共查询到17条相似文献,搜索用时 78 毫秒
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本文研究了溅射气氛中氮含量及后续热处理对射频溅射法制备的Fe-N薄膜的磁性能的影响,电镜分析的结果显示,样品中含有少量Fe16N2。 相似文献
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Ti对Zn-Al合金薄膜耐腐蚀性能的影响 总被引:1,自引:0,他引:1
应用组合材料芯片技术,以离子束溅射法在低碳钢基片上制备了不同Ti掺杂量的Zn-Al-Ti薄膜(Al和Zn质量分数分别为55%和45%)样品阵列.沉积得到的多层薄膜经低温扩散和高温晶化形成合金薄膜.以电化学方法测定合金薄膜在浓度(质量分数)为3.5%的中性NaCl水溶液中的耐蚀性能,并进一步研究了优选出的组分的耐蚀性.结果表明,Ti的适量掺杂可使合金薄膜的耐蚀性能明显提高.其中,Ti的质量分数在6%左右时耐蚀性能最佳.采用XRD及SEM对6%Ti的合金薄膜的相结构和表面形貌进行了表征,并与未掺杂Ti的薄膜进行了比较.此外,分析了Zn-Al-6%Ti合金薄膜的腐蚀机理,为进一步优化薄膜体系提供了依据. 相似文献
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F.P. Wang. P. Wu L.Q. Pan Y. Tian H. Qiu Department of Physics School of Applied Sciences University of Science Technology Beijing Beijing China Beijing Keda-Tianyu Microelectronic Material Technology Development Co. Ltd. Beijing 《金属学报(英文版)》2002,15(2):215-220
1. IntroductionCu filnls are very pron1isillg for electronic devices because of both high electromigrationresista11ce alld high electrical conductivity['--']. For a sputter-deposited film, base pressure,deposition rate, substrate temperature and energetic… 相似文献
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Fe-Cu thin films of 0.2μm in thickness with different Cu contents were prepared by using r.f. magnetron sputtering onto glass substrate. The effect of sputtering param-eters, including Ar gas pressure and input rf power, on the structure and magnetic properties was investigated. It was found that when the power is lower than 70 W, the structure of the films remained single bcc-Fe phase with Cu solubility of up to 50at.%. TEM observations for the bcc-Fe phase showed that the grain size was in the nanometer range of less than 20nm. The coercivity of Fe-Cu films was largely affected by not only Ar gas pressure but also rf power, and reached about 2.5Oe in the pressure of 0.67-6.67Pa and in the power of less than WOW. In addition, saturation magnetization, with Cu content less than 60at. %, was about proportional to the con-tent of bcc-Fe. When Cu content was at 60at.%, however, saturation magnetization was much smaller than its calculation value. 相似文献
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分别在未施加偏压和施加-100 V偏压条件下,利用磁控溅射技术在压气机叶片用1Cr11Ni2W2MoV热强不锈钢基体上沉积了Ti0.3Al0.7N和Ti0.39Al0.55Si0.05Y0.01N硬质涂层.实验结果表明,施加偏压及Si和Y掺杂明显改变了涂层的相结构,提高了涂层致密度,施加-100 V偏压且添加Si和Y的涂层为非晶结构,表面更加均匀致密.950℃氧化实验表明:Ti0.39Al0.55Si0.05Y0.01N涂层表面形成极薄且致密的Al2O3保护性氧化膜,大大降低了氧化速率.施加-100 V偏压的(Ti,Al)N和(Ti,Al,Si,Y)N沉积态涂层与未施加偏压的相应涂层相比,硬度均降低,尤其是(Ti,Al,Si,Y)N涂层变化显著.经950℃热处理,施加偏压的(Ti,Al,Si,Y)N涂层硬度略有降低,这是由于形成了硬度较低的B4相,而未施加偏压的(Ti,Al,Si,Y)N涂层硬度显著提高,这归因于B1相固溶体的分解.划痕测试结果表明,在实验载荷(50N)下,所有涂层均未出现连续性的剥落. 相似文献
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Co/Ti非晶多层膜晶化过程中结构及磁性的变化 总被引:2,自引:0,他引:2
利用双对向靶溅射方法在室温下制备Co/Ti非晶多层膜,并采用原位退火透射电镜和原位热重法,观测了Co/Ti多层膜结构与磁性随温度的变化,结果表明:退火温度ta为400℃时,薄膜开始晶化,Co,Ti颗粒析出并粗化;ta>600℃时,具有铁磁性的Co单质完全消失,全部转化为Co2Ti相.热磁测量在390及520℃附近出现了两个明显的磁性转变峰,与薄膜结构变化对应.适当温度(400—520℃)的退火可获得高饱和磁化强度的Co-Ti颗粒膜. 相似文献
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电弧离子镀(Ti,Al)N复合薄膜的结构和性能研究 总被引:18,自引:0,他引:18
利用电弧离子镀设备在1Cr11Ni2W2MoV不锈钢基体表面沉积了不同成分的(Ti1-xAlx)N薄膜;X射线衍射分析表明,x在0-0.5之间时,薄膜是Bl型(NaCl)单相结构;x=0.64时,同时出现B1和B4型(ZnS)两种相结构,x≥0.79时,只出现B4型结构;随着Al含量的增加,晶格常数减小,B1结构的薄膜择优取向由(111)向(220)转变。力学性能测试表明,适当Al含量可以提高薄膜的硬度、膜基结合强度及抗磨损性能;B1结构(Ti,Al)N薄膜的氧化实验表明,随着Al含量的增加,薄膜抗氧化性能显著提高。 相似文献