comb Filter Based on Multimode Interference Ti : LiNbO $_{3}$ Waveguide

A temperature-insensitive dual-comb filter has been demonstrated for the first time by multimode interference based on a Ti : LiNbO$_{3}$ channel waveguide. The phase difference between comb filters was about 180 $^{circ}$. We only observed less than ${pm}$0.125-nm variation of the center wavelength of the filter during temperature change from 20 $^{circ}$C to 50 $^{circ}$C. The measured extinction ratio and channel spacing of the comb filter were about ${-}$25 dB and 3.2 THz, respectively.      

A 47 GHz Cross-Coupled VCO Employing High- Island-Gate Varactor for Phase Noise Reduction

A 47 GHz $LC$ cross-coupled voltage controlled oscillator (VCO) employing the high-$Q$ island-gate varactor (IGV) based on a 0.13 $mu{rm m}$ RFCMOS technology is reported in this work. To verify the improvement in the phase noise, two otherwise identical VCOs, each with an IGV and a conventional multi-finger varactor, were fabricated and the phase noise performance was compared. With $V_{DD}$ of 1.2 V and core power consumption of 3.86 mW, the VCOs with the IGV and the multi-finger varactor have a phase noise of $-$95.4 dBc/Hz and $-$91.4 dBc/Hz respectively, at 1 MHz offset, verifying the phase noise reduction with the introduction of the high-$Q$ IGV. The VCO with IGV exhibited an output power of around $-$15 dBm, leading to a FoM of $-$182.9 dBc/Hz and a tuning range of 3.35% (45.69 to 47.22 GHz).      

1580-V–40-$hbox{m}Omegacdot hbox{cm}^{2}$ Double-RESURF MOSFETs on 4H-SiC $(hbox{000}bar{hbox{1}})$

Double-reduced-surface-field (RESURF) MOSFETs with $hbox{N}_{2}hbox{O}$ -grown oxides have been fabricated on the 4H-SiC $(hbox{000} bar{hbox{1}})$ face. The double-RESURF structure is effective in reducing the drift resistance, as well as in increasing the breakdown voltage. In addition, by utilizing the 4H-SiC $(hbox{000}bar{hbox{1}})$ face, the channel mobility can be increased to over 30 $hbox{cm}^{2}/hbox{V}cdothbox{s}$, and hence, the channel resistance is decreased. As a result, the fabricated MOSFETs on 4H-SiC $( hbox{000}bar{hbox{1}})$ have demonstrated a high breakdown voltage $(V_{B})$ of 1580 V and a low on-resistance $(R_{rm ON})$ of 40 $hbox{m}Omega cdothbox{cm}^{2}$. The figure-of-merit $(V_{B}^{2}/R_{rm ON})$ of the fabricated device has reached 62 $hbox{MW/cm}^{2}$, which is the highest value among any lateral MOSFETs and is more than ten times higher than the “Si limit.”      

Impacts of $hbox{N}_{2}$ and $hbox{NH}_{3}$ Plasma Surface Treatments on High-Performance LTPS-TFT With High-$kappa$ Gate Dielectric

Low-temperature polycrystalline-silicon thin-film transistors (LTPS-TFTs) with high- $kappa$ gate dielectrics and plasma surface treatments are demonstrated for the first time. Significant field-effect mobility $mu_{rm FE}$ improvements of $sim$86.0% and 112.5% are observed for LTPS-TFTs with $hbox{HfO}_{2}$ gate dielectric after $hbox{N}_{2}$ and $ hbox{NH}_{3}$ plasma surface treatments, respectively. In addition, the $hbox{N}_{2}$ and $ hbox{NH}_{3}$ plasma surface treatments can also reduce surface roughness scattering to enhance the field-effect mobility $mu_{rm FE}$ at high gate bias voltage $V_{G}$, resulting in 217.0% and 219.6% improvements in driving current, respectively. As a result, high-performance LTPS-TFT with low threshold voltage $V_{rm TH} sim hbox{0.33} hbox{V}$, excellent subthreshold swing S.S. $sim$0.156 V/decade, and high field-effect mobility $mu_{rm FE} sim hbox{62.02} hbox{cm}^{2}/hbox{V} cdot hbox{s}$ would be suitable for the application of system-on-panel.      

High- RF-MEMS 4–6-GHz Tunable Evanescent-Mode Cavity Filter

This paper presents a miniature high- $Q$ tunable evanescent-mode cavity filter using planar capacitive RF microelectromechanical system (MEMS) switch networks and with a frequency coverage of 4.07–5.58 GHz. The two-pole filter, with an internal volume of 1.5 cm$^3$ , results in an insertion loss of 4.91–3.18- and a 1-dB bandwidth of 17.8–41.1 MHz, respectively, and an ultimate rejection of $>$ 80 dB. RF-MEMS switches with digital/analog tuning capabilities were used in the tunable networks so as to align the two poles together and result in a near-ideal frequency response. The measured $Q_{u}$ of the filter is 300–500 over the tuning range, which is the best reported $Q$ using RF-MEMS technology. The filter can withstand an acceleration of 55–110 g without affecting its frequency response. The topology can be extended to a multiple-pole design with the use of several RF-MEMS tuning networks inside the evanescent-mode cavity. To our knowledge, these results represent the state-of-the-art in RF-MEMS tunable filters.      

Pentacene-Based Low-Voltage Strain Sensors With PVP/$ hbox{Ta}_{2}hbox{O}_{5}$ Hybrid Gate Dielectrics

Field-controllable pentacene-semiconductor-based strain sensors were fabricated with hybrid gate dielectrics using polyvinyl phenol (PVP) and high-$k$ inorganic tantalum pentoxide $(hbox{Ta}_{2}hbox{O}_{5})$ onto polyethylene naphthalate films. The $hbox{Ta}_{2}hbox{O}_{5}$ gate-dielectric layer combined with a thin PVP layer to form very smooth and hydrophobic surfaces turns out to improve the molecular structures of pentacene films significantly. The PVP– $hbox{Ta}_{2}hbox{O}_{5}$ hybrid-gate-dielectric films exhibit a high dielectric constant of 19.27 and a leakage-current density of as low as 100 $hbox{nA/cm}^{2}$ . The sensors employing a thin-film-transistor-like Wheatstone bridge configuration able to operate at reduced voltage ($sim$4 V) show good device characteristics with a field-effect mobility of 1.89 $hbox{cm}^{2}/hbox{V} cdot hbox{s}$ and a threshold voltage of $-$0.5 V. The strain sensor characterized with bending at 45$^{circ}$ with respect to the bridge bias direction with different bending radii of 50-, 40-, 30-, 20-, and 8-mm displays output signals improved in linearity in a low range of operating voltages.      

A 67 dBm $OIP_{3}$ Multistacked Junction Varactor

A multistacked varactor is presented for ultra-linear tunable radio frequency applications. The varactor elements are applied in anti-series configuration and are characterized by an “exponential” $C$- $V _{R}$ relationship. Third-order intermodulation ($IM_{3}$) is cancelled through proper harmonic loading of the terminals of the anti-series configuration. Multiple stacking is used to further increase the power handling and to minimize the remaining fifth-order distortion. The measured output intercept point ($OIP_{3}$ ) at 2 GHz is $ > 67~{rm dBm}$ for modulated signals up to 10 MHz bandwidth, while providing a capacitance tuning ratio of 3:1 with an average quality factor of 40 and maximum control voltage of 10 V.      

A 300 nW, 15 ppm/$^{circ}$C, 20 ppm/V CMOS Voltage Reference Circuit Consisting of Subthreshold MOSFETs

A low-power CMOS voltage reference was developed using a 0.35 $mu$m standard CMOS process technology. The device consists of MOSFET circuits operated in the subthreshold region and uses no resistors. It generates two voltages having opposite temperature coefficients and adds them to produce an output voltage with a near-zero temperature coefficient. The resulting voltage is equal to the extrapolated threshold voltage of a MOSFET at absolute zero temperature, which was about 745$~$mV for the MOSFETs we used. The temperature coefficient of the voltage was 7 ppm/ $^{circ}$C at best and 15 ppm/$^{circ}$C on average, in a range from ${-}$ 20 to 80$^{circ}$ C. The line sensitivity was 20 ppm/V in a supply voltage range of 1.4–3 V, and the power supply rejection ratio (PSRR) was ${-}$45 dB at 100 Hz. The power dissipation was 0.3 $mu$W at 80$^{circ}$C. The chip area was 0.05 mm$^2$ . Our device would be suitable for use in subthreshold-operated, power-aware LSIs.      

Near-Stoichiometric Ti : LiNbO$_{3}$ Strip Waveguides Fabricated by Standard Ti Diffusion and Post-VTE

We report near-stoichiometric (NS) Ti : LiNbO$_{3}$ waveguides fabricated by indiffusion of 4-, 5-, 6-, 7- $mu{hbox {m}}$-wide 120-nm-thick Ti-strips at 1060 $^{circ}hbox{C}$ for 10 h into a congruent $hbox{LiNbO}_{3}$ (i.e., standard Ti diffusion procedure) and post-vapour-transport-equilibration (VTE) treatment at 1100 $^{circ}hbox{C}$ for 5 h. These waveguides are NS and single-mode at 1.5 $mu{hbox {m}}$, and have a loss of 1.0/0.8 dB/cm for the TM/TE mode. In the width/depth direction of the waveguide, the mode field follows a Gauss/Hermite–Gauss profile, and the Ti profile follows a sum of two error functions/a Gauss function. The post-VTE resulted in increase of diffusion width/depth by 2.0/1.0 $mu{hbox {m}}$. A two-dimensional refractive index profile in the guiding layer is suggested.      

A Dual-Band Self-Oscillating Mixer for -Band and -Band Applications

A self-oscillating mixer that employs both the fundamental and harmonic signals generated by the oscillator subcircuit in the mixing process is experimentally demonstrated. The resulting circuit is a dual-band down-converting mixer that can operate in $C$ -band from 5.0 to 6.0 GHz, or in $X$-band from 9.8 to 11.8 GHz. The oscillator uses active superharmonic coupling to enforce the quadrature relationship of the fundamental outputs. Either the fundamental outputs of the oscillator or the second harmonic oscillator output signals that exists at the common-mode nodes are connected to the mixer via a set of complementary switches. The mixer achieves a conversion gain between 5–12 dB in both frequency bands. The output 1-dB compression points for both modes of the mixer are approximately $-{hbox{5 dBm}}$ and the output third-order intercept point for $C$ -band and $X$ -band operation are 12 and 13 dBm, respectively. The integrated circuit was fabricated in 0.13-$mu {hbox{m}}$ CMOS technology and measures ${hbox{0.525 mm}}^{2}$ including bonding pads.      

Pulsed $I_{d}$– $V_{g}$ Methodology and Its Application to Electron-Trapping Characterization and Defect Density Profiling

The pulsed current–voltage ($I$– $V$) measurement technique with pulse times ranging from $sim$17 ns to $sim$ 6 ms was employed to study the effect of fast transient charging on the threshold voltage shift $Delta V_{t}$ of MOSFETs. The extracted $Delta V_{t}$ values are found to be strongly dependent on the band bending of the dielectric stack defined by the high-$kappa$ and interfacial layer dielectric constants and thicknesses, as well as applied voltages. Various hafnium-based gate stacks were found to exhibit a similar trap density profile.      

Zn$_{1 - x}$Mg$_{x}$ O Homojunction-Based Ultraviolet Photodetector

Zn$_{1 - {x}}$ Mg$_{x}$ O p-n photodiodes were fabricated on (0001) sapphire substrates using a pulsed laser deposition technique with different Mg contents. Ti–Au and Ni–Au metals deposited using vacuum evaporation were used as n-type and p-type contacts, respectively. The X-ray diffraction analysis showed the Zn$_{1 - {x}}$Mg$_{x}$O double layers have a single phase hexagonal wurtzite structure. The optical bandgap of Zn$_{1 - {x}}$Mg$_{x}$O films has been tuned from 3.27 to 4.26 eV by increasing the Mg content ${x} =0.0$ to ${x}=0.34$. Correspondingly, the cutoff wavelength of the resultant detectors varies from 380 to 284 nm. Zn$_{1 - {x}}$Mg$_{x}$O p-n photodiodes with different Mg contents exhibit very good performance, with a very low dark current (${≪}$ 20 pA) at the bias voltage of 10 V. The ultraviolet to visible rejection ratio is more than three orders of magnitude.      

Integrated Al O :Er Zero-Loss Optical Amplifier and Power Splitter With 40-nm Bandwidth

A combined planar lossless optical amplifier and 1 $,times,$2 power splitter device has been realized in Al$_2$ O$_3$:Er$^{3+}$ on silicon. Net internal gain was measured over a wavelength range of 40 nm across the complete telecom $C$ -band (1525–1565 nm). Calculations predict net gain in a combined amplifier and 1$,times,$ 4 power splitter device over the same wavelength range for a total injected pump power as low as 30 mW.      

Electrical Properties of Amorphous $hbox{Bi}_{5} hbox{Nb}_{3}hbox{O}_{15}$ Thin Film for RF MIM Capacitors

Amorphous $hbox{Bi}_{5}hbox{Nb}_{3}hbox{O}_{15}(hbox{B}_{5} hbox{N}_{3})$ film grown at 300 $^{circ}hbox{C}$ showed a high-$k$ value of 71 at 100 kHz, and similar $k$ value was observed at 0.5–5.0 GHz. The 80-nm-thick film exhibited a high capacitance density of 7.8 fF/$muhbox{m}^{2}$ and a low dissipation factor of 0.95% at 100 kHz with a low leakage-current density of 1.23 nA/ $hbox{cm}^{2}$ at 1 V. The quadratic and linear voltage coefficient of capacitances of the $hbox{B}_{5}hbox{N}_{3}$ film were 438 ppm/$hbox{V}^{2}$ and 456 ppm/V, respectively, with a low temperature coefficient of capacitance of 309 ppm/$^{circ}hbox{C}$ at 100 kHz. These results confirmed the potential of the amorphous $hbox{B}_{5}hbox{N}_{3}$ film as a good candidate material for a high-performance metal–insulator–metal capacitors.      

Equivalent Circuit Model for the Gate Leakage Current in Broken Down $hbox{HfO}_{2}/hbox{TaN/TiN}$ Gate Stacks

We propose an equivalent circuit model for the post-breakdown (BD) current–voltage ( $I$–$V$) characteristics in $hbox{HfO}_{2}/hbox{TaN/TiN}$ gate stacks in n-MOSFETs. The model consists of two opposite-biased diodes with series resistances and a shunt leakage path. The circuit admits analytical solution using the Lambert $W$-function and is tested for both negative and positive gate biases in the voltage range of $-$1.5 to $+$1.5 V. We also show the versatility of the proposed approach to deal with the post-BD $I$– $V$ when source and drain contacts are grounded or floating and analyze the obtained results in terms of the charge available for conduction.      

High-Performance $hbox{In}_{0.7}hbox{Ga}_{0.3}hbox{As}$ -Channel MOSFETs With High-$kappa$ Gate Dielectrics and $alpha$-Si Passivation

Long and short buried-channel $hbox{In}_{0.7}hbox{Ga}_{0.3}hbox{As}$ MOSFETs with and without $alpha$-Si passivation are demonstrated. Devices with $alpha$-Si passivation show much higher transconductance and an effective peak mobility of 3810 $hbox{cm}^{2}/ hbox{V} cdot hbox{s}$. Short-channel MOSFETs with a gate length of 160 nm display a current of 825 $muhbox{A}/muhbox{m}$ at $V_{g} - V_{t} = hbox{1.6} hbox{V}$ and peak transconductance of 715 $muhbox{S}/muhbox{m}$. In addition, the virtual source velocity extracted from the short-channel devices is 1.4–1.7 times higher than that of Si MOSFETs. These results indicate that the high-performance $hbox{In}_{0.7}hbox{Ga}_{0.3} hbox{As}$-channel MOSFETs passivated by an $alpha$ -Si layer are promising candidates for advanced post-Si CMOS applications.      

0.8-V Supply Voltage Deep-Submicrometer Inversion-Mode $hbox{In}_{0.75}hbox{Ga}_{0.25}hbox{As}$ MOSFET

We report the experimental demonstration of deep-submicrometer inversion-mode $hbox{In}_{0.75}hbox{Ga}_{0.25}hbox{As}$ MOSFETs with ALD high- $k$ $hbox{Al}_{2}hbox{O}_{3}$ as gate dielectric. In this letter, n-channel MOSFETs with 100–200-nm-long gates have been fabricated. At a supply voltage of 0.8 V, the fabricated devices with 200–130-nm-long gates exhibit drain currents of 232–440 $muhbox{A}/muhbox{m}$ and transconductances of 538–705 $muhbox{S}/muhbox{m}$. The 100-nm device has a drain current of 801 $muhbox{A}/muhbox{m}$ and a transconductance of 940 $muhbox{S}/muhbox{m}$. However, the device cannot be pinched off due to severe short-channel effect. Important scaling metrics, such as on/off current ratio, subthreshold swing, and drain-induced barrier lowering, are presented, and their relations to the short-channel effect are discussed.      

A Sub-100 $mu{rm W}$ Ku-Band RTD VCO for Extremely Low Power Applications

This letter presents the microwave performance of a sub-100 $mu{rm W}$ Ku-band differential-mode resonant tunneling diode (RTD)-based voltage controlled oscillator (VCO) with an extremely low power consumption of 87 $mu{rm W}$ using an InP-based RTD/HBT MMIC technology. In order to achieve the extremely low-power Ku-band RTD VCO, the device size of RTD is scaled down to $0.6times 0.6 mu{rm m}^{2}$. The obtained dc power consumption of 87 $mu{rm W}$ is found to be only 1/18 of the conventional-type MMIC VCOs reported in the Ku-band. The fabricated RTD VCO has a phase noise of $-$100.3 dBc/Hz at 1 MHz offset frequency and a tuning range of 140 MHz with the figure-of-merit (FOM) of $-$194.3 dBc/Hz.      

Low-Voltage Organic Field-Effect Transistor With PMMA/$ hbox{ZrO}_{2}$ Bilayer Dielectric

This paper reports on the application of a bilayer polymethylmethacrylate (PMMA)/ $hbox{ZrO}_{2}$ dielectric in copper phthalocyanine (CuPc) organic field-effect transistors (OFETs). By depositing a PMMA layer on $hbox{ZrO}_{2}$, the leakage of the dielectric is reduced by one order of magnitude compared to single-layer $hbox{ZrO}_{2}$. A high-quality interface is obtained between the organic semiconductor and the combined insulators. By integrating the advantages of polymer and high- $k$ dielectrics, the device achieves both high mobility and low threshold voltage. The typical field-effect mobility, threshold voltage, on/off current ratio, and subthreshold slope of OFETs with bilayer dielectric are $hbox{5.6}timeshbox{10}^{-2} hbox{cm}^{2}/hbox{V} cdot hbox{s}$, 0.8 V, $hbox{1.2} times hbox{10}^{3}$, and 2.1 V/dec, respectively. By using the bilayer dielectrics, the hysteresis observed in the devices with single-layer $hbox{ZrO}_{2}$ is no longer present.