Polymeric Confonnal Coatings for Implantable Electronic Devices

Long-term implantable devices such as cardiac pacemakers are protected from corrosive tissue fluids by means of a metallic, hermetically sealed enclosure. When the electronic circuitry contacts infiltrating tissue fluids due to a corrosive breach in the hermeticity, failure of the device is almost immediate. Polymeric coatings have been investigated to serve as a secondary moisture barrier in this work.     

电子元器件的应用可靠性（8）

从电子元器件的选择、控制和使用等诸多方面讨论电子元器件的应用可靠性，包括质量等级、失效率等级、选择原则与质量控制；微电子器件的应用可靠性(过应力损伤、降额使用、二次筛选)；阻容元件的使用可靠性(电阻器、电位器、电容器)及其他元件的选择和应用(继电器、微波元件、连接器)。     

电子元器件的应用可靠性（5）

从电子元器件的选择、控制和使用等诸多方面讨论电子元器件的应用可靠性，包括质量等级、失效率等级、选择原则与质量控制；微电子器件的应用可靠性(过应力损伤、降额使用、二次筛选)；阻容元件的使用可靠性(电阻器、电位器、电容器)及其他元件的选择和应用(继电器、微波元件、连接器)。     

电子元器件的应用可靠性（4）

从电子元器件的选择、控制和使用等诸多方面讨论电子元器件的应用可靠性，包括质量等级、失效率等级、选择原则与质量控制；微电子器件的应用可靠性(过应力损伤、降额使用、二次筛选)；阻容元件的使用可靠性(电阻器、电位器、电容器)及其他元件的选择和应用(继电器、微波元件、连接器)。     

电子元器件的应用可靠性（2）

从电子元器件的选择、控制和使用等诸多方面讨论电子元器件的应用可靠性，包括质量等级、失效率等级、选择原则与质量控制；微电子器件的应用可靠性(过应力损伤、降额使用、二次筛选)；阻容元件的使用可靠性(电阻器、电位器、电容器)及其他元件的选择和应用(继电器、微波元件、连接器)。     

电子元器件的应用可靠性（1）

从电子元器件的选择、控制和使用等诸多方面讨论电子元器件的应用可靠性，包括质量等级、失效率等级、选择原则与质量控制；微电子器件的应用可靠性(过应力损伤、降额使用、二次筛选)；阻容元件的使用可靠性(电阻器、电位器、电容器)及其他元件的选择和应用(继电器、微波元件、连接器)。     

An Integrated Power Recovery Module Dedicated to Implantable Electronic Devices

This paper concerns the design and implementation of an inductively coupled RF telemetry for both power and data transferring to implantable microelectronic devices. The major shortcomings of available inductive powering designs are their low power-transfer efficiency and large size of the implantable unit. Therefore, there is a need to fully integrate interfacing module of the implantable unit. The presented power recovery module is dedicated to the biotelemetry application of cortical/nerve stimulation. The proposed strategy allows providing dual regulated output voltages 3.3 V/1.8 V to the electrodes driver and other implantable circuitry, respectively. Its low dropout voltage makes high power efficiency attainable. Fabricated integrated prototype in a CMOS 0.18 m technology has demonstrated its feasibility, providing a load current driving ability of 5 mA for each one of the two supply voltages.Yamu Hu received the B.S. degree in electrical engineering from Huazhong University of Science & Technology (HUST), Wuhan, P. R. China, in 1993, and the M.S. degree in electronics engineering from Ecole Polytechnique of Montreal, Canada, in 2000. He is currently working toward the Ph.D degree in electronics engineering at the same university. His research interest includes low-noise, low-power Analog/Mixed-Signal ICs for biomedical applications, RF front-end for wireless communications.Mohamad Sawan received the B.Sc. degree in electrical engineering from Université Laval, Canada in 1984, the M.Sc. and Ph.D. degrees, both in electrical engineering, from Université de Sherbrooke, Canada, in 1986 and 1990 respectively, and postdoctorate training from McGill University, Canada in 1991. He joined Ecole Polytechnique de Montréal in 1991 where he is currently a Professor in Microelectronics.His scientific interests are the design and test of mixed-signal (analog, digital and RF) circuits and systems, the digital and analog signal processing, the modeling, design, integration, assembly and validation of advanced wirelessly powered and controlled monitoring and measurement techniques. These topics are oriented toward the biomedical implantable devices and telecommunications applications. Dr. Sawan is a holder of a Canadian Research Chair in Smart Medical Devices. He is leading the ReSMiQ (Microelectronics Strategic Alliance of Quebec) research center. He is founder of the Eastern Canadian IEEE-Solid State Circuits Society Chapter and the IEEE-Northeastern workshop on Circuits and Systems (NewCAS). Also, he is cofounder of the International Functional Electrical Stimulation Society, and founder of PolySTIM neurotechnology laboratory at the Ecole Polytechnique de Montreal.He published more than 250 papers in peer reviewed journals and conference proceedings and was awarded 6 patents. He is editor of the Springer Mixed-signal Letters, Distinguished Lecturer for the IEEE CAS Society. He received the Barbara Turnbull 2003 award for spinal cord research. He is Fellow of the Canadian Academy of Engineering, and Fellow of the IEEE.Mourad El-Gamal received the B.Sc. degree with Honours from Ain-Shams University, Cairo, Egypt, in 1987, the M.Sc. degree from Vanderbilt University, Nashville, TN, in 1993, and the Ph.D. degree from McGill University, Montré al, Canada, in 1998, all in electrical engineering.He is currently an Associate Professor and William Dawson Scholar at McGill University. His research interests include integrated circuits and MEMS for communications applications, on which he has published many papers, and most recently contributed to a chapter on low voltage 5-GHz RFIC front-ends, published by the IEE in 2003. He has received several teaching awards and recognitions, and holds one patent. He was on leave of absence from McGill in 2002 to assume the role of Director of Engineering, then Vice President, of the Wireless Business Unit of MEMSCAP, headquartered in France—a 165 employee, publicly trading company specializing in MEMS. He oversaw all the business and technical aspects in different sites around the world related to RF-MEMS devices, RFICs, and millimeter-wave passive circuits. Earlier, he worked for the French telecommunications company ALCATEL and was a Member of the Technical Staff at IBM. He regularly serves as a consultant for leading microelectronics companies in North America and in Europe.Dr. El-Gamal is a member of the Analog Signal Processing Technical Committee of the IEEE Circuits and Systems (CAS) Society, and is a member of the Technical Committee of the Bipolar/BiCMOS Circuits and Technology Meeting (BCTM). He was a Guest Editor for the October 2004 issue of the Journal of Solid-State Circuits. He is the co-recipient of several research awards, the most recent being the 2003 Myril B. Reed Best Paper Award of the IEEE International Midwest Symposium on Circuits and Systems for work on frequency synthesizer covering the lower and upper bands of 5 GHz WLANs.     

生物医学中的植入式电子系统的现状与发展

"植入式电子学"已成为生物医学电子学中一个极为重要的组成部分.在对目前生物医学中各种典型植入式电子系统的分析后,本文总结出了植入式电子系统的综合性结构模型,并结合国际上有关植入式电子系统最新研究的进展,讨论了系统实现的关键技术、难点以及可能的解决方法,最后讨论了植入式电子系统的发展方向.     

真空电子器件工作和非工作可靠性的探讨

论述了几个军用真空电子器件在不同应用条件下的工作和非工作的可靠性情况 ,提出器件在非工作贮存期内的预计失效率模型 ,并讨论在长期非工作贮存期内出现的失效机理及定性得出存放寿命与时间相关的结论。     

电子器件可靠性试验简介

本文主要介绍可靠性试验的基本概念、种类、方法以及环境试验项目。     

基于Bellcore标准的电子产品可靠性预计方法及案例研究

介绍了Bellcore标准进行可靠性预计的理论基础,包括元器件失效率与单元失效率模型等。利用Bellcore现行的TelcordiaSR-332标准手册,对某用于商用环境中的单板计算机进行了可靠性预计。给出了该单板计算机MTBF预计的过程和方法,以及失效率和MTBF的预计结果,并与军用标准的预计结果进行了对比,说明了Bellcore标准目前存在的一些问题。     

Reliability of an Electronic Assembly: A Case History

This article describes the work done in evaluating the reliability of a printed-circuit-card assembly. Some assemblies went through thermal shock, humidity, and power-temperature cycling. A model was developed for interpreting a long term, high temperature life-test. Two iterations of the life test took place as part of the evaluation. A short term, intermediate temperature life-test of a relatively large number of assemblies preceded release to manufacturing.     

Studies on Inkjet-Printed Conducting Lines for Electronic Devices

Inkjet printing is considered one of the most promising methods for patterning and materials deposition. The feasibility of employing inkjet technology for the creation of conductive pathways on printed circuit boards is addressed herein. Prediction of the width, length, and thickness of printed lines as a function of the dot diameter, resolution, and volume fraction of the particles in the ink is presented. Surface treatment of the substrate to promote desirable adhesion and wetting properties as well as the adjustment of the curing process to reduce the surface roughness of the printed traces were studied. In a sintering study, samples sintered at 250°C for 20 min showed a resistivity of 4.2 μΩ cm, which is approximately 2.6 times that of bulk silver. A low-temperature sintering method through the reduction of a metal salt is presented. The resistivity of printed samples sintered at 140°C for 30 min in the presence of silver nitrate with N,N-dimethylformamide showed a resistivity of 22.5 μΩ cm.     

基于低频电噪声的光电耦合器可靠性筛选方法研究

低频电噪声是表征电子器件质量和可靠性的敏感参数,通过测试低频噪声,可以快速、无损地实现光耦器件的可靠性评估。通过开展可靠性老化对光电耦合器低频噪声特性影响的试验研究,提出基于低频段宽频带噪声参数的光电耦合器可靠性筛选方法,并将可靠性筛选结果与点频噪声筛选方法结果进行对比分析。结果表明,与点频噪声参数等现有方法相比,宽频带噪声参数可以更灵敏和准确地表征器件可靠性,同时计算简便,基于宽频带噪声参数的光电耦合器可靠性筛选方法可以实现更为准确合理的可靠性分类筛选。     

Reliability of Nondeteriorating Devices

A general theory has been developed for calculating the reliability of a device which does not deteriorate with time and which is exposed to a stochastic load. Two important cases of stochastic loads have been considered: (1) statistically independent random pulses, and (2) a sequence of random pulses, each one separated from the next one by a random period of time during which no load is applied to the device. Numerical examples are included.     

Radio-Frequency Coils in Implantable Devices: Misalignment Analysis and Design Procedure

Radio-frequency (RF) coils are used extensively in the design of implantable devices for transdermal power and data transmission. The practical issues of coil misalignments and configurations have not been investigated, and this paper presents a detailed theoretical analysis of misalignment effects in RF coil systems, including lateral and angular misalignments. Formulas are derived for the mutual inductance and, whenever possible, simplified upper bounds and lower bounds of the coupling coefficient are provided. A design procedure is established to maximize coil coupling for a given configuration, and a companion paper [1] discusses a circuit design technique to reduce the effects of misalignment on transmission efficiency.     

基于BP网络的敏感电子器件二信息融合

压力传感器的输出信号在实际应用中受多个非目标参量的影响,其中它对温度的敏感成为其最大的缺点。我们提出了利用BP网络的二敏感电子器件信息融合来消除温度对压力传感器输出信号的影响,提高其精度和可靠性。该方法利用BP网络的Levenberg-Marquardt算法实现数据融合,网络结构简单,学习速度快,具有很好的应用前景。     

Healable Transparent Electronic Devices

With the advent of the digital era, healable electronic devices are being developed to alleviate the propagation of breakdown in electronics due to the mechanical damage caused by bending, accidental cutting or scratching. Meanwhile, flexible transparent electronics, exhibiting high transmittance and robust flexibility, are drawing enormous research efforts due to their potential applications in various integrated wearable electronics. However, the breakdown of flexible transparent electronics seriously limits their reliability and lifetime. Therefore, transparent healable electronics are desired to tackle these problems, yet most of the healable electronics are not transparent nowadays. The combination of high performance, healability, and transparency into electronics is often mutually exclusive. Herein, after a brief introduction of self‐healing materials, healable electronics, and flexible transparent electronics, the recent progress in the healable electronic devices without transparency is reviewed in detail. Then, healable transparent electronic devices with high transparency, robust portability, and reliable flexibility are summarized. They are drawing great attention owing to their potential application in optical devices as well as smart wearable and integrated optoelectronic devices. Following that, the critical challenges and prospects are highlighted for the development of healable transparent electronic devices.     

Metasurface Patch for Wireless Power Transfer in Implantable Devices

Wireless power transfer (WPT) systems enable the long-term operation and miniaturization of implantable devices by eliminating the need for battery replacement and wired power supplies. Although wireless power transfer systems for implantable devices are extensively studied, their practical application is still challenging owing to the constraints and requirements of the human body, such as reflection loss owing to differences in the tissue dielectric properties, mm-sized devices, and electromagnetic (EM) wave attenuation of the tissue. Here, a phase-gradient metasurface patch is presented to achieve 5.8 GHz EM power focusing at a focal point of depth 10 mm in the tissue via EM wavefront modulation at the skin–air interface. The proposed metasurface patch is fabricated by arranging subwavelength-thickness (<λ/10) unit cell structures composed of four metallic layers separated by dielectric substrates that exhibit high-Q resonance properties and a sufficient phase modulation range with enhanced transmission. By applying the fabricated metasurface patch to a wireless power transfer system for implantable devices, it is experimentally confirmed that the transmission coefficient (S₂₁) is improved by 6.37 dB compared with that of a wireless power transfer system without the metasurface patch. Furthermore, it is confirmed that the transmission coefficient can be maintained for an incident angle variation up to 30° from the transmitter to the metasurface patch, resulting in a stable power delivery of the proposed wireless power transfer system.