Nb-Ti/Al/Ni/Au based ohmic contacts to AlGaN/GaN

In this paper, we report on a novel Nb-Ti/Al/Ni/Au metallic system proposed to form ohmic contact to AlGaN/GaN heterostructure. The metallic system uses deposition of thin niobium layer as the first layer in contact with the AlGaN barrier layer before deposition of the conventional Ti/Al/Ni/Au metallic system. The fabrication and electrical characterization of the Nb-Ti/Al/Ni/Au based ohmic contacts are presented. We have shown that Nb-based ohmic contacts at optimal alloying temperatures seem to be superior to that of conventional Ti/Al/Ni/Au in both surface morphology and contact resistivity evaluation. Auger Electron Spectroscopy (AES) and Secondary Ion Mass Spectroscopy (SIMS) are also used to evaluate the improved ohmic contact formation.     

On the difficulties in characterizing ZnO nanowires

The electrical properties of single ZnO nanowires grown by vapor phase transport were investigated. While some samples were contacted by Ti/Au electrodes, another set of samples was investigated using a manipulator tip in a low energy electron point-source microscope. The deduced resistivities range from?1 to 10(3)?Ωcm. Additionally, the resistivities of nanowires from multiple publications were brought together and compared to the values obtained from our measurements. The overview of all data shows enormous differences (10(-3)-10(5)?Ωcm) in the measured resistivities. In order to reveal the origin of the discrepancies, the influence of growth parameters, measuring methods, contact resistances, crystal structures and ambient conditions are investigated and discussed in detail.     

Template synthesis and forming electrical contacts to single Au nanowires by focused ion beam techniques

Metallic Au nanowires were electrochemically synthesized in 20?μm thick ion track etched polycarbonate membranes with the nominal pore diameter of 200?nm. Scanning and transmission electron microscopy analysis and x-ray diffraction of samples revealed that the nanowires are dense with a fcc [Formula: see text] texturing. The I-V characteristics of a single Au nanowire were investigated using a four-point microprobe set-up. The Au nanowire was placed in electrical contact with electrodes patterned on planar substrates using a dual-beam focused ion beam technique. The resistivity of the Au nanowires was found to be 2.8 × 10(-4)?Ω?cm.     

Fluorine-doped tin oxide films grown by pulsed direct current magnetron sputtering with an Sn target

Fluorine-doped tin oxide (FTO) films have been deposited by pulsed DC magnetron sputtering with an Sn target. Various ratios of CF4/O2 gas were injected to enhance the optical and electrical properties of the films. The extinction coefficient was lower than 1.5×10(-3) in the range from 400 to 800?nm when the CF4O2 ratio was 0.375. The resistivity of fluorine-doped SnO2 films (1.63×10(-3)?Ω?cm) deposited at 300?°C was 27.9 times smaller than that of undoped SnO2 (4.55×10(-2)?Ω?cm). Finally, an FTO film was consecutively deposited for protecting the oxidation of indium tin oxide films. The resistivity of the double-layered film was 2.68×10(-4)?Ω?cm, which increased by less than 39% at a 450?°C annealing temperature for 1?h in air.     

Fabrication of silicon carbide nanowires/carbon nanotubes heterojunction arrays by high-flux Si ion implantation

An array of silicon carbide nanowire (SiCNW)-carbon nanotube (CNT) heterojunctions was fabricated by high-flux Si ion implantation into a multi-walled carbon nanotube (MWCNT) array with a metal vapor vacuum arc (MEVVA) ion source. Under Si irradiation, the top part of a CNT array was gradually transformed into an amorphous nanowire array with increasing Si dose while the bottom part still remained a CNT structure. X-ray photoelectron spectroscopy (XPS) analysis shows that the SiC compound was produced in the nanowire part even at the lower Si dose of 5 × 10(16)?ions?cm(-2), and the SiC amount increased with increasing the Si dose. Therefore, the fabrication of a SiCNW-CNT heterojunction array with the MEVVA technique has been successfully demonstrated. The corresponding formation mechanism of SiCNWs was?proposed.     

Radiation hardness of the electrical properties of carbon nanotube network field effect transistors under high-energy proton irradiation

The effect of high-energy proton irradiation on the physical properties of carbon nanotubes (CNTs) was investigated. The focus of the study was on the electrical properties of single-walled carbon nanotube (SWNT) network devices exposed to proton beams. Field-effect transistors (FETs) of network type were fabricated using SWNTs and were then irradiated by high-energy proton beams of 10-35?MeV with a fluence of 4 × 10(10)-4 × 10(12)?cm(-2) that are comparable to the aerospace radiation environment. The electrical properties of both metallic and semiconducting CNT network FET devices underwent no significant change after the high-energy proton irradiation, indicating that the CNT network devices are very tolerant in proton beams. Raman spectra confirm the proton-radiation hardness of CNT network FET devices. The radiation hardness of CNT network FET devices promises therefore the potential usefulness of CNT-based electronics for future space application.     

Preparation and electrical properties of electrospun tin-doped indium oxide nanowires

Well-aligned tin-doped indium (ITO) nanowires have been prepared using the electrospinning process. The Sn doping mechanism and microstructure have been characterized by x-ray diffraction (XRD) and x-ray photoelectron spectroscopy (XPS). Devices for I-V measurement and field-effect transistors (FETs) were assembled using ITO nanowires with top contact configurations. The effect of Sn doping on the electrical conductivity was significant in that it enhanced the conductance by over 10(7) times, up to ～1?S?cm(-1) for ITO nanowires with an Sn content of 17.5 at.%. The nanowire FETs were operated in the depletion mode with an electron mobility of up to 0.45?cm(2)?V(-1)?s(-1) and an on/off ratio of 10(3).     

Effect of thermal annealing on Ni/Au contact to a-InGaZnO films deposited by dc sputtering

We deposited Ni (15 nm)/Au (30 nm) layers on a-InGaZnO in order to produce low-resistance ohmic contacts by using a dc sputtering method. The samples were annealed at various temperatures for 5 min in Ar ambient. The electrical and the structural properties of the Ni/Au contact to a-InGaZnO were investigated. According to the current-voltage measurements, both the as-deposited and low-temperature annealed samples showed an ohmic behavior. The specific contact resistance of the as-deposited sample was 4.1 × 10^− 5 Ω cm², which was the lowest value. Further increasing the temperature above 400 °C led to an increase in the specific contact resistance. This is due to the chemical intermixing and formation of the oxide in the contact interface caused by the post-growth thermal annealing.     

A novel method for preparing vertically grown single-crystalline gold nanowires

A surfactant-free, template-less and seed-less method, namely the thermal-assisted photoreduction (TAP) process, has been developed to synthesize vertically grown Au nanowires (30-80?nm in diameter and about 2?μm in length) on the surface of thin film titanium dioxide (TiO(2)), which is locally excited by blackbody radiation. The Au nanowires thus produced are single-crystalline with a preferred [Formula: see text] growth direction. The electrical behavior investigated using a nanomanipulation device indicates that the Au nanowires possess an excellent electrical resistivity of about 3.49 × 10(-8)?Ω?m.     

Electrical contact properties between the accumulation layer and metal electrodes in ultrathin poly(3-hexylthiophene)(P3HT) field effect transistors

Probing contact properties between an ultrathin conjugated polymer film and metal electrodes in field effect transistors (FETs) is crucial not only to understanding charge transport properties in the accumulation layer but also in building organic sensors with high sensitivity. We investigated the contact properties between gold electrodes and poly(3-hexylthiophene) (P3HT) as a function of film thickness using gated four-point sheet resistance measurements. In an FET with a 2 nm thick P3HT film, a large voltage drop of 1.9 V (V(D) = -3 V) corresponding to a contact resistance of 2.3 × 10(8) Ω was observed. An effective FET mobility of 1.4 × 10(-3) cm(2)/(V s) was calculated when the voltage drop at the contacts was factored out, which is approximately a factor of 3 greater than the two-contact FET mobility of 5.5 × 10(-4) cm(2)/(V s). A sharp decrease in the ratio of the contact resistance to the channel resistance was observed with increasing film thickness up to a thickness of approximately 6 nm, separating a contact limited regime from a charge transport limited regime. The origin of the large contact resistance observed in the device prepared with an ultrathin P3HT film is discussed in light of results from X-ray diffraction (XRD) and atomic force microscopy (AFM) studies.     

Low-resistance p-type ohmic contacts for high-power InGaAs/GaAs-980 nm CW semiconductor lasers

In this paper, the optimization of ohmic contacts for semiconductor lasers based on InGaAs/GaAs/GaAlAs layers is reported. Transmission electron microscopy (TEM) and electrical methods were used to study extensively the Pt/Ti/Pt/Au metallization system. The contact fabrication technology was optimized towards achieving the lowest electrical resistance. The technological control and optimization concerned the contact annealing temperature and thickness of metallic layers that form the contact. The average specific contact resistance was below 5×10⁻⁶ Ω cm² (with the record value of 8×10⁻⁷ Ω cm²) for the 10 nm Pt/20 nm Ti/30 nm Pt/150 nm Au system. The presented system was used in fabrication of continuous wave (CW) operated laser diodes. The chips mounted on passively cooled copper block achieved optical powers over 1 W, threshold current density values of 140-160 A/cm² and differential efficiencies above 1 W/A. The value of the characteristic temperature T₀ for discussed lasers varied in the range of 180-200 K.     

ZnO上欧姆接触的研究进展

为制备高性能的ZnO基器件如UV光发射器，探测器、场效应晶体管，在ZnO上形成优良的金属电极是十分必要的。回顾了近年来ZnO上制备欧姆接触的新进展，对在n型ZnO上制备欧姆接触的Al，A1/Pt，A1/Au，Ti/Al，Ti，AU，Ti/A1/Pt/Au，Re/Ti/Au等金属化方案的性能与特点，以及影响欧姆接触电阻率和热稳定性的因素，如表面处理和退火等进行了分析与归纳。同时，对P型ZnO上难以获得低接触电阻的原因进行了讨论。文章还简要说明了ZnO上透明欧姆接触的研究现状，指出获得低阻、高导电、高透光和高热稳定性的接触是未来ZnO基光电器件的发展方向。     

Single-crystalline Ni2Ge/Ge/Ni2Ge nanowire heterostructure transistors

In this study, we report on the formation of a single-crystalline Ni(2)Ge/Ge/Ni(2)Ge nanowire heterostructure and its field effect characteristics by controlled reaction between a supercritical fluid-liquid-solid (SFLS) synthesized Ge nanowire and Ni metal contacts. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies reveal a wide temperature range to convert the Ge nanowire to single-crystalline Ni(2)Ge by a thermal diffusion process. The maximum current density of the fully germanide Ni(2)Ge nanowires exceeds 3.5 × 10(7) A cm(-2), and the resistivity is about 88 μΩ cm. The in situ reaction examined by TEM shows atomically sharp interfaces for the Ni(2)Ge/Ge/Ni(2)Ge heterostructure. The interface epitaxial relationships are determined to be [Formula: see text] and [Formula: see text]. Back-gate field effect transistors (FETs) were also fabricated using this low resistivity Ni(2)Ge as source/drain contacts. Electrical measurements show a good p-type FET behavior with an on/off ratio over 10(3) and a one order of magnitude improvement in hole mobility from that of SFLS-synthesized Ge nanowire.     

Ti/Al/Ni/Au在N-polar GaN上的欧姆接触

N-polar GaN以其特有的材料特性和化学活性日益受到研究者关注,而N-polar GaN上欧姆接触也成为研究的热点。以Ti/Al/Ni/Au作为欧姆接触金属,分析了N-polar GaN上欧姆接触的最优退火条件,并借助剖面透射电子显微镜(TEM)和能量色散X射线能谱仪(EDX)研究了金属和N-polar GaN之间的反应生成物。结果表明,当退火温度升高到860℃时,可得到比接触电阻率ρc为1.7×10~(-5)Ω·cm~2的最优欧姆接触特性。TEM和EDX测试发现,除了生成已报道的AlN,还会在界面处产生多晶AlO_x,两者共同作用会进一步拉高势垒,从而对N-polar GaN上欧姆接触产生不利影响。     

Correlation between the performance and microstructure of Ti/Al/Ti/Au Ohmic contacts to p-type silicon nanowires

Understanding the electrical and microstructural aspects of contact formation at nanoscale is essential for the realization of low-resistance metallization suitable for the next generation of nanowire based devices. In this study, we present detailed electrical and microstructural characteristics of Ti/Al/Ti/Au metal contacts to p-type Si nanowires (SiNWs) annealed at various temperatures. Focused ion beam cross-sectioning techniques and scanning transmission electron microscopy (STEM) were used to determine the microstructure of the source/drain metal contacts of working SiNW field-effect transistors (FETs) annealed for 30 s in the 450-850?°C temperature range in inert atmosphere. Formation of titanium silicides is observed at the metal/semiconductor interface after the 750?°C anneal. Extensive Si out-diffusion from the nanowire after the 750?°C anneal led to Kirkendall void formation. Annealing at 850?°C led to almost complete out-diffusion of Si from the nanowire core. Devices with 550?°C annealed contacts had linear electrical characteristics; whereas the devices annealed at 750?°C had the best characteristics in terms of linearity, symmetric behavior, and yield. Devices annealed at 850?°C had poor yield, which can be directly attributed to the microstructure of the contact region observed in STEM.     

Hybrid Si nanowire/amorphous silicon FETs for large-area image sensor arrays

Silicon nanowire (SiNW) field-effect transistors (FETs) were fabricated from nanowire mats mechanically transferred from a donor growth wafer. Top- and bottom-gate FET structures were fabricated using a doped a-Si:H thin film as the source/drain (s/d) contact. With a graded doping profile for the a-Si:H s/d contacts, the off-current for the hybrid nanowire/thin-film devices was found to decrease by 3 orders of magnitude. Devices with the graded contacts had on/off ratios of ～10(5), field-effect mobility of ～50 cm(2)/(V s), and subthreshold swing of 2.5 V/decade. A 2 in. diagonal 160 × 180 pixel image sensor array was fabricated by integrating the SiNW backplane with an a-Si:H p-i-n photodiode.     

Blueshift of electroluminescence from single n-InP nanowire/p-Si heterojunctions due to the Burstein-Moss effect

Single-crystalline n-type InP nanowires (NWs) with different electron concentrations were synthesized on Si substrates via the vapor phase transport method. The electrical properties of the InP nanowires were investigated by fabricating and measuring single NW field-effect transistors (FETs). Single InP NW/p(+)-Si heterojunctions were fabricated, and electroluminescence (EL) spectra from them were studied. It was found that both the photoluminescence (PL) spectra of the InP NWs and the EL spectra of the heterojunctions blueshift from 920 to 775?nm when the electron concentrations of the InP NWs increase from 2 × 10(17) to 1.4 × 10(19)?cm(-3). The blueshifts can be attributed to the Burstein-Moss effect rather than the quantum confinement effect in the InP NWs. The large blueshifts observed in this study indicate a potential application of InP NWs in nano-multicolour displays.     

Microstructure evolution and development of annealed Ni/Au contacts to GaN nanowires

The development of Ni/Au contacts to Mg-doped GaN nanowires (NWs) is examined. Unlike Ni/Au contacts to planar GaN, current-voltage (I-V) measurements of Mg-doped nanowire devices frequently exhibit a strong degradation after annealing in N(2)/O(2). This degradation originates from the poor wetting behavior of Ni and Au on SiO(2) and the excessive void formation that occurs at the metal/NW and metal/oxide interfaces. The void formation can cause cracking and delamination of the metal film as well as reduce the contact area at the metal/NW interface, which increases the resistance. The morphology and composition of the annealed Ni/Au contacts on SiO(2) and the p-GaN films were investigated by scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS) and x-ray diffraction (XRD) measurements. Adhesion experiments were performed in order to determine the degree of adhesion of the Ni/Au films to the SiO(2) as well as observe and analyze the morphology of the film's underside by SEM. Device degradation from annealing was prevented through the use of a specific adhesion layer of Ti/Al/Ni deposited prior to the nanowire dispersal and Ni/Au deposition. I-V measurements of NW devices fabricated using this adhesion layer showed a decrease in resistance after annealing, whereas all others showed an increase in resistance. Transmission electron microscopy (TEM) on a cross-section of a NW with Ni/Au contacts and a Ti/Al/Ni adhesion layer showed a lack of void formation at the contact/NW interface. Results of the XRD and TEM analysis of the NW contact structure using a Ti/Al/Ni adhesion layer suggests Al alloying of the Ni/Au contact increases the adhesion and stability of the metal film as well as prevents excessive void formation at the contact/NW interface.     

Synthesis and characterization of cadmium telluride nanowire

CdTe nanowires with controlled composition were cathodically electrodeposited using track-etched polycarbonate membrane as scaffolds and their material and electrical properties were systematically investigated. As-deposited CdTe nanowires show nanocrystalline cubic phase structures with grain sizes of up to 60 nm. The dark-field images of nanowires reveal that the crystallinity of nanowires was greatly improved from nanocrystalline to a few single crystals within nanowires upon annealing at 200?°C for 6?h in a reducing environment (5%?H(2)+95%?N(2)). For electrical characterization, a single CdTe nanowire was assembled across microfabricated gold electrodes using the drop-casting method. In addition to an increase in grain size, the electrical resistivity of an annealed single nanowire (a few 10(5)?Ω?cm) was one order of magnitude greater than in an as-deposited nanowire, indicating that crystallinity of nanowires improved and defects within nanowires were reduced during annealing. By controlling the dopants levels (e.g.?Te content of nanowires), the resistivity of nanowires was varied from 10(4) to 10(0)?Ω?cm. Current-voltage (I-V) characteristics of nanowires indicated the presence of Schottky barriers at both ends of the Au/CdTe interface. Temperature-dependent I-V measurements show that the electron transport mode was determined by a thermally activated component at T>-50?°C and a temperature-independent component below -50?°C. Under optical illumination, the single CdTe nanowire exhibited enhanced conductance.     

Electrical and morphological characterization of polyaniline/sulfonated poly(arylene ether sulfone) composite films

Electrically conductive polyaniline/sulfonated poly(arylene ether sulfone) (PANI/BPS-35) composites were prepared. The influence of humidity and temperature on electrical conductivity of 20 wt% polyaniline containing composite films was tested. The conductivity increment from 17 mS/cm to 44 mS/cm was observed when the temperature increased from 24 °C to 80 °C at 50% relative humidity (RH). The maximum conductivity was 53 mS/cm at 80 °C and 70% RH. Aluminum (Al) and gold (Au) contacts were deposited onto PANI/BPS composite films and their contact properties have been investigated. While Al contacts behave like Schottky type contact, Au contacts showed nearly ohmic characterization. Scanning electron microscopy technology was used to investigate the morphology of PANI/BPS-35 composite films.