A wideband current-commutating passive mixer for multi-standard receivers in a 0.18 μm CMOS

This paper reports a wideband passive mixer for direct conversion multi-standard receivers.A brief comparison between current-commutating passive mixers and active mixers is presented.The effect of source and load impedance on the linearity of a mixer is analyzed.Specially,the impact of the input impedance of the transimpedance amplifier(TIA),which acts as the load impedance of a mixer,is investigated in detail.The analysis is verified by a passive mixer implemented with 0.18 m CMOS technology.The circuit is inductorless and can operate over a broad frequency range.On wafer measurements show that,with radio frequency(RF) ranges from 700 MHz to 2.3 GHz,the mixer achieves 21 dB of conversion voltage gain with a-1 dB intermediate frequency(IF) bandwidth of 10 MHz.The measured IIP3 is 9 dBm and the measured double-sideband noise figure(NF) is 10.6 dB at 10 MHz output.The chip occupies an area of 0.19 mm2 and drains a current of 5.5 mA from a 1.8 V supply.     

An ultra-broadband distributed passive gate-pumped mixer in 0.18μm CMOS

A broadband distributed passive gate-pumped mixer(DPGM) using standard 0.18μm CMOS technology is presented.By employing distributed topology,the mixer can operate at a wide frequency range.In addition,a fourth-order low pass filter is applied to improve the port-to-port isolation.This paper also analyzes the impedance match and conversion loss of the mixer,which consumes zero dc power and exhibits a measured conversion loss of 9.4—17 dB from 3 to 40 GHz with a compact size of 0.78 mm~2.The input referred 1 dB compression point is higher than 4 dBm at a fixed IF frequency of 500 MHz and RF frequency of 23 GHz,and the measured RF-to-LO, RF-to-IF and LO-to-IF isolations are better than 21,38 and 45 dB,respectively.The mixer is suitable for WLAN, UWB,Wi-Max,automotive radar systems and other millimeter-wave radio applications.     

A fully integrated direct-conversion digital satellite tuner in 0.18μm CMOS

A fully integrated direct-conversion digital satellite tuner for DVB-S/S2 and ABS-S applications is presented.A broadband noise-canceling Balun-LNA and passive quadrature mixers provided a high-linearity low noise RF front-end,while the synthesizer integrated the loop filter to reduce the solution cost and system debug time.Fabricated in 0.18μm CMOS,the chip achieves a less than 7.6 dB noise figure over a 900-2150 MHz L-band, while the measured sensitivity for 4.42 MS/s QPSK-3/4 mode is -91 dBm at the PCB connector.The fully integrated integer-N synthesizer operating from 2150 to 4350 MHz achieves less than 1℃integrated phase error. The chip consumes about 145 mA at a 3.3 V supply with internal integrated LDOs.     

A fractional-N frequency divider for multi-standard wireless transceiver fabricated in 0.18 μm CMOS process

With the rapid evolution of wireless communication technology,integrating various communication modes in a mobile terminal has become the popular trend.Because of this,multi-standard wireless technology is one of the hot spots in current research.This paper presents a wideband fractional-N frequency divider of the multi-standard wireless transceiver for many applications.High-speed divider-by-2 with traditional sourcecoupled-logic is designed for very wide band usage.Phase switching technique and a chain of divider-by-2/3 are applied to the programmable frequency divider with 0.5 step.The phase noise of the whole frequency synthesizer will be decreased by the narrower step of programmable frequency divider.△-Σ modulator is achieved by an improved MASH 1-1-1 structure.This structure has excellent performance in many ways,such as noise,spur and input dynamic range.Fabricated in TSMC 0.18 μm CMOS process,the fractional-N frequency divider occupies a chip area of 1130 × 510μm2 and it can correctly divide within the frequency range of 0.8-9 GHz.With 1.8 V supply voltage,its division ratio ranges from 62.5 to 254 and the total current consumption is 29 mA.     

A 0.18 μm CMOS Gilbert low noise mixer with noise cancellation

This paper presents a broadband Gilbert low noise mixer implemented with noise cancellation technique operating between 10 MHz and 0.9 GHz. The Gilbert mixer is known for its perfect port isolation and bad noise performance. The noise cancellation technique of LNA can be applied here to have a better NF. The chip is implemented in SMIC 0.18 μm CMOS technology. Measurement shows that the proposed low noise mixer has a 13.7-19.5 dB voltage gain from 10 MHz to 0.9 GHz, an average noise figure of 5 dB and a minimum value of 4.3 dB. The core area is 0.6 × 0.45 mm².     

A 0.18μm CMOS Gilbert low noise mixer with noise cancellation

正This paper presents a broadband Gilbert low noise mixer implemented with noise cancellation technique operating between 10 MHz and 0.9 GHz.The Gilbert mixer is known for its perfect port isolation and bad noise performance.The noise cancellation technique of LNA can be applied here to have a better NF.The chip is implemented in SMIC 0.18μm CMOS technology.Measurement shows that the proposed low noise mixer has a 13.7-19.5 dB voltage gain from 10 MHz to 0.9 GHz,an average noise figure of 5 dB and a minimum value of 4.3 dB.The core area is 0.6 x 0.45 mm~2.     

A low power high gain gain-controlled LNAC＋mixer for GNSS receivers

A low power high gain gain-controlled LNAC+mixer for GNSS receivers is reported. The high gain LNA is realized with a current source load.Its gain-controlled ability is achieved using a programmable bias circuit. Taking advantage of the high gain LNA, a high noise figure passive mixer is adopted. With the passive mixer, low power consumption and high voltage gain of the LNACmixer are achieved. To fully investigate the performance of this circuit, comparisons between a conventional LNAC+mixer, a previous low power LNAC+mixer, and the proposed LNAC+mixer are presented. The circuit is implemented in 0.18 m mixed-signal CMOS technology. A 3.8 dB noise figure, an overall 45 dB converge gain and a 10 dB controlled gain range of the two stages are measured. The chip occupies 0.24 mm2and consumes 2 mA current under 1.8 V supply.     

A multi-mode multi-band RF receiver front-end for a TD-SCDMA/LTE/LTE-advanced in 0.18-μm CMOS process

正A fully integrated multi-mode multi-band directed-conversion radio frequency(RF) receiver front-end for a TD-SCDMA/LTE/LTE-advanced is presented.The front-end employs direct-conversion design,and consists of two differential tunable low noise amplifiers(LNA),a quadrature mixer,and two intermediate frequency(IF) amplifiers.The two independent tunable LNAs are used to cover all the four frequency bands,achieving sufficient low noise and high gain performance with low power consumption.Switched capacitor arrays perform a resonant frequency point calibration for the LNAs.The two LNAs are combined at the driver stage of the mixer,which employs a folded double balanced Gilbert structure,and utilizes PMOS transistors as local oscillator(LO) switches to reduce flicker noise.The front-end has three gain modes to obtain a higher dynamic range.Frequency band selection and mode of configuration is realized by an on-chip serial peripheral interface(SPI) module.The frontend is fabricated in a TSMC 0.18-μm RF CMOS process and occupies an area of 1.3 mm~2.The measured doublesideband (DSB) noise figure is below 3.5 dB and the conversion gain is over 43 dB at all of the frequency bands. The total current consumption is 31 mA from a 1.8-V supply.     

Design of GGNMOS ESD protection device for radiation-hardened 0.18 μm CMOS process

In this paper, the ESD discharge capability of GGNMOS (gate grounded NMOS) device in the radiation-hardened 0.18 μm bulk silicon CMOS process (Rad-Hard by Process: RHBP) is optimized by layout and ion implantation design. The effects of gate length, DCGS and ESD ion implantation of GGNMOS on discharge current density and lattice temperature are studied by TCAD and device simulation. The size of DCGS, multi finger number and single finger width of ESD verification structures are designed, and the discharge capacity and efficiency of GGNMOS devices in ESD are characterized by TLP test technology. Finally, the optimized GGNMOS is verified on the DSP circuit, and its ESD performance is over 3500 V in HBM mode.     

An 8.12 μ W wavelet denoising chip for PPG detection and portable heart ratemonitoring in 0.18 μm CMOS

A low power wavelet denoising chip for photoplethysmography (PPG) detection and portable heart rate monitoring is presented. To eliminate noise and improve detection accuracy, Harr wavelet (HWT) is chosen as the processing tool. An optimized finite impulse response structure is proposed to lower the computational complexity of proposed algorithm, which is benefit for reducing the power consumption of proposed chip. The modulus maxima pair location module is design to accurately locate the PPG peaks. A clock control unit is designed to further reduce the power consumption of the proposed chip. Fabricated with the 0.18 μm N-well CMOS 1P6M technology, the power consumption of proposed chip is only 8.12 μ W in 1 V voltage supply. Validated with PPG signals in multiparameter intelligent monitoring in intensive care databases and signals acquired by the wrist photoelectric volume detection front end, the proposed chip can accurately detect PPG signals. The average sensitivity and positive prediction are 99.91% and 100%, respectively.     

A 10 bit 200 MS/s pipeline ADC using loading-balanced architecture in 0.18 μm CMOS

A new loading-balanced architecture for high speed and low power consumption pipeline analog-to-digital converter (ADC) is presented in this paper. The proposed ADC uses SHA-less, op-amp and capacitor-sharing technique, capacitor-scaling scheme to reduce the die area and power consumption. A new capacitor-sharing scheme was proposed to cancel the extra reset phase of the feedback capacitors. The non-standard inter-stage gain increases the feedback factor of the first stage and makes it equal to the second stage, by which, the load capacitor of op-amp shared by the first and second stages is balanced. As for the fourth stage, the capacitor and op-amp no longer scale down. From the system''s point of view, all load capacitors of the shared OTAs are balanced by employing a loading-balanced architecture. The die area and power consumption are optimized maximally. The ADC is implemented in a 0.18 μm 1P6M CMOS technology, and occupies a die area of 1.2×1.2 mm². The measurement results show a 55.58 dB signal-to-noise-and-distortion ratio (SNDR) and 62.97 dB spurious-free dynamic range (SFDR) with a 25 MHz input operating at a 200 MS/s sampling rate. The proposed ADC consumes 115 mW at 200 MS/s from a 1.8 V supply.     

A passive UHF RFID tag chip with a dual-resolution temperature sensor in a 0.18μm standard CMOS process

This paper presents a passive EPC Gen-2 UHF RFID tag chip with a dual-resolution temperature sensor. The chip tag integrates a temperature sensor,an RF/analog front-end circuit,an NVM memory and a digital baseband in a standard CMOS process.The sensor with a low power sigma-delta(ΣΔ) ADC is designed to operate in low and high resolution modes.It can not only achieve the target accuracy but also reduce the power consumption and the sensing time.A CMOS-only RF rectifier and a single-poly non-volatile memory(NVM) are designed to realize a low cost tag chip.The 192-bit-N VM tag chip with an area of 1 mm~2 is implemented in a 0.18-μm standard CMOS process.The sensitivity of the tag is -10.7 dBm/-8.4 dBm when the sensor is disabled/enabled.It achieves a maximum reading/sensing distance of 4 m/3.1 m at 2 W EIRP.The inaccuracy of the sensor is -0.6℃/0.5℃(-1.0℃/1.2℃) in the operating range from 5 to 15℃in high resolution mode(-30 to 50℃in low resolution mode).The resolution of the sensor achieves 0.02℃(0.18℃) in high(low) resolution mode.     

An integrated front-end vertical hall magnetic sensor fabricated in 0.18 μm low-voltage CMOS technology

An integrated front-end vertical CMOS Hall magnetic sensor is proposed for the in-plane magnetic field measurement. To improve the magnetic sensitivity and to obtain low offset, a fully symmetric vertical Hall device (FSVHD) has been optimized with a minimum size design. A new four-phase spinning current modulation associated with a correlated double sampling (CDS) demodulation technique has been further applied to compensate for the offset and also to provide a linear Hall output voltage. The vertical Hall sensor chip has been manufactured in a 0.18 μm low-voltage CMOS technology and it occupies an area of 1.54 mm². The experimental results show in the magnetic field range from –200 to 200 mT, the entire vertical Hall sensor performs with the linearity of 99.9% and the system magnetic sensitivity of 1.22 V/T and the residual offset of 60 μT. Meanwhile, it consumes 4.5 mW at a 3.3 V supply voltage. The proposed vertical Hall sensor is very suitable for the low-cost system-on-chip (SOC) implementation of 2D or 3D magnetic microsystems.     

A 0.18μm CMOS single-inductor single-stage quadrature frontend for GNSS receiver

This paper presents an improved merged architecture for a low-IF GNSS receiver frontend,where the bias current and functions are reused in a stacked quadrature LNA-mixer-VCO.Only a single spiral inductor is implemented for the LC resonator and an extra 1/2 frequency divider is added as the quadrature LO signal generator. The details of the design are presented.The gain plan and noise figure are discussed.The phase noise,quadrature accuracy and power consumption are improved.The test chip is fabricated though a 0.18μm RF CMOS process. The measured noise figure is 5.4 dB on average,with a gain of 43 dB and a IIP3 of-39 dBm.The measured phase noise is better than -105 dBc/Hz at 1 MHz offset.The total power consumption is 19.8 mW with a 1.8 V supply. The experimental results satisfy the requirements for GNSS applications.     

A 10 bit 50 MS/s SAR ADC with partial split capacitor switching scheme in 0.18 μm CMOS

This paper presents a 10 bit successive approximation register (SAR) analog-to-digital converter (ADC) in 0.18 μ m 1P6M CMOS technology with a 1.8 V supply voltage. To improve the conversion speed, a partial split capacitor switching scheme is proposed. By reducing the time constant of the bit cycles, the proposed technique shortens the settling time of a capacitive digital-to-analog converter (DAC). In addition, a new SAR control logic is proposed to reduce loop delay to further enhance the conversion speed. At 1.8 V supply voltage and 50 MS/s the SAR ADC achieves a signal-to-noise and distortion ratio (SNDR) of 57.5 dB and spurious-free dynamic range (SFDR) of 69.3 dB. The power consumption is 2.26 mW and the core die area is 0.096 mm².     

A 6.25 Gb/s equalizer in 0.18μm CMOS technology for high-speed SerDes

This paper presents a 0.18μm CMOS 6.25 Gb/s equalizer for high speed backplane communication. The proposed equalizer is a combined one consisting of a one-tap feed-forward equalizer （FFE） and a two-tap half-rate decision feedback equalizer （DFE） in order to cancel both pre-cursor and post-cursor ISI. By employing an active-inductive peaking circuit for the delay line, the bandwidth of the FFE is increased and the area cost is minimized. CML-based circuits such as DFFs, summers and multiplexes all help to improve the speed of DFEs. Measurement results illustrate that the equalizer operates well when equalizing 6.25 Gb/s data is passed over a 30-inch channel with a loss of 22 dB and consumes 55.8 mW with the supply voltage of 1.8 V. The overall chip area including pads is 0.3 × 0.5 mm^2.     

A 0.18μm CMOS fluorescent detector system for bio-sensing application

A CMOS fluorescent detector system for biological experiment is presented. This system integrates a CMOS compatible photodiode, a capacitive trans-impedance amplifier （CTIA）, and a 12 bit pipelined analog-to- digital converter （ADC）, and is implemented in a 0.18μm standard CMOS process. Some special techniques, such as a ＂contact imaging＂ detecting method, pseudo-differential architecture, dummy photodiodes, and a T-type reset switch, are adopted to achieve low-level sensing application. Experiment results show that the Nwell/Psub photodiode with CTIA pixel achieves a sensitivity of 0.1 A/W at 515 nm and a dark current of 300 fA with 300 mV reverse biased voltage. The maximum differential and integral nonlinearity of the designed ADC are 0.8 LSB and 3 LSB, respectively. With an integrating time of 50 ms, this system is sensitive to the fluorescence emitted by the fluorescein solution with concentration as low as 20 ng/mL and can generate 7 fA photocurrent. This chip occupies 3 mm^2 and consumes 37 mW.     

A 5.25-GHz low-power down-conversion mixer in 0.18-μm CMOS technology

A 5.25 GHz low voltage, high linear and isolated mixer using TSMC 0.18 μm CMOS process for WLAN receiver was investigated. The paper presents a novel topology mixer that leads to better performance in terms of linearity, isolation and power consumption for low supply voltage. The measuring results of the proposed mixer achieve: 7.6 dB power conversion gain, 11.4 dB double side band noise figure, 3 dBm input third-order intercept point, and the total dc power consumption of this mixer including output buffers is 2.45 mW from a 1 V supply voltage. The current output buffer is about 2 mW, the excellent LO-RF, LO-IF and RF-IF isolation achieved up to 37.8, 54.8 and 38.2 dB, respectively.     

A RF receiver frontend for SC-UWB in a 0.18-μm CMOS process

正A radio frequency(RF) receiver frontend for single-carrier ultra-wideband(SC-UWB) is presented. The front end employs direct-conversion architecture,and consists of a differential low noise amplifier(LNA),a quadrature mixer,and two intermediate frequency(IF) amplifiers.The proposed LNA employs source inductively degenerated topology.First,the expression of input impedance matching bandwidth in terms of gate-source capacitance, resonant frequency and target S_(11) is given.Then,a noise figure optimization strategy under gain and power constraints is proposed,with consideration of the integrated gate inductor,the bond-wire inductance,and its variation.The LNA utilizes two stages with different resonant frequencies to acquire flat gain over the 7.1-8.1 GHz frequency band,and has two gain modes to obtain a higher receiver dynamic range.The mixer uses a double balanced Gilbert structure.The front end is fabricated in a TSMC 0.18-/im RF CMOS process and occupies an area of 1.43 mm~2.In high and low gain modes,the measured maximum conversion gain are 42 dB and 22 dB,input 1 dB compression points are -40 dBm and -20 dBm,and S_(11) is better than -18 dB and -14.5 dB.The 3 dB IF bandwidth is more than 500 MHz.The double sideband noise figure is 4.7 dB in high gain mode.The total power consumption is 65 mW from a 1.8 V supply.