温度对AZ31B镁合金表面化学镀Ni-B合金性能的影响

试验研究了镀液温度对AZ31B镁合金表面化学镀Ni-B合金性能的影响。结果表明:镀液温度对化学镀Ni-B合金的镀速、成分、形貌、耐腐蚀性有很大的影响,当温度为80℃时,镀速较大,镀层均匀、紧凑、细小,耐腐蚀性良好。     

还原剂对AZ31B镁合金表面化学镀Ni-B合金性能的影响

试验研究了还原剂浓度对镁合金表面化学镀Ni-B合金性能的影响.结果表明,还原剂浓度对化学镀Ni-B合金的镀速、成分、形貌、耐腐蚀性有很大的影响,当还原剂浓度为1.2mL/L时,镀速较大,而且镀层均匀、紧凑、细密,耐腐蚀性良好.     

主盐对镁合金表面化学镀Ni-B合金性能的影响

主要研究镀液中主盐浓度对镁合金表面化学镀Ni-B合金性能的影响,着重探讨主盐浓度对镀速、镀层形貌及耐腐蚀性的影响.结果表明:当氯化镍浓度为30g/L时,镀速最大且镀层组织均匀、紧凑、细小,耐腐蚀性较好.     

化学镀Ni-B和Ni-B/BN镀层微动磨损性能研究

采用化学镀液相沉积技术,以钛合金TA7为基体材料,分别镀覆Ni-B合金镀层和Ni-B/BN自润滑复合镀层,对镀层进行微动磨损性能测试和镀层表面形貌观察.结果表明:在微动磨损过程中完全滑移状态下,Ni-B/BN镀层中六方BN微粒具有类似石墨层状结构,该Ni-B/BN镀层具有自润滑性能,使其摩擦因数比Ni-B镀层低,即Ni-B/BN复合镀层在滑移区耐微动磨损性能要优于化学镀Ni-B二元合金镀层.     

化学镀 Ni-Mo-P 合金镀层的组织结构与防垢性能研究

目的采用材料测试方法和防垢实验,研究不同工艺条件下的化学镀Ni-Mo-P合金镀层的组织结构与防垢性能。方法在化学镀Ni-P镀层基底上,添加含有钼酸根离子杂多酸盐,在不同工艺条件下化学沉积Ni-Mo-P合金镀层,研究化学镀Ni-Mo-P合金镀层的表面形貌和组织结构,分析镀液中硼酸含量和钼酸铵含量对镀层沉积速率的影响,观测镀层在结垢实验后的表面形貌并分析结垢速率。通过SEM,XRD和EDS对化学镀Ni-Mo-P合金镀层的表面形貌和组织结构进行检测,研究在酸性镀液中硼酸含量对化学镀Ni-Mo-P工艺条件的影响。采用防垢实验测试化学镀Ni-Mo-P合金镀层的防垢性能。结果在化学镀Ni-Mo-P过程中,钼酸根离子杂多酸盐具有稳定作用。化学镀Ni-Mo-P合金镀层的化学沉积镀液的最佳工艺条件为:Ni SO4·6H_2O 16.5 g/L,Na H_2PO_2·H_2O 20 g/L,钼酸钠0.5~0.8 g/L,硼酸2 g/L,乙酸钠7.5 g/L。化学镀Ni-Mo-P合金镀层的结垢速率明显低于化学镀Ni-P镀层,具有良好的防垢能力,形成了非晶态的镀层。结论采用化学镀Ni-P镀层基底上沉积得到非晶态的Ni-Mo-P合金镀层,硼酸具有调节镀液p H值和络合作用,非晶态的Ni-Mo-P合金镀层平均结垢速率最小值为0.58μm/h,具有良好的阻垢能力。     

化学镀Ni—B合金工艺研究

近年来,化学镀Ni-B合金层的优异功能特性越来越受到各国化学镀工作者的重视,但它在我国还是个空白.本文详细讨论了二甲氨基硼烷化学镀Ni-B镀液中各种成分和工艺条件对Ni-B合金沉积速度和镀层含硼量的影响,确定了柠檬酸铵做配位剂的二甲氨基硼烷化学镀Ni-B合金的最佳工艺条件。按此条件可以稳定地获得含硼量为1～5％的Ni-B镀层。     

钢铁件化学镀Ni-Cu-P合金工艺研究

在酸性化学镀Ni-P合金镀液中加入硫酸铜和光亮剂,成功研制了一种钢铁件的全光亮化学镀Ni-Cu-P合金工艺,检测了镀液和镀层性能,探讨了主要成分和工艺条件对化学镀Ni-Cu-P合金镀层性能的影响.结果表明,所形成的Ni-Cu-P合金镀层结晶细致、光泽高,具有较高的装饰性,镀层耐蚀性、耐磨性和镀液稳定性优于酸性化学镀Ni-P合金工艺.     

铝硅合金表面复合化学镀(Ni-B)-SiC的研究

研究了在铝合金(LG12)表面上复合化学镀(Ni-B)-SiC镀层工艺,对影响镀层镀速的几大因素进行了探讨,确定在铝硅合金上复合化学镀(Ni-B)-SiC的最佳工艺及相关参数.同时对该工艺下获得的复合镀层结构性能进行了研究.结果表明,分散相SiC的嵌入基本没有改变Ni-B基质合金原有的非晶结构.450℃热处理后,复合镀层向晶体结构转变,镀层硬度值HV14737,达到最大.     

化学镀Ni-B镀层对Al-Cu-Mg合金组织和腐蚀性的影响

采用化学镀法在Al-Cu-Mg合金表面制备Ni-B镀层,通过扫描电镜(SEM)及X射线衍射分别对镀层形貌及结构进行了分析。研究了在3.5%Na Cl溶液中Ni-B镀层对Al-Cu-Mg合金腐蚀形为的影响。结果表明,Ni-B镀层为结构致密的非晶合金,经热处理后镀层发生明显晶化转变,分解成面心立方(fcc)Ni相及大量的Ni_3B相,使镀层硬度明显提高。在腐蚀介质中,Ni-B镀层较Al-Cu-Mg合金腐蚀电流密度降低近一个数量级。Ni-B镀层试样的腐蚀过程主要由电荷传递过程控制,且未发现微孔腐蚀现象,因此可有效阻碍腐蚀液对基体的直接侵蚀从而提高Al-Cu-Mg合金的耐腐蚀性。     

Ni-B合金电沉积工艺性能研究

研究了Ni-B合金电沉积的镀液、镀层性能.阴极极化曲线实验结果表明Ni-B合金电沉积是典型的诱导共沉积类型.镀液稳定性高,镀层硬度高,镀态硬度值可达700～800HV,耐磨性好.镀层具有一定的耐酸能力和很强的耐碱液腐蚀能力.     

Effect of coating bath composition on the properties of electroless nickel-boron films

The effect of borohydride, thallium acetate, ethylenediamine and sodium hydroxide concentrations, and the coating bath temperature on both the coating rate and boron content of the electroless Ni-B films was investigated systematically. The Ni-B coating rate increased with the increase in thallium acetate and sodium hydroxide concentrations, but it was not very sensitive to the borohydride concentration. Below 90 g L^− 1 ethylenediamine concentration the coating efficiency was significantly low and above this value as the ethylenediamine concentration increased the coating rate decreased slightly. Below 85 °C the coating rate was very low and above this temperature it was insensitive to the bath temperature. The boron content of Ni-B film increased with the increase in the borohydride concentration and the bath temperature, and decreased with the increase in thallium acetate and ethylenediamine concentrations. Up to 50 g L^− 1 sodium hydroxide concentration, the boron content of the film increased and above this concentration it was insensitive to the sodium hydroxide concentration. As the boron content of Ni-B film increased, both the corrosion resistance and microhardness of Ni-B film increased. Heat treatment brought significant improvement in the microhardness but the corrosion resistance of Ni-B film was observed to decrease due to the disappearance of the amorphous characteristics of the as-deposited Ni-B film and the formation of the Ni-B compound phases.     

Tribological and corrosion behaviour of electroless Ni-B coating possessing a blackberry like structure

This study aims to evaluate the tribological and corrosion properties of the electroless Ni-B coating deposited on AISI 304 stainless steels. The microstructure of the coating was characterized using x-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectrometry (SEM-EDS). XRD analysis revealed that the prepared coating possessed an amorphous character. SEM-EDS investigation also indicated that a non-stoichiometric Ni-B coating was deposited with a columnar growth mechanism on the stainless steel substrate and the morphology of the growth surface was blackberry-like. The hardness and tribological properties were characterized by microhardness and a pin-on-disc wear test. The electroless Ni-B coated sample had a higher degree of hardness, a lower friction coefficient and a lower wear rate than the uncoated substrate. The electrochemical potentiodynamic polarization method was used to evaluate the corrosion resistance of the coating. The electroless Ni-B coating offered cathodic protection on the substrate by acting as a sacrificial anode although it was electrochemically more reactive than the stainless steel substrate.     

Influence of deposition temperature and heat treatment on the performance of electroless Ni-B films

Electroless nickel-boron (Ni-B) was synthesized on mild steel or copper surface. The deposition of thin electroless Ni-B films using an acidic bath having nickel chloride as a source of nickel and dimethylamine borane (DMAB) as a reducing agent and operated at low temperature has been investigated in this paper. The effect of the plating time and temperature on the quality of Ni-B coatings was estimated. The results revealed that the plating rate decreases with increasing plating time and increases with increasing plating temperatures. The boron (B) content of the electroless Ni-B layer increased with increasing temperature. The resulting surfaces were examined and characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD). XRD analysis was performed to investigate structural modifications. Microhardness, corrosion and oxidation resistance of electroless as-plated and heat-treated Ni-B coatings, were evaluated. The effect of heat treatment temperature on the phase structure and microhardness of Ni-B coated at different temperatures was discussed. XRD patterns reveal that electroless Ni-B coatings deposited at 60 and 80 °C are amorphous in as-plated condition and undergo phase transformation to crystalline nickel and nickel borides upon heat-treatment. Heat treatment achieved significant improvement in the microhardness and corrosion resistance due to the formation of the Ni-B compound phases (Ni₃B).     

工况条件对化学镀镍硼合金层耐磨性的影响

本文研究了载荷和配对材料对化学镀镍硼合金层耐磨性的影响。结果表明:镀层的磨损量随载荷的增加而加大;配对材料的硬度愈高,镀层的磨损量愈大。     

The effects of deposition parameters on surface morphology and crystallographic orientation of electroless Ni-B coatings

Electroless Ni-B coatings were deposited on AISI 304 stainless steels by electroless deposition method, which was performed for nine different test conditions at various levels of temperature, concentration of NaBH₄, concentration of NiCl₂, and time, using the Taguchi L₉(3⁴) experimental method. The effects of deposition parameters on the crystallographic orientation of electroless Ni-B coatings were investigated using SEM and XRD equipment. SEM analysis revealed that the Ni-B coatings developed six types (pea-like, maize-like, primary nodular, blackberry-like or grapes-like, broccoli-like, and cauliflower-like) of morphological structures depending on the deposition parameters. XRD results also showed that these structures exhibited different levels of amorphous character. The concentration of NaBH₄ had the most dominant effect on the morphological and crystallographic development of electroless Ni-B coatings.     

Ni-B合金化学镀包覆TiB2粉的研究

为改善TiB2粉末物性,采用化学镀工艺对其进行包覆Ni—B合金处理。经Hall流动仪检测,包覆后粉末松装密度由1．15～1．17g／cm^3增加到1．38～1．39g／cm^3,粉末流动性由包覆前粉末堵塞霍尔流动性测量仪喷嘴变为94～97s／50g;SEM形貌扫描分析表明包覆效果较好,包覆率大于90％;补加镀液包覆效果更好,镀层更致密,包覆率大于95％。