Modeling of Substrate Noise Generation, Isolation, and Impact for an LC-VCO and a Digital Modem on a Lightly-Doped Substrate

Substrate noise generated by the digital circuits on a mixed-signal IC can severely disturb the analog and RF circuits sharing the same substrate. Simulations at the circuit level of the substrate noise coupling in large systems-on-chip (SoCs) do not provide the necessary understanding in the problem. Analysis at a higher level of abstraction gives much more insight in the coupling mechanisms. This paper presents a physical model to estimate and understand the substrate noise generation by a digital modem, the propagation of this noise and the resulting performance degradation of LC tank VCOs. The proposed linearized model is fast to derive and to evaluate, while remaining accurate. It is validated with measurements on two test structures: a reference design and a design with a$hboxp^+ $/n-well (digital) guard ring. Both structures contain a functional 40k gate digital modem and a 0.18$muhbox m$3.5 GHz CMOS LC-VCO on a lightly-doped substrate. In both cases, the model accurately predicts the level of the spurious components appearing at the VCO output due to the digital switching activity. The error remains smaller than 3 dB. Finally, we demonstrate how the proposed model enables a systematic and controlled isolation strategy to suppress substrate noise coupling problems. As an example, the model is used to determine suitable dimensions for a digital guard ring.     

一种混合信号集成电路衬底耦合噪声分析方法

讨论分析了混合信号集成电路衬底噪声耦合的机理,及对模拟电路性能的影响。提出了一种混合信号集成电路衬底耦合噪声分析方法,基于TSMC 0.35μm 2P4M CMOS工艺,以14位高速电流舵D/A转换器为例,给出了混合信号集成电路衬底耦合噪声分析方法的仿真结果,并与实际测试结果进行比较,证实了分析方法的可信性。     

Analysis and experimental verification of digital substrate noisegeneration for epi-type substrates

Substrate coupling in mixed-signal IC's can cause important performance degradation of the analog circuits. Accurate simulation is therefore needed to investigate the generation, propagation, and impact of substrate noise. Recent studies were limited to the time-domain behavior of generated substrate noise and to noise injection from a single noise source. This paper focuses on substrate noise generation by digital circuits and on the spectral content of this noise. To simulate the noise generation, a SPICE substrate model for heavily doped epi-type substrates has been used. The accuracy of this model has been verified with measurements of substrate noise, using a wide-band, continuous-time substrate noise sensor, which allows accurate measurement of the spectral content of substrate noise. The substrate noise generation of digital circuits is analyzed, both in the time and frequency domain, and the influence of the different substrate noise coupling mechanisms is demonstrated. It is shown that substrate noise voltages up to 20 mV are generated and that, in the frequency band up to 1 GHz, noise peaks are generated at multiples of the clock and repetition frequency. These noise signals will strongly deteriorate the behavior of small signal analog amplifiers, as used in integrated front-ends     

Performance degradation of LC-tank VCOs by impact of digital switching noise in lightly doped substrates

In mixed analog-digital designs, digital switching noise is an important limitation for the performance of analog and RF circuits. This paper reports a physical model describing the impact of digital switching noise on LC-tank voltage-controlled oscillators (VCOs) in lightly doped substrates. The model takes into account the propagation from the source of substrate noise to the different components in the VCO and the resulting modulation of the oscillator frequency. The model is validated with measurements on a 3.5-GHz LC-tank VCO designed in 0.18-/spl mu/m CMOS. It reveals that for this VCO, impact occurs mainly via the nonideal metal ground lines for lower frequencies and low tuning voltage and via the integrated inductors for higher frequencies and high tuning voltage. To make the design immune to substrate noise, the parasitic resistance of the on-chip ground interconnect has to be kept as low as possible and inductors have to be shielded. Hence, the developed model allows investigating the dominant mechanisms behind the impact of substrate noise on a VCO, which is crucial information for achieving a substrate noise immune design.     

A simple on-chip repetitive sampling setup for the quantification of substrate noise

The quantification of substrate noise is an important issue in mixed-signal designs, where sensitive analog circuits are embedded in a hostile digital environment. In this paper we present an experimental environment to characterize the sensitivity of embedded analog circuits to digitally generated substrate noise. Our measurement technique is based on equivalent-time substrate voltage sampling and uses a simple differential latch comparator without explicit input sample-and-hold. A surprisingly large measurement bandwidth is observed,which is explained from the detailed circuit behavior. On our 0.18-/spl mu/m CMOS test chip,we have demonstrated that our system allows to wave trace pulses as narrow as 200 ps accurately. Additionally, the extraction of precise measurement data from observations that are excessively corrupted by additive noise and timing jitter is addressed. We present simple yet very effective methods to accurately reconstruct pulse waveform features without the use of delicate deconvolution operations.     

基于小波神经网络和相位差的模拟电路故障诊断

根据模拟电路中存在噪声的问题,提出利用相位差来进行故障诊断。通过正常模式和故障模式下相位差和幅值差的特征提取,建立故障字典。然后利用小波神经网络对故障电路建模,基于该网络学习收敛快,对网络输入不太敏感的特点,实现故障诊断。通过实例证明,该方法不但诊断准确,而且很切合实际模拟电路。     

Efficient methods for modelling substrate coupling in mixed-signalintegrated circuits

A key problem in the design of large mixed-signal circuits is the noise caused by the coupling of digital signals into the substrate. This paper describes methods that allow circuit designers to model efficiently such substrate noise in large mixed-signal SPICE designs. In the light of these techniques a new methodology is presented for efficiently modelling the substrate noise caused by current injection and its coupling to analogue signals; this is then extended to provide a real-time modelling capability. The practicality and the numerical efficiency of the methods are demonstrated on several prototype example circuits     

Substrate noise generation in complex digital systems: efficient modeling and simulation methodology and experimental verification

More and more system-on-chip designs require the integration of analog circuits on large digital chips and will therefore suffer from substrate noise coupling. To investigate the impact of substrate noise on analog circuits, information is needed about digital substrate noise generation. In this paper, a recently proposed simulation methodology to estimate the time-domain waveform of the substrate noise is applied to an 86-Kgate CMOS ASIC on a low-ohmic epi-type substrate. These simulation results have been compared with substrate noise measurements on this ASIC and the difference between the simulated and measured substrate noise rms voltage is less than 10%. The simulated time domain waveform and frequency spectrum of the substrate noise correspond well with the measurements, indicating the validity of this simulation methodology. Both measurements and simulations have been used to analyze the substrate noise generation in more detail. It has been found that direct noise coupling from the on-chip power supply to the substrate dominates the substrate noise generation and that more than 80% of the substrate noise is generated by simultaneous switching of the core cells. By varying the parameters of the simulation model, it has been concluded that a flip-chip packaging technique can reduce the substrate noise rms voltage by two orders of magnitude when compared to traditional wirebonding.     

Fast Substrate Noise Aware Floorplanning for Mixed Signal SOC Designs

In this paper, we introduce a novel substrate noise estimation technique during early floorplanning for mixed signal system-on-chip (SOC), based on block preference directed graph (BPDG). Given a set of analog and digital blocks, BPDG is constructed based on their inherent noise characteristics to capture the preferred relative locations for substrate noise minimization. For each instance of floorplan in sequence pair or ${B}^{ast}$-tree, we efficiently count the number of violations against BPDG which correlates remarkably well with accurate but computation-intensive substrate noise modeling. Thus, our BPDG-based model can guide fast substrate noise-aware floorplanning and layout optimization for mixed signal SOC. Our experimental results show that the proposed approach is significantly faster than conventional full-blown substrate model-based floorplanning.      

Compact model to efficiently characterize TSV-to-transistor noise coupling in 3D ICs

A methodology is proposed to characterize through silicon via (TSV) induced noise coupling in three-dimensional (3D) integrated circuits. Different substrate biasing schemes (such as a single substrate contact versus regularly placed substrate contacts) and TSV fabrication methods (such as via-first and via-last) are considered. A compact π model is proposed to efficiently estimate the coupling noise at a victim transistor. Each admittance within the compact model is approximated with a closed-form expression consisting of logarithmic functions. The methodology is validated using the 3D transmission line matrix (TLM) method, demonstrating, on average, 4.8% error. The compact model and the closed-form expressions are utilized to better understand TSV induced noise as a function of multiple parameters such as TSV type, placement of substrate contacts, signal slew rate and voltage swing. The effect of differential TSV signaling is also investigated. Design guidelines are developed based on these results.     

SWAN: high-level simulation methodology for digital substrate noise generation

Substrate noise generated by the switching digital circuits degrades the performance of analog circuits embedded on the same substrate. It is therefore important to know the amount of noise at a certain point on the substrate. Existing transistor-level simulation approaches based on a substrate model extracted from layout information are not feasible for digital circuits of practical size. This paper presents a complete high-level methodology, which simulates a large digital standard cell-based design using a network of substrate macromodels, with one macromodel for each standard cell. Such macromodels can be constructed for both EPI-type and bulk-type substrates. Comparison of our substrate waveform analysis (SWAN) to several measurements and to several full SPICE simulations indicates that the substrate noise is simulated with our methodology within 10%-20% error in the time domain and within 2 dB relative error at the major resonance in the frequency domain. However, it is several orders of magnitude faster in CPU time than a full SPICE simulation.     

Simulation and measurement of supply and substrate noise in mixed-signal ICs

Digital noise in mixed-signal circuits is characterized using a scalable macromodel for substrate noise coupling. The noise coupling obtained through simulations is verified with measured data from a digital noise generator and noise sensitive analog circuits fabricated in the 0.35-/spl mu/m heavily doped CMOS process. The simulations and measurements also demonstrate the effectiveness of including grounded guard rings and separating bulk and supply pins in digital circuits to reduce substrate coupling.     

Addressing substrate coupling in mixed-mode ICs: simulation andpower distribution synthesis

This paper describes new techniques for the simulation and power distribution synthesis of mixed analog/digital integrated circuits considering the parasitic coupling of noise through the common substrate. By spatially discretizing a simplified form of Maxwell's equations, a three-dimensional linear mesh model of the substrate is developed. For simulation, a macromodel of the fine substrate mesh is formulated and a modified version of SPICE3 is used to simulate the electrical circuit coupled with the macromodel. For synthesis, a coarse substrate mesh, and interconnect models are used to couple linear macromodels of circuit functional blocks. Asymptotic Waveform Evaluation (AWE) is used to evaluate the electrical behavior of the network at every iteration in the synthesis process. Macromodel simulations are significantly faster than device level simulations and compare accurately to measured results. Synthesis results demonstrate the critical need to constrain substrate noise and simultaneously optimize power bus geometry and pad assignment to meet performance targets     

Voltage-comparator-based measurement of equivalently sampledsubstrate noise waveforms in mixed-signal integrated circuits

This paper describes measurement of substrate noise waveforms in mixed-signal integrated circuits. This method uses wide-band chopper-type single-ended voltage comparators as on-chip noise detectors. By analyzing equivalently sampled comparator outputs in synchronized operation, the noise voltage in the auto-zero and compare modes can be measured separately, and noise waveforms were experimentally reconstructed to within 0.5-ns accuracy. The noise transmission path was analyzed, and this showed that the noise sampled at the auto-zero mode of the comparator can be used to reconstruct substrate noise waveforms with high resolution. The results also explain the influence of noise coupling on analog circuits widely used in on-chip analog-to-digital converters     

Substrate coupling in digital circuits in mixed-signal smart-power systems

This paper describes theoretical and experimental data characterizing the sensitivity of nMOS and CMOS digital circuits to substrate coupling in mixed-signal, smart-power systems. The work presented here focuses on the noise effects created by high-power analog circuits and affecting sensitive digital circuits on the same integrated circuit. The sources and mechanism of the noise behavior of such digital circuits are identified and analyzed. The results are obtained primarily from a set of dedicated test circuits specifically designed, fabricated, and evaluated for this work. The conclusions drawn from the theoretical and experimental analyses are used to develop physical and circuit design techniques to mitigate the substrate noise problems. These results provide insight into the noise immunity of digital circuits with respect to substrate coupling.     

Measurements and analysis of PLL jitter caused by digital switchingnoise

When integrating analog and digital circuits onto a mixed-mode chip, power supply noise coupling is a major limitation on the performance of the analog circuitry. Several techniques exist for reducing the noise coupling, of which one of the cheapest is separating the power supply distribution networks for the analog and digital circuits. Noise coupling from a digital noise-generating circuit through the power supply/substrate into an analog phase-locked loop (PLL) is analyzed for three different power supply schemes. The main mechanisms for noise coupling are identified by comparing different PLLs and varying their bandwidths. It is found that the main cause of jitter strongly depends on the power supply configuration of the PLL. Measurements were done on mixed-mode designs in a standard 0.25-μm digital CMOS process with a low-resistivity substrate. The same circuits were also implemented with triple-well processing for comparisons     

Partitioning Analog and Digital Processing in Mixed-Signal Systems

Shrinking feature sizes, combined with the need for low-power and lightweight components, fuel the desire to place large mixed-signal systems onto a single die. A major design issue in mixed-signal systems is the effect of digital switching noise coupled to sensitive analog circuits through the substrate. A method is presented for minimizing this effect by partitioning digital and analog processing into separate time blocks. The resulting trade-off between lost signal and increased energy consumption is explored. As an example, a GPS synchronizer design is analyzed with respect to modifications that can be made to increase performance, while minimizing any associated energy penalty. Application of the partitioning method to other communications systems is discussed.     

A 0.18-$muhbox m$CMOS Analog Min-Sum Iterative Decoder for a (32,8) Low-Density Parity-Check (LDPC) Code

Current-mode circuits are presented for implementing analog min-sum (MS) iterative decoders. These decoders are used to efficiently decode the best known error correcting codes such as low-density parity-check (LDPC) codes and turbo codes. The proposed circuits are devised based on current mirrors, and thus, in any fabrication technology that accurate current mirrors can be designed, analog MS decoders can be implemented. The functionality of the proposed circuits is verified by implementing an analog MS decoder for a (32,8) LDPC code in a 0.18-mum CMOS technology. This decoder is the first reported analog MS decoder. For low signal to noise ratios where the circuit imperfections are dominated by the noise of the channel, the measured error correcting performance of this chip in steady-state condition surpasses that of the conventional floating-point discrete-time synchronous MS decoder. When data throughput is 6 Mb/s, loss in the coding gain compared to the conventional MS decoder at BER of 10^-3 is about 0.3 dB and power consumption is about 5 mW. This is the first time that an analog decoder has been successfully tested for an LDPC code, though a short one     

Experimental results and modeling techniques for substrate noise inmixed-signal integrated circuits

An experimental technique is described for observing the effects of switching transients in digital MOS circuits that perturb analog circuits integrated on the same die by means of coupling through the substrate. Various approaches to reducing substrate crosstalk (the use of physical separation of analog and digital circuits, guard rings, and a low-inductance substrate bias) are evaluated experimentally for a CMOS technology with a substrate comprising an epitaxial layer grown on a heavily doped bulk wafer. Observations indicate that reducing the inductance in the substrate bias is the most effective. Device simulations are used to show how crosstalk propagates via the heavily doped bulk and to predict the nature of substrate crosstalk in CMOS technologies integrated in uniform, lightly doped bulk substrates, showing that in such cases the substrate noise is highly dependent on layout geometry. A method of including substrate effects in SPICE simulations for circuits fabricated on epitaxial, heavily doped substrates is developed     

Analysis of the PLL jitter due to power/ground and substrate noise

Phase-locked loops (PLL) in radio-frequency (RF) and mixed analog-digital integrated circuits (ICs) experience substrate coupling due to the simultaneous circuit switching and power/ground (P/G) noise which translate to a timing jitter. In this paper. an analysis of the PLL timing jitter due to substrate noise resulting from P/G noise and large-signal switching is presented. A general comprehensive stochastic model of the substrate and P/G noise sources in very large-scale integration (VLSI) circuits is proposed. This is followed by calculation of the phase noise of the constituent voltage-controlled oscillator (VCO) in terms of the statistical properties of substrate and P/G noise. The PLL timing jitter is then predicted in response to the VCO phase noise. Our mathematical method is utilized to study the jitter-induced P/G noise in a CMOS PLL, which is designed and simulated in a 0.25-/spl mu/m standard CMOS process. A comparison between the results obtained by our mathematical model and those obtained by HSPICE simulation prove the accuracy of the predicted model.