Thermal studies of blends of poly(phenylene sulfide) (PPS) with poly(phenylene sulfide sulfone) (PPSS) and with poly(phenylene sulfide ether) (PPSE)

The miscibilities of poly(phenylene) sulfide/poly(phenylene sulfide sulfone) (PPS/PPSS) and poly(phenylene) sulfide/poly(phenylene sulfide ether) (PPS/PPSE) blends were invesigated in terms of shifts of glass transition temperatures T_g of pure PPS, PPSS, a dn PPSE. The crystallization kinetics of PPS/PPSS blends was also studied as a function of molar composition. The PPS/PPSS and PPS/PPSE blends are respectively partially and fully miscible. PPSE shows a plasticizing effect on PPS as does PPS on PPSS, which necessarily improves te processibility in the respective systems. We can control T_g and melting temperature T_m of PPS by varying amounts of PPSE in blends. The melt crystallization temperature T_mc of PPS/PPSE blends was higher than that of the PPSE homopolymer. Therefore, these blends require shorter cycle times in processing than pure PPSE. The overall rate of crystallization for PPS/PPSS blends follows the Avrami equation with an exponent ?2. The maximal rate of crystallization for PPS/PPSS blends occurs at a temperatre higher by 10°C than that for PPS, while the crystallization half time t_1/2 is 4 times shorter. In the cold crystallization range, crystal growth rates increase and Avrami exponents decrease significantly as the temperature increases.     

Thermal analysis of poly(phenylene sulfide) polymers. I: Thermal characterization of PPS polymers of different molecular weights

Thermal properties of Fortron®

1 ®Registered trademark of Hoechst Celanese Corporation.

poly(phenylene sulfide) (PPS) polymers of different molecular weights were studied by DSC. Crystallization studies revealed that the ability of these polymers to crystallize decreases with increasing molecular weight. The Avrami equation poorly describes the isothermal crystallization of PPS. Lamellar crystallization was observed for the lowest molecular weight sample. For the other, higher molecular weight polymers the Avrami exponent is always between 2 and 3, suggesting development of distorted spherulites with heterogeneous nucleation. The temperature dependence of the solid and melt heat capacities have been determined. The solid specific heat capacity did not exhibit a molecular weight dependence. The heat capacity increase at the glass transition, T_g, has been calculated to be 28.1 J°C^?1 mole^?1. The equilibrium melting point of PPS has been estimated to be 348.5°C using the Hoffman–Weeks method. The T_g of PPS increases with molecular weight. The T_g of the highest molecular weight evaluated is 92.5°C. A DMA relaxation peak corresponding to the onset of the phenylene ring rotation occurs at ?92°C. Only the highest molecular weight could be quenched to a completely amorphous state.     

Aging behavior of optically transparent poly (methyl methacrylate) composites

The thermal aging between 25 and 115°C of hot pressed glass fiber reinforced poly (methy1 methacrylate)(PMMA) transparent composites was studied as a function of the temperature and time of hot pressing. Thermal aging at near the T_g of the PMMA matrix caused dimensional changes and a reduction in optical transmission and clarity. The reduction in transmission was attributed to gas bubbles that formed in the matrix, which may be due to the evaporation of residual MMA monomer or low T_g (∼ 75°C) polymer in the composites during aging. Thermal cycling between 25 and 100°C by eliminating low T_g of the PMMA matrix establishes the upper temperature limit to which the composite can be exposed without seriously damaging its optical properties.     

Physical aging of epoxy resin blended with poly(ether sulfone): Effect of poly(ether sulfone) molecular weight

The physical aging process of 4-4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with various molecular weights of poly(ether sulfone) (PES; M_n = 28,600, 10,600, and 6,137) was studied by DSC. For DGEBA/DDS system blended with a low MW PES-3 (M_n = 6,137), no phase separation of the polymer blend and only one enthalpic relaxation process due to physical aging was observed. Since the high MW PES-1 (M_n = 28,600) had a T_g close to that of fully cured DGEBA/DDS, the fully cured DGEBA/DDS/PES-1 blend had a broader glass transition than a neat DGEBA/DDS system. However, the DSC results showed two enthalpic relaxation processes due to the physical aging of PES-rich and cured epoxy-rich phases as the material was aged at 155 °C (30 °C below T_g). Since the T_gs of PES-1-rich and epoxy-rich phases overlapped with each other, the enthalpic relaxation processes corresponding to each phase coupled to each other in the earlier stage of physical aging. The medium MW PES-2 (M_n = 10,600) has a much lower T_g than that of fully cured DGEBA/DDS, two well separated T_gs were observed for the cured DGEBA/DDS/PES-2 blend, indicating the cured epoxy was immiscible with PES. Aging the polymer blend at 155 °C (24 °C below T_g1 of the PES-2-rich phase and 53 °C below T_g2 of the epoxy-rich phase) produced two well separated relaxation processes due to PES-2-rich and epoxy-rich phases. The experimental results suggested that aging the polymer blend at a suitable temperature would improve the phase separation between PES-1-rich and epoxy-rich phases.     

Extensional processing behavior of thermoplastics reinforced with a melt processable glass

This work was concerned with investigating the processing behavior of thermoplastics reinforced with a melt processable phosphate glass under extensional flows at temperatures used for forming and shaping operations. Injection molded blends consisting of polyetherimide (PEI) and polyphenylene sulfide (PPS) reinforced with 30‐60 wt% phosphate glass were exposed to uniaxial and planar deformation at temperatures above the T_g of the phosphate glass (234°C) to evaluate the effects on the morphology and mechanical properties of the composites. Tensile testing at elevated temperatures (250‐300°C) was used to evaluate the forming behavior and ascertain the conditions most suited for the deformation of the composite blends. A temperature approximately 35°C above the T_g of the P‐glass was found to offer conditions most conducive to the deformation of the PEI/P‐glass blends. The phosphate glass reinforced PEI was found to offer greater retention of properties and smoother surfaces than an E‐glass filled material when exposed to shearfree deformation similar to that seen in a process such as thermoforming. For PPS based composites, the application of planar shearfree deformation near the melting point of the PPS (≈︁ 283°C) resulted in the elongation of the phosphate glass phase which served to enhance the stiffness of the composite blends along the principal deformation direction.     

Thermal and mechanical properties of compression‐molded pMDI‐reinforced PCL/gluten composites

Many biopolymers and synthetic polymers composites were developed by different researchers for environmental protection and for cost reduction. One of these composites is polycaprolactone (PCL) and vital wheat gluten or wheat flour composites were prepared and compatibilized with polymeric diphenylmethane diisocyanate (pMDI) by blending and compression‐molding. PCL/pMDI blend exhibited glass transition (T_g) at ?67°C (0.20 J/g/°C) and vital gluten at 63°C (0.45 J/g/°C), whereas no T_g was recorded for wheat flour. Although T_g was unmistakable for either PCL or gluten, all composite exhibited one T_g, which is strong indication of interaction between PCL and the fillers. Several samples amongst the blended or compression‐molded composites exhibited no T_g signifying another confirmation of interaction. The ΔH of the endothermic (melting) and the exothermic (crystallization) for PCL was decreased as the percentage of gluten or flour increased, whereas the overall ΔH was higher for all composites compared to the theoretical value. The presence of pMDI appeared to strengthen the mechanical properties of the composites by mostly interacting with the filler (gluten or flour) and not as much with PCL. The FTIR analysis ruled out covalent interaction between PCL, pMDI, or the fillers but suggested the occurrence of physical interactions. Based on the data presented here and the data published earlier, the presence of pMDI did not change the nature of interaction between PCL and gluten, but it improved the mechanical properties of the composite. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Epoxy filled with nylon powder—An approach to reduce void formation via fused particle method

In the quest for superior materials, especially in industrial applications demanding strength, stiffness, low density, and cost-efficiency, composite materials have emerged as game changers. Combining a polymer matrix with reinforcement materials, they hold great promise. However, the challenge of particle agglomeration looms large, especially at high loadings. Particle agglomeration disrupts filler distribution and gives rise to voids in polymer composites. This study investigates the fusion behavior of agglomerated Nylon particles and their influence on Nylon/epoxy composites. Using epoxy resin and Nylon SP301, a micron-sized Nylon 12 powder with a 185°C melting point, composites were prepared at 3%, 9%, and 15% Nylon loading. After curing, these composites underwent controlled heating at 185, 195, and 205°C, with a fusion of 20–100 min. At 185°C, particles initially remain separate, forming slight clumps after 20 min and increasingly sticking together at 60 and 100 min. Shifting to 195°C, particles begin consolidating into a solid mass even after 20 min. The introduction of Nylon decreases composite density compared to pure epoxy, and density changes vary with fusion time, exhibiting complete fusion, partial fusion, and shrinkage-induced gap formation. Differential scanning calorimetry analysis reveals evolving glass transition temperatures (T_g) influenced by the fusion process, with longer fusion times yielding higher T_g and greater heat capacity.     

Effects of fibers on the glass transition temperature of polyphenylene sulfide composites

The glass transition temperature (T_g) of polyphenylene sulfide (PPS), and of several commercial and model PPS prepregs with aramid, carbon, and glass fibers was studied by means of differential scanning calorimetry. The T_g of unreinforced PPS was found to range between 83–90°C, depending on source and molecular weight. The T_g of the commercial prepregs was depressed by about 3–5°C from that of the corresponding unfilled PPS, an effect that was ascribed to the plasticization of the PPS by one or more components of the fiber finish (size) that was assumed to have diffused into the PPS polymer. In the case of model prepregs prepared with finish-free reinforcing fibers, an expected increase in T_g was observed. In model prepregs prepared with finished (sized) aramid fibers, the T_g was depressed as in the case of the commercial prepregs. With sized AS-4 carbon fibers, the T_g was increased, but significantly less so than with unsized AS-4 fibers. With sized glass fibers, the same slight increase in T_g was observed as with unsized glass fibers. The increase or decrease of T_g in all cases was a function of the fiber content in the model PPS prepregs.     

Positive temperature coefficient to resistively characteristics of polystyrene/nickel powder/multiwall carbon nanotubes composites

Positive temperature coefficient to resistivity (PTCR) characteristics of polystyrene (PS)/Ni‐powder (40 wt%) composites in the presence of multiwall carbon nanotubes (MWCNTs) has been investigated with reference to PS/carbon black (CB) composites. The PS/CB (10 wt%) composites showed a sudden rise in resistivity (PTC trip) at ≈110°C, above the glass transition temperature (T_g) of PS (T_g ≈95°C). Interestingly, the PTC trip temperature of PS/Ni‐powder (40 wt%)/MWCNT (0.75 phr) composites appeared at ≈90°C (below T_g of PS), indicating better dimensional stability of the composites at PTC trip temperature. The PTC trip temperature of the composites below the T_g of matrix polymer (PS) has been explained in terms of higher coefficient of thermal expansion (CTE) value of PS than Ni that led to a disruption in continuous network structure of Ni even below the T_g of PS. The dielectric study of PS/Ni‐powder (40 wt%)/MWCNT (0.75 phr) composites indicated possible use of the PTC composites as dielectric material. Dynamic mechanical analysis (DMA) and thermogravimetric analysis studies revealed higher storage modulus and improved thermal stability of PS/Ni‐powder (40 wt%)/MWCNT (0.75 phr) composites than the PS/CB (10 wt%) composites. POLYM. COMPOS., 33:1977–1986, 2012. © 2012 Society of Plastics Engineers     

Investigation of non-isothermal crystallization,dynamic mechanical and dielectric properties of poly(ether-ketone) matrix composites

ABSTRACT

Poly(ether-ketone)/hexagonal boron nitride (h-BN) composites reinforced with micrometer-sized h-BN particles were investigated. The composites exhibited glass transition temperature (T_g) and thermal stability over 160°C and 560°C, respectively. The melting point and peak crystallization temperatures of the composites decreased up to 17°C and 12°C, respectively. The linear CTE of the composites decreased both below and above the T_g. The storage modulus increased with increasing h-BN content at all temperatures (50–250°C). The composites possessed excellent dielectric properties with insignificant dispersion with increasing frequency. Thus, resultant composites are promising candidates for the printed circuit boards/electronic substrates.     

Microstructure and photocatalytic activity of electrospun carbon nanofibers decorated by TiO2 nanoparticles from hydrothermal reaction/blended spinning

Recently, carbon nanofibers@TiO₂ (CNFs@TiO₂) composites as photocatalysts for dye degradation have attracted intense attention. However, only few contributions had been made to investigate systematically the differences between the various preparation approaches and the influence of thermal treatment on the photocatalytic activity. In this work, the electrospun CNFs@TiO₂ composites which were prepared by hydrothermal reaction and blended spinning, respectively, have been fabricated via stabilization in air at 280 °C and then carbonization in N₂ at heat treatment temperature between 500 and 1100 °C. The composites which were prepared by hydrothermal reaction and blended spinning showed the outstanding photocatalytic activity at 900 °C and 1100 °C, respectively. And the photocatalytic activity of composites prepared by hydrothermal reaction was higher than that prepared by blended spinning, but reversibility of the composites showed a reverse trend. These results indicated that the effect of heat treatment temperature on the photocatalytic activity depended on the synergistic effect among the adsorptive property of CNFs, TiO₂ loading amount and anatase phase content in composites. Hence, combining the merits of hydrothermal reaction and blended spinning, a novel method for preparing CNFs@TiO₂ composites with high TiO₂ loading amount and strong interfacial interaction could be envisioned.     

Effect of preparation methods on thermal properties of poly(acrylic acid)/silica composites

Poly(acrylic acid)-silica composites have been prepared by two different methods and thermally characterized. The glass transition temperature (T_g) of the PAA-SiO₂ system prepared by mixture method was found to be 120°C irrespective of the type and amounts of silica involved in this work. However, the T_g varied between 132°C and 113°C in the systems prepared by polymerization reaction depending upon the type of silica and percentage conversion. The composites prepared by mixture and polymerization method have been investigated by using thermogravimetry (TGA) to follow the kinetics of anhydride formation and thermal degradation reactions. The activation energy of thermal anhydride formation and thermal degradation reaction was not found to change very much with ratio of PAA-SiO₂ when the composites were prepared by simple mixing. For the composites prepared by polymerization method the activation energy of anhydride formation and thermal degradation reaction were observed to change with percentage conversion. © 1998 John Wiley & Sons, Inc. J. Appl. Polym. Sci. 70: 891–895, 1998     

Thermophysical properties of anhydride‐cured epoxy/nano‐clay composites

Polymer nano‐composites made with a matrix of anhydride‐cured diglycidyl ether of bisphenol A (DGEBA) and reinforced with organo‐montmorillonite clay were investigated. A sonication technique was used to process the epoxy/clay nano‐composites. The thermal properties of the nano‐composites were measured with dynamic mechanical analysis (DMA). The glass transition temperature T_g of the anhydride‐cured epoxy was higher than the room temperature (RT). For samples with 6.25 wt% (4.0 vol%) of clay, the storage modulus at 30°C and at (T_g + 15)°C was observed to increase 43% and 230%, respectively, relative to the value of unfilled epoxy. The clay reinforcing effect was evaluated using the Tandon‐Weng model for randomly oriented particulate filled composites. Transmission electron microscopy (TEM) examination of the nano‐composites prepared by sonication of clays in acetone showed well‐dispersed platelets in the nano‐composites. The clay nano‐platelets were observed to be well‐intercalated/expanded in the anhydride‐cured epoxy resin system. POLYM. COMPOS., 26:42–51, 2005. © 2004 Society of Plastics Engineers.     

Synthesis and characterization of polypropylene/clay nanocomposites

Polypropylene/clay (PP/clay) nanocomposites were synthesized via intercalative polymerization. The nanostructure of the composites was investigated by wide‐angle X‐ray diffractometry (WAXD) and transmission electron microscopy (TEM). The WAXD patterns of the PP/clay nanocomposites indicated that the characteristic diffraction peak of the clay disappeared. The TEM image showed the clay was exfoliated into nanometer size and dispersed uniformly in the PP matrix. The composites exhibited much higher storage modulus compared to that of pure PP. At temperatures higher than T_g, the storage modulus of the PP/clay nanocomposites with 8.1 wt % clay content increased three times that of the pure PP. Additionally, the thermal stability of the nanocomposites significantly increased. The maximum decomposition temperature was increased by 44°C with the introduction of about 10 wt % clay. The heat‐distortion temperatures (HDTs) of the nanocomposites also increased. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 3611–3617, 2001     

The gel-phase modulus of high-impact polystyrene from dynamic mechanical spectroscopy

High-impact polystyrene (HIPS) constitutes a mechanically attractive composite, consisting of a glassy matrix and a rubberlike particle phase (gel phase). Dynamic mechanical spectroscopy was performed for the polystyrene matrix for three different types of HIPS as well as for the concentrated gel-phase material, at the vicinity of the respective glass-transition temperatures (T_g). An approximate estimation of the gel-phase modulus was attempted by using known mechanical models. A comparison with experiments was also made. The modulus of the composite was found to be lower than the theoretical lower bound for particulate composites. This was attributed to a separate phase between gel particles and the matrix. A diffusion-type variation of the modulus of this mesophase layer was estimated, and a correlation between calculated fitting parametric exponents and impact behavior of HIPS was found. Moreover, the T_gs of the materials under investigation were also measured with two independent methods. It was found that all types of HIPS presented higher T_gs than the pure matrix by 5 to 10°C with the highest T_g found being that of the gel-enriched material. The shift of T_gs to higher temperatures was attributed to an eventual increase of the effective cross-link density of the matrix because of grafting.     

Synthesis and characterization of bis(4‐cyanato‐3,5‐dimethylphenyl)anisylmethane/epoxy/glass fiber composites

Bis(4‐cyanato‐3,5‐dimethylphenyl)anisylmethane was prepared by treating CNBr with bis(4‐hydroxy‐3,5‐dimethylphenyl)anisylmethane and blended with commercial epoxy resin in different ratios and cured at 120°C for 2 h, 180°C for 1 h, and postcured at 220°C for 1 h using diamino diphenyl methane as curing agent. Castings of neat resin and blends were prepared and characterized. The composite laminates were also fabricated with glass fiber using the same composition. The tensile strength of the composites increased with increase in cyanate content (3, 6, and 9%) from 322 to 355 MPa. The fracture toughness values also increased from 0.7671 kJ/m², for neat epoxy resin, to 0.8615 kJ/m², for 9% cyanate ester‐modified epoxy system. The 10% weight loss temperature of pure epoxy (358°C) was increased to 390°C by the incorporation of cyanate ester resin. The incorporation of cyanate ester up to 9% in the epoxy resin increases the T_g from 143 to 147°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Effect of polyarylene ether nitriles on processing and mechanical behaviors of phthalonitrile‐epoxy copolymers and glass fiber laminated composites

A series of copolymers and glass fiber composites were successfully prepared from 2,2‐bis [4‐(3,4‐dicyanophenoxy) phenyl] propane (BAPh), epoxy resins E‐44 (EP), and polyarylene ether nitriles (PEN) with 4,4′‐diaminodiphenyl sulfone as curing additive. The gelation time was shortened from 25 min to 4 min when PEN content was 0 wt % and 15 wt %, respectively. PEN could accelerate the crosslinking reaction between the phthalonitrile and epoxy. The initial decomposition temperatures (T_i) of BAPh/EP copolymers and glass fiber composites were all more than 350°C in nitrogen. The T_g of 15 wt % PEN glass fiber composites increased by 21.2°C compared with that of in comparison with BAPh/EP glass fiber composite. The flexural strength of the copolymers and glass fiber composites reached 119.8 MPa and 698.5 MPa which increased by 16.6 MPa and 127.3 MPa in comparison with BAPh/EP composite, respectively. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Hybrid Sol–Gel Glasses with Glass‐Transition Temperatures Below Room Temperature

Melting gels are hybrid gels that have the ability to soften and flow at around 100°C for some combinations of mono‐ and di‐substituted alkoxysiloxanes, where substitutions are either all aromatic or all aliphatic. In this study, melting gels were prepared using phenyltriethoxysilane (PhTES) and dimethyldiethoxysilane (DMDES), meaning both an aromatic and aliphatic substitution. Differential scanning calorimetry was performed to identify glass‐transition temperatures, and thermal gravimetric analysis coupled with differential thermal analysis (TGA‐DTA) was performed to measure weight loss. The glass‐transition temperatures (T_g) ranged from ?61°C to +5.6°C, which are between the values in the methyl only system, where all T_g values are less than 0°C, and those values in the phenyl only system, where T_g values are greater than 0°C. The T_g decreased with an increase in the DMDES fraction. Below 450°C, the gels lost little weight, but around 600°C there was a drop in weight. This temperature is lower than the temperature for gels prepared with only aromatic substitutions, but higher than that for gels prepared with only aliphatic substitutions. Final heat treatment was carried out at 150°C for the gel with 80%PhTES‐20%DMDES (in mol%), and the consolidation temperature increased with increasing DMDES content to 205°C for the gel with 50%PhTES‐50%DMDES. After this heat treatment, the melting gels no longer soften.     

Completely amorphous high thermal resistant copolyesters from bio-based 2,5-furandicarboxylic acid

Polyesters from renewable resources with glass transition temperature (T_g) higher than 100°C are crucial in broadening their application range. In this work, a series of high molecular weight copolyesters, poly(butylene bis[4-(2-hydroxyethoxy) phenyl] sulfone 2,5-furandicarboxylate) (PBSF), was synthesized from bis[4-(2-hydroxyethoxy) phenyl] sulfone (BHEPS), bio-based 1,4-butanediol (BDO), and 2,5-furandicarboxylic acid (FDCA) via transesterification. Nuclear magnetic resonance spectroscopy (¹H-NMR and ¹³C-NMR) was used to confirm their chemical structures, composition, and sequence distribution. Characterizations demonstrated that with the increasing content of BHEPS unit, T_g of synthesized polyesters was increased from 38.2°C for PBF to 122°C for PBSF-95, in which the content of BHEPS unit was 95%. However, the weight average molecular weight (M_w) of PBSF was dramatically decreased after the addition of BHEPS, from 95,300 g/mol for PBF to only 9600 g/mol for PBSF-95, which was too low for practical application. Taking molecular weight, T_g, and mechanical properties into account, PBSF-65 was considered to be a promising polyester with M_w of 28,500 g/mol, T_g of 104.7°C, tensile strength of 82 MPa, and elongation-at-break of 98%. Besides, it was a completely amorphous polyester with a transmittance of 89.9% by cutoff at 700 nm. Summarily, PBSF-65 showed great potential to be used as raw material for the manufacture of baby bottles, children's toys, kitchen appliances, and beverage packaging, especially in the case when high transparency and heat resistance are required.     

Elaboration and dielectric property of modified PZT/epoxy nanocomposites

Composites of lead zirconate titanate (PZT) 50 nm nanoparticles and epoxy resins have been produced with various PZT contents from 0 to 20 wt%. The morphology and thermal properties of prepared composites were characterized using scanning electron microscopy and differential scanning calorimetry. The PZT nanoparticles were found to be well dispersed in the epoxy resin matrix. The glass transition temperature (T_g) value of the nanocomposites increases from 164 to 178°C with increasing the PZT weight fraction. The dielectric composites properties dependences were studied via a wide range of frequency from 10 Hz to 100 kHz. The dielectric constant of PZT/epoxy composite was increased from 5.56 to 6.29 (at f = 1 kHz, T = 30°C), respectively to the incorporated PZT amount, and these values are higher than that the dielectric constant of pure cured epoxy resin, ε = 4.86. POLYM. COMPOS., 37:455–461, 2016. © 2014 Society of Plastics Engineers