Si(100)和Si(111)衬底上的同质分子束外延

用超高真空电子束蒸发系统进行了硅的同质分子束外延.发现采用适当的表面化学处理方法,然后在超高真空中加热,可以在较低温度下(800—814℃)获得清洁和平整的有序表面.Si(100)和Si(111)的外延分别在520℃和714℃进行,外延膜的结构和电学特性良好.     

Temperature Dependence of Epitaxial Graphene Formation on SiC(0001)

The formation of epitaxial graphene on SiC(0001) surfaces is studied using atomic force microscopy, Auger electron spectroscopy, electron diffraction, Raman spectroscopy, and electrical measurements. Starting from hydrogen-annealed surfaces, graphene formation by vacuum annealing is observed to begin at about 1150°C, with the overall step-terrace arrangement of the surface being preserved but with significant roughness (pit formation) on the terraces. At higher temperatures near 1250°C, the step morphology changes, with the terraces becoming more compact. At 1350°C and above, the surface morphology changes into relatively large flat terraces separated by step bunches. Features believed to arise from grain boundaries in the graphene are resolved on the terraces, as are fainter features attributed to atoms at the buried graphene/SiC interface.     

石墨烯的SiC外延生长及应用(续)

正3.3 X射线光电子能谱XPS能谱分析的基本原理:一定能量的X光照射到样品表面和待测物质发生作用,可以使待测物质原子中的电子脱离原子成为自由电子。通过接收并测量这些光电子的能量,得到原子或分子内部各轨道的结合能,从而就可以了解样品中元素的组成。图8所示为样品的XPS能谱图,图中各峰值     

Substrate Modes of (Al,In)GaN Semiconductor Laser Diodes on SiC and GaN Substrates

In semiconductor laser diodes layers with high refractive index can act as parasitic waveguides and cause severe losses to the optical mode propagating in the longitudinal direction. For (Al,In)GaN laser diodes, the parasitic modes are typically caused by the SiC or GaN substrate or buffer layers, hence the name substrate modes. A set of four different experiments shows the effect of substrate modes in the near-field (the most direct evidence of substrate modes), as side lobes in far-field, oscillations of the optical gain spectra, and as dependency of threshold current on n-cladding thickness. We derive several basic properties of the substrate modes by simple estimates. For a quantitative analysis we employ a 2-D finite element electromagnetic simulation tool. We simulate periodic variations in the cavity gain spectrum that explain the measurements in terms of absolute value and oscillation amplitude. We show that it is necessary to include the refractive index dispersion in order to get the correct period of the gain oscillations. Furthermore, we use the simulations to optimize the laser diode design with respect to substrate mode losses within the constraints given, e.g., by growth conditions     

Electronic Structure of SiN Layers on Si(111) and SiC/Si(111) Substrates

Semiconductors - Ultrathin epitaxial silicon nitride films were formed on different Si(111) and SiC/Si(111) substrates by nitridation with plasma-activated nitrogen. Photoemission studies of the...     

High-Quality (211)B CdTe on (211)Si Substrates Using Metalorganic Vapor-Phase Epitaxy

High-quality (211)B CdTe buffer layers are required during Hg_1−x Cd _x Te heteroepitaxy on Si substrates. In this study, direct metalorganic vapor-phase epitaxy (MOVPE) of (211)B CdTe on Si, as well as CdTe on Si using intermediate Ge and ZnTe layers, has been achieved. Tertiary butyl arsine was used as a precursor to enable As surfactant action during CdTe MOVPE on Si. The grown CdTe/Si films display a best x-ray diffraction rocking-curve full-width at half-maximum of 64 arc-s and a best Everson etch pit density of 3 × 10⁵ cm⁻². These values are the best reported for MOVPE-grown (211)B CdTe/Si and match state-of-the-art material grown using molecular-beam epitaxy.     

Wet Etching Study of La0.67(Sr0.5Ca0.5)0.33MnO3 Films on Silicon Substrates

Wet etching of colossal magnetoresistive (CMR) perovskite La_0.67(Sr_0.5 Ca_0.5)_0.33MnO₃ (LSCMO) films on Bi₄Ti₃O₁₂/CeO₂/yttrium-stabilized zirconia (YSZ)-buffered Si substrates was investigated using potassium hydroxide (KOH) and buffered hydrofluoric acid (BHF) solutions. X-ray diffraction (XRD) and scanning spreading resistance microscopy (SSRM) measurements revealed that the morphological roughness of the LSCMO films increases, while the electrical resistance roughness decreases, with increasing KOH etching time. The LSCMO films are highly chemically resistant to KOH solution; however, in the case of BHF etching, an etch rate of 22 nm/min was obtained with high selectivity over a photoresist mask.     

偏晶向(0001)Si-面衬底上4H-SiC的LPCVD外延生长

化学气相沉积(CVD)是微电子器件用SiC外延材料的主要生长技术.为了获得高质量的4H-SiC外延材料,在偏向<1120>方向8°的4H-SiC(0001)Si-面衬底上,利用台阶控制生长技术进行4H-SiC的同质外延生长.表面形貌是SiC外延材料质量好坏的一个重要参数,为此研究了表面形貌与工艺参数的关系,探讨了4H-SiC外延膜的表面缺陷形成原因.利用Raman散射技术研究了非均匀4H-SiC外延材料的多晶型现象.     

偏晶向(0001)Si-面衬底上4H-SiC的LPCVD外延生长

化学气相沉积(CVD)是微电子器件用SiC外延材料的主要生长技术.为了获得高质量的4H-SiC外延材料,在偏向<1120>方向8°的4H-SiC(0001)Si-面衬底上,利用台阶控制生长技术进行4H-SiC的同质外延生长.表面形貌是SiC外延材料质量好坏的一个重要参数,为此研究了表面形貌与工艺参数的关系,探讨了4H-SiC外延膜的表面缺陷形成原因.利用Raman散射技术研究了非均匀4H-SiC外延材料的多晶型现象.     

偏晶向(0001)Si-面衬底上4H-SiC的LPCVD外延生长

化学气相沉积（CVD）是微电子器件用SiC外延材料的主要生长技术. 为了获得高质量的4H-SiC外延材料，在偏向〈1120〉方向8. 的4H-SiC (0001) Si-面衬底上，利用台阶控制生长技术进行4H-SiC的同质外延生长. 表面形貌是SiC外延材料质量好坏的一个重要参数，为此研究了表面形貌与工艺参数的关系，探讨了4H-SiC外延膜的表面缺陷形成原因. 利用Raman散射技术研究了非均匀4H-SiC外延材料的多晶型现象.     

In Situ Thermolysis of a Ni Salt on Amorphous Carbon and Graphene Oxide Substrates

Understanding the thermal decomposition of metal salt precursors on carbon structures is essential for the controlled synthesis of metal-decorated carbon nanomaterials. Here, the thermolysis of a Ni precursor salt, NiCl₂·6H₂O, on amorphous carbon (a-C) and graphene oxide (GO) substrates is explored using in situ transmission electron microscopy. Thermal decomposition of NiCl₂·6H₂O on GO occurs at higher temperatures and slower kinetics than on a-C substrate. This is correlated to a higher activation barrier for Cl₂ removal calculated by the density functional theory, strong Ni-GO interaction, high-density oxygen functional groups, defects, and weak van der Waals using GO substrate. The thermolysis of NiCl₂·6H₂O proceeds via multistep decomposition stages into the formation of Ni nanoparticles with significant differences in their size and distribution depending on the substrate. Using GO substrates leads to nanoparticles with 500% smaller average sizes and higher thermal stability than a-C substrate. Ni nanoparticles showcase the fcc crystal structure, and no size effect on the stability of the crystal structure is observed. These findings demonstrate the significant role of carbon substrate on nanoparticle formation and growth during the thermolysis of carbon–metal heterostructures. This opens new venues to engineer stable, supported catalysts and new carbon-based sensors and filtering devices.     

氧化物缓冲层制备Si(111)基GaN纳米线

采用氧化物缓冲层,通过射频磁控溅射系统依次在n型Si(111)衬底上沉积Ga2O3/ZnO(Ga2O3/MgO)薄膜,然后将薄膜于950℃氨化合成GaN纳米结构,氨化时间为15min。采用X射线衍射(XRD)、傅里叶红外吸收谱(FTIR)和高分辨透射电镜(HRTEM)对样品的结构进行了分析,结果显示两种缓冲层下制备的样品均为六方纤锌矿单晶GaN纳米结构,且缓冲层的取向对纳米线的生长方向有很大影响;采用扫描电镜(SEM)对样品的形貌进行了测试,发现纳米线表面光滑,长度可达几十微米,表明采用氧化物缓冲层制备了高质量的GaN线。同时对GaN纳米线的生长机理进行了简单讨论。     

Pore Sealing on Si(001) and Si(111) in Homoepitaxy and Annealing: A Monte Carlo Simulation

A Monte Carlo simulation is reported of (i) the homoepitaxial growth of a continuous film on porous Si(111) and Si(001) surfaces and (ii) high-temperature annealing of a porous-silicon substrate. The simulation is based on a 3D model for diamond-type crystals. It is shown that homoepitaxy produces a smooth film on a (111) surface, whereas the film on a (001) surface shows {111} tetrahedral pits. It is found that the minimum deposited dose required for pore sealing is much lower for a (111) surface; this is true of all temperatures, deposition rates, and porosities considered. The difference in surface morphology between the two films is attributed to the influence of surface orientation on adatom migration. The variation is examined of pore penetration depth with respect to epitaxy conditions and porosity. Structural changes under annealing are investigated in the Si(001) case.     

Photoelectric Properties of GaN Layers Grown by Plasma-Assisted Molecular-Beam Epitaxy on Si(111) Substrates and SiC/Si(111) Epitaxial Layers

Semiconductors - The photoelectric properties of GaN/SiC/Si(111) and GaN/Si(111) heterostructures grown by plasma-assisted molecular-beam epitaxy under the same growth conditions on identical...     

AIN/Si(111)复合衬底上4H-SiC薄膜的异质外延

利用化学气相淀积(CVD)的方法在AlN/Si(111)复合衬底上成功实现了4H-SiC薄膜的异质外延生长,用X射线衍射(XRD)、扫描电子显微镜(SEM)、阴极荧光(CL)等方法对所得样品的结构特征、表面形貌和光学性质进行了表征测量.XRD测量结果显示得到的SiC薄膜的晶体取向单一;室温CL结果表明所得SiC薄膜为4H-SiC,且随着生长温度的升高,SiC薄膜的CL发光效率提高.生长温度、反应气源中C/si比等工艺参数对SiC薄膜的外延生长及其性质影响的研究表明在AIN/Si(111)复合衬底上外延4H-SiC的最佳衬底温度为1230～1270℃,比通常4H-SiC同质外延所需的温度低200～300℃;较为合适的C/Si比值为1.3.     

Formation of a Quasi‐Free‐Standing Single Layer of Graphene and Hexagonal Boron Nitride on Pt(111) by a Single Molecular Precursor

It is shown that on Pt(111) it is possible to prepare hexagonal boron nitride (h‐BN) and graphene (G) in‐plane heterojunctions from a single molecular precursor, by thermal decomposition of dimethylamine borane (DMAB). Photoemission, near‐edge X‐ray absorption spectroscopy, low energy electron microscopy, and temperature programmed desorption measurements indicate that the layer fully covers the Pt(111) surface. Evidence of in‐plane layer continuity and weak interaction with Pt substrate has been established. The findings demonstrate that dehydrogenation and pyrolitic decomposition of DMAB is an efficient and easy method for obtaining a continuous almost freestanding layer mostly made of G, h‐BN with only a low percentage (<3%) of impurities (B and N‐doped G domains or C‐doped h‐BN or boron carbonitride, BCN at the boundaries) in the same 2D sheet on a metal substrate, such as Pt(111), paving the way for the advancement of next‐generation G‐like‐based electronics and novel spintronic devices.     

Yield Strengths of Biaxially Textured Metallic Substrates (Ni and its Alloys) Determined Using a Simplified Test Method

A simple testing method is used to compare the yield strengths (YS) of biaxially textured metallic substrates (Ni and its alloys) presently under development for YBa₂Cu₃O_7−x coated conductors. This method is based on a retired ASTM D3379 tensile test standard method that was originally recommended for single filament materials. Several common textured substrates, such as Ni, Ni-3at.%W, and Ni-5at.%W, procured from different manufacturers, were tested using this method, and the data were compared with the values reported in the literature. A new alloy substrate (constantan (Cu55-Ni44-Mn1wt.%)) that is biaxially textured in-house was also tested using this method, and the YS data were compared with those of other substrates. For the substrates used in this study, the data obtained using this method indicated that Ni substrates have YS of ∼52 MPa, Ni-3at.%W substrates have YS of ∼106 MPa, Ni-5at.%W substrates have YS 163 MPa, and Cu55-Ni44-Mn1 wt.% substrates have YS of 74 MPa.     

Impact of Carrier Gas on the GaN Layers Properties Grown on (001) and (11n) GaAs Substrates by AP-MOVPE: Comparative Study

Semiconductors - The impact of carrier gas on the GaN layers properties grown by atmospheric pressure metal-organic vapor-phase epitaxy (AP-MOVPE) on (001) and (11n) GaAs substrates were...