根据磷铜阳极维护酸性光亮镀铜液中的氯离子

通过观察磷铜阳极表面的成膜情况来判断酸性光亮镀铜液中的氯离子含量。当镀液中的氯离子含量接近通常要求的上限或下限时,阳极表面的膜有明显变化,电镀产品则无明显变化。即阳极通常比阴极先反映出问题。本方法可及时指出因镀液中氯离子含量偏高或偏低引起的产品问题。     

再谈磷铜阳极

光亮酸性镀铜工艺的发展,主要取决于两个问题的成功解决:阳极和光亮剂.与人们的预料相反,高纯铜并不是酸性镀铜的好阳极,它产生铜粉,使镀液混浊,镀层粗糙.1954年Nevers等对铜阳极的研究为酸铜工艺的发展作出了重大贡献.他们发现,如果用含有杂质的火法铜做阳极,铜在阳极溶解时几乎不产生铜粉,实际上没有阳极泥,阳极上生成一层结合相当牢固的黑色胶状膜.研究表明,砷是产生所需阳极特性的主要元素,银、碲、硒等微量杂质也有一定作用.此后,由于市场上火法铜的短缺,人们想到在高纯铜中添加磷,结果相当理想.美国黄铜公司通过广泛的研究表明,如果在纯铜上加进0.005%以上的磷或砷,     

化学镀镍-铜-磷三元合金工艺的研究

为提高化学镀镍－磷合金镀层的性能及获得多种性能的合金镀层以拓宽其应用范围。在化学镀镍－磷合金液中加入硫酸铜制得镍－铜－磷三元合金。研究了镀液中硫酸镍、次磷酸钠、柠檬酸钠、硫酸铜、稳定剂、光亮剂的含量以及pH值和温度等因素对合金镀层的外观、沉积速度及铜含量的影响。通过5％氯化钠溶液和10％硫酸溶液浸泡试验比较了所得镍－铜－磷合金镀层与镍－磷合金镀层以及前人制得的镍－磷合金镀层的耐蚀性，同时比较了上述镀层的其它性能。结果表明，所得镍－铜－磷合金镀层的耐蚀性、外观、结合力、孔隙率、沉积速度、硬度和耐磨性等性能优于镍－磷合金及前人制得的镍－铜－磷合金镀层。     

化学镀镍铜磷三元合金沉积工艺的研究

为提高化学镀镍的硬度、耐磨及耐蚀性,以拓宽在电子工业中应用,采用在化学镀镍磷合金液中添加适量的铜离子制得镍铜磷三元合金。研究了镍离子与铜离子浓度比、次磷酸钠含量、沉积温度对合金镀层沉积速率的影响,利用Ｓ－５７０扫描电镜和Ｈ－８００透电镀观察了镀层表面形貌和显微组织,通过硝酸腐蚀试验比较了镍磷合金与镍铜镀层的耐蚀性。结果表明,铜的共沉积能明显提高镍磷合金的耐蚀性。     

高速镀铜溶液铜离子浓度升高的原因和对策

在光亮酸性镀铜工艺中 ,常常会出现铜离子浓度降低 ,需要补充硫酸铜的现象 ,如果是用块状磷铜阳极 ,需要在阳极棒上排满磷铜块 ,最好的办法是用装满磷铜球的钛蓝作阳性 ,以增加阳极面积 ,避免铜离子浓度降低。但在高速镀铜工艺中 ,情况恰恰相反。我厂高速镀铜溶液的总体积约为 1 5ｍ3 ,每天铜离子升高约 2ｇ/Ｌ ,即每天阳极溶解的铜比阴极析出的铜约多 30ｋｇ。如不及时处理 ,当铜离子浓度高于 73ｇ/Ｌ时 ,镀层粗糙、变脆 ,由于硫酸铜在阳极析出 ,使阳性钝化 ,槽电压升高 ,生产难以正常进行。1　高速镀铜溶液铜离子浓度上升的原因1 1　常规…     

电镀铜两则

使用磷铜阳极的一种镀铜方法;一种镀铜的整平剂;电镀双层硬铬的方法。     

电镀铜装置

<正>介绍了一种电镀铜装置。该装置由镀槽、可溶性磷铜阳极、阴极(基底)、阴极(基底)固定台和电场强度调节板等部件组成。可溶性磷铜阳极外套装网孔状阳极袋,阴极(基底)固定台用以夹持固定阴极(基底)。电场强度固定板安装于阳极与阴极(基底)之间,用以调节极间电场强度。     

硫酸盐镀铜溶液中铜阳极性能研究

采用电化学联机测试系统对酸性硫酸盐镀铜工艺中含磷质量分数不同的铜阳极的电化学行为进行了阳极极化曲线和循环伏安曲线的对比进行,结果表明在酸性硫酸盐镀铜溶液中低质量分数磷铜阳要要比高质量分数磷铜阳极和纯铜阳极允许使用的阳极电流密度高,产生的Cu^ 离子更少,效果更好。     

电镀磷铜阳极产品发展

自1954年美国对铜阳极在硫酸盐光亮镀铜工艺的发展研究中，发现在铜阳极中添加少量的磷，在电镀过程中铜阳极的表面生成一层黑色的“磷膜”，这层“磷膜”具有金属导电性，控制电镀的速度，使镀层均匀，无铜粉产生，大大减少阳极泥的生成，提高镀层的质量。从而出现“磷铜阳极”这种产品。磷铜阳极的生产工艺不同，其产品的质量也不同。     

再谈硫酸盐光亮镀铜的磷铜阳极

在装饰性和ＰＣＢ电镀中,酸性光亮镀的阳极最佳含磷量为０．０３５－０．０７０％,磷化铜（Ｃｕ３Ｐ）黑膜的生成对于阳极性能具有决定性的意义。     

ABS塑料表面电沉积铜工艺研究

介绍了一种ABS塑料表面电沉积铜工艺,工艺流程主要包括:表面整理,去应力,粗化,敏化,活化,化学镀铜,光亮酸性镀铜.通过平行试验得到ABS塑料上电镀铜的较佳工艺条件为:无水硫酸铜140g/L,硫酸60g/L,氯离子30mg/L,光亮剂3 mL/L,磷铜片阳极(P含量为0.03%～0.06%),温度40℃,电流密度1.5～3.0A/dm2,电镀时间5 min.扫描电镜及性能测试结果表明,所得铜镀层光亮、均匀,与塑料基体结合良好.     

不锈钢管内表面镀铜

介绍了一种开采石油用不锈钢管内表面镀铜的工艺。给出了调整后的工艺流程。重点对不锈钢镀铜的内阳极及其选择作了介绍。内阳极有两种材质,分别为不溶性碳精棒和含磷铜棒。试验中用无磷纯铜代替了含磷铜棒作为酸性镀铜内阳极,并给出了阳极反应的特点与控制方法。批量生产实践证明,单个电流为20A左右,电镀时间20min时,产品质量满足要求。通过高压水冲刷检验,镀层与基体结合良好。     

Influence of salt content on clay electro-dewatering with copper and stainless steel anodes

Abstract

The electro-dewatering technique is an effective method to reinforce soft clay. Electro-dewatering experiments were conducted to assess the impact of salt content on electro-dewatering behaviors and effects with copper and stainless steel anodes. The changes in the current, accumulated drainage volume, and electro-osmotic flow velocity reflect the “catch point” phenomenon between the copper anode and the stainless steel anode. Moreover, the higher the salt content was, the earlier the appearance of the “catch point,” which means that the effect of the copper anode was better in the early stages and then worse in the following stages than that of the stainless steel anode. Based on photographs of anode surface, SEM-EDS (Scanning electron microscopy-Energy dispersive spectrometry) and XRD (X-ray diffraction) results, we found that the copper anode surface produced green product, which observably decreased the conductivity of the copper anode and then reduced the effective electrical potential gradient. On the other hand, there were no added elements on the stainless steel anode surface after the electro-dewatering experiments, and the conductivity of the stainless steel anode was similar to its initial status. The above two points led to the appearance of the“catch point” phenomenon. The pH value of the stainless steel anode was lower than that of copper anode, and the concentration of Cl^? had the opposite relationship. Because the effective electrical potential gradient of the stainless steel anode was higher than that of the copper anode after the “catch point,” the water content of the stainless steel anode was lower than that of the copper anode.     

酸性镀铜工艺硫酸过量引起的故障分析

工业生产中,硫酸的过量添加会造成酸性镀铜工艺阳极钝化、槽电压升高、工作电流下降.本文讨论了硫酸对硫酸铜溶解度的影响,发现水溶液中硫酸含量超过50 g/L后硫酸铜的溶解度急剧下降.当硫酸含量过高时,随着电镀过程的进行,CU<'2+>在阳极表面层的浓度不断升高,引起硫酸铜晶体在阳极表面析出,使阳极钝化,导致无法正常生产.     

高能球磨高温固相法制备尖晶石型铜铬黑颜料

以Cr2O3与CuO为原料,采用高能球磨高温固相法制备尖晶石型铜铬黑颜料;利用XRD、SEM和激光粒度仪等方法对制备颜料的结构、形貌及粒度进行了表征。系统研究了前体混料方式、球磨时间、煅烧温度、煅烧时间等条件对铜铬黑颜料晶型、粒度的影响;探讨了掺杂对铜铬黑颜料着色力的影响。研究表明,通过高能球磨可有效地控制颗粒大小及均匀性,NiO与CoO的掺入可显著提高其着色力。高能球磨10 min,煅烧温度900 ℃,保温时间3 h下制备出了粒径分布均匀着色力较好的铜铬黑颜料。     

铜阳极泥脱铜渣中金、银、钯含量测定

建立了连续测定铜阳极泥脱铜渣中金、银、钯含量的分析方法,并与火试金法进行比较。首先,利用硝酸+乙二胺四乙酸（EDTA）+酒石酸消解铜阳极泥脱铜渣,得到含有银、钯和少量金的消解液,考察了硝酸、EDTA和酒石酸用量对消解效果的影响。结果表明,硝酸、EDTA和酒石酸用量分别为30mL、3mL、1.5g时,消解效果最好。然后,利用王水对残渣进行二次消解,得到含有金和少量银、钯的消解液,考察了王水用量对消解效果的影响。结果表明,王水用量为15mL时即可完成消解。最后采用火焰原子吸收光谱仪测定消解液中的金、银、钯含量。采用本方法测定铜阳极泥脱铜渣,Au、Ag、Pd各元素相对标准偏差均小于1%（n=10）,加标回收率在95.57%～98.70%之间,实验结果准确可靠、重现性好,与火试金法测定结果相一致。     

金矿尾渣中铜的电动修复

以云南省大理白族自治州鹤庆县北衙金矿尾渣为研究对象,采用电动修复技术,研究了不同的阳极工作液、不同的可渗透反应材料(PRB)和不同的可渗透反应材料放置位置对矿渣中铜的去除率的影响,分析了尾矿中铜的形态分布及修复技术对不同形态铜的去除情况.矿渣中水溶态的铜含量占总含铜量的0.7%,弱酸可提取态占5.8%,铁锰氧化物结合态占40.9%,有机物及硫化物结合态占9.7%,残渣态占42.9%.结果表明,阳极工作液为0.1mol/L柠檬酸溶液、PRB为椰壳活性炭并置于距阳极10cm处时,近阳极区矿渣中水溶态的铜去除率为66.5%,弱酸可提取态铜的去除率为51.5%,铁锰氧化物结合态铜的去除率为58.5%,而电动修复对有机物及硫化物结合态和残渣态的铜几乎没有效果.     

铜精炼过程铜液温度软测量模型及应用

为了解决铜精炼过程中高温铜液温度的测量难题,确保铜精炼过程的阳极铜产品质量,基于铜精炼过程中不同阶段的热工机理,分别建立了保温过程、氧化过程以及还原过程的高温铜液温度的机理软测量模型,并采用数据预处理、黄金分割法搜索区间及其函数链神经网络校正等技术对其进行了算法设计以及编程实现.实际应用结果表明,铜精炼过程铜液温度软测量可以反映铜精炼过程铜液温度的真实变化,有助于实现铜精炼过程铜液温度软控制以及提高铜精炼过程的生产效率和生产质量.     

The influence of some parameters on the surface roughness of thin copper foils using statistical analysis

The influence of nucleation potential, nucleation time, growth potential and substrate roughness on the surface roughness of thin copper foils deposited electrolytically on titanium substrates from a 83 g dm^–3 Cu²⁺ and 140 g dm^–3 H₂SO₄ solution at a temperature of 65 °C, using 2k⁴ factorial design, was studied. A mathematical model to determine the average surface roughness, a quality parameter of thin copper foils, was established. Statistical adjustment of the model enables its use in accurate prediction (error lower than 5%) of the average surface roughness of thin copper foils. The initial steps of copper nucleation and growth are particularly important for the quality of thin (18 m) copper foils, because during its manufacture, a rapid and homogeneous covering of the entire surface of the electrode becomes fundamental in order to obtain foils with a low surface roughness and a low degree of pinholes per unit area. Mechanisms for copper nucleation on titanium, based on the Thirsk and Harrison model for different experimental conditions, were determined with the aid of potentiostatic current transients. It was shown that the roughness of the thin copper foils is a function of not only the growth process, but also the nucleation process and that the lowest surface roughness is related to a pre-nucleation step at –0.590 V for 10 ms on a titanium substrate polished with 600-grit paper.     

Computerized scaled cells to study the effect of additive ratios and concentrations on nodulation during copper electrorefining

Scaled copper electrorefining cells were designed, built and computerized to simulate as closely as possible industrial conditions at three Canadian copper refineries. The industrial dimensions of Falconbridge, Kidd Metallurgical Division, were considered while designing scaled cells. Anode width to cell width ratio, anode width to cathode width ratio, anodic surface to cathodic surface ratio, as well as electrolyte volume to cathodic surface ratio, which was about 60 L m^–2, were consistent with Kidd's industrial ratios. However, the cell design also allowed simulation of INCO's Copper Cliff Copper Refinery (CCCR) or Noranda's Canadian Copper Refinery (CCR). Electrorefining cells were 135.0 cm deep by 14.7 cm wide. Electrolyte flow rate was parallel to the electrodes. Electrolyte was circulated from the lower part of the electrorefining cells to the top where there was an overflow going to the electrowinning circuit. The equipment was computer controlled using Labview software. Experiments were conducted using this scaled electrorefining set-up to evaluate the effect of various ratios and concentrations of additives on nodulation during copper electrorefining under high current densities. Cathodic polarization curves, SEM micrographs, porosity analyses and copper grain analyses were used to characterize the cathodes produced.