Si、Cu、Mg元素对ZL101合金电导率和力学性能的影响

采用正交试验方法研究了合金元素Si、Cu、Mg加入量对铸造铝合金电导率与力学性能的影响.结果表明,Si改善合金抗拉强度,但Si作为半导体,严重地减少铝基体的有效导电截面,故而降低合金导电性;Cu和Mg明显提高合金的强度,但其固溶在铝基体中,使得基体晶格畸变增加,电子波的散射几率增加,因而降低合金导电性.经T6处理后,合金的电导率和力学性能得到进一步改善提高.     

固溶处理对Al-0.9Mg-0.6Si-0.7Cu合金组织与性能的影响

采用铸锭冶金法制备了Al-0.9Mg-0.6Si-0.7Cu合金,通过电导率测试、显微组织观察、力学性能测试、XRD物相分析以及α(Al)基体点阵常数的计算等方法研究了固溶温度(525~570℃)对该合金微观组织、力学性能和断口形貌的影响。结果表明,实验合金最佳的固溶时效工艺为555℃×45 min固溶水淬,185℃×5.5 h时效;在此条件下,合金的抗拉强度、屈服强度、伸长率和电导率分别为396 MPa、377 MPa、19.5%和38.9%IACS。XRD物相分析表明,合金主要由α-Al基体和Mg2Si等合显微组成;通过基体点阵常数的精确计算,能较好地表征合金的固溶程度。固溶处理后残留的析出相粒子和再结晶程度是影响合金拉伸断口形貌的主要因素。     

过量Mg、Si元素对6101电工导线性能影响及机制

通过电导率测试、拉伸试验、XRD、显微组织分析的方法研究了过量Mg、Si元素对6101铝合金导线强度及导电率的影响。结果表明:Mg过量0.15%的6101合金时效后,由于Mg在Al基体中有很大的固溶极限,大量的过剩Mg依然存在于基体中,在增加基体畸变程度的同时还会降低强化相在基体中的溶解度,使强化相容易从基体中析出并长大粗化,对合金时效强化的效果和导电率有不利的影响;Si过量0.13%、0.05%的6101合金时效后,过剩Si原子会从基体中析出,减小基体的晶格畸变,有利于导电性能的提高;过剩Si的存在可促进β″相的析出,增强合金时效强化效果与速率,且Si过量0.13%合金效果强于Si过量0.05%合金。     

固溶处理对Al-Mg-Si-Mn合金组织与性能的影响研究

通过电导率测试、显微组织观察、力学性能测试、XRD物相分析以及α(Al)基体点阵常数的计算等方法研究了固溶温度和时间对Al-0.69Mg-1.12Si-0.5Mn合金微观组织、力学性能和断口形貌的影响。结果表明:实验合金板材的最佳固溶工艺为550℃/30min;在此条件下,合金的抗拉强度、屈服强度、伸长率和电导率分别为375MPa、354MPa、10.5%、和41.7%IACS。合金主要由α-Al基体、Mg2Si和不可溶Mn12Si7Al5等合金相组成;通过基体点阵常数的精确计算,能较好地表征合金的固溶程度。在510～550℃范围内,适当提高固溶温度和延长固溶时间,粗大的平衡相逐渐回溶,基体过饱和程度增加,合金的强度逐渐升高;进一步提高固溶温度或延长固溶时间,合金强度逐渐降低。     

Mg-2Zn-xCu合金的显微组织和热物性能（英文）

通过显微组织和热物性能表征、热处理及第一性原理计算,研究Mg-2Zn-xCu (x=0.5, 1.0, 1.5,摩尔分数,%)合金的显微组织和热物性能。结果表明,添加Cu元素对合金显微组织和热物性能有影响。随着Cu含量增加,铸态合金中MgCuZn相含量增加,铸态合金电导率和热导率增大。固溶处理后,合金中共晶组织部分溶解,Zn原子回溶进入基体,导致合金的电导率和热导率均降低。时效处理前期,溶质原子从基体中沉淀析出,合金电导率增大,时效24 h后,Mg-2Zn-1.5Cu合金的热导率最高达到147.1 W/(m·K)。合金中形成的热稳定MgCuZn相对合金的电导率和热导率起促进作用。Zn元素在基体中含量越低,晶格畸变程度越低,导热性能则越好。另外,第一性原理计算结果也表明MgCuZn三元相具有很好的导电和导热性能。     

过量Mg、Si元素对6101电工导线性能影响及机制探究

本文通过电导率测试、拉伸试验、XRD、显微组织分析的方法研究了过量Mg、Si元素对6101铝合金导线强度及导电率的影响。结果表明： Mg过量超过0.15%的6101合金时效后,由于Mg在Al基体中有很大的固溶极限,大量的过剩Mg依然存在于基体中,在增加基体畸变程度的同时还会降低强化相在基体中的溶解度,使强化相容易从基体中析出并长大粗化,对合金时效强化的效果和导电率有不利的影响;Si过量0.13%、0.05%的6101合金时效后,过剩Si原子会从基体中析出,减小基体的晶格畸变,有利于导电性能的提高;过剩Si的存在可促进β″相的析出,增强合金时效强化效果与速率,且Si过量0.13%合金效果强于Si过量0.05%合金。     

Cu对ZL114A合金组织与力学性能的影响

以ZL114A合金为研究对象,探讨了Cu合金化对ZL114A微观组织和力学性能的影响。结果表明,在ZL114A合金中Cu加入量小于0.1%时,合金组织和性能无明显变化,此时Cu完全固溶在基体中。随着Cu加入量增加,合金抗拉强度呈先迅速升高再稍微下降趋势,伸长率则一直降低。在Cu加入量为0.5%时,ZL114A合金的抗拉强度达到最大值337.21 MPa,伸长率降低至3.4%。Cu含量高于0.1%(超过基体固溶极限)时,时效会析出W(Al2Mg5Si4Cu4)相,W相弥散分布在基体中,形成第二相强化,提高合金强度、降低塑性。析出第二相过程中铝基体会产生晶格畸变,提高合金的强度。     

固溶-时效处理对Cu-Co-Cr-Si合金组织和性能的影响

研究了不同固溶 时效处理工艺对Cu Co Cr Si合金力学性能、电学性能及其显微组织的影响。结果表明 ,该合金有显著的时效强化特性 ,强化相为Co2 Si、Cr,最佳的固溶与时效处理工艺为 980℃× 1h固溶 ,冰盐水淬火 ,之后进行 4 80℃× 4h时效 ;在最佳固溶时效处理条件下 ,合金的抗拉强度、屈服强度、伸长率和相对电导率分别为5 45 9MPa、4 38 9MPa、19 2 %和 4 6 7%IACS。     

退火温度对高纯Al-1wt% Si合金组织及性能的影响

用光学显微镜、扫描电镜观察,硬度、电导率的测试,观察高纯Al-1wt%Si合金中共晶相分布随再结晶退火温度的变化,研究其对材料组织、硬度及电导率的影响.结果表明,合金开始再结晶温度为300℃,晶粒开始长大温度为450℃;合金硬度值随共晶Si相固溶量的增大而升高,电导率随其固溶量的增大而降低;共晶Si相在a-Al基体中固溶时,退火温度高于450℃扩散系数增大、510℃达到固溶极限.     

Mn含量对高饱和度Al-8Zn-1.8Mg-1.4Cu合金强度的影响

通过透射电镜(TEM与HRTEM)、室温拉伸测试、JMatPro模拟等手段,研究了0.4%与0.8%的Mn对高饱和度Al-8Zn-1.8Mg-1.4Cu合金锻件抗拉强度、屈服强度的影响。结果表明,当合金中含有0.4%与0.8%的Mn时,合金抗拉强度分别达到545、553MPa,较基体合金分别提高7.9%和9.5%,屈服强度分别达到448、469MPa,较基体合金分别提高16.3%和17.4%;向Al-8Zn-1.8Mg-1.4Cu合金中添加Mn元素,经过固溶时效热处理后合金中形成Al_6Mn析出相,Al_6Mn析出相以棒条状存在于晶粒内外,其数量随Mn含量提高而增多;固溶时效后,Al_6Mn析出相与铝基体以非共格形式存在,以弥散强化方式提高合金强度;另外,Mn原子会置换铝基体中的Al原子,导致面心立方铝基体晶格发生膨胀、晶格常数变大,产生晶格畸变,实现固溶强化。     

Microstructure and performance of Al-Si alloy with high Si content by high temperature diffusion treatment

The Al-Si alloy with high Si content was prepared by pressure infiltration.Microstructure observation shows that three-dimensional structure(3D-structure) is obtained from irregular sharp Si particles via high temperature diffusion treatment(HTDT).Flat Si-Al interfaces transform to smooth curves,and Si phases precipitate in Al and Si-Al interface.The bonding of Si-Al interface is improved by HTDT,which improves the mechanical performance of Al-Si alloy.The bending strength of 3D-Al-Si alloy increases by 6% compared with that of Al-Si alloy,but the elastic modulus changes a little.The coefficient of thermal expansion(CTE) of the 3D-Al-Si alloy is 7.7×10-6/°C from 20 °C to 100 °C,which decreases by 7% compared with that of Al-Si alloy.However,HTDT has little effect on the thermal conductivity of Al-Si alloy.     

硅相形态及含量对Al-Si合金线膨胀系数的影响

利用金相显微镜、DIL402C高温膨胀仪等对Al-Si合金的线膨胀进行了研究。结果表明：对于Al-Si合金,硅含量越高,其线膨胀系数越小,随温度变化幅度减小;随着温度升高,磷变质比锶变质的线膨胀系数变化幅度小,合金更加稳定;此外,T6热处理也显著降低Al-Si合金的线膨胀系数。通过对合金线膨胀系数和微观组织的对比观察发现：硅相的形态和体积分数对Al-Si合金的线膨胀系数产生重要影响。初晶硅体积分数的增加和初晶硅的析出能够显著降低Al-Si合金的线膨胀系数,共晶硅的形态对合金线膨胀系数也有一定的影响,共晶硅为短棒状、颗粒状时（尤其经热处理后）,合金的线膨胀系数也显著降低。     

Microstructure and thermophysical properties of Mg−2Zn−xCu alloys

The microstructure and thermophysical properties of Mg−2Zn−xCu alloys (x=0.5, 1.0 and 1.5, at.%) were investigated through microstructural and thermophysical characterization, heat treatment, and first-principles calculations. It was found that the addition of Cu had influence on the microstructure and thermophysical properties of the alloy. As the Cu content increased, the content of the MgCuZn phase increased in the as-cast alloys along with the electrical and thermal conductivities. After solution treatment, the eutectic structure partially decomposed and Zn atoms dissolved into the matrix, leading to the decrease in both the electrical and thermal conductivities of the alloy. During the early stages of the aging treatment, solute atoms precipitated from the matrix, thus increasing the electrical conductivity of the alloy. After aging for 24 h, the thermal conductivity of Mg−2Zn−1.5Cu alloy reached the maximum of 147.1 W/(m·K). The thermostable MgCuZn phases were responsible for increasing the electrical and thermal conductivities. Smaller amounts of Zn atoms dissolved in the matrix resulted in smaller lattice distortion and higher conductivities. The first-principles calculations findings also proved that the MgCuZn phases had very high conductance.     

Zr、Cr元素对Al-Si合金电导率与力学性能的影响

通过正交试验和验证试验研究了不同的Si、Zr、Cr元素含量对Al-Si合金电导率与力学性能的影响.结果表明:当合金的成分为5%Si、0.35%Zr、0.35%Cr、1%Cu、0.5%Mg,经过T6处理后,电导率达到25.35 MS/m,抗拉强度达到361 MPa,伸长率达到2.83%,布氏硬度为109.34,均超越ZL101A.合金中的Si在改善合金力学性能的同时直接减少Al基体的有效导电截面,使合金的电导率下降;微量Zr可以在几乎不影响电导率的情况下提高合金力学性能;Cr元素对合金起到一定的强化作用.通过试验可将Al-Si合金的电导率提高5%～8%.     

Effect of V addition on hardness and electrical conductivity in Cu-Ni-Si alloys

The effect of vanadium (V) addition on the microstructure, the hardness and the electrical conductivity of Cu-2.8Ni-0.7Si alloys was investigated. The V-free, the 0.1 wt% V-added, the 0.2 wt% V-added Cu base alloys were exposed to the same experimental conditions. After the cold rolling of the studied alloys, the matrix was recrystallized during the solution heat treatment at 950 °C for 2 h. However, small amounts of vanadium substantially suppressed the recrystallization and retarded the grain growth of the Cu base alloys. The added vanadium accelerated the precipitation of Ni₂Si intermetallic compounds during aging and therefore it contributed positively to the resultant hardness and electrical conductivity. It was found that the hardness and the electrical conductivity increased simultaneously with increasing aging temperature and time with accelerated precipitation kinetics by the addition of vanadium. In the present study, the Cu-2.8Ni-0.7Si alloy with 0.1 wt%V was found to have an excellent combination of the hardness and the electrical conductivity when it was aged at 500 °C.     

Effects of Ti addition and heat treatments on mechanical and electrical properties of Cu-Ni-Si alloys

The mechanical and electrical properties of Cu-5.98Ni-1.43Si and Cu-5.98Ni-1.29Si-0.24Ti alloys under heat treatment at 400 and 500 °C after hot- and cold-rolling were investigated, and a microstructural analysis using transmission electron microscopy was performed. Cu-5.98Ni-1.29Si-0.24Ti alloy displayed the combined Vickers hardness/electrical conductivity value of 315.9 Hv/57.1%IACS. This was attributed to a decrease of the solution solubility of Ni and Si in the Cu matrix by the formation of smaller and denser δ-Ni₂Si precipitates. Meanwhile, the alloyed Ti was detected in the coarse Ni-Si-Ti phase particles, along with other large Ni-Si phase particles, in Cu-5.98Ni-1.29Si-0.24Ti.     

Microstructural evolution of direct chill cast Al-15.5Si-4Cu-1Mg-1Ni-0.5Cr alloy during solution treatment

Heat treatment has important influence on the microstructure and mechanical properties of Al-Si alloys. The most common used heat treatment method for these alloys is solution treatment followed by age-hardening. This paper investigates the microstructural evolution of a direct chill (DC) cast Al-15.5Si-4Cu-1Mg-1Ni-0.5Cr alloy after solution treated at 500, 510, 520 and 530℃, respectively for different times. The major phases observed in the as-cast alloy are α-aluminum dendrite, primary Si particle, eutectic Si, Al7Cu4Ni, Al5Cu2Mg8Si6, Al15(Cr, Fe, Ni, Cu)4Si2 and Al2Cu. The Al2Cu phase dissolves completely after being solution treated for 2 h at 500℃, while the eutectic Si, Al5Cu2Mg8Si6 and Al15(Cr, Fe, Ni, Cu)4Si2 phases are insoluble. In addition, the Al7Cu4Ni phase is substituted by the Al3CuNi phase. The α-aluminum dendrite network disappears when the solution temperature is increased to 530℃. Incipient melting of the Al2Cu-rich eutectic mixture occurrs at 520℃, and melting of the Al5Cu2Mg8Si6 and Al3CuNi phases is observed at a solution temperature of 530℃. The void formation of the structure and deterioration of the mechanical properties are found in samples solution treated at 530℃.     

Effect of heat treatment on tensile and fatigue deformation behavior of extruded Al-12 wt%Si alloy

This study investigated the effect of heat treatment on tensile and high-cycle fatigue deformation behavior of extruded Al-12 wt%Si alloy. The material used in this study was extruded at a ratio of 17.7: 1 through extrusion process. To identify the effects of heat treatment, T6 heat treatment (515 °C/1 h, water quenching, and then 175 °C/10 h) was performed. Microstructural observation identified Si phases aligned in the extrusion direction in both extruded alloy (F) and heat treated alloy (T6). The average grain size of F alloy was 8.15 °C, and that of T6 alloy was 8.22 °C. Both alloys were composed of Al matrix, Si, Al₂Cu, Al₃Ni and AlFeSi phases. As T6 heat treatment was applied, Al₂Cu phases became more finely and evenly distributed. Tensile results confirmed that yield strength increased from 119.0 MPa to 329.0 MPa, ultimate tensile strength increased from 226.8 MPa to 391.4 MPa, and the elongation decreased from 16.1% to 5.0% as T6 heat treatment was applied. High-cycle fatigue results represented F alloy’s fatigue limit as 185 MPa and T6 alloy’s fatigue limit as 275 MPa, indicating that high-cycle fatigue properties increased significantly as heat treatment was conducted. Through tensile and fatigue fracture surface analysis, this study considered the deformation behaviors of extruded and heat treated Al-Si alloys in relation to their microstructures.     

亚共晶Al-Si合金中微量元素La变质共晶Si的关键影响因素EI北大核心CSCD

理论分析了亚共晶Al-Si合金中微量元素La变质共晶Si的关键影响因素。结果表明,La在α-Al中最大固溶度及La与Al、Si的相互作用参数决定其对共晶Si的变质效果。当La的添加量低于其在α-Al中最大固溶度时,La分布在α-Al和共晶Si中,其变质效果随着La添加量的增加而增加。当La的添加量大于其在α-Al中最大固溶度时,由于La与Al、Si的相互作用参数较大且2者相近,会形成含Al、Si、La的三元化合物,计算结果表明,在各种可能Al、Si、La的化合物中,AlSiLa的形成热较大,且与Al熔体间的界面能较低,最易在熔体中形成;此时,La分布在α-Al、AlSiLa和共晶Si中,其中La在α-Al和共晶Si中的浓度基本不随La添加量的增加而变化,变质效果亦基本保持不变。当变质元素的添加量接近其在α-Al中的最大固溶度时,变质效果最佳。     

Microstructure of interaction interface between Al-Si, Zn-Al alloys and Al2O3p／6061Al composite

Interaction behaviors between Al-Si, Zn-Al alloys and Al2O3p/6061Al composite at different heating temperatures were investigated. It is found that Al2O3p/6061Al composite can be wetted well by AlSi-1, AlSi-4 and Zn-Al alloys and an interaction layer forms between the alloy and composite during interaction. Little Al-Si alloys remain on the surface when they fully wet the composite and Si element in Al-Si alloy diffuses into composite entirely and assembles in the composite near the interface of Al-Si alloy/composite to form a Si-rich zone. The mierostrueture in interaction layer with Si penetration is still dense. Much more residual Zn-Al alloy exists on the surface of composite when it wets the composite, and porosities appear at the interface of Zn-Al alloy/composite. The penetration of elements Zn, Cu of Zn-Al alloy into composite leads to the generation of shrinkage cavities in the interaction layer and makes the microstructure of Al2O3p/6061Al composite loose.